A multi-channel long-distance light source engine structure

Abstract

The utility model relates to a kind of multi-channel long-distance source light engine structure, including emission group, wave division multiplexing group and adapter group, the emission group includes pedestal, pedestal is arranged with emission unit, emission unit includes CW light source, silicon optical chip and optical fiber array, CW light source is used to output optical signal, silicon optical chip is used to split beam and modulation of input optical signal, the optical fiber array is used to couple the optical signal of silicon optical chip output into wave division multiplexing group;The wave division multiplexing group includes wave division multiplexer, wave division multiplexer is used to receive the optical signal that is split beam and modulation by silicon optical chip, and different wavelength optical signal is output to adapter group after combining wave;The adapter group includes adapter, for transmitting the optical signal of wave division multiplexer output to external optical fiber;Advantage is that: the data carrying capacity of single chip is significantly improved, the multiplication of channel number is realized under the premise of not increasing module volume, meet the demand of high-density integration to high-speed optical module.

Description

Technical Field

[0001] This utility model relates to the field of optical communication, and in particular to a multi-channel long-distance transmitting optical engine structure. Background Technology

[0002] In the field of high-speed optical communication, especially in data centers and long-distance transmission applications, the transmitting optical engine, as the core component of the optical module, plays a crucial role in converting electrical signals into multi-wavelength optical signals and performing multiplexing output. Traditional transmitting optical engines mostly use EML (Electro-absorption Modulated Laser) chips as integrated light source and modulation devices, combined with filters or dielectric film multiplexers to achieve multi-wavelength multiplexing. However, as transmission rates evolve towards 400G, 800G, and even higher speeds, the demand for channel quantity and integration has increased dramatically, and traditional solutions face many bottlenecks.

[0003] First, EML chips are based on III-V semiconductor materials, and typically a single chip only supports modulation output for one or two wavelengths. When multi-channel wavelength division multiplexing (such as four or more wavelengths) is required, multiple independent EML chips must be used. For example, in applications that implement four-channel multiplexed output, if each channel needs to support four wavelengths, up to 16 laser units are required, resulting in a significant increase in the number of chips. This not only significantly increases the demand for packaging space but also makes the optical structure more complex and reduces manufacturability.

[0004] Secondly, because EML chips integrate lasers and modulators, their manufacturing process is complex and costly, and they are difficult to be compatible with CMOS processes, which is not conducive to large-scale integration and low-cost mass production. Furthermore, using discrete filters or dielectric film multiplexers for wavelength combining results in a lengthy optical path structure, cumbersome assembly processes, low manufacturability, and difficulty in guaranteeing yield. In addition, traditional wavelength division multiplexers often use a planar arrangement, failing to fully utilize vertical space, resulting in wasted space resources and limiting further improvements in overall integration density.

[0005] Therefore, this case is brought. Utility Model Content

[0006] The purpose of this invention is to provide a multi-channel, long-distance transmitting optical engine structure that significantly increases the number of channels and improves space utilization while reducing process difficulty and manufacturing costs based on existing module size.

[0007] To achieve the above objectives, the technical solution of this utility model is as follows:

[0008] A multi-channel, long-distance transmitting optical engine structure includes a transmitter group, a wavelength division multiplexing group, and an adapter group; The transmitting group includes a base on which several transmitting units are arranged. Each transmitting unit includes several CW light sources, a silicon photonic chip, and an optical fiber array. The CW light sources are used to output optical signals. The silicon photonic chip is used to receive the optical signals output by the CW light sources, split each input optical signal, add a modulation signal, and output the signal. The optical fiber array is used to couple the optical signals output by the silicon photonic chip into the wavelength division multiplexing group. The wavelength division multiplexing group includes several wavelength division multiplexers. Each wavelength division multiplexer is used to receive optical signals output from different CW light sources and split and modulated by a silicon photonics chip, and output multiple optical signals of different wavelengths to the adapter group through a single optical fiber. The adapter group includes several adapters corresponding to the number of wavelength division multiplexers. The adapters serve as external optical fiber connection interfaces and are used to transmit the optical signals output by the corresponding wavelength division multiplexers to the external optical fiber.

[0009] Furthermore, the wavelength division multiplexing group includes a support frame for fixing several wavelength division multiplexers in a stacked manner.

[0010] The advantages of this utility model are: 1. An architecture employing silicon photonics chips and wavelength division multiplexers in tandem effectively solves the problems of large chip count, large space occupation, and complex optical paths inherent in traditional EML solutions for high-channel-count applications. This structure utilizes silicon photonics chips to achieve efficient modulation of multiple CW light sources and splits each optical signal for processing, significantly improving the data carrying capacity of a single chip. It achieves a doubling of the number of channels without increasing module size, meeting the high-density integration requirements of 400G, 800G, and higher-speed optical modules. 2. By vertically arranging wavelength division multiplexing chips using a stacked bracket structure, space resources in the height direction are fully utilized, avoiding the space waste caused by traditional planar layout. This significantly improves the space utilization and integration of the optical engine, making the overall structure more compact and able to meet the miniaturized packaging size requirements of different standards. 3. By using silicon photonics chips for beam splitting and modulation, and combining a wavelength division multiplexer (arrayed grating chip) with an optical fiber array (FA), the complex optical path is optimized, reducing the difficulty of manufacturing and significantly improving its manufacturability. It has advantages such as high integration, high scalability, and low optical path loss. At the same time, the modular design supports flexible wavelength configuration and "one-to-many" expansion capability, which makes it easy to adjust the channel combination according to actual needs, enhancing the system's adaptability and scalability, significantly improving the transmission rate of a single module, and meeting the communication requirements of the next generation of high-capacity data centers. Attached Figure Description

[0011] Figure 1 This is a three-dimensional structural diagram of the multi-channel long-distance emitting optical engine structure in the embodiment; Figure 2 for Figure 1 A bottom view diagram; Figure 3 for Figure 2 Enlarged diagram of part A in the diagram; Figure 4 for Figure 2 Enlarged view of section B and left view section diagram; Label Explanation CW light sources: 101, 102, 103, 104; Fiber optic arrays: 201, 202; Silicon photonics chips: 301, 302; Wavelength division multiplexers: 401, 402, 403, 404; LC adapters: 501, 502, 503, 504; Stent: 6. Detailed Implementation

[0012] The present invention will be further described in detail below with reference to the embodiments. It should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer" etc. indicated by the accompanying drawings are only for the convenience of describing the present invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0013] like Figures 1 to 4 As shown, this embodiment proposes a multi-channel long-distance transmitting optical engine structure, which includes a transmitter group, a wavelength division multiplexing group, and an adapter group in sequence.

[0014] refer to Figure 1 In this embodiment, the transmitting group includes a base, on which two transmitting units are arranged. Each transmitting unit includes two CW light sources, a silicon photonic chip, and a fiber optic array. Figure 1 Taking the transmitting unit containing the silicon photonic chip 301 as an example, this transmitting unit includes a CW light source 101 and a CW light source 102. The CW light source 101 emits optical signal λ1, and the CW light source 102 emits optical signal λ2. The silicon photonic chip 301 has multiple optical signal input ports and multiple modulation channels. After optical signals λ1 and λ2 are input into the silicon photonic chip 301, they are each split into four beams. The four beams of optical signal λ1 enter four modulation channels for intensity modulation to load electrical signal data, and the four beams of optical signal λ2 enter another four modulation channels for intensity modulation to load electrical signal data. After modulation, the four beams of optical signal λ1 and four beams of optical signal λ2 enter the fiber array 201. Figure 3As shown, the fiber array 201 has at least 8 channels, with four optical signals λ1 occupying four of the channels and four optical signals λ2 occupying the other four channels. The fiber array 201 couples the eight optical signals into a wavelength division multiplexing group.

[0015] refer to Figure 1 and Figure 3 In this embodiment, the two transmitting units include CW light sources 101, 102, 103, and 104. CW light source 101 emits optical signal λ1, CW light source 102 emits optical signal λ2, CW light source 103 emits optical signal λ3, and CW light source 104 emits optical signal λ4. The wavelengths of λ1, λ2, λ3, and λ4 are 1330 nm, 1310 nm, 1290 nm, and 1270 nm, respectively. The optical signals emitted by CW light sources 101 and 102 are split and modulated by the silicon photonics chip 301 to form eight optical signals that enter the fiber array 201. The optical signals emitted by CW light sources 103 and 104 are split and modulated by the silicon photonics chip 302 to form eight optical signals that enter the fiber array 202.

[0016] In this embodiment, the wavelength division multiplexing (WDM) group includes WDM multiplexers 401, 402, 403, and 404. Each WDM multiplexer integrates at least four wavelength channels for receiving four optical signals from λ1 to λ4. Figure 1 and Figure 4 As shown, taking wavelength division multiplexer 401 as an example, the optical signal λ1 output by CW light source 101 is split into four beams, one of which enters wavelength division multiplexer 401; the optical signal λ2 output by CW light source 102 is split into four beams, one of which enters wavelength division multiplexer 402; the optical signal λ3 output by CW light source 103 is split into four beams, one of which enters wavelength division multiplexer 403; the optical signal λ4 output by CW light source 104 is split into four beams, one of which enters wavelength division multiplexer 401; then wavelength division multiplexer 401 performs multiplexing processing on the four input optical signals (λ1~λ4) and outputs them through a single single-mode fiber. Wavelength division multiplexers 402, 403, and 404 perform multiplexing of the four input optical signals (λ1~λ4) in the same manner and output them through a single single-mode optical fiber. Single-mode optical fiber, as a transmission medium, can be used for signal transmission in long-distance, high-speed communication systems.

[0017] In this embodiment, the adapter group includes four LC adapters, namely Figure 1The system includes LC adapters 501, 502, 503, and 504. LC adapter 501 is connected to wavelength division multiplexer 401 via a single-mode fiber; LC adapter 502 is connected to wavelength division multiplexer 402 via a single-mode fiber; LC adapter 503 is connected to wavelength division multiplexer 403 via a single-mode fiber; and LC adapter 504 is connected to wavelength division multiplexer 404 via a single-mode fiber. The optical signal output from the wavelength division multiplexer is transmitted via a single-mode fiber to the corresponding LC adapter, and then from the LC adapter to an external optical fiber.

[0018] By innovatively employing an architecture that integrates dual silicon photonic chips and a multi-wavelength division multiplexer, this solution effectively addresses the issues of large chip count, large space occupation, and complex optical paths inherent in traditional EML solutions for high-channel-count applications. This architecture utilizes silicon photonic chips to achieve efficient modulation of multiple CW light sources and splits each optical signal for processing, significantly improving the data carrying capacity of a single chip. It doubles the number of channels without increasing module size, meeting the high-density integration requirements of 400G, 800G, and higher-speed optical modules. Simultaneously, the modular design supports flexible wavelength configuration and "one-to-many" expansion capabilities, facilitating adjustments to channel combinations according to actual needs and enhancing system adaptability and scalability. The overall solution offers advantages such as high bandwidth, small size, low loss, and ease of mass production, making it particularly suitable for high-capacity optical communication scenarios such as long-distance interconnects in data centers.

[0019] Preferably, the wavelength division multiplexing (WDM) group in this embodiment includes two supports 6, with two WDM multiplexers stacked on each support 6. By vertically arranging the WDM chips through a stacked support structure, space resources in the height direction are fully utilized, avoiding the space waste caused by traditional planar layouts. This significantly improves the space utilization and integration of the optical engine, making the overall structure more compact and able to meet the miniaturized packaging size requirements of different standards.

[0020] The above embodiments are only used to explain the concept of this utility model, and are not intended to limit the protection of this utility model. Any non-substantial modifications made to this utility model using this concept should fall within the protection scope of this utility model.

Claims

1. A multi-channel, long-distance transmitting optical engine structure, comprising a transmitter group, a wavelength division multiplexing group, and an adapter group, characterized in that: The transmitting group includes a base on which several transmitting units are arranged. Each transmitting unit includes several CW light sources, a silicon photonic chip, and an optical fiber array. The CW light sources are used to output optical signals. The silicon photonic chip is used to receive the optical signals output by the CW light sources, split each input optical signal, add a modulation signal, and output the signal. The optical fiber array is used to couple the optical signals output by the silicon photonic chip into the wavelength division multiplexing group. The wavelength division multiplexing group includes several wavelength division multiplexers. Each wavelength division multiplexer is used to receive optical signals output from different CW light sources and split and modulated by a silicon photonics chip, and output multiple optical signals of different wavelengths to the adapter group through a single optical fiber. The adapter group includes several adapters corresponding to the number of wavelength division multiplexers. The adapters serve as external optical fiber connection interfaces and are used to transmit the optical signals output by the corresponding wavelength division multiplexers to the external optical fiber.

2. The multi-channel long-distance transmitting optical engine structure as described in claim 1, characterized in that, The wavelength division multiplexing group includes a support frame for fixing several wavelength division multiplexers in a stacked manner.

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