Heat-generating core, liquid heater and liquid heating device

Abstract

The application provides a heating core, a liquid heater and a liquid heating device, and belongs to the field of liquid heating devices. The heating core comprises a base body, a heating element and a porous covering layer. The heating element is arranged on a first surface of the base body. The heating element comprises a heating part and an electrical connection part. The heating part is connected to the electrical connection part. The porous covering layer covers at least part of the surface of the heating part away from the base body. The porous covering layer is connected to the base body. By arranging the heating element and the porous covering layer on the first surface of the base body, covering at least part of the surface of the heating part away from the base body with the porous covering layer, and connecting the porous covering layer to the base body, the mist generating substrate in the base body can permeate into the porous covering layer. Part of the mist generating substrate can flow to the surface of the heating part away from the base body through the porous covering layer, so that the surface of the heating part away from the base body can also be infiltrated. Therefore, the local temperature of the surface of the heating part away from the base body can be prevented from being too high, and the generation of a burnt taste can be reduced.

Description

Technical Field

[0001] This application relates to the field of liquid heating devices, and particularly to a heating element, a liquid heater, and a liquid heating device. Background Technology

[0002] Common liquid heating devices include a liquid heater and a power supply component, with the liquid heater connected to the power supply component. During operation, the power supply component supplies power to the liquid heater. The liquid heater includes a liquid storage component and a heating element. The liquid storage component stores the mist-generating matrix, which seeps into the heating element. During operation, the heating element generates heat, thereby heating the mist-generating matrix to produce mist.

[0003] The heating element consists of a substrate and a heating element. During the operation of the liquid heating device, the mist-generating matrix seeps into the substrate and forms mist under the heating action of the heating element. The heating element is usually located on the surface of the substrate. The mist-generating matrix seeping out from the substrate has difficulty wetting the surface of the heating element facing away from the substrate, which can easily lead to excessively high local temperatures in the heating element, resulting in a burnt smell. Utility Model Content

[0004] This application provides a heating element, a liquid heater, and a liquid heating device, which helps to avoid excessively high local temperatures in the heating element and reduce the generation of a burnt smell. The technical solution is as follows: In a first aspect, embodiments of this application provide a heating element, which includes a substrate, a heating element, and a porous covering layer. The heating element is disposed on a first surface of the substrate and includes a heating part and a power receiving part. The heating part is connected to the power receiving part. The porous covering layer covers at least a portion of the surface of the heating part facing away from the substrate and is connected to the substrate.

[0005] In some examples, the first surface has a first groove, the heating element is located in the first groove, and the surface of the heating element facing away from the substrate is lower than the first surface.

[0006] In some examples, the distance between the surface of the heating element facing away from the substrate and the first surface is 0.1 mm to 0.3 mm.

[0007] In some examples, the depth of the first groove is 15% to 25% of the thickness of the substrate, and the depth direction of the first groove and the thickness direction of the substrate are both perpendicular to the first surface.

[0008] In some examples, the surface of the porous capping layer facing away from the substrate is not higher than the first surface.

[0009] In some examples, the shape of the orthographic projection of the first groove onto the first surface is the same as the shape of the orthographic projection of the heating element onto the first surface.

[0010] In some examples, the thickness of the porous capping layer is 20 μm to 100 μm.

[0011] In some examples, the average pore size of the porous capping layer is smaller than the average pore size of the substrate.

[0012] In some examples, the average pore size of the porous capping layer ranges from 5 μm to 20 μm; the average pore size of the substrate ranges from 10 μm to 50 μm.

[0013] In some examples, the porous capping layer is sintered to the substrate.

[0014] In some examples, the porosity of the matrix is ​​40% to 65%.

[0015] Secondly, embodiments of this application also provide a liquid heater, the liquid heater including a liquid storage component and a heating element as described in the first aspect, the heating element being located in the liquid storage component.

[0016] Thirdly, embodiments of this application also provide a liquid heating device, which includes a power supply component and a liquid heater as described in the second aspect, wherein the power supply component is used to supply power to the heating element of the liquid heater.

[0017] The beneficial effects of the technical solutions provided in this application include at least the following: By providing a heating element and a porous covering layer on the first surface of the substrate, the porous covering layer covers at least a portion of the surface of the heating element facing away from the substrate. The porous covering layer is also connected to the substrate, allowing the mist-generating matrix in the substrate to permeate into the porous covering layer. Through the porous covering layer, some of the mist-generating matrix can flow to the surface of the heating element facing away from the substrate, thus wetting the surface of the heating element facing away from the substrate. This can prevent the local temperature of the surface of the heating element facing away from the substrate from becoming too high and reduce the generation of burnt odor. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of a heating element provided in an embodiment of this application; Figure 2 This is a schematic diagram of the internal structure of a heating element provided in an embodiment of this application; Figure 3 This is a flowchart illustrating a method for preparing a heating element according to an embodiment of this application; Figure 4 This is a schematic diagram illustrating the manufacturing process of a heating element provided in an embodiment of this application; Figure 5 This is a schematic diagram of the structure of a liquid heating device provided in an embodiment of this application; Figure 6 This is a schematic diagram of the internal structure of a liquid heating device provided in an embodiment of this application.

[0020] Icon labels: 01-Green body; 03-Porous media slurry layer; 10-Substrate; 10a-First surface; 10b-Second surface; 10c-First groove; 10d-Second groove; 20 - Heating element; 21 - Heating section; 22 - Electrical connection section; 30 - Porous capping layer; 40 - Heating element; 100 - Power supply assembly; 101 - Bracket; 101a - Docking slot; 101b - Airflow sensor mounting slot; 101c - Sensing air passage; 1014 - Air intake pipe; 102 - Airflow sensor; 103 - Circuit board; 1031 - Button; 1032 - Keycap; 104 - Battery; 105 - Display panel; 106 - First housing; 200-Liquid heater; 200a-Mist generation chamber; 200c-Lower sealing chamber; 210-Liquid storage assembly; 211-Liquid storage tank shell; 211a-Liquid storage tank; 225-First seal; 225b-Airflow channel; 226-Sealing base; 226a-Exhaust channel; 226b-Liquid inlet channel; 227-Electrode; 228-Adsorption element; 229-Second seal; 301-Second outer shell; 3011-Mouth; 302-End cap. Detailed Implementation

[0021] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that this application may also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods have been omitted so as not to obscure the description of this application with unnecessary detail.

[0022] It should also be understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0023] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0024] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0025] Furthermore, in the description of this application and the appended claims, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0026] References to "one embodiment" or "some embodiments" in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized. "A plurality" means two or more.

[0027] Figure 1 This is a schematic diagram of the structure of a heating element provided in an embodiment of this application, as shown below. Figure 1 As shown, the heating core includes a substrate 10, a heating element 20, and a porous covering layer 30.

[0028] For example, the substrate 10 can be made of ceramic. The substrate 10 is formed, for example, by sintering.

[0029] The substrate 10 can be a porous structure, and the substrate 10 can have opposite first surfaces 10a and second surfaces 10b. The mist generation matrix can penetrate into the substrate 10 from the second surface 10b.

[0030] A heating element 20 is disposed on a first surface 10a of the substrate 10. The heating element 20 includes a heating portion 21 and a contact portion 22, the heating portion 21 being connected to the contact portion 22. A porous covering layer 30 covers at least a portion of the surface of the heating portion 21 facing away from the substrate 10, and the porous covering layer 30 is connected to the substrate 10.

[0031] By providing a heating element 20 and a porous covering layer 30 on the first surface 10a of the substrate 10, the porous covering layer 30 covers at least a portion of the surface of the heating element 21 facing away from the substrate 10. The porous covering layer 30 is also connected to the substrate 10, allowing the mist-generating matrix in the substrate 10 to permeate into the porous covering layer 30. Through the porous covering layer 30, some of the mist-generating matrix can flow to the surface of the heating element 21 facing away from the substrate 10, so that the surface of the heating element 21 facing away from the substrate can also be wetted. This can prevent the local temperature of the surface of the heating element 21 facing away from the substrate 10 from becoming too high and reduce the generation of burnt smell.

[0032] Furthermore, when the flow of the liquid storage component in the liquid heating device to the mist generating matrix of the substrate 10 is interrupted, such as when the liquid heating device shakes or tilts during use, the mist generating matrix stored in the porous covering layer 30 can still be supplied to the heating element 21 for a period of time to reduce the occurrence of dry burning.

[0033] The heating element 20 refers to a structure used to generate heat when energized. The heat generated by the heating element 20 is primarily used to heat the mist-generating substrate, causing the substrate to transform into mist.

[0034] In some examples, the heating element 21 can be a mesh structure, that is, the heating element 21 is a heating mesh, which is beneficial to increasing the contact area between the mist generating matrix and the heating element 21.

[0035] For example, the heating element 21 can be a metal mesh, such as a nickel-chromium alloy mesh, i.e., a metal mesh made of nickel-chromium alloy material, or an iron-chromium-aluminum alloy mesh, i.e., a metal mesh made of iron-chromium-aluminum alloy material.

[0036] For example, the wire diameter of the metal mesh can be 0.05mm to 0.15mm.

[0037] The heating element 20 may include two electrical contacts 22, which may be arranged at intervals along the first direction X. The heating element 21 may be connected between the two electrical contacts 22. The electrical contacts 22 may be sheet-like to facilitate electrical connection with other circuit structures. The first direction X and the second direction Y are both parallel to the first surface 10a, and the first direction X and the second direction Y are perpendicular to each other.

[0038] like Figure 1 As shown, the first surface 10a of the substrate 10 may be provided with a first groove 10c, and the heating element 20 is located in the first groove 10c. The surface of the heating element 20 facing away from the substrate 10 is lower than the first surface 10a of the substrate 10.

[0039] The heating element 20 is the heating part in the heating core, and the heat generated by the heating element 20 during operation is conducted to the substrate 10. In related technologies, the heating element 20 is usually directly covered on the first surface 10a, which makes the first surface 10a prone to overheating, resulting in carbonization of the mist-generating matrix and the production of a large amount of burnt odor. The carbonized mist-generating matrix will also adhere to the surface of the substrate 10 for a long time, causing the liquid heating device to have a strong burnt odor during long-term use.

[0040] In the embodiments of this application, "lower than the first surface 10a of the substrate 10", "lower than the first surface 10a" or similar expressions mean that it is located in the first groove 10c and is located on the side of the first surface 10a near the bottom of the first groove 10c, that is, it is entirely located in the first groove 10c and is not flush with the first surface 10a; "higher than the first surface 10a of the substrate 10", "higher than the first surface 10a" or similar expressions mean that a part is located in the first groove 10c and another part is located outside the first groove 10c; "not higher than the first surface 10a of the substrate 10", "not higher than the first surface 10a" or similar expressions mean that it is entirely located in the first groove 10c, including being located in the first groove 10c and on the side of the first surface 10a near the bottom of the first groove 10c, or being located in the first groove 10c and flush with the first surface 10a.

[0041] Submerging the heating element 20 into the first groove 10c increases the distance between the heating element 20 and the first surface 10a, which helps to reduce the temperature of the first surface 10a and thus avoids the carbonization of the mist generation matrix caused by the excessively high temperature of the first surface 10a.

[0042] The fact that the surface of the heating element 20 facing away from the substrate 10 is lower than the first surface 10a of the substrate 10 means that the heating element 20 is entirely located in the first groove 10c and is not flush with the first surface 10a. This allows a certain amount of mist-generating matrix to be accommodated in the first groove 10c, and since this mist-generating matrix is ​​located on the surface of the heating element 20 facing away from the substrate 10, the heating element 20 can be kept wetted, preventing dry burning.

[0043] For example, the distance between the surface of the heating element 20 facing away from the substrate 10 and the first surface 10a of the substrate 10 is 0.1 mm to 0.3 mm.

[0044] The size of this distance affects the amount of mist-generating substrate that can be accommodated in the first groove 10c. A range of 0.1mm to 0.3mm can accommodate enough mist-generating substrate to wet the heating element 20, while avoiding excessive accumulation of mist-generating substrate in the first groove 10c that could affect mist generation or cause leakage of the mist-generating substrate.

[0045] In some examples, the depth of the first groove 10c is 15% to 25% of the thickness of the substrate 10. The depth direction of the first groove 10c and the thickness direction Z of the substrate 10 are both perpendicular to the first surface 10a; that is, the depth direction of the first groove 10c and the thickness direction Z of the substrate 10 are the same, both perpendicular to the first direction X and the second direction Y. Here, the thickness of the substrate 10 refers to the distance between the first surface 10a and the second surface 10b of the substrate 10.

[0046] For example, the depth of the first groove 10c is 15%, 20%, or 25% of the thickness of the substrate 10.

[0047] The depth of the first groove 10c is set to 15% to 25% of the thickness of the substrate 10, so that the heating element 20 is at a sufficient distance from the first surface 10a of the substrate 10, so as to avoid the temperature of the first surface 10a being too high, while at the same time, the first surface 10a of the substrate 10 can generate more mist.

[0048] like Figure 1 As shown, the shape of the first groove 10c projected onto the first surface 10a is the same as the shape of the heating element 20 projected onto the first surface 10a.

[0049] As an example, the orthographic projection of the first groove 10c onto the first surface 10a can coincide with the orthographic projection of the heating element 20 onto the first surface 10a.

[0050] The shape of the first groove 10c is set to be the same as that of the heating element 20, so that the mist generating matrix located in the first groove 10c can fully wet the heating element 20, while avoiding the first groove 10c being too large, which would result in a high risk of leakage of the mist generating matrix.

[0051] Figure 2 This is a schematic diagram of the internal structure of a heating element provided in an embodiment of this application, as shown below. Figure 2 As shown, the surface of the porous capping layer 30 facing away from the substrate 10 is not higher than the first surface 10a of the substrate 10.

[0052] By arranging the porous cover layer 30 as a whole in the first groove 10c, the porous cover layer 30 is prevented from protruding outward relative to the first surface 10a of the substrate 10, which can provide a certain degree of protection for the porous cover layer 30 and prevent it from being damaged by bumps or other impacts.

[0053] like Figure 2 As shown, the second surface 10b of the substrate 10 may be provided with a second groove 10d, which can accommodate the mist generating matrix, thereby increasing the contact area between the substrate 10 and the mist generating matrix, and allowing the mist generating matrix to better penetrate into the substrate 10.

[0054] As an example, the surface of the porous capping layer 30 facing away from the substrate 10 is flush with the first surface 10a of the substrate 10.

[0055] In some examples, the thickness of the porous capping layer 30 is 20 μm to 100 μm.

[0056] The thickness of the porous covering layer 30 being too thin or too thick will affect the generation of mist. If the porous covering layer 30 is too thin, the amount of mist-generating matrix provided to the surface of the heating element 21 facing away from the substrate 10 will be reduced, making it difficult for the heating element 21 to be sufficiently wetted with the mist-generating matrix, and the problem of excessively high local temperature on the surface of the heating element 21 facing away from the substrate 10 will not be significantly improved. If the thickness of the porous covering layer 30 is too large, it will affect the release of mist. By setting the porous covering layer 30 within this thickness range, the porous covering layer 30 can provide a more appropriate amount of mist-generating matrix to the heating element 20, keeping the heating element 21 wetted, which is also conducive to the generation of mist.

[0057] For example, the thickness of the porous capping layer 30 is 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm or 100 μm.

[0058] Both the porous capping layer 30 and the substrate 10 are porous structures, wherein the average pore size of the porous capping layer 30 can be smaller than the average pore size of the substrate 10.

[0059] Porous structures contain numerous pores distributed throughout their interior and surface, with varying sizes among the pores. The average pore diameter can be the average of the diameters of multiple pores obtained through statistical methods. For example, it could be the average diameter of pores per unit volume.

[0060] A smaller average pore size can generate greater capillary force. By setting the average pore size of the porous capping layer 30 to be smaller than that of the substrate 10, a portion of the mist-generating matrix that has penetrated into the substrate 10 can more quickly penetrate into the porous capping layer 30 under the action of capillary force. A mist-generating matrix film with a thickness of 0.5 μm to 5 μm can also be formed between the porous capping layer 30 and the heating element 21, fully covering the heating element 21 so that all parts of the surface of the heating element 21 facing away from the substrate 10 can be in full contact with the mist-generating matrix.

[0061] In some examples, the average pore size of the porous capping layer 30 can range from 5 μm to 20 μm; the average pore size of the substrate 10 can range from 10 μm to 50 μm.

[0062] For example, the porous capping layer 30 has an average pore size of 5 μm or 15 μm. The substrate 10 has an average pore size of 20 μm, 30 μm, 40 μm or 50 μm.

[0063] The average pore size of the substrate 10 is set within this range so that the substrate 10 can fully adsorb and store a portion of the mist-generating matrix, and the mist-generating matrix can fully penetrate to the first surface 10a, while preventing leakage of the mist-generating matrix. The average pore size of the porous cover layer 30 is set within this range so that the porous cover layer 30 can generate strong capillary force, providing sufficient mist-generating matrix to the surface of the heating element 21 facing away from the substrate 10.

[0064] In some examples, the porosity of the matrix 10 is 40% to 65%.

[0065] For example, the porosity of the matrix 10 can be 40%, 45%, 50%, 55%, 60%, or 65%.

[0066] The porosity of the substrate 10 affects its ability to store the mist-generating matrix, as well as the permeation and flow of the mist matrix within the substrate 10. A porosity of 40% to 65% is used to allow the substrate 10 to adsorb and store a sufficient amount of mist matrix to wet the heating element 20.

[0067] The substrate 10 can be made of ceramic material. For example, the substrate 10 may include at least one of alumina, silicon oxide, and silicon carbide.

[0068] The porous capping layer 30 can be formed using ceramic materials or nanofiber membranes.

[0069] In some examples, the porous capping layer 30 and the substrate 10 can be sintered together. The sintering method allows the porous capping layer 30 and the substrate 10 to be tightly connected, and it also makes it easier to manufacture the porous capping layer 30.

[0070] As an example, Figure 3 This is a flowchart illustrating a method for preparing a heating element according to an embodiment of this application. Figure 4 This is a schematic diagram illustrating the fabrication process of a heating element according to an embodiment of this application, as shown below. Figure 4 As shown, the preparation method includes: In step S10, green blank 01 is prepared.

[0071] like Figure 4 As shown, a first groove 10c can be formed on the surface of the green blank 01.

[0072] For example, the green blank 01 can be made by hot press injection molding. Hot press injection molding can also be called hot press molding or hot press injection molding.

[0073] In step S12, the heating element 20 is placed into the first groove 10c.

[0074] like Figure 4 As shown, the heating element 20 is pressed into the first groove 10c. When placing the heating element 20, the depth to which the heating element 20 is pressed in can be controlled to be 15% to 25% of the thickness of the green blank 01.

[0075] In step S14, the green blank 01 is sintered.

[0076] Sintering is co-firing bonding. For example, the green blank 01 can be sintered at a temperature of 1400℃~1600℃ to tightly connect the green blank 01 and the heating element 20 into a whole, resulting in the substrate 10 and the heating element 20 connected to the substrate 10.

[0077] In step S16, a porous medium slurry layer 03 is formed covering the heating part 21 of the heating element 20.

[0078] The porous media slurry layer 03 can be formed from a porous media slurry, which may contain 30 vol% to 50 vol% of a pore-forming agent. For example, the porous media slurry may include a ceramic slurry or a nanofiber slurry.

[0079] In step S18, the porous medium slurry layer 03 is sintered to form a porous capping layer 30.

[0080] For example, the porous media slurry layer 03 can be sintered at a temperature of 600°C to 800°C to sinter the porous media slurry layer 03 and the substrate 10 into a whole, forming a porous cover layer 30.

[0081] Comparative tests show that traditional ceramic heating elements have a liquid conduction rate of only 3.2 μL / s, produce mist with droplet particles of 2.5 μm in diameter (median diameter D50), trigger dry-burning time of only 4.2 seconds, and formaldehyde release of 8.6 μg / puff. The heating element provided in this application has a liquid conduction rate of 5.8 μL / s, an 81% improvement over traditional ceramic heating elements. It produces mist with droplet particles of 1.7 μm in diameter (median diameter D50), a 32% reduction compared to traditional ceramic heating elements. The trigger dry-burning time reaches 8.5 seconds, a 102% improvement compared to traditional ceramic heating elements, and formaldehyde release is reduced to 2.1 μg / puff, a 76% reduction compared to traditional ceramic heating elements.

[0082] This application also provides a liquid heating device. In this embodiment, the liquid heating device refers to a device that can heat a mist-generating matrix to a certain temperature, causing corresponding components in the mist-generating matrix to form an inhalable mist. Inhalation refers to the state of inhaling the mist into the user's oral cavity, nasal cavity, or lungs through the user's mouth or nose. The mist-generating matrix refers to a product capable of forming mist (aerosol) under heating. The mist may contain volatile compounds. The mist-generating matrix can be liquid or semi-liquid.

[0083] Figure 5 This is a schematic diagram of the structure of a liquid heating device provided in an embodiment of this application, as shown below. Figure 5 As shown, the liquid heating device includes a power supply component 100 and a liquid heater 200. The power supply component 100 is connected to the liquid heater 200 and is used to supply power to the liquid heater 200.

[0084] In some examples, the power supply component 100 is detachably connected to the liquid heater 200. Because the power supply component 100 is detachably connected to the liquid heater 200, it is easy to replace the liquid heater 200.

[0085] In other examples, the power supply assembly 100 and the liquid heater 200 may be fixedly connected. For example, the housing portion of the power supply assembly 100 and the liquid storage tank housing 211 of the liquid heater 200 are integrally formed.

[0086] Figure 6This is a schematic diagram of the internal structure of a liquid heating device provided in an embodiment of this application. In this embodiment, the liquid heating device refers to a device that can heat a mist-generating matrix to a certain temperature, causing the corresponding components in the mist-generating matrix to form an inhalable mist. Inhalation refers to the state of inhaling the mist into the user's oral cavity, nasal cavity, or lungs through the user's mouth or nose. The mist-generating matrix refers to a product capable of forming mist (aerosol) under heating. The mist may contain volatile compounds. The mist-generating matrix can be liquid or semi-liquid.

[0087] like Figure 5 As shown, the power supply assembly 100 includes a bracket 101 and a circuit structure. The bracket 101 is provided with a docking groove 101a for connecting to the liquid heater 200. The bracket 101 is also provided with an air inlet pipe 1014, which is connected to the bottom of the docking groove 101a and is used to supply air to the liquid heater 200.

[0088] The circuit structure may include a circuit board 103 and an airflow sensor 102. The circuit board 103 is located on one side of the bracket 101. The bracket 101 has an airflow sensor mounting slot 101b, which is located outside the docking slot 101a. The airflow sensor mounting slot 101b and the docking slot 101a are also connected through a sensing air passage 101c. The airflow sensor 102 is located in the airflow sensor mounting slot 101b and is connected to the circuit board 103.

[0089] The power supply assembly 100 also includes a display panel 105, which is located on the side of the circuit board 103 away from the airflow sensor 102 and is electrically connected to the circuit board 103.

[0090] The display panel 105 is arranged on one side of the circuit board 103, so that the display panel 105 and the circuit board 103 are arranged in a parallel or nearly parallel manner, which saves space and makes the structure of the power supply components more compact.

[0091] The power supply assembly also includes a battery 104, which is located at the bottom of the docking groove 101a.

[0092] For example, battery 104 may include any one of lithium-ion battery, nickel metal hydride battery, nickel-cadmium battery or lithium-based battery, and lithium-based battery may include lithium cobalt battery, lithium iron phosphate battery, lithium titanate battery or lithium polymer battery.

[0093] As an example, the power supply assembly 100 may also include a first housing 106, with a bracket 101 located within the first housing 106 and a display panel 105 located outside the first housing 106. The liquid heating device may include a second housing 301 and an end cap 302, with the end cap 302 connected to the second housing 301 to form a receiving cavity in which both the power supply assembly 100 and the liquid heater 200 are located.

[0094] The second housing 301 may be connected to a suction nozzle 3011. For example, the second housing 301 and the suction nozzle 3011 may be an integral structure; or the second housing 301 and the suction nozzle 3011 may be detachably connected to facilitate the replacement of the suction nozzle 3011.

[0095] At least a portion of the second housing 301 can be a light-transmitting area, and the display panel 105 can be arranged directly opposite the light-transmitting area, allowing the user to observe the content displayed on the display panel. The light-transmitting area can be a transparent portion of the second housing 301, or an opening on the surface of the second housing 301 exposing the display panel. The display panel can be a Liquid Crystal Display (LCD) panel or an Organic Light-Emitting Diode (OLED) panel. The display panel can be a display panel with only display function, or a touch display panel with touch function in addition to display function, for user operation.

[0096] In the embodiments of this application, "exposed," "revealed," or similar expressions mean that it can be seen or touched from the outside.

[0097] The air inlet pipe 1014 of the bracket 101 extends to the end cap 302. The air inlet end of the air inlet pipe 1014 can be connected to the end cap 302 and communicate with the outside. For example, an air inlet hole can be provided at the position of the end cap 302 opposite to the air inlet end of the air inlet pipe 1014, and the air inlet hole communicates with the air inlet pipe 1014.

[0098] The liquid heater 200 may include a liquid storage assembly 210 and any of the aforementioned heating elements 40. The liquid storage assembly 210 includes a liquid storage tank housing 211 and a sealing base 226, and the first outer shell 106 can be snapped into the liquid storage tank housing 211.

[0099] The liquid storage chamber shell 211 and the sealing base 226 are connected to form a liquid storage chamber 211a. The liquid storage chamber 211a is used to store the mist generation matrix. A mist generation chamber 200a is formed in the sealing base 226, and the sealing base 226 is also provided with a liquid inlet channel 226b communicating with the mist generation chamber 200a and the liquid storage chamber 211a. The heating element 40 is disposed in the mist generation chamber 200a and the heating element 20 is located on the side of the substrate 10 away from the liquid inlet channel 226b.

[0100] By applying the aforementioned heating core 40 to the liquid heater 200, the mist-generating matrix in the substrate 10 can penetrate into the porous covering layer 30. Through the porous covering layer 30, some of the mist-generating matrix can flow to the surface of the heating part 21 facing away from the substrate 10, so that the surface of the heating part 21 facing away from the substrate can also be wetted. This can prevent the local temperature of the surface of the heating part 21 facing away from the substrate 10 from being too high and reduce the generation of burnt smell.

[0101] As an example, a first seal 225 may be connected to the side of the sealing base 226 away from the liquid storage tank 211a, and a mist generation chamber 200a is formed between the sealing base 226 and the first seal 225.

[0102] For example, the first seal 225 may be a silicone seal.

[0103] A lower sealing cavity 200c is formed between the first sealing element 225 and the bottom of the docking groove 101a, and the lower sealing cavity 200c is connected to the air intake pipe 1014.

[0104] like Figure 6 As shown, the outlet end of the air inlet pipe 1014 can be located in the lower sealing cavity 200c, and the outlet end of the air inlet pipe 1014 can protrude from the bottom of the docking groove 101a. This can reduce the risk of the mist generation matrix or condensate leaking into the lower sealing cavity 200c and entering the air inlet pipe 1014.

[0105] The lower sealing cavity 200c is also connected to the airflow sensor mounting slot 101b via the sensing air passage 101c. During the suction process, the user causes a change in air pressure in the lower sealing cavity 200c, which in turn causes a change in air pressure in the sensing air passage 101c, triggering the airflow sensor 102 and controlling the heating core 40 to work.

[0106] The first seal 225 also has an airflow channel 225b, which connects the mist generation chamber 200a and the lower sealing chamber 200c.

[0107] The sealing base 226 also has an exhaust channel 226a, one end of which is connected to the mist generation chamber 200a, and the other end of which is connected to the suction nozzle 3011. During the suction process, the airflow enters the lower sealing chamber 200c from the air inlet pipe 1014, and then enters the mist generation chamber 200a from the lower sealing chamber 200c via the airflow channel 225b.

[0108] As an example, there may be two inlet channels 226b, and the exhaust channel 226a may be located between the two inlet channels 226b.

[0109] The sealing base 226 is also provided with a liquid inlet channel 226b, which connects the mist generation chamber 200a and the side of the sealing base 226 away from the bottom of the docking groove 101a, that is, connects the mist generation chamber 200a and the liquid storage chamber 211a. The heating element 40 is located in the mist generation chamber 200a, separating the liquid inlet channel 226b and the airflow channel 225b.

[0110] The mist-generating matrix can flow to the heating element 40 through the liquid inlet channel 226b, keeping the heating element 40 in a moist state. When the heating element 40 is working, it heats the mist-generating matrix, releasing mist into the mist-generating chamber 200a. During suction, the mist in the mist-generating chamber 200a enters the suction nozzle 3011 through the exhaust channel 226a. The heating element 40 separates the liquid inlet channel 226b and the airflow channel 225b, preventing the mist-generating matrix in the liquid inlet channel 226b from flowing into the airflow channel 225b.

[0111] The structure of the heating element 40 can be referred to the aforementioned description. The heating element 40 can be snapped into the mist generation chamber 200a to prevent the heating element 40 from becoming loose.

[0112] The liquid heater 200 may also include an electrode 227 inserted in the first seal 225.

[0113] Electrode 227 can be a metal rod. For example, electrode 227 can be a copper metal rod.

[0114] One end of electrode 227 is located in the mist generation chamber 200a and abuts against the heating element 20. Exemplarily, electrode 227 can abut against the contact portion 22 of the heating element 20, not only achieving electrical connection with the heating element 20 but also further reinforcing the heating core 40 and preventing it from loosening. The other end of electrode 227 is used to connect to battery 104. In some examples, electrode 227 can be directly electrically connected to battery 104; in other examples, electrode 227 can also be electrically connected to battery 104 via circuit board 103, i.e., electrode 227 is electrically connected to circuit board 103, and circuit board 103 is electrically connected to battery 104. Exemplarily, electrode 227 can be connected to circuit board 103 via a wire.

[0115] For example, two electrodes 227 may be provided, and the two electrodes 227 may correspond one-to-one with the two contact portions 22 of the heating element 20. The airflow channel 225b may be located between the two electrodes 227.

[0116] The substrate 10 absorbs the mist-generating matrix flowing out of the liquid inlet channel 226b and temporarily stores it in the substrate 10 and the porous covering layer 30, keeping the substrate 10 and the porous covering layer 30 in a moist state. The heating element 20 heats the substrate 10 and the porous covering layer 30, causing the mist-generating matrix in the substrate 10 and the porous covering layer 30 to convert into mist. By arranging the heating element 20 on the side of the substrate 10 away from the liquid inlet channel 226b, and with the electrode 227 abutting against the side of the heating element 20 away from the substrate 10, the heating core 40 can be reinforced, making the heating core 40 stable, separating the liquid inlet channel 226b and the airflow channel 225b, and preventing the mist-generating matrix in the liquid inlet channel 226b from directly leaking into the mist generation chamber 200a.

[0117] like Figure 6 As shown, the liquid heating device may further include an adsorption element 228, which is located in the lower sealed cavity 200c and is used to adsorb the mist generation matrix in the lower sealed cavity 200c. The adsorption element 228 may be sleeved on the outside of the electrode 227.

[0118] For example, the absorbent element 228 can be absorbent cotton.

[0119] As an example, the adsorbent 228 can be arranged facing the airflow channel 225b, so that the mist generating matrix or condensate leaking from the airflow channel 225b can drip onto the adsorbent 228 and be absorbed by the adsorbent 228, thus preventing the leaked mist generating matrix or condensate from entering the air intake pipe 1014.

[0120] like Figure 6 As shown, the electrode 227 can be disposed through the adsorption member 228, and the electrode 227 and the adsorption member 228 can be interference fit to prevent the leakage of the mist generation matrix or the condensate formed from leaking along the electrode 227 to the outside of the lower sealing cavity 200c.

[0121] The sensing air passage 101c can be higher than the adsorption member 228, that is, the sensing air passage 101c can be located between the adsorption member 228 and the first sealing member 225, which can reduce the risk of leaked mist generation matrix or formed condensate entering the sensing air passage 101c.

[0122] Reference Figure 6 As shown, the liquid heater 200 may also include a second seal 229, which is located on the side of the sealing base 226 away from the first seal 225. The second seal 229 forms a seal with the inner wall of the liquid storage tank housing 211 to improve the sealing performance of the liquid storage tank 211a.

[0123] For example, the second seal 229 may be a silicone seal.

[0124] The circuit structure may also include a button 1031, both of which, along with the airflow sensor 102, are connected to the circuit board 103. The button 1031 is located on the side of the circuit board 103 furthest from the airflow sensor 102. The button 1031 is provided for user convenience. For example, the button 1031 can be used to control the start or stop of the liquid heating device.

[0125] A keycap 1032 may be provided on the second outer shell 301, with the keycap 1032 facing the button 1031, so that the user can press the button 1031 through the keycap 1032.

[0126] Figures 5-6 The structure of the liquid heater 200 and power supply assembly 100 in the liquid heating device shown is merely an example and is not intended to limit this application.

[0127] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A heating element, characterized in that, The device includes a substrate (10), a heating element (20), and a porous covering layer (30). The heating element (20) is disposed on a first surface (10a) of the substrate (10). The heating element (20) includes a heating part (21) and a power receiving part (22). The heating part (21) is connected to the power receiving part (22). The porous covering layer (30) covers at least a portion of the surface of the heating part (21) facing away from the substrate (10). The porous covering layer (30) is connected to the substrate (10).

2. The heating element according to claim 1, characterized in that, The first surface (10a) is provided with a first groove (10c), the heating element (20) is located in the first groove (10c), and the surface of the heating element (20) facing away from the substrate (10) is lower than the first surface (10a).

3. The heating element according to claim 2, characterized in that, The distance between the surface of the heating element (20) facing away from the substrate (10) and the first surface (10a) is 0.1 mm to 0.3 mm.

4. The heating element according to claim 2, characterized in that, The depth of the first groove (10c) is 15% to 25% of the thickness of the substrate (10), and the depth direction of the first groove (10c) and the thickness direction (Z) of the substrate (10) are both perpendicular to the first surface (10a).

5. The heating element according to claim 2, characterized in that, The surface of the porous capping layer (30) facing away from the substrate (10) is not higher than the first surface (10a).

6. The heating element according to claim 2, characterized in that, The shape of the orthographic projection of the first groove (10c) onto the first surface (10a) is the same as the shape of the orthographic projection of the heating element (20) onto the first surface (10a).

7. The heating element according to any one of claims 1 to 6, characterized in that, The thickness of the porous capping layer (30) is 20μm~100μm.

8. The heating element according to any one of claims 1 to 6, characterized in that, The average pore size of the porous capping layer (30) is smaller than the average pore size of the substrate (10).

9. The heating element according to claim 8, characterized in that, The average pore size of the porous capping layer (30) ranges from 5 μm to 20 μm; the average pore size of the substrate (10) ranges from 10 μm to 50 μm.

10. The heating element according to any one of claims 1 to 6, characterized in that, The porous capping layer (30) is sintered with the substrate (10).

11. The heating element according to any one of claims 1 to 6, characterized in that, The porosity of the matrix (10) is 40%~65%.

12. A liquid heater, characterized in that, It includes a liquid storage assembly (210) and a heating element as described in any one of claims 1 to 11, wherein the heating element (40) is disposed in the liquid storage assembly (210).

13. A liquid heating device, characterized in that, It includes a power supply component and a liquid heater (200) as claimed in claim 12, wherein the power supply component (100) is used to supply power to the heating element (40) of the liquid heater (200).

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