Circuit board structure
Patent Information
- Application Number
- CN202521879765.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-02
- Publication Date
- 2026-10-27
- Estimated Expiration
- 2035-09-02
AI Technical Summary
[0002]近年来，因应高功率元件(如功率晶片、MOSFET、电感等)的热耗日益增加，以及密度日渐上升的趋势，以往的电路板难以同时兼顾机械强度与高效率散热，导致整体产品的可靠性下降
[0078]综上所述，本实用新型藉由组合式的本体，运用散热基板的良好散热能力与结构刚性，以及接合基板的绝缘及线路焊接性来整合两者的优势，使得电路板结构能同时兼具优异的散热性能、机械强度与良好的焊接制程弹性。此外，于散热基板与接合基板接合后可形成共面的平面，在此平面铺设连续的导热绝缘层、布线层与阻焊层，进一步整合电路功能与导热路径，提升布局弹性。
Smart Images
Figure CN224909737U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a circuit board structure, and more particularly to a circuit board structure with good heat dissipation capabilities. Background Technology
[0002] In recent years, due to the increasing heat dissipation and density of high-power components (such as power chips, MOSFETs, and inductors), conventional circuit boards have struggled to simultaneously achieve both mechanical strength and efficient heat dissipation, leading to a decline in overall product reliability. Therefore, existing technologies still need improvement to provide a circuit board structure that effectively integrates heat dissipation and enhanced mechanical strength while maintaining flexibility in circuit design. Utility Model Content
[0003] This utility model relates to a circuit board structure that integrates heat dissipation and enhances mechanical strength while maintaining circuit design flexibility through a modular body.
[0004] According to one aspect of the present invention, a circuit board structure is provided. The circuit board structure includes a body. The body includes a heat dissipation substrate and a bonding substrate. The heat dissipation substrate has a first side. The bonding substrate has a second side. The heat dissipation substrate and the bonding substrate are joined together by the first side and the second side to form a bonding surface, the surface area of the bonding surface being equivalent to the surface area of the first side and the second side joined together.
[0005] According to another aspect of the present invention, a circuit board structure is provided. The circuit board structure includes a body, a first thermally conductive insulating layer, a first wiring layer, and a first solder resist layer. The body includes a heat dissipation substrate and a bonding substrate. The heat dissipation substrate has a first surface. The bonding substrate has a second surface. The second surface is coplanar with the first surface. The first thermally conductive insulating layer covers the first surface and the second surface. The first wiring layer is disposed on the first thermally conductive insulating layer. The first solder resist layer is disposed on the first wiring layer.
[0006] To provide a better understanding of the above and other aspects of this utility model, specific embodiments are described below in conjunction with the accompanying drawings: Attached Figure Description
[0007] Figure 1 An exploded view of a circuit board structure according to an embodiment of the present invention is shown;
[0008] Figure 2 Draw Figure 1 An example of how this circuit board structure is applied to power modules;
[0009] Figure 3 An exploded view of a circuit board structure according to another embodiment of the present invention is shown;
[0010] Figure 4The first combined instance of the body is displayed in views from different directions;
[0011] Figure 5 A second combined instance of the body is displayed in views from different orientations;
[0012] Figure 6 A third combined instance of the body is displayed in different directional views;
[0013] Figure 7 A fourth combined instance of the body is displayed in views from different orientations;
[0014] Figure 8 A fifth combined instance of the body is displayed in different directional views;
[0015] Figure 9 A sixth combined instance of the body is displayed in different directional views;
[0016] Figure 10 The seventh combined instance of the body is displayed in different directional views;
[0017] Figure 11 The eighth combined instance of the body is displayed in different directional views;
[0018] Figure 12 The ninth combined instance of displaying the main body in different directional views; and
[0019] Figure 13 The tenth combined instance of the body is displayed in different directional views.
[0020] In the attached figures, the following labels are used:
[0021] 10: Main circuit board
[0022] 100, 100A: Circuit board structure
[0023] 110,110a,110b,110c,110d,110e,110f,110g,110h,110i: body
[0024] 110f1: First plane
[0025] 110f2: Second plane
[0026] 111: Heat dissipation substrate
[0027] 111a, 111e, 111g, 111i: convex part
[0028] 111f: Pin
[0029] 111h: Slider
[0030] 111e1: First side
[0031] 111S1: First surface
[0032] 111S2: Third Surface
[0033] 1111: First Sub-Heat Plate
[0034] 1111S1, 1112S1: Surface
[0035] 1112: Second heat sink
[0036] 112: Bonding substrate
[0037] 112a, 112e, 112g, 112i: concave part
[0038] 112f: Socket
[0039] 112h: Slide
[0040] 112e1: Second side
[0041] 112S1: Second surface
[0042] 112S2: Fourth Surface
[0043] 113, 114: Insulating substrate
[0044] 113S1: Fifth Surface
[0045] 121: First thermally conductive insulating layer
[0046] 122: Second thermally conductive insulating layer
[0047] 131: First wiring layer
[0048] 132: Second wiring layer
[0049] 141: First solder mask layer
[0050] 142: Second solder resist layer
[0051] 150: Heating element
[0052] 160: Conductive contact
[0053] 170: Heat dissipation structure
[0054] JF: Joint surface
[0055] L1: First Length
[0056] L2: Second Length Detailed Implementation
[0057] The various embodiments of this utility model will be described in detail below, with illustrations provided. In addition to these detailed descriptions, this utility model can be widely implemented in other embodiments. Any easy substitutions, modifications, or equivalent changes to the described embodiments are included within the scope of this utility model, and the following patent claims shall prevail. In the description of this specification, many specific details and implementation examples are provided to give the reader a more complete understanding of this utility model; however, these specific details and implementation examples should not be considered as limitations of this utility model. Furthermore, well-known steps or elements are not described in the details to avoid creating unnecessary limitations on this utility model. In the drawings, the same or similar element symbols are used to represent the same or similar elements.
[0058] Figure 1 An exploded view of a circuit board structure 100 according to an embodiment of the present invention is shown. (Refer to...) Figure 1 The circuit board structure 100 includes a body 110. The body 110 may have a first plane 110f1 facing the positive Z-axis direction and a second plane facing the negative Z-axis direction (e.g., ...). Figure 3 The first plane 110f1 and the second plane 110f2 are substantially flat surfaces, parallel to the XY plane, respectively. The body 110 may include a combination of at least two substrates, such as a heat dissipation substrate 111 and a bonding substrate 112. The heat dissipation substrate 111 may have a first surface 111S1 facing the positive Z-axis, and the bonding substrate 112 may have a second surface 112S1 facing the positive Z-axis, wherein the first surface 111S1 and the second surface 112S1 are substantially flat surfaces, parallel to the XY plane, respectively. The first surface 111S1 and the second surface 112S1 are coplanar and together form the first plane 110f1 of the body 110. Furthermore, the heat dissipation substrate 111 may have a third surface facing the negative Z-axis (e.g., ...). Figure 3 As indicated by 111S2), the bonding substrate 112 may have a fourth surface facing the negative Z-axis direction (e.g., Figure 3 As indicated by 112S2), the third surface 111S2 and the fourth surface 112S2 are substantially flat surfaces, parallel to the XY plane respectively. The third surface 111S2 and the fourth surface 112S2 are coplanar, and together they can form the second plane of the body 110 (e.g., Figure 3 The indicated 110f2).
[0059] The heat dissipation substrate 111 may have a first thickness, wherein the first thickness is the distance between the first surface 111S1 and the third surface 111S2 along the Z-axis; the bonding substrate 112 may have a second thickness, wherein the second thickness is the distance between the second surface 112S1 and the fourth surface 112S2 along the Z-axis. Since the first surface 111S1 and the second surface 112S1 are coplanar, and the third surface 111S2 and the fourth surface 112S2 are coplanar, the heat dissipation substrate 111 and the bonding substrate 112 may have the same thickness.
[0060] In one embodiment, the heat dissipation substrate 111 can be made of metal, such as aluminum, copper, or other metallic materials, to suppress thermal expansion of the substrate and enhance heat dissipation, or for applications requiring shielding against electromagnetic interference. The heat dissipation substrate 111 can also be made of ceramic, such as alumina (Al2O3), aluminum nitride (AlN), silicon nitride (Si3N4), etc., depending on their main components. Alternatively, different manufacturing methods can be used to create ceramic substrates, such as high-temperature co-fired multilayer ceramics (HTCC), low-temperature co-fired multilayer ceramics (LTCC), direct copper plating (DBC), direct copper plating (DPC), and active metal bonding (AMB). The bonding substrate 112 can be made of insulating material, including but not limited to FR-1, FR-2, FR-4, CEM-1, CEM-2, and composite materials containing reinforcing materials. The body 110 of this invention is a composite body, which integrates the advantages of the heat dissipation substrate 111's excellent heat dissipation capacity and structural rigidity with the bonding substrate 112's insulation and solderability. In one embodiment, the area of the heat dissipation substrate 111 may be larger than the area of the bonding substrate 112 in order to maximize the heat dissipation area and efficiency.
[0061] The circuit board structure 100 may further include a first thermally conductive insulating layer 121, a first wiring layer 131, and a first solder resist layer 141. The first thermally conductive insulating layer 121 may continuously cover the first plane 110f1 of the body 110, then the first wiring layer 131 is formed on the first thermally conductive insulating layer 121, and finally the first solder resist layer 141 is formed on the first wiring layer 131 to prevent circuit oxidation. Although Figure 1 The first wiring layer 131 and the first solder mask layer 141 are shown as a whole surface, but this is only for illustration. In reality, the first wiring layer 131 may contain multiple circuit patterns or solder pads, and the first solder mask layer 141 may have corresponding window areas.
[0062] In addition, the circuit board structure 100 may also include a second thermally conductive insulating layer 122, a second wiring layer 132, and a second solder mask layer 142. The second thermally conductive insulating layer 122 may continuously cover the second plane of the body 110 (e.g., Figure 3(110f2 as indicated). The second wiring layer 132 and the second solder mask layer 142 can be described and configured similarly to the first wiring layer 131 and the first solder mask layer 141, and will not be repeated here.
[0063] Figure 2 Draw Figure 1 The circuit board structure 100 is applied to an example of a power module. In one embodiment, the power module is, for example, a power supply, but is not limited thereto. See also... Figure 1 and Figure 2 The circuit board structure 100 may include at least one heating element 150, which may be correspondingly disposed on the heat dissipation substrate 111 and rapidly conduct heat away by utilizing the high thermal conductivity of the heat dissipation substrate 111. For example, the bottom of the heating element 150 may be directly attached to the first thermally conductive insulating layer 121, allowing heat to be dissipated from the heat dissipation substrate 111 via the first thermally conductive insulating layer 121; or the heating element 150 may have metal leads, which may be soldered to the pads of the first wiring layer 131, allowing heat to be dissipated from the heat dissipation substrate 111 via the first wiring layer 131 and the first thermally conductive insulating layer 121. In addition, the circuit board structure 100 may also include conductive contacts 160, which are correspondingly disposed on the bonding substrate 112, for example, on the second surface 112S1, and exposed from the first solder mask layer 141. Conductive contacts 160, such as solder joints, solder balls, springs, gold fingers, solder fingers, etc., are used to connect with the main circuit board 10 of the power module to transmit electrical signals. Figure 2 As shown, the circuit board structure 100 is vertically connected to the main circuit board 10. That is, the thickness direction (Z-axis) of the circuit board structure 100 is perpendicular to the thickness direction (Y-axis) of the main circuit board 10.
[0064] Figure 3 An exploded view of a circuit board structure 100A according to another embodiment of the present invention is shown. (Refer to...) Figure 3 In another embodiment, the circuit board structure 100A may include, for example, Figure 1The circuit board structure 100A, shown as a body 110, a first thermally conductive insulating layer 121, a first wiring layer 131, and a first solder resist layer 141, has a similar configuration. The difference is that the circuit board structure 100A further includes a heat dissipation structure 170, such as heat sink fins. The heat dissipation structure 170 can be disposed on the second plane 110f2 of the body 110, thereby further increasing heat dissipation efficiency. In one embodiment, the heat dissipation structure 170 can correspond to the heat dissipation substrate 111 of the body 110 and is disposed on the third surface 111S2 of the heat dissipation substrate 111. In another embodiment, the heat dissipation structure 170 also corresponds to the heat dissipation substrate 111 of the body 110 and can further extend to the bonding substrate 112. The heat sink fins can be bonded to the second plane 110f2 of the body 110 face-to-face in a common manner, such as by thermally conductive adhesive, or they can be bonded to the back surface of the second plane 110f2 and the back surface of the heat sink fins. Figure 3 (Not shown) The assembly structure is processed and set, such as hole locking, slotted assembly, etc.
[0065] Figure 4 The first combined instance of body 110 is shown in views from different orientations. (Refer to...) Figure 4 The body 110 may include a heat dissipation substrate 111 and a bonding substrate 112. The heat dissipation substrate 111 may have a first side 111e1, located on the side of the heat dissipation substrate 111 facing the negative Y-axis, forming the entire outer contour edge of the heat dissipation substrate 111 near this side. The bonding substrate 112 may have a second side 112e1, located on the side of the bonding substrate 112 facing the positive Y-axis, forming the entire outer contour edge of the bonding substrate 112 near this side. The heat dissipation substrate 111 and the bonding substrate 112 can be mated together by the first side 111e1 and the second side 112e1, forming a bonding surface JF (shown as a thicker line) at the junction. The surface area of the bonding surface JF is equivalent to the surface area of the first side 111e1 and the second side 112e1 at the junction. Viewed from the X-axis, this bonding surface JF also spans the thickness direction of the heat dissipation substrate 111 and the bonding substrate 112. That is, the mating surface JF spans the first plane 110f1 and the second plane 110f2 of the body 110.
[0066] like Figure 4 As shown, the heat dissipation substrate 111 may have a first length L1 on the first side 111e1, and the bonding substrate 112 may have a second length L2 on the second side 112e1. The first length L1 may be greater than the second length L2, and the length of the bonding surface JF on the X-axis is equal to the second length L2.
[0067] Figure 4 In one embodiment, the mating surface JF is a plane; however, this invention is not limited thereto, and in other embodiments, the mating surface JF may be non-planar.
[0068] Reference Figure 5The image shows a second assembly example of the body 110a in different orientation views. Similarly, the heat dissipation substrate 111 and the bonding substrate 112 of the body 110a can be mated together by first sides 111e1 and second sides 112e1, forming a bonding surface JF (shown as a thicker line) at the junction. The surface area of the bonding surface JF is equivalent to the surface area of the first sides 111e1 and second sides 112e1 at the junction. Viewed from the X-axis, this bonding surface JF also spans the thickness direction of the heat dissipation substrate 111 and the bonding substrate 112. That is, the bonding surface JF spans the first plane 110f1 and the second plane 110f2 of the body 110a. Figure 4 One difference in the body 110 is that the heat dissipation substrate 111 and the bonding substrate 112 may each include a protrusion 111a and a recess 112a, respectively disposed on the first side 111e1 and the second side 112e1. Therefore, the first side 111e1 and the second side 112e1 may have protruding and recessed surfaces. The protrusion 111a and the recess 112a correspond in shape and size and can be mated together.
[0069] Reference Figure 6 The image shows a third assembly example of the body 110b in different orientation views. Similarly, the heat dissipation substrate 111 and the bonding substrate 112 of the body 110b can be mated together by first sides 111e1 and second sides 112e1, forming a bonding surface JF (shown as a thicker line) at the junction. The surface area of the bonding surface JF is equivalent to the surface area of the first sides 111e1 and second sides 112e1 at the junction. Viewed from the X-axis, this bonding surface JF also spans the thickness direction of the heat dissipation substrate 111 and the bonding substrate 112. That is, the bonding surface JF spans the first plane 110f1 and the second plane 110f2 of the body 110b. Figure 4 One difference of the body 110 is that the heat dissipation substrate 111 may have a first length L1 on the first side 111e1, and the bonding substrate 112 may have a second length L2 on the second side 112e1, wherein the first length L1 may be equal to the second length L2. In this way, the required insulation distance on the Y-axis can be further increased according to safety requirements.
[0070] Reference Figure 7 The image shows a fourth assembly example of the body 110c from different directional views. Similarly, the heat dissipation substrate 111 and the bonding substrate 112 of the body 110c can be mated together by first sides 111e1 and second sides 112e1, forming a bonding surface JF (shown as a thicker line) at the junction. The surface area of the bonding surface JF is equivalent to the surface area of the first sides 111e1 and second sides 112e1 at the junction. Viewed from the X-axis, this bonding surface JF also spans the thickness direction of the heat dissipation substrate 111 and the bonding substrate 112. That is, the bonding surface JF spans the first plane 110f1 and the second plane 110f2 of the body 110c. Figure 4 One difference in the body 110 is that the heat dissipation substrate 111 includes a first sub-heat dissipation plate 1111 and a second sub-heat dissipation plate 1112, with a first side 111e1 located on the first sub-heat dissipation plate 1111. The body 110c may also include an insulating substrate 113, that is, the body 110c may include a combination of three substrates (heat dissipation substrate 111, bonding substrate 112, and insulating substrate 113). The insulating substrate 113 is disposed between the first sub-heat dissipation plate 1111 and the second sub-heat dissipation plate 1112. The first surface 111S1 of the heat dissipation substrate 111 may be formed by a surface 1111S1 of the first sub-heat dissipation plate 1111 and a surface 1112S1 of the second sub-heat dissipation plate 1112, wherein surface 1112S1 and surface 1111S1 are on the same side. The first surface 111S1 of the heat dissipation substrate 111, the second surface 112S1 of the bonding substrate 112, and the fifth surface 113S1 of the insulating substrate 113 are coplanar, and together they form the first plane 110f1 of the body 110c. The second plane 110f2 of the body 110c can be formed in a similar manner, which will not be described in detail here. The insulating substrate 113 can provide additional soldering areas for the heat-generating element. For example, the metal leads of the heat-generating element can pass through this insulating substrate 113, so that the metal leads reach from one side of the first plane 110f1 of the body 110c to one side of the second plane 110f2, and are soldered on the side of the second plane 110f2.
[0071] Reference Figure 8 The image shows a fifth assembly example of the body 110d from different directional views. Similarly, the heat dissipation substrate 111 and the bonding substrate 112 of the body 110d can be mated together via a first side 111e1 and a second side 112e1, forming a bonding surface JF (shown as a thicker line) at the junction. Viewed from the X-axis, this bonding surface JF also spans the thickness direction of the heat dissipation substrate 111 and the bonding substrate 112. That is, the bonding surface JF spans the first plane 110f1 and the second plane 110f2 of the body 110d. Figure 4One difference in the body 110d is that the heat dissipation substrate 111 includes a first sub-heat dissipation plate 1111 and a second sub-heat dissipation plate 1112. The body 110d may also include an insulating substrate 114. That is, the body 110d may include a combination of three substrates (heat dissipation substrate 111, bonding substrate 112, and insulating substrate 114). The insulating substrate 114 is connected to the bonding substrate 112 and separates the first sub-heat dissipation plate 1111 and the second sub-heat dissipation plate 1112. This configuration of the body 110d can be applied to a transformer. For example, the first sub-heat dissipation plate 1111 can be used on the high-voltage side of the transformer, corresponding to a wiring layer with a larger cross-sectional area; the second sub-heat dissipation plate 1112 can be used on the low-voltage side of the transformer, corresponding to a wiring layer with a smaller cross-sectional area. In this case, the insulating substrate 114 can separate the high-voltage side and the low-voltage side and provide insulation between them.
[0072] Reference Figure 9 The image shows a sixth assembly example of the body 110e from different directional views. Similarly, the heat dissipation substrate 111 and the bonding substrate 112 of the body 110e can be mated together by first sides 111e1 and second sides 112e1, forming a bonding surface JF (shown as a thicker line) at the junction. The surface area of the bonding surface JF is equivalent to the surface area of the first sides 111e1 and second sides 112e1 at the junction. Viewed from the X-axis, this bonding surface JF also spans the thickness direction of the heat dissipation substrate 111 and the bonding substrate 112. That is, the bonding surface JF spans the first plane 110f1 and the second plane 110f2 of the body 110e. Figure 4 One difference in the body 110 is that the heat dissipation substrate 111 and the bonding substrate 112 may each include a protrusion 111e and a recess 112e, respectively disposed on the first side 111e1 and the second side 112e1. Therefore, the first side 111e1 and the second side 112e1 may have partially protruding and partially recessed surfaces. The protrusions 111e and the recesses 112e correspond in shape and size and can be mated together.
[0073] Reference Figure 10 The image shows a seventh combination example of the body 110f, viewed from different directions. Similarly, the heat dissipation substrate 111 and the bonding substrate 112 of the body 110f can be mated together by first sides 111e1 and second sides 112e1, forming a bonding surface JF (shown as a thicker line) at the junction. The surface area of the bonding surface JF is equivalent to the surface area of the first sides 111e1 and second sides 112e1 joined together. Viewed from the X-axis, this bonding surface JF also spans the thickness direction of the heat dissipation substrate 111 and the bonding substrate 112. That is, the bonding surface JF spans the first plane 110f1 and the second plane 110f2 of the body 110f. Figure 4One difference in the body 110 is that the heat dissipation substrate 111 and the bonding substrate 112 may each include two pins 111f and two holes 112f, respectively disposed on the first side 111e1 and the second side 112e1. The shapes and sizes of the pins 111f and the holes 112f correspond to each other and can be mated together. The number of pins 111f and holes 112f described above is an example; in practice, it can be determined according to the actual length of the heat dissipation substrate 111 and the bonding substrate 112 (e.g., ...). Figure 4 and Figure 6 The first length L1 and the second length L2 shown are adjusted to set the corresponding number of pins 111f and sockets 112f required for stable engagement. In one embodiment, the horizontal perimeter of the pin 111f in the XZ section can be equal to the horizontal perimeter of the socket 112f in the XZ section, so that the side of the pin 111f and the wall of the socket 112f fit together completely to improve heat conduction efficiency; in another embodiment, the horizontal perimeter of the pin 111f in the XZ section can be slightly smaller than the horizontal perimeter of the socket 112f in the XZ section, and when the pin 111f and the socket 112f are mated, thermally conductive adhesive is filled into the remaining space inside the socket 112f to enhance adhesion and increase heat dissipation.
[0074] Reference Figure 11 The image shows an eighth assembly example of the body 110g, viewed from different directions. Similarly, the heat dissipation substrate 111 and the bonding substrate 112 of the body 110g can be mated together via a first side 111e1 and a second side 112e1, forming a bonding surface JF (shown as a thicker line) at the junction. The surface area of the bonding surface JF is equivalent to the surface area of the first side 111e1 and the second side 112e1 at the junction. Viewed from the X-axis, this bonding surface JF also spans the thickness direction of the heat dissipation substrate 111 and the bonding substrate 112. That is, the bonding surface JF spans the first plane 110f1 and the second plane 110f2 of the body 110g. Figure 4 One difference in the body 110 is that the heat dissipation substrate 111 and the bonding substrate 112 may each include two protrusions 111g and two recesses 112g, respectively disposed on the first side 111e1 and the second side 112e1. Therefore, the first side 111e1 and the second side 112e1 may have two protruding surfaces and two recessed surfaces. The shapes and sizes of the protrusions 111g and the recesses 112g correspond and can be mated together. The number of the protrusions 111g and the insertion holes 112f described above is an example, and in practice, it can be determined according to the actual length of the heat dissipation substrate 111 and the bonding substrate 112 (e.g., ...). Figure 4 and Figure 6The first length L1 and the second length L2 shown are adjusted to set the corresponding number of protrusions 111g and concave portions 112g required for stable bonding. In one embodiment, the horizontal perimeter of the protrusion 111g in the XZ section can be equal to the horizontal perimeter of the concave portion 112g in the XZ section, so that the protrusions 111g and concave portions 112g fit perfectly when joined to improve heat conduction efficiency; in another embodiment, the horizontal perimeter of the protrusion 111g in the XZ section can be slightly smaller than the horizontal perimeter of the concave portion 112g in the XZ section, and when the protrusion 111g and the concave portion 112g are joined, the gap space of the concave portion 112g in the X direction is filled with thermally conductive adhesive to enhance adhesion and increase heat dissipation effect.
[0075] Reference Figure 12 The ninth assembly example of the body 110h is shown in different directional views. Similarly, the heat dissipation substrate 111 and the bonding substrate 112 of the body 110h can be mated together by the first side 111e1 and the second side 112e1, forming a bonding surface JF (shown as a thicker line) at the junction. The surface area of the bonding surface JF is equivalent to the surface area of the first side 111e1 and the second side 112e1. Viewed from the X-axis, this bonding surface JF also spans the thickness direction of the heat dissipation substrate 111 and the bonding substrate 112. That is, the bonding surface JF spans the first plane 110f1 and the second plane 110f2 of the body 110h. Figure 4 One difference in the body 110 is that the heat dissipation substrate 111 and the bonding substrate 112 may each include a slider 111h and a groove 112h, respectively disposed on the first side 111e1 and the second side 112e1. Therefore, the first side 111e1 and the second side 112e1 may have protruding and recessed surfaces. The slider 111h and the groove 112h correspond in shape and size, and the entrance of the groove 112h may be opened in the negative direction facing the X-axis. The slider 111h can enter the groove 112h from the entrance of the groove 112h and can be connected to each other. The sum of the side lengths of the slider 111h in the YZ section may be slightly smaller than the sum of the side lengths of the groove 112h in the YZ section. After the slider 111h slides into the groove 112h, thermally conductive adhesive is filled into the gap space in the groove 112h to enhance the adhesion and increase the heat dissipation effect.
[0076] Reference Figure 13The image shows a tenth combination example of the body 110i, viewed from different directions. Similarly, the heat dissipation substrate 111 and the bonding substrate 112 of the body 110i can be mated together by first sides 111e1 and second sides 112e1, forming a bonding surface JF (shown as a thicker line) at the junction. The surface area of the bonding surface JF is equivalent to the surface area of the first sides 111e1 and second sides 112e1 joined together. Viewed from the X-axis, this bonding surface JF also spans the thickness direction of the heat dissipation substrate 111 and the bonding substrate 112. That is, the bonding surface JF spans the first plane 110f1 and the second plane 110f2 of the body 110i. Figure 4 One difference of the body 110 is that the heat dissipation substrate 111 and the bonding substrate 112 may each include a protrusion 111i and a recess 112i, respectively disposed on the first side 111e1 and the second side 112e1, so the first side 111e1 and the second side 112e1 may have protruding and recessed surfaces. The protrusion 111i and the recess 112i correspond in shape and size, for example, they are "V" shaped, and can be mated together.
[0077] The heat dissipation substrate 111 and the bonding substrate 112 in the foregoing embodiments may have corresponding structures and be mated together, forming a bonding surface JF at the junction. Although these structures are exemplified above, other unmentioned but corresponding structures may also be applied in this invention. In one embodiment, an adhesive layer, such as thermally conductive adhesive, may also be provided on these bonding surfaces JF to further enhance the bonding strength.
[0078] In summary, this invention integrates the advantages of a modular body, utilizing the excellent heat dissipation capacity and structural rigidity of the heat dissipation substrate, and the insulation and solderability of the bonding substrate. This allows the circuit board structure to simultaneously possess superior heat dissipation performance, mechanical strength, and good soldering process flexibility. Furthermore, after the heat dissipation substrate and the bonding substrate are joined, a coplanar plane can be formed. A continuous thermally conductive insulating layer, wiring layer, and solder mask layer can be laid on this plane, further integrating circuit functions and heat conduction paths, and enhancing layout flexibility.
[0079] Although the present invention has been described above with reference to embodiments, it is not intended to limit the scope of the invention. Those skilled in the art can make various modifications and refinements without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.
Claims
1. A circuit board structure, characterized in that, Includes an ontology, which includes: A heat dissipation substrate having a first side; and A bonding substrate having a second side; The heat dissipation substrate and the bonding substrate are joined together by the first side and the second side to form a bonding surface, and the surface area of the bonding surface is equivalent to the surface area of the first side and the second side joined together.
2. The circuit board structure as described in claim 1, characterized in that, The mating surface is not planar.
3. The circuit board structure as described in claim 1, characterized in that, An adhesive layer is provided on the joint surface.
4. The circuit board structure as described in claim 1, characterized in that, The heat dissipation substrate and the bonding substrate each include a protrusion and a recess, which are respectively disposed on the first side and the second side.
5. The circuit board structure as described in claim 1, characterized in that, The heat dissipation substrate and the bonding substrate each include a pin and a hole, which are respectively disposed on the first side and the second side.
6. The circuit board structure as described in claim 1, characterized in that, The heat dissipation substrate and the bonding substrate each include a slider and a groove, which are respectively disposed on the first side and the second side.
7. The circuit board structure as described in claim 1, characterized in that, The body further includes an insulating substrate, which includes a first sub-heat sink and a second sub-heat sink, with the first side located on the first sub-heat sink and the insulating substrate disposed between the first sub-heat sink and the second sub-heat sink.
8. The circuit board structure as described in claim 1, characterized in that, The body further includes an insulating substrate, which includes a first sub-heat sink and a second sub-heat sink. The insulating substrate is connected to the bonding substrate and separates the first sub-heat sink and the second sub-heat sink.
9. The circuit board structure as described in claim 1, characterized in that, The heat dissipation substrate has a first length on the first side, and the bonding substrate has a second length on the second side, wherein the first length is greater than the second length.
10. The circuit board structure as described in claim 1, characterized in that, The heat dissipation substrate has a first length on the first side, and the bonding substrate has a second length on the second side, wherein the first length is equal to the second length.
11. The circuit board structure as described in claim 1, characterized in that, It also includes at least one heat-generating element, which is correspondingly disposed on the heat dissipation substrate.
12. The circuit board structure as described in claim 1, characterized in that, The body has a first plane and a second plane, the first plane including a first surface of the heat dissipation substrate and a second surface of the bonding substrate, and the second plane including a third surface of the heat dissipation substrate and a fourth surface of the bonding substrate.
13. The circuit board structure as described in claim 12, characterized in that, It further includes a thermally conductive insulating layer, a wiring layer and a solder resist layer, the thermally conductive insulating layer covering the first plane and the wiring layer located between the thermally conductive insulating layer and the solder resist layer.
14. The circuit board structure as described in claim 13, characterized in that, It also includes a conductive contact, which is disposed on the bonding substrate and exposed from the solder resist layer.
15. The circuit board structure as described in claim 12, characterized in that, It also includes a heat dissipation structure disposed on the second plane.
16. A circuit board structure, characterized in that, include: One entity, including: A heat dissipation substrate having a first surface; and A bonding substrate has a second surface that is coplanar with the first surface; A first thermally conductive insulating layer covers the first surface and the second surface; A first wiring layer is disposed on the first thermally conductive insulating layer; and A first solder mask layer is disposed on the first wiring layer.
17. The circuit board structure as described in claim 16, characterized in that, It further includes a second thermally conductive insulating layer, a second wiring layer, and a second solder resist layer, wherein the heat dissipation substrate further has a third surface opposite to the first surface, the bonding substrate further has a fourth surface opposite to the second surface, the third surface and the fourth surface are coplanar, the second thermally conductive insulating layer covers the third surface and the fourth surface, the second wiring layer is disposed on the second thermally conductive insulating layer, and the second solder resist layer is disposed on the second wiring layer.
18. The circuit board structure as described in claim 16, characterized in that, It further includes a heat dissipation structure, wherein the heat dissipation substrate has a third surface opposite to the first surface, and the heat dissipation structure is disposed on the third surface.
19. The circuit board structure as described in claim 16, characterized in that, It also includes a conductive contact, which is disposed on the second surface and exposed from the first solder mask layer.
20. The circuit board structure as described in claim 16, characterized in that, It also includes at least one heat-generating element, which is disposed on the heat dissipation substrate and electrically connected to the first wiring layer.
21. The circuit board structure as described in claim 16, characterized in that, The heat dissipation substrate can be a metal substrate or a ceramic substrate.
22. The circuit board structure as described in claim 16, characterized in that, The body further includes an insulating substrate, which has a first sub-heat sink and a second sub-heat sink. The first surface is formed by a surface of the first sub-heat sink and a surface of the second sub-heat sink on the same side. The insulating substrate is disposed between the first sub-heat sink and the second sub-heat sink, and a fifth surface of the insulating substrate is coplanar with the first surface.
23. The circuit board structure as described in claim 22, characterized in that, The insulating substrate is connected to the bonding substrate and separates the first sub-heat sink and the second sub-heat sink.