Speaker formed with thin film conductor

Abstract

The utility model discloses a loudspeaker formed with film conductor, which is characterized in that comprising: voice coil (50), film conductor (60) is connected with voice coil (50), diaphragm (70) is installed on the upper surface of film conductor (60), the joint temperature T_low of diaphragm (70) bonded with film conductor (60) is lower than the joint temperature T_high of voice coil (50) and film conductor (60), and the electrode part is in a straight line, a circular arc shape or a curve shape.

Description

Technical Field

[0001] This utility model relates to a loudspeaker in which a thin film conductor is formed between the voice coil and the diaphragm. Background Technology

[0002] Generally, a loudspeaker is an audio device that converts electrical signals into the vibration of a diaphragm, producing sound waves by generating compression and rarefaction waves in the air. In other words, a loudspeaker is a device that converts electrical energy into sound energy, primarily composed of a vibration system, a support system, and a magnetic circuit system. Loudspeakers can be classified into various types based on the placement and shape of the diaphragm (vibration system component) and the principle and method of converting electrical signals into sound waves. In particular, loudspeakers used in display devices such as televisions are radiating loudspeakers where the diaphragm is directly placed in the air. They typically operate on the following principle: when an audio signal current is passed through a coil within a magnetic field formed by a permanent magnet, mechanical force acts on the coil according to the intensity of the current, causing it to move.

[0003] In recent years, there has been a problem in the manufacturing process of loudspeakers where heat-sensitive diaphragms age or deform due to heat, resulting in a decrease in loudspeaker performance or durability. Utility Model Content

[0004] The purpose of this invention is to solve the above problems. In order to avoid direct bonding between the voice coil and the diaphragm, a thin film conductor is added as an intermediate medium to protect the loudspeaker, including the diaphragm, from the effects of bonding temperature during the manufacturing process. The invention also aims to realize electrode parts of various shapes through the thin film conductor.

[0005] A loudspeaker with a thin film conductor according to an embodiment of the present invention includes: a voice coil 50; a thin film conductor 60 joined to the voice coil 50; and a diaphragm 70 mounted on top of the thin film conductor 60; wherein the joining temperature T_low of the diaphragm 70 joined to the thin film conductor 60 is lower than the joining temperature T_high of the voice coil 50 and the thin film conductor 60.

[0006] In addition, the thin film conductor 60 is arranged parallel to the inner circumferential surface of the diaphragm 70.

[0007] In addition, the thin film conductor 60 has a circular arc shape with a certain width.

[0008] In addition, electrode portions 62, which extend from an arc surface of a certain width for energizing the voice coil 50, electrode surface contact portions 64, which extend from the electrode portions toward the center and protrude therein, and electrode end portions that extend from the electrode portions toward the direction away from the center to connect to the PCB are formed on the thin film conductor 60.

[0009] In addition, the electrode portions 62 of electrodes A and B, and the electrode surface contact portions 64 extending from the electrode portions toward the center and protruding therein, are bonded to the underside of the diaphragm 70 at a bonding temperature T_low.

[0010] In addition, the electrode portions 62 of electrodes A and B are bonded along the curved shape of the diaphragm to achieve surface contact.

[0011] Another loudspeaker with a thin film conductor according to an embodiment of the present invention may have the following structure: a voice coil 50; a thin film conductor 60 joined to the voice coil 50; and a diaphragm 70 mounted on top of the thin film conductor 60, wherein the inner peripheral surfaces of the diaphragm 70 bonded to the thin film conductor 60 are parallel to each other, while the voice coil 50 bonded to the thin film conductor 60 may be orthogonal to each other.

[0012] According to an embodiment of the present invention, a loudspeaker manufacturing method having a thin-film conductor is provided. As a loudspeaker manufacturing method, the following steps may be included: at a bonding temperature T_high, a thin-film conductor 60 having a certain width and an arcuate surface shape is bonded to a voice coil 50 in a mutually perpendicular manner; at a bonding temperature T_low, the inner peripheral surface of a diaphragm 70 is bonded to a certain width of the thin-film conductor 60 in a mutually parallel surface contact manner, wherein the bonding temperature T_high > T_low. Attached Figure Description

[0013] Figure 1 This is an exploded view of the loudspeaker according to the present invention.

[0014] Figure 2 This is a cross-sectional view obtained by cutting the loudspeaker according to the present invention along the thin film conductor 60.

[0015] Figure 3 This utility model has a structure in which the diaphragm is covered with a dust cover.

[0016] Figure 4 This is the structure in this utility model where the thin film conductor 60 is bonded to the voice coil 50.

[0017] Figure 5 As for the lower shape of the speaker diaphragm in this utility model, it is from Figure 4 The structure of voice coil 50 is omitted.

[0018] Figure 6 This is a view of the structure of the speaker diaphragm of this utility model from the bottom.

[0019] Figure 7 The diagram shows the cross-sectional structure of the loudspeaker diaphragm of this invention, and the enlarged view is a diagram that distinguishes the diaphragm and the electrode section.

[0020] Figure 8The electrode portion 62 of this utility model, including the electrode surface contact portion 64 and the electrode end portion 66, has a 180-degree structure.

[0021] Figure 9 The electrode portion 62 of this utility model, including the electrode surface contact portion 64 and the electrode end portion 66, has a 90-degree structure.

[0022] Figure 10 The electrode portion in this utility model has a curved shape.

[0023] Figure 11 The electrode part in this utility model has an arc shape. Detailed Implementation

[0024] Figure 1 This is an exploded view of the loudspeaker according to the present invention. The loudspeaker frame 10 is in the shape of a circular container, with a circumferential wall of a certain height formed along the circumference, serving as the lower housing for accommodating the accessories described later. A portion of the circumferential wall of the loudspeaker frame 10 is missing, and a PCB is located on this circumference for controlling the voice coil.

[0025] The speaker frame is hollow within a certain radius from the center, and a yoke 20 is formed in the hollow part of the circular plate. The yoke 20 forms a recessed receiving part, is inserted into the hollow part formed in the center of the speaker frame, and is formed in an integral form.

[0026] Magnet 30 is located at yoke 20 and is mounted on yoke 20 in the shape of a disc with a certain thickness. The outer diameter of magnet 30 is smaller than the inner diameter of yoke 20. A circular plate 40 is provided above magnet 30. The diameter of the circular plate is the same as the diameter of magnet. Therefore, magnet 30 is located inside yoke 20, and circular plate 40 is located above magnet.

[0027] The voice coil 50 is formed along the circumference of the circular plate 40. Above the voice coil of this invention, a thin-film conductor 60 is joined to the voice coil. The thin-film conductor 60 is joined to the voice coil below and also to the diaphragm 70 above. More specifically, the thin-film conductor 60 and the lower part of the diaphragm 70 are integrally joined. The joining temperature between the upper part of the voice coil and the thin-film conductor 60, i.e., the heat fusion temperature, can be, for example, several hundred degrees Celsius (hereinafter referred to as T_high), while the joining temperature between the thin-film conductor 60 and the diaphragm 70, i.e., the heat fusion temperature, is, for example, below 100 degrees Celsius (hereinafter referred to as T_low).

[0028] In other words, the bonding of the thin-film conductor 60 to the voice coil 50 takes place within the T_high temperature range, while the bonding of the thin-film conductor 60 to the diaphragm 70 takes place within the T_low temperature range. T_high and T_low are related to the diaphragm material; the bonding of the thin-film conductor 60 and the diaphragm 70 occurs within the T_low temperature range, where the diaphragm material is unaffected by the bonding temperature. At temperatures where the diaphragm material may be affected by the bonding temperature, direct bonding between the voice coil 50 and the diaphragm 70 should be avoided. Instead, the bonding of the thin-film conductor 60 and the voice coil 50 should be performed within the T_high temperature range, provided that the diaphragm material is unaffected by the bonding temperature.

[0029] On the other hand, the thin film conductor 60 and the diaphragm 70 are bonded within the bonding temperature range T_low. The electrode end portion 66 of the thin film conductor 60, described later, is also bonded within the T_low temperature range.

[0030] The thin-film conductor 60 is in the shape of two flat half-rings, with their undersides connected to the voice coil 50. The thin-film conductor 60 and the voice coil 50 are not directly connected, but rather joined by thermal fusion. To achieve this connection, additional electrode surface contacts need to be formed on the thin-film conductor 60. These electrode surface contacts will be described in detail below. The thin-film conductor 60 is a structure separated into two parts along electrodes A and B. If the number of thin-film conductors increases in an even number, the required number of electrode surface contacts also increases accordingly.

[0031] The term "flat semi-circular shape" refers to a thin-film disk shape with a rectangular cross-section. To connect the thin-film conductor to an external power source, two additional semi-circular electrode portions 62 are formed, each attached to the underside of the diaphragm and extending to connect to the PCB of the speaker frame 10 for conduction. A dust cover 80 is formed in the hollow portion at the center of the diaphragm 70, and the dust cover 80 can be mounted on the inner circumferential surface formed along the hollow portion of the diaphragm 70.

[0032] Figure 2 This is a cross-sectional view of the loudspeaker according to the present invention cut along the longitudinal direction. Through this cross-sectional view, the shape of the thin film conductor 60 engaging downwards with the voice coil 50 and upwards with the diaphragm 70 can be understood.

[0033] The circular container-shaped speaker frame 10 is divided into a lower part that houses the yoke 20 and an upper part that supports the diaphragm 70. The yoke 20, mounted in the lower part of the speaker frame, is circular and houses the magnet 30 and a circular plate 40. The circular plate 40 supports an electromagnet generated by the voice coil relative to the magnet 30, allowing it to move up and down along the yoke 20. The voice coil 50, wound around the outer circumference of the circular plate 40, operates as an electromagnet using electricity supplied through the PCB, thereby controlling the relative movement of the voice coil 50 relative to the magnet 30.

[0034] The magnet 30, the circular plate 40, and the voice coil 50 inside the yoke 20 can all maintain a gap with the inner circumferential surface of the yoke. This is to allow the voice coil 50 to move up and down, while the magnet is attached or fixed to be installed inside the yoke.

[0035] A thin-film conductor 60 is provided at the upper end of the voice coil 50. The thin-film conductor 60 is vertically attached to the upper end of the voice coil in a manner parallel to the top of the circular plate 40. An electrode portion 62, consisting of electrodes A and B, is connected to the PCB from the thin-film conductor 60. In order to ensure the electrical contact area between the voice coil, the electrode portion, and the thin-film conductor, an electrode surface contact portion 64 protruding towards the center of the diaphragm is formed on the inner side of the thin-film conductor.

[0036] The electrode contact portion 64, like the thin-film conductor, is also flat and is formed on each of the annular semi-rings. The thin-film conductor 60 is in the shape of two semi-rings, which are flat arc surfaces with a certain width.

[0037] In addition, to ensure sufficient contact area between the electrode section and the PCB, an electrode end portion 66 is formed at the end of each electrode section. The electrode surface contact portion 64 and electrode end portion 66, which are additionally formed on each electrode section of electrode A and electrode B, are both formed on a straight line extending from the center of the diaphragm. Since the diaphragm moves up and down with the voice coil, it is necessary to ensure sufficient contact area between the diaphragm and the PCB.

[0038] The electrode ends 66, additionally formed on electrodes A and B of electrode section 62, are connected between the upper and lower parts of the speaker frame 10 for stable support, and inserted into the gap between the upper and lower parts of the speaker frame. They are fixed by the interlocking of the upper and lower parts of the speaker frame, and then the PCB is powered through a power supply device connecting the upper and lower parts of the speaker frame. The power supply device can be a conductive structure or component.

[0039] Electrode portions 62 for external power supply are formed on the two thin-film conductors 60 respectively, and the electrode portions can have various shapes in terms of function.

[0040] The electrode portions 62 of electrodes A and B are adhered to the underside of the diaphragm to support it. In order to move up and down with the movement of the voice coil 50, the diaphragm 70 has a radially formed, elastic crest and trough curved shape. The curved shape refers to a smoothly curved surface; the diaphragm can form crests and troughs with smooth curves.

[0041] The electrode portions of electrodes A and B can be joined along the curved shape of the diaphragm. That is, in order for the electrode portions to make surface contact with the underside of the diaphragm along the curved shape of the diaphragm, the electrode portions must have the same shape as the curved shape of the diaphragm.

[0042] Figure 3 and Figure 4 In this invention, flat, semi-annular thin-film conductors 60 are respectively bonded to the voice coil 50. As a structure to protect the diaphragm during welding inside the diaphragm, existing technologies may cause the diaphragm to melt or deform when welding is performed above it. This invention, however, uses a structure that forms a hollow portion on the diaphragm, bonds the voice coil 50 to the thin-film conductors 60 at a specific bonding temperature, and then covers the diaphragm for bonding. The underside of the diaphragm can be supported by the radial width of the thin-film conductors; the larger the radial width of the thin-film conductors, the wider the supported area, thus providing stable support for the diaphragm.

[0043] Figure 3 It is the upper structure covering the diaphragm 70 and the dust cover 80 on the speaker frame 10. When viewed from above, the thin film conductor 60 is obscured by the dust cover and is not visible. Figure 4 This is the lower structure of the diaphragm, with the electrode end portion 66 attached to the underside of the diaphragm. Figure 3 and Figure 4 In this configuration, the electrode portions of electrodes A and B can be configured to engage in surface contact beneath the diaphragm along its curved shape.

[0044] A thin-film conductor 60 is vertically joined to the end of the voice coil 50 along its circumference and is joined to the hollow diaphragm 70 in a surface-contact support manner. That is, when the thin-film conductor 60, which has a flat, disc-shaped cross-section, is joined, its horizontal direction is perpendicular to the vertical direction of the voice coil 50 at its end. In addition, an electrode portion 62 is formed so as to stably support the diaphragm in surface contact along the hollow diaphragm, while being connected to the voice coil and an external power source.

[0045] On the thin film conductor 60, relative to the two semi-annular thin film conductors 60, electrode surface contact portions 64 protruding toward the center of the diaphragm 70 are formed respectively. The electrode surface contact portions 64, electrode portions 62 and electrode end portions 66 formed on the two semi-annular thin film conductors 60 may have the same cross-sectional thickness and be radially linearly distributed along the center of the diaphragm.

[0046] Figure 5 The lower part of the diaphragm is shaped such that a thin film conductor 60 is joined to the underside of the diaphragm 70 in a surface-to-surface manner, and a dust cover 80 is provided on the opposite side.

[0047] The thin-film conductor 60 is in the shape of two flat half-rings, which are discs with a rectangular cross-section. The bottom of the thin-film conductor 60 is engaged with the voice coil and is connected to the voice coil through the electrode surface contact portion 64. In order to make the thin-film conductor 60 connected to the PCB to which an external power supply is applied, the thin-film conductor 60 extends from the electrode surface contact portion 64 through the electrode portion 62 to the electrode end portion 66, and is engaged with the diaphragm 70 in a surface contact manner.

[0048] Figure 6 Two thin-film conductors 60 are each formed with a 180-degree arc surface to communicate with the voice coil. The thin-film conductors 60 are additionally formed with an electrode surface contact portion 64 for communicating with the voice coil, and an electrode end portion 66 with a certain area for connecting to an external power source. Therefore, electrode portions 62 including the electrode surface contact portion 64 and the electrode end portion 66 are also formed.

[0049] The electrode contact portion 64 ensures additional area from the semi-annular thin-film conductor 60 toward the center of the diaphragm, thereby ensuring sufficient contact area for conduction with the voice coil during vibration. Similarly, the electrode end portion 66 also has a shape that is wider than the electrode portion 62 to ensure sufficient contact area with the PCB.

[0050] The electrode portion 62, including the electrode surface contact portion 64 and the electrode end portion 66, can be arranged at a certain angle relative to the center of the diaphragm, starting from each electrode of the semi-annular thin-film conductor 60. It is not limited to electrodes A and B; 2N electrodes (+ / -) can be arranged, i.e., an even number. If N = 1, there are 2 electrodes; if N > 1, 4, 6, or 8 electrodes can be arranged. Increasing the number of electrodes also increases the number of electrode surface contact portions, electrode portions, and electrode end portions. The more electrode surface contact portions, electrode portions, and electrode end portions that contact and support the entire circular diaphragm area, the more stable the diaphragm installation, maintaining a stable motion even during vertical movement.

[0051] Figure 7 This is a cross-sectional structure used to illustrate this content. It can be observed that the cross-sectional thickness of the diaphragm 70 with the electrode portion 62 to which the thin-film conductor 60 is attached is greater than the cross-sectional thickness of the diaphragm without the thin-film conductor 60. Upon magnification, it can be seen that the peaks (62_H) and troughs (62_L) of the thin-film conductor 60 are distinguishable from the peaks (72_H) and troughs (72_L) of the diaphragm 70 cross-section. At this time, the electrode contact portion 64 is located further inside the thin-film conductor 60 than the diaphragm, towards the center of the diaphragm, and the electrode end portion 66 is located at the edge of the diaphragm 70 for connection to the PCB. If the electrode portions are not biased towards one side of the diaphragm but are uniformly arranged along 360 degrees, a loudspeaker with more stable diaphragm movement can be manufactured.

[0052] Figure 8 The electrode portion 62, including the electrode surface contact portion 64 and the electrode end portion 66, is arranged at 180 degrees to each other. Figure 9 It has a 90-degree structure. Figure 8In the first electrode surface contact portion 64a, the first electrode portion 62a and the first electrode end portion 66a are at 180 degrees to the second electrode surface contact portion 64b, the second electrode portion 62b and the second electrode end portion 66b.

[0053] The electrode contact portion 64, electrode portion 62 and electrode end portion 66 formed by the two semi-annular thin film conductors 60 are arranged in a straight line.

[0054] exist Figure 9 In the middle, the third electrode surface contact portion 64c, the third electrode portion 62c and the third electrode end portion 66c also include a fourth electrode surface contact portion 64d, a fourth electrode portion 62d and a fourth electrode end portion 66d, which are at a 90-degree angle to each other.

[0055] Additionally, as the voice coil moves, the semi-annular thin-film conductor in direct contact with it travels along... Figure 8 and Figure 9 When the paper extends or retracts, the electrode parts 62a, 62b, 62c, and 62d are linked to the extension or retraction motion at four points.

[0056] The electrode portions 62a, 62b, 62c, and 62d are shaped to be integrated with or in contact with the diaphragm, and move in tandem with the diaphragm.

[0057] In other words, the thin film conductor 60 is not limited to two, but can be 2N (N>1) semi-ring shapes, and can be a flat arc surface with a certain width.

[0058] In essence, what affects the stable movement of the diaphragm is the electrode section that supports the curved shape.

[0059] Figure 10 This is one embodiment of the electrode portion of the present invention, wherein the electrode portion includes a curved portion 82. The electrode portion has the same thickness as the thin film conductor and is formed to a certain area so as to adhere and join with the underside of the diaphragm along the curved shape. Regarding... Figure 10 The electrode section, when connecting the electrode surface contact section and the electrode end section, is different from the aforementioned electrode section 62 which is formed in a straight line radially starting from the center of the diaphragm; it is curved.

[0060] In other words, the electrode portion 82, including the electrode surface contact portion 84 and the electrode end portion 86, is configured to connect the thin film conductor 60 and the PCB. Although the positions of the electrode surface contact portion 84 and the electrode end portion 86 are the same as those of the linear electrode portion 62, Figure 10 The electrode portion is curved.

[0061] Figure 11 This is another embodiment of the electrode portion of this utility model, wherein the electrode portion includes an arc-shaped portion 92a. The arc-shaped portion 92a refers to an electrode portion with an arc shape. Regarding... Figure 11The electrode portion, when connecting the electrode surface contact portion and the electrode end portion, is different from the aforementioned electrode portion 62 and curved portion 82 which are formed in a straight line along the radial direction starting from the center of the diaphragm. A part of its electrode portion is an arc portion formed at a certain angle along the arc of the diaphragm.

[0062] The electrode portion 92, including the electrode surface contact portion 94 and the electrode end portion 96, is configured to connect the thin film conductor 60 and the PCB. Although the positions of the electrode surface contact portion 94 and the electrode end portion 96 are the same as those of the straight electrode portion 62, the arc portion 92a makes surface contact with the underside of the arc-shaped diaphragm that forms an angle relative to the center of the diaphragm, and in particular, it can be formed along the crests and troughs that constitute the wave shape of the diaphragm.

[0063] exist Figure 11 In order to connect the electrode surface contact portion 96 and the electrode end portion 96, not only is an arc portion 92a formed, but also a folding portion 92b that folds the arc portion back is formed. Through the arc portion 92a and the folding portion 92b, a structure in which the diaphragm is uniformly contacted and supported by the electrode can be achieved.

[0064] On the other hand, the thin-film conductor 60 of this invention can avoid the problem of diaphragm melting or deformation due to welding heat during the joining process of voice coil 50 and diaphragm 70. First, the thin-film conductor 60, whose inner circumferential surface formed along the hollow portion of the diaphragm is parallel to and in surface contact with the voice coil 50, is joined to the voice coil 50. That is, by adopting a structure in which the thin-film conductor 60 is joined to the voice coil 50 first, and then the diaphragm is mounted on top of the thin-film conductor 60, the heat required during the joining process of the thin-film conductor 60 and the voice coil 50 is not transferred to the diaphragm when it is subsequently joined to the thin-film conductor 60. This is generally because the joining temperature of the thin-film conductor 60 and the voice coil 50 is T_high, while the temperature at which the diaphragm is joined to the thin-film conductor 60 is T_low, and T_high > T_low.

Claims

1. A loudspeaker having a thin-film conductor formed thereon, characterized in that, include: Voice coil (50); A thin film conductor (60) is joined at a right angle to the upper end of the voice coil (50); A diaphragm (70) is surface-contacted and bonded to the thin-film conductor (60); The thin film conductor (60) is in the shape of two semi-rings and forms a flat arc surface with a certain width.

2. The loudspeaker with a thin-film conductor according to claim 1, characterized in that, Electrode portions (62) for external power supply are also formed on the two thin film conductors (60).

3. The loudspeaker with a thin-film conductor according to claim 2, characterized in that, The electrode portion has a curved shape so as to make surface contact with the underside of the diaphragm along the curved shape of the diaphragm.

4. The loudspeaker with a thin-film conductor according to claim 2, characterized in that, An electrode surface contact portion (64) is further formed on the thin film conductor (60), which protrudes from the two semi-annular thin film conductors (60) toward the center of the diaphragm (70).

5. The loudspeaker with a thin-film conductor formed according to claim 4, characterized in that, An electrode end portion (66) is further formed on the thin film conductor (60), which is located at the respective edges of the two semi-annular thin film conductors (60).

6. The loudspeaker with a thin-film conductor formed according to claim 5, characterized in that, The electrode contact portion (64), electrode portion (62) and electrode end portion (66) formed by each of the thin film conductors (60) have the same thickness and are radially linearly distributed along the center of the diaphragm (70).

7. The loudspeaker with a thin-film conductor formed according to claim 5, characterized in that, The electrode contact portion (64), electrode portion (62) and electrode end portion (66) formed by each of the thin film conductors (60) have the same thickness, and the electrode portion includes a curved portion (82) formed along the diaphragm.

8. The loudspeaker with a thin-film conductor according to claim 5, characterized in that, The electrode contact portion (64), electrode portion (62) and electrode end portion (66) formed by each of the thin film conductors (60) have the same thickness, and the electrode portion includes an arc portion (92a) formed along the diaphragm.

9. The loudspeaker with a thin-film conductor formed according to claim 8, characterized in that, The arc portion (92a) of the electrode is formed at a certain angle along the crest or trough of the wave that constitutes the curved shape of the diaphragm.

10. The loudspeaker with a thin-film conductor formed according to claim 8, characterized in that, The electrode section also includes a foldback section (92b), which is used to change the direction of the arc section (92a).

11. The loudspeaker with a thin-film conductor formed according to claim 1, characterized in that, The bonding temperature T_low between the thin film conductor (60) and the diaphragm (70) is lower than the bonding temperature T_high between the voice coil (50) and the thin film conductor (60).

12. A loudspeaker having a thin-film conductor formed thereon, characterized in that, include: Voice coil (50); A thin film conductor (60) is joined at a right angle to the upper end of the voice coil (50); A diaphragm (70) is surface-contacted and bonded to the thin-film conductor (60); The thin film conductor (60) is in the shape of 2N (N>1) semi-rings and forms a flat arc surface with a certain width.

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