Integrated circuit connection structure based on carbon nanotube patterning copper plating
Patent Information
- Application Number
- CN202522542622.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-30
- Publication Date
- 2026-10-27
- Estimated Expiration
- 2035-11-30
AI Technical Summary
[0006]针对现有技术的不足，本实用新型提供了基于碳纳米管图案化镀铜的一体化电路连接结构，可以解决柔性加热元件中碳纳米管功能层与金属电极层之间因物理结合而产生的界面接触电阻高、机械结合可靠性差及易受环境侵蚀的缺陷问题
1、第一功能区作为高效、均匀的电热转换区，第二功能区作为低电阻、高可靠的电流传输区。
Smart Images
Figure CN224909699U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of flexible electronics technology, specifically to an integrated circuit connection structure based on patterned copper plating of carbon nanotubes. Background Technology
[0002] The rapid development of flexible electronics technology has created an urgent need for flexible heating devices to achieve high uniformity, low power consumption, high reliability, and thinness.
[0003] Carbon nanotube films are considered ideal materials for next-generation flexible electronic components due to their advantages such as planar heating, fast thermal response, good chemical stability and intrinsic flexibility. However, the current mainstream manufacturing scheme for flexible heating devices based on carbon nanotube films can be summarized as "separate manufacturing and subsequent integration". Specifically, this scheme first separately prepares the pure carbon nanotube heating area and the metal electrode / circuit area, and then integrates the two through physical methods such as conductive silver paste bonding, ultrasonic welding or mechanical pressing.
[0004] This approach has significant drawbacks: First, the high interfacial contact resistance between carbon nanotubes and metal electrodes leads to energy loss, local overheating, and even the risk of burnout; second, the mechanically bonded interface is prone to peeling or cracking under bending stress, which seriously affects the reliability of the device; in addition, the interface pores are susceptible to environmental erosion, which accelerates performance degradation. On the other hand, flexible conductive films based on emerging materials such as conductive silver paste and silver nanowires, while possessing a certain degree of flexibility, still have inherent limitations: conductive silver paste has low conductivity, resulting in insufficient heating efficiency and signal transmission performance; silver nanowires, on the other hand, suffer from problems such as high contact resistance, easy migration and oxidation, and high cost, which restrict their long-term stability and widespread application.
[0005] Therefore, an integrated circuit connection structure based on carbon nanotube patterned copper plating is proposed to solve the problems mentioned above. Utility Model Content
[0006] To address the shortcomings of existing technologies, this invention provides an integrated circuit connection structure based on patterned copper plating of carbon nanotubes. This structure can solve the problems of high interfacial contact resistance, poor mechanical bonding reliability, and susceptibility to environmental corrosion caused by the physical bonding between the carbon nanotube functional layer and the metal electrode layer in flexible heating elements.
[0007] To achieve the above objectives, the present invention provides the following technical solution: including an integrated circuit structure, an insulating protective layer, and a sealing layer, wherein the integrated circuit structure includes a carbon nanotube thin film flexible substrate and a patterned copper plating layer disposed thereon; The integrated circuit structure further includes a first functional area and a second functional area.
[0008] Preferably, the first functional area is strip-shaped, the second functional area is strip-shaped, the first functional area is connected to the second functional area, and the second functional area is located between the two ends of two adjacent first functional areas.
[0009] Preferably, the first functional area is serpentine, the second functional area is U-shaped, the first functional area is connected to the second functional area, and the second functional area is located between the two ends of two adjacent first functional areas.
[0010] Preferably, the first functional area is grid-shaped, the second functional area is strip-shaped, the first functional area is connected to the second functional area, and the second functional area is located on the opposite sides of two adjacent first functional areas.
[0011] Preferably, flexible encapsulation fabrics are arranged opposite each other on the corresponding sides, and a heating component is arranged between the flexible encapsulation fabrics. The heating component consists of an integrated circuit structure, a thermistor, and a power connection line. The integrated circuit structure is located on one side of the first functional area, and the second functional area is connected to the integrated circuit structure. The thermistor is located in the heating area of the first functional area and is electrically connected to the carbon nanotube copper-plated integrated circuit.
[0012] Preferably, there are at least two insulating protective layers, which are arranged vertically opposite each other, and a moisture sensing component is disposed between the two insulating protective layers. The moisture sensing component consists of an integrated circuit structure and leads. The integrated circuit structure consists of a second functional area of a flexible humidity sensor and a first functional area of a flexible humidity sensor.
[0013] Preferably, the sealing layers are arranged vertically opposite each other, and an interdigitated electrode assembly is disposed between the two sealing layers. The interdigitated electrode assembly consists of an integrated circuit structure, a first functional area of a supercapacitor, and a second functional area of a supercapacitor. The first functional area of the supercapacitor is disposed within the first functional area.
[0014] Compared with the prior art, this utility model provides an integrated circuit connection structure based on carbon nanotube patterned copper plating, which has the following beneficial effects: 1. The first functional area serves as a highly efficient and uniform electrothermal conversion zone, while the second functional area serves as a low-resistance and highly reliable current transmission zone.
[0015] 2. By utilizing the sensitivity of the resistance of the first functional area to the external environment (such as strain, temperature, and target object), the structure can be constructed into a highly sensitive flexible sensor.
[0016] 3. By utilizing the first functional region as the main electrode active material carrier, its huge specific surface area and porous structure are used to store charges or embed ions. The second functional region is used as a highly efficient current collector to be responsible for the rapid collection and transport of electrons. In addition, this structure also has application potential in electromagnetic shielding, flexible antennas and smart heaters. Attached Figure Description
[0017] Figure 1 This is a schematic diagram of the circuit structure of the integrated copper plating on carbon nanotubes of this utility model; Figure 2 This is a schematic diagram of the partitioned structure of the integrated copper-plated carbon nanotube circuit of this utility model. Figure 3 This is a schematic diagram of the partitioning of the multi-patterned carbon nanotube copper-plated integrated circuit of this utility model. Figure 4 This is a schematic diagram of the flexible heating element structure of this utility model; Figure 5 This is a schematic diagram of the flexible humidity sensor structure of this utility model; Figure 6 This is a schematic diagram of the flexible supercapacitor structure of this utility model.
[0018] In the figure: 1. Flexible substrate of carbon nanotube film; 2. Patterned copper plating layer; 3. First functional area; 4. Second functional area; 5. Flexible encapsulation fabric; 6. Thermistor; 7. Power connection line; 8. First functional area of flexible humidity sensor; 9. Second functional area of flexible humidity sensor; 10. Insulating protective layer; 11. Lead wire; 12. First functional area of supercapacitor; 13. Second functional area of supercapacitor; 14. Sealing layer. Detailed Implementation
[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0020] Example 1: Please see Figure 1 - Figure 6 The integrated circuit connection structure based on carbon nanotube patterned copper plating in this embodiment includes an integrated circuit structure, an insulating protective layer 10, and a sealing layer 14. The integrated circuit structure includes a carbon nanotube thin film flexible substrate 1 and a patterned copper plating layer 2 disposed thereon. The integrated circuit structure also includes a first functional area 3 and a second functional area 4; The first functional area 3 is strip-shaped, and the second functional area 4 is strip-shaped. The first functional area 3 and the second functional area 4 are connected, and the second functional area 4 is located between the two ends of two adjacent first functional areas 3. In this process, by combining patterned mask technology with a coating process, a patterned copper layer 2 is selectively constructed on a flexible carbon nanotube thin film substrate 1, which divides the circuit structure into two functionally distinct but seamlessly connected regions: a first functional region 3 composed of pure carbon nanotubes, and a composite region consisting of carbon nanotubes and metallic copper. The patterns of the first functional area 3 and the second functional area 4 can be flexibly designed and precisely fabricated according to the functional requirements of the final device. By changing the patterns of the first functional area 3 and the second functional area 4, their effective length, area and current distribution can be controlled, thereby optimizing the electrical performance and functionality of the device. like Figure 3 As shown, the first functional area 3 is in the shape of a strip, and the second functional area 4 is in the shape of a strip.
[0021] Among them, the flexible carbon nanotube film substrate 1 has advantages such as being lightweight, thin, flexible, space-saving, bendable, and comfortable. As a flexible heating element, it belongs to planar heating and achieves heating through current drive. Its high electrothermal conversion efficiency enables instant heating upon power-on, reducing energy consumption by 20%. It features rapid, efficient, and uniform heating; in addition, carbon materials have better stability, do not age, and have flame-retardant properties, resulting in high safety and a long service life. Among them, the patterned copper plating layer 2 is set on the flexible substrate 1 of carbon nanotube film, dividing the entire circuit into the first functional area 3 and the second functional area 4. The two functional areas are seamlessly and tightly connected. The first functional area 3 is a pure carbon nanotube film area that is precisely shaped by laser cutting. The second functional area 4 is a composite area of carbon nanotube film and metallic copper. Through patterned mask technology, thick copper plating is performed in this area to form a low-resistance bus electrode. Among them, the first functional area 3 and the second functional area 4 are based on the preset circuit pattern distribution and together form a continuous whole. The metal plating formed on the second functional area 4 is made of highly conductive metals or alloys. The metal plating is made of copper to achieve the best balance between cost and conductivity. The sheet resistance of the carbon nanotube flexible substrate can be determined according to actual needs. The metal coating is a composite coating of one or more of copper, silver, gold, and nickel; depending on different application requirements, the metal coating may also use tin, lead, or their alloys to improve performance. Among them, the patterned copper plating method is physical vapor deposition (PVD), electrochemical vapor deposition (EVD) or electroless deposition (ELD), or, depending on the circumstances, one of plasma spraying, coating and inkjet printing. The circuit structure also includes an insulating protective layer covering the carbon nanotube composite circuit layer.
[0022] Example 2: Please see Figure 3 The first functional area 3 is serpentine, the second functional area 4 is U-shaped, the first functional area 3 and the second functional area 4 are connected, and the second functional area 4 is located between the two ends of two adjacent first functional areas 3. The patterns of the first functional area 3 and the second functional area 4 can be flexibly designed and precisely fabricated according to the functional requirements of the final device. By changing the patterns of the first functional area 3 and the second functional area 4, their effective length, area and current distribution can be controlled, thereby optimizing the electrical performance and functionality of the device. like Figure 3 As shown, the first functional area 3 is serpentine and the second functional area 4 is U-shaped.
[0023] Example 3: Please see Figure 3 The first functional area 3 is grid-shaped, and the second functional area 4 is strip-shaped. The first functional area 3 and the second functional area 4 are connected, and the second functional area 4 is located on the corresponding sides of two adjacent first functional areas 3. The patterns of the first functional area 3 and the second functional area 4 can be flexibly designed and precisely fabricated according to the functional requirements of the final device. By changing the patterns of the first functional area 3 and the second functional area 4, their effective length, area and current distribution can be controlled, thereby optimizing the electrical performance and functionality of the device. like Figure 3 As shown, the first functional area 3 is grid-shaped and the second functional area 4 is strip-shaped.
[0024] Example 4: Please see Figure 4 It includes an integrated circuit structure, an insulating protective layer 10, and a sealing layer 14. The integrated circuit structure includes a carbon nanotube thin film flexible substrate 1 and a patterned copper plating layer 2 disposed thereon. The integrated circuit structure also includes a first functional area 3 and a second functional area 4; The first functional area 3 is strip-shaped, the second functional area 4 is strip-shaped, the first functional area 3 and the second functional area 4 are connected, and the second functional area 4 is located between the two ends of two adjacent first functional areas 3; 3. Flexible encapsulation fabric 5 is arranged opposite to each other on both sides. A heating component is arranged between the flexible encapsulation fabric 5. The heating component consists of an integrated circuit structure, a thermistor 6 and a power connection line 7. The integrated circuit structure is located on one side of the first functional area 3. The second functional area 4 is connected to the integrated circuit structure. The thermistor 6 is located in the heating area of the first functional area 3 and is electrically connected to the carbon nanotube copper-plated integrated circuit. The flexible encapsulation fabric 5 arranged vertically opposite each other, and the heating component sandwiching the flexible encapsulation fabric 5 together constitute a flexible heating sheet; Among them, the first functional area 3 of the integrated circuit with patterned copper plating of carbon nanotubes retains the characteristics of pure carbon nanotubes and serves as a planar electrothermal conversion area to achieve rapid and uniform Joule heating when current passes through; the second functional area 4 forms a low-resistance conductive path through patterned copper plating and serves as an electrode responsible for efficient injection and transmission of current; a series-parallel hybrid circuit is formed within the same heating component. The dimensions of the first functional area 3 and the second functional area 4 are not limited and can be set according to different electrical parameters and heating requirements. The size of the flexible heating element and the heating area can also be adjusted according to actual needs. In this embodiment, a thermistor 6 is provided on the heating component, located in the heating area of the first functional area 3, and electrically connected to the integrated circuit of copper-plated carbon nanotubes; the thermistor 6 can fix the temperature within a set range. In this embodiment, the flexible heating element, through its conformal integrated structure, completely eliminates the risk of contact resistance and interface separation between the electrodes and the heating element in traditional heating elements. While ensuring excellent flexibility, it significantly improves heating efficiency, temperature uniformity, and long-term operational reliability.
[0025] Please see Figure 5 There are at least two insulating protective layers 10, which are arranged opposite each other. A moisture sensing component is arranged between the two insulating protective layers 10. The moisture sensing component consists of an integrated circuit structure and lead wires 11. The integrated circuit structure consists of a second functional area 9 of the flexible humidity sensor and a first functional area 8 of the flexible humidity sensor. An insulating protective layer 10 arranged opposite each other, and a moisture-sensing component between the insulating protective layers 10 constitute a flexible humidity sensor; The integrated circuit fabrication method of carbon nanotube patterned copper plating includes: providing a complete rectangular carbon nanotube thin film flexible base; selectively plating copper only in the preset interdigitated electrode area through patterned masking and plating technology to form the second functional area 9 of the flexible humidity sensor. This functional area serves as an electrode and signal lead responsible for the stable injection of current and the transmission of electrical signals; the gap area between the interdigitated electrodes is not plated with copper due to the protection of the mask and is retained as a pure carbon nanotube thin film, serving as the first functional area 8 of the flexible humidity sensor. It retains the characteristics of pure carbon nanotubes and serves as a temperature-sensitive unit, using its resistivity to convert the temperature signal into a measurable resistance signal. There are no restrictions on the size of the functional area; it can be set according to different parameter requirements. The size of the flexible humidity sensor can also be adjusted according to actual needs. The insulating protective layer 10 can be made of polyimide film as a flexible substrate, and the surface can be treated with oxygen plasma to form a micro-rough structure, which can enhance the adhesion of the nanotube copper-plated integrated circuit. In this embodiment, the conformal integrated structure effectively eliminates the problem of unstable contact resistance between the sensitive material and the electrode in traditional sensors, significantly improving the sensor's measurement accuracy, signal stability and mechanical durability, and achieving high repeatability of the humidity and resistance relationship; the entire flexible sensing structure does not separate the sensitive area from the electrode when bent, stretched or even twisted, ensuring reliability when used on flexible devices.
[0026] Please see Figure 6 The sealing layers 14 are arranged opposite each other, and an interdigitated electrode assembly is arranged between the two sealing layers 14. The interdigitated electrode assembly consists of an integrated circuit structure, a first functional area 12 of the supercapacitor, and a second functional area 13 of the supercapacitor. The first functional area 3 is arranged in the first functional area 12 of the supercapacitor. The sealing layers 14 arranged opposite each other, and the interdigitated electrode assembly between the sealing layers 14 constitute a flexible supercapacitor; The interdigitated electrode assembly consists of an integrated circuit with patterned copper plating on carbon nanotubes; the integrated circuit structure with patterned copper plating on carbon nanotubes achieves efficient charge storage and collection functions in synergy. In this embodiment, the pure carbon nanotube film interdigitated in the first functional region 3 of the supercapacitor maintains its porous characteristics and serves as the double-layer charge storage host, with a huge specific surface area to achieve efficient adsorption / desorption of electrolyte ions; the second functional region 13 of the supercapacitor constructs a low-resistance current collection network through precise patterned copper plating, which serves as the current collector of the device and ensures rapid electron conduction during high-rate charging and discharging. In this embodiment, by adjusting the patterned design of the interdigitated electrodes, the in-plane conductivity and out-of-plane conductivity can be differentially controlled, effectively suppressing edge effects during charging and discharging and improving the uniformity of electric field distribution. The electrode pattern and size of the supercapacitor can also be adjusted according to actual needs. In this embodiment, an atomic-scale electrical contact interface is formed through the three-dimensional interpenetrating structure of the carbon nanotube framework and the copper plating layer, which significantly reduces the contact impedance between the current collector and the active material and significantly improves the charge and discharge efficiency. After long-term cycling, the performance degradation rate of the device is much lower than that of traditional metal and carbon material interfaces. Relying on the flexible characteristics of the carbon nanotube patterned copper-plated integrated circuit, this device can be seamlessly integrated with other flexible electronic components on the same substrate, making it possible to manufacture compact, thin, and fully flexible electronic systems.
[0027] The above are merely a few embodiments of this application and are not intended to limit this application in any way. Although this application discloses preferred embodiments as described above, they are not intended to limit this application. Any changes or modifications made by those skilled in the art without departing from the scope of the technical solution of this application using the disclosed technical content are equivalent to equivalent implementation cases and fall within the scope of the technical solution.
Claims
1. An integrated circuit connection structure based on patterned copper plating of carbon nanotubes, characterized in that: It includes an integrated circuit structure, an insulating protective layer (10), and a sealing layer (14). The integrated circuit structure includes a carbon nanotube thin film flexible substrate (1) and a patterned copper plating layer (2) disposed thereon. The integrated circuit structure also includes a first functional area (3) and a second functional area (4).
2. The integrated circuit connection structure based on patterned copper plating of carbon nanotubes according to claim 1, characterized in that: The first functional area (3) is strip-shaped, the second functional area (4) is strip-shaped, the first functional area (3) is connected to the second functional area (4), and the second functional area (4) is located between the two ends of two adjacent first functional areas (3).
3. The integrated circuit connection structure based on patterned copper plating of carbon nanotubes according to claim 1, characterized in that: The first functional area (3) is serpentine, the second functional area (4) is U-shaped, the first functional area (3) is connected to the second functional area (4), and the second functional area (4) is located between the two ends of two adjacent first functional areas (3).
4. The integrated circuit connection structure based on patterned copper plating of carbon nanotubes according to claim 1, characterized in that: The first functional area (3) is grid-shaped, and the second functional area (4) is strip-shaped. The first functional area (3) and the second functional area (4) are connected, and the second functional area (4) is located on the opposite sides of two adjacent first functional areas (3).
5. The integrated circuit connection structure based on patterned copper plating of carbon nanotubes according to claim 1, characterized in that: Flexible encapsulation fabric (5) is arranged opposite to each other on both sides of (3). A heating component is arranged between the flexible encapsulation fabric (5). The heating component consists of an integrated circuit structure, a thermistor (6) and a power connection line (7). The integrated circuit structure is located on one side of the first functional area (3). The second functional area (4) is connected to the integrated circuit structure. The thermistor (6) is located in the heating area of the first functional area (3) and is electrically connected to the carbon nanotube copper-plated integrated circuit.
6. The integrated circuit connection structure based on patterned copper plating of carbon nanotubes according to claim 1, characterized in that: There are at least two insulating protective layers (10), which are arranged opposite each other. A humidity sensing component is provided between the two insulating protective layers (10). The humidity sensing component consists of an integrated circuit structure and leads (11). The integrated circuit structure consists of a second functional area (9) of a flexible humidity sensor and a first functional area (8) of a flexible humidity sensor.
7. The integrated circuit connection structure based on patterned copper plating of carbon nanotubes according to claim 1, characterized in that: The sealing layer (14) is arranged in a vertically opposite manner, and an interdigitated electrode assembly is provided between the two sealing layers (14). The interdigitated electrode assembly consists of an integrated circuit structure, a first functional area (12) of a supercapacitor, and a second functional area (13) of a supercapacitor. The first functional area (3) is provided in the first functional area (12) of the supercapacitor.