Lightweight virtual camera

CN224909546UActive Publication Date: 2026-10-27JIANGSU HANLICHEN DIGITAL TECH CO LTD
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Patent Information

Application Number
CN202522136619.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-10-10
Publication Date
2026-10-27
Estimated Expiration
2035-10-10

AI Technical Summary

Technical Problem

[0006]为了解决现有防滑梯级存在的问题,本实用新型提供一种防滑梯级,包括梯级本体和防滑结构

Benefits of technology

[0017]本实用新型的有益效果在于:通过将彩色摄像头模组可分离地安装在半导体散热模块的散热面上,并采用磁吸接口实现物理固定与供电连接,无需借助螺丝、卡扣等工具即可完成摄像头模组的拆装。用户可根据虚拟现实拍摄场景的需求(如视场角调整、分辨率切换),快速更换不同参数的摄像头模组,显著简化了设备维护与功能扩展的操作流程,提升了装置对多样化应用场景的适配能力。

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Abstract

The application relates to the field of shooting devices, in particular to a lightweight virtual shooting device. The scheme of the application comprises a processor, at least two color camera modules, a video output interface for connecting a virtual reality display device and a semiconductor heat dissipation module; the color camera modules are detachably mounted on the heat dissipation surface of the semiconductor heat dissipation module and are connected with an adapter module through a magnetic suction interface to obtain power supply; each color camera module comprises a temperature sensor and a wireless communication unit; the temperature sensor is connected with the wireless communication unit and is used for transmitting temperature information to the outside through the wireless communication unit. The color camera modules are directly mounted on the heat dissipation surface of the semiconductor heat dissipation module, so that the heat generated by the camera during operation can be directly conducted to the heat dissipation module through physical contact; in combination with the active heat dissipation capacity of the semiconductor heat dissipation module, the problem of local overheating of the camera in a traditional device is effectively solved.
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Description

Technical Field

[0001] This utility model relates to the field of shooting devices, specifically to a lightweight virtual shooting device. Background Technology

[0002] With the rapid development of virtual reality (VR) technology, virtual reality display devices (such as VR headsets and VR all-in-one machines) have been widely used in fields such as gaming, education and training, medical simulation, and industrial simulation. To achieve an immersive virtual reality experience, a dedicated video shooting device is usually required to collect video data of the real scene and transmit it to the virtual reality display device. Through 3D reconstruction, field-of-view matching, and other processing, a virtual environment synchronized with the user's perspective is constructed.

[0003] Currently, lightweight virtual shooting devices mostly employ a multi-camera module collaborative approach. This involves using at least two color camera modules to capture video data from different angles. After preprocessing such as stitching and distortion correction by a processor, the data is transmitted to a virtual reality display device via a video output interface. However, existing video shooting devices still have the following shortcomings: Camera module installation and maintenance are inconvenient: existing devices mostly use fixed installation methods for camera modules (such as screw fastening and snap-fit ​​connection). When it is necessary to replace the camera with different parameters (such as adjusting the field of view and resolution) to adapt to different shooting scenarios, it is necessary to disassemble the device shell or special fixing structure, which is cumbersome and can easily cause mechanical damage to the equipment.

[0004] Insufficient heat dissipation: The image sensor, processing chip and other components in the camera module will generate a lot of heat when shooting at high frame rate and high resolution. Existing devices mostly use passive heat dissipation (such as heat sinks) or centralized active heat dissipation (such as a single fan), which makes it difficult to accurately dissipate heat for each camera module. This can easily lead to unstable camera operation, increased image noise or even hardware damage due to local overheating.

[0005] Therefore, given the shortcomings of existing lightweight virtual shooting devices in terms of installation flexibility, heat dissipation efficiency, temperature monitoring, and connection reliability, there is an urgent need for an improved technical solution to enhance the adaptability, stability, and service life of the equipment. Utility Model Content

[0006] In order to solve the problems of existing anti-slip ladder steps, this utility model provides an anti-slip ladder step, including a ladder body and an anti-slip structure.

[0007] The technical solution adopted by this utility model to solve its technical problem is: to provide a lightweight virtual shooting device, including a processor, at least two color camera modules, a video output interface for connecting to a virtual reality display device, and a semiconductor heat dissipation module; The at least two color camera modules and the video output interface are all connected to the processor; The color camera module can be detachably mounted on the heat dissipation surface of the semiconductor heat dissipation module and connected to the adapter module via a magnetic interface to obtain power. Each of the color camera modules includes a temperature sensor and a wireless communication unit. The temperature sensor is connected to the wireless communication unit and is used to transmit temperature information to the outside through the wireless communication unit.

[0008] It also includes an adapter module integrated into the magnetic interface female of the semiconductor heat dissipation module; the adapter module includes a group of elastic contacts that are adapted to the male of the magnetic interface of the color camera module, and the group of elastic contacts is connected to the processor through a flexible flat cable; the group of elastic contacts includes power supply contacts, data transmission contacts and positioning calibration contacts, wherein the positioning calibration contacts are preferentially turned on when the camera module is magnetically attached, triggering the processor to perform identity recognition and communication protocol matching of the camera module.

[0009] The video output interface is an HDMI interface, a DP interface, or a Type-C interface.

[0010] It also includes a communication unit for communicating with the server, the communication unit being connected to the processor.

[0011] It also includes a charging interface, a battery, and a power management chip. The charging interface is connected to the power management chip, and the battery is connected to the power management chip. The power management chip is used to supply power to the processor, the color camera module, and the semiconductor heat dissipation module.

[0012] The charging interface is a USB interface.

[0013] The data pins of the USB interface are also connected to the processor.

[0014] The semiconductor heat dissipation module includes a semiconductor cooling chip, heat dissipation fins, and a micro fan, with the semiconductor cooling chip connected to the processor.

[0015] The color camera module transmits data to the processor via the magnetic interface.

[0016] The wireless communication unit is a Bluetooth module, and the Bluetooth module is a Bluetooth BLE 5.0 module.

[0017] The beneficial effects of this invention are as follows: By detachably mounting the color camera module on the heat dissipation surface of the semiconductor heat dissipation module and using a magnetic interface for physical fixation and power supply connection, the camera module can be assembled and disassembled without the need for screws, clips, or other tools. Users can quickly replace camera modules with different parameters according to the needs of virtual reality shooting scenarios (such as field of view adjustment and resolution switching), significantly simplifying the operation process of equipment maintenance and function expansion, and improving the device's adaptability to diverse application scenarios.

[0018] The color camera module is directly mounted on the heat dissipation surface of the semiconductor heat dissipation module, allowing the heat generated by the camera during operation to be directly conducted to the heat dissipation module through physical contact. Combined with the active heat dissipation capability of the semiconductor heat dissipation module, this effectively solves the problem of localized overheating of the camera in traditional devices. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the virtual shooting device in Embodiment 1 of this application; Figure 2 This is a schematic diagram of the structure of the color camera module in Embodiment 1 of this application; Figure 3 This is a schematic diagram of the virtual shooting device in Embodiment 2 of this application. Detailed Implementation The present application will be further described in detail below with reference to the accompanying drawings, so that those skilled in the art can better understand and implement the present invention, but the embodiments described are not intended to limit the present invention.

[0020] Example 1: As Figure 1-2 As shown, Embodiment 1 of this utility model discloses a lightweight virtual shooting device. The device achieves efficient heat dissipation and flexible expansion through modular design, specifically including: a processor 1, at least two color camera modules 2, a video output interface 3, a semiconductor heat dissipation module 4, and an adapter module 6.

[0021] Processor 1 can be a high-performance embedded processor (such as an ARM architecture processor) that integrates a video encoding / decoding unit, a communication interface controller, and a logic control unit. It is used to receive video data collected by the color camera module 2 and perform preprocessing, while coordinating the working status of each module.

[0022] The number of color camera modules 2 is 2-4 (configured according to the field of view requirements of virtual reality shooting). Each camera module 2 includes a lens assembly 21, an image sensor 22, a temperature sensor 23, a wireless communication unit 24, and a magnetic interface male connector 25. Among them: the lens assembly 21 adopts a wide-angle fisheye lens to adapt to the large field of view shooting requirements of virtual reality scenes; the image sensor 22 adopts a CMOS sensor to convert optical signals into electrical signals; the temperature sensor 23 (such as an NTC thermistor) is set close to the image sensor 22 to detect the sensor's operating temperature in real time; the wireless communication unit 24 adopts a Bluetooth BLE 5.0 module, which is electrically connected to the temperature sensor 23 and wirelessly transmits temperature data to the wireless receiver of the processor 1; the magnetic interface male connector 25 is a metal contact structure, located on the back of the camera module 2, and is adapted to the magnetic interface female connector of the semiconductor heat dissipation module 4.

[0023] The semiconductor heat dissipation module 4 includes a thermoelectric cooler, heat sink fins, a miniature cooling fan, and a magnetic connector. The cold side of the thermoelectric cooler serves as the mounting reference surface for the camera module 2, and a magnetic connector is mounted on its surface. The heat sink fins are in contact with the hot side of the thermoelectric cooler, and a miniature cooling fan is located on one side of the heat sink fins to accelerate heat dissipation. The magnetic connector has a built-in strong magnet that can be attracted and fixed to the magnetic connector male 25 of the camera module 2, enabling the camera module 2 to be detachably installed.

[0024] The adapter module 6 is integrated into the internal cavity of the magnetic interface socket and includes a group of elastic contacts and a flexible flat cable. The elastic contact group is composed of metal springs and is divided into three groups according to function: power supply contacts, data transmission contacts, and positioning calibration contacts. Specifically: the power supply contacts transmit the operating voltage (e.g., 5V DC) to power the camera module 2; the data transmission contacts use the MIPI-CSI protocol interface to transmit the raw video data output by the image sensor 22; the positioning calibration contacts are positioned higher than the power supply and data transmission contacts, and during the adsorption process between the camera module 2 and the magnetic interface socket, the positioning calibration contacts make contact and conduct first. The elastic contact group is electrically connected to the processor 1 via the flexible flat cable, which is bend-resistant and adapts to the frequent disassembly and reassembly of the camera module 2.

[0025] The wireless receiving module is paired with the wireless communication unit 24 of the camera module 2. When the camera module 2 is attached to the semiconductor heat dissipation module 4, the positioning calibration contact is turned on first, triggering the processor 1 to start the identification process: the unique identification information (such as chip ID) of the camera module 2 is read through the data transmission contact, and the corresponding communication protocol (such as resolution and frame rate parameters) is automatically matched. After the configuration is completed, the power supply contact and the data transmission contact are officially turned on, realizing stable power supply and video data transmission.

[0026] The video output interface 3 can be selected as an HDMI 2.1 interface, a DP 1.4 interface, or a Type-C interface (supporting DisplayPort Alt mode), which is electrically connected to the video output end of the processor 1 and is used to transmit the pre-processed video data to virtual reality display devices (such as VR headsets) to meet the real-time display requirements of virtual reality scenes.

[0027] The working process of this embodiment is as follows: When the color camera module 2 is attached to the semiconductor heat dissipation module 4, the identity recognition and protocol matching are completed by prioritizing the conduction of the positioning calibration contact. Then, power is obtained through the power supply contact. The video data collected by the image sensor 22 is transmitted to the processor 1 through the data transmission contact and the flexible flat cable. At the same time, the temperature data detected by the temperature sensor 23 is sent to the processor 1 in real time through the wireless communication unit 24. If the temperature exceeds the threshold (e.g., 45°C), the processor 1 controls the semiconductor cooling chip and the micro heat dissipation fan to increase the heat dissipation power. The video data processed by the processor 1 is transmitted to the virtual reality display device through the video output interface 3 to realize the shooting and display of virtual reality scenes.

[0028] Example 2: Figure 3 As shown, this embodiment 2, based on the above embodiment 1, further adds remote communication, independent power supply, and intelligent heat dissipation control functions. Its specific structure is as follows: The video recording device also includes a communication unit 7, a charging interface 8, a battery 9, and a power management chip 10. The communication unit 7 uses a Wi-Fi 6 module or a 4G / 5G cellular communication module, and is electrically connected to the processor 1 via an SPI interface. It is used to upload pre-processed video data or device status information (such as temperature and battery level) to a remote server, and can also receive control commands from the server (such as shooting parameter adjustment and firmware upgrade commands), enabling networked management of the device.

[0029] Charging port 8 is a USB Type-C interface. Its power pin is connected to the input terminal of the power management chip 10, and its data pin is connected to the general-purpose input / output interface of the processor 1 through a USB-HUB chip, enabling this interface to simultaneously perform charging and data transmission functions (such as connecting to an external storage device to export video files, or communicating with a server via a wired connection). Battery 9 uses a 1000mAh lithium polymer battery, whose positive and negative terminals are connected to the energy storage terminal of the power management chip 10 through a protection module, providing the device with 3-4 hours of battery life when disconnected from an external power source.

[0030] The output of the power management chip 10 is electrically connected to the processor 1, the magnetic interface socket (power supply contact) of the color camera module 2, the semiconductor cooling chip of the semiconductor heat dissipation module 4, and a miniature fan through multiple sets of DC-DC conversion modules, respectively, to achieve the following functions: It receives 5V DC power from charging interface 8 to charge battery 9 and power the entire device; Monitor the power status of battery 9 and feed back power data to processor 1 via I2C bus; The output power is dynamically allocated according to the instructions of the processor 1. For example, when the camera module 2 is working at full load, the power supply of the semiconductor cooling chip is automatically increased.

[0031] The structure of the semiconductor heat dissipation module 4 is further defined as follows: the control terminal of the semiconductor cooling chip (such as TEC1-12706) is connected to the processor 1 via a PWM signal line; the heat dissipation fins adopt an aluminum comb-shaped structure (surface area ≥100cm²); and the drive module of the micro fan (speed 3000rpm) is connected to the controlled output terminal of the power management chip 10. When the processor 1 receives the temperature data (≥45℃) of the camera module 2 via the Bluetooth BLE5.0 module, it adjusts the operating current of the semiconductor cooling chip (0-3A) through the PWM signal and simultaneously starts the micro fan to accelerate heat dissipation; when the temperature is ≤30℃, it automatically reduces the cooling power or turns off the fan to save energy.

[0032] The data transmission path between the color camera module 2 and the processor 1 is further as follows: the image sensor 22 (such as IMX477) of the camera module 2 is connected to the data transmission contact of the magnetic interface male connector 25 through the onboard MIPI-CSI interface. When the camera module 2 is attached to the magnetic interface female connector, the data transmission contact is directly connected to the MIPI receiver of the processor 1 through a flexible flat cable.

[0033] The wireless communication unit 24 specifically adopts a Bluetooth BLE 5.0 module (such as CC2541), which is connected to the temperature sensor 23 (such as SHT30) through an I2C interface. It collects temperature data every 100ms and sends it in a broadcast manner. After receiving the data, the Bluetooth receiver of the processor 1 (which is set independently from the communication unit 7) combines the temperature feedback of the heat dissipation module 4 (collected by the NTC sensor on the main module board) to form a closed-loop temperature control logic.

[0034] The following is a supplementary explanation of the workflow in Example 2: When an external power source is connected via the USB Type-C interface 8, the power management chip 10 prioritizes charging the battery 9 while simultaneously powering the entire device. When the external power source is disconnected, the battery 9 continues to supply power through the power management chip 10, and the processor 1 displays the remaining battery level in real time. Video data can be transmitted to the VR device via video output interface 3, and simultaneously uploaded to the server via communication unit 7; during local debugging, data stored in processor 1 can be directly read via the data pin of USB Type-C interface 8. Processor 1 integrates the temperature data from camera module 2 (Bluetooth transmission) and heat dissipation module 4 (wired transmission), and dynamically adjusts the power of the semiconductor cooling chip and the speed of fan 44 through PWM signals to ensure that the device works stably in an environment of -10℃ to 50℃.

[0035] The above are all preferred embodiments of this application and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A lightweight virtual shooting device, characterized in that, It includes a processor, at least two color camera modules, a video output interface for connecting to a virtual reality display device, and a semiconductor heat dissipation module; The at least two color camera modules and the video output interface are all connected to the processor; The color camera module can be detachably mounted on the heat dissipation surface of the semiconductor heat dissipation module and is connected to the adapter module via a magnetic interface to obtain power. Each of the color camera modules includes a temperature sensor and a wireless communication unit. The temperature sensor is connected to the wireless communication unit and is used to transmit temperature information to the outside through the wireless communication unit.

2. The lightweight virtual shooting device according to claim 1, characterized in that, It also includes an adapter module integrated into the magnetic interface female of the semiconductor heat dissipation module; the adapter module includes a set of elastic contacts that are adapted to the magnetic interface male of the color camera module, and the set of elastic contacts is connected to the processor through a flexible flat cable; The elastic contact group includes power supply contacts, data transmission contacts, and positioning calibration contacts. The positioning calibration contacts are preferentially turned on when the camera module is magnetically attached, triggering the processor to perform identity recognition and communication protocol matching on the camera module.

3. The lightweight virtual shooting device according to claim 1, characterized in that, The video output interface is an HDMI interface, a DP interface, or a Type-C interface.

4. The lightweight virtual shooting device according to claim 1, characterized in that, It also includes a communication unit for communicating with the server, the communication unit being connected to the processor.

5. The lightweight virtual shooting device according to claim 1, characterized in that, It also includes a charging interface, a battery, and a power management chip. The charging interface is connected to the power management chip, and the battery is connected to the power management chip. The power management chip is used to supply power to the processor, the color camera module, and the semiconductor heat dissipation module.

6. The lightweight virtual shooting device according to claim 5, characterized in that, The charging interface is a USB interface.

7. The lightweight virtual shooting device according to claim 6, characterized in that, The data pins of the USB interface are also connected to the processor.

8. The lightweight virtual shooting device according to claim 1, characterized in that, The semiconductor heat dissipation module includes a semiconductor cooling chip, heat dissipation fins, and a micro fan, with the semiconductor cooling chip connected to the processor.

9. The lightweight virtual shooting device according to claim 1, characterized in that, The color camera module transmits data to the processor via the magnetic interface.

10. The lightweight virtual shooting device according to claim 1, characterized in that, The wireless communication unit is a Bluetooth module, and the Bluetooth module is a Bluetooth BLE 5.0 module.