An anti-static and high-frequency-resistant camera module circuit board structure

Abstract

The utility model discloses a kind of anti-static, high-frequency-resistant camera module circuit board structure, it is characterized by: including PCB, PCB top surface includes separated peripheral contact area and internal sensitive area, and the upper of PCB is provided with photosensitive chip module, connector module, power chip module, storage chip module, anti-interference module, wherein photosensitive chip module is located in the center of internal sensitive area of PCB, power chip module, storage chip module are arranged around photosensitive chip module four around, connector module is set to PCB bottom surface, anti-interference module is set to the peripheral contact area of PCB, anti-interference module includes the resistance and capacitor of parallelly arranged, the beneficial effects of the utility model include: the anti-static and high-frequency-resistant capability of camera is improved by the layout design of circuit board, by the layout of circuit, the selection of component and the distribution strategy mode of ground wire direction, with the lowest cost, the failure caused by camera module being destroyed by static electricity and high frequency is solved.

Description

Technical Field

[0001] This utility model relates to the field of camera module circuit design technology, specifically to an anti-static and anti-high frequency camera module circuit board structure. Background Technology

[0002] With the development of artificial intelligence, cameras are being used more and more widely and occupy a very important position. Consequently, failures caused by various interferences have become one of the most frequently reported problems by users in the market for AI camera modules. Conventional camera modules are susceptible to ESD pulses and high-frequency noise interference in complex electromagnetic environments, leading to image noise, data frame loss, or even damage to components due to electrostatic discharge. Summary of the Invention

[0003] To address the shortcomings of the existing technology, this utility model provides an anti-static and high-frequency resistant camera module circuit board structure, which improves the stability and reliability of the camera module in electrostatic discharge (ESD) and high-frequency electromagnetic interference (EMI) environments.

[0004] To achieve the above objectives, the present invention adopts the following technical solution:

[0005] An anti-static and high-frequency resistant camera module circuit board structure is characterized by comprising a PCB board, the top surface of which includes a separated peripheral contact area and an internal sensitive area. A photosensitive chip module, a connector module, a power chip module, a storage chip module, and an anti-interference module are disposed on the PCB board. The photosensitive chip module is located at the center of the internal sensitive area of ​​the PCB board, and the power chip module and storage chip module are arranged around the photosensitive chip module. The connector module is disposed on the bottom surface of the PCB board. The anti-interference module is disposed in the peripheral contact area of ​​the PCB board and includes a resistor and a capacitor connected in parallel. The peripheral contact area of ​​the PCB board has multiple screw holes, and a grounding copper strip is connected to each screw hole on both the top and bottom surfaces of the PCB board as EGND. The photosensitive chip module, power chip module, and storage chip module each have a grounding electrode DGND. One end of the anti-interference module is connected to EGND, and the other end is connected to DGND.

[0006] Furthermore, the spacing between the EGND and DGND is greater than 250 μm.

[0007] Furthermore, the peripheral contact area of ​​the PCB board has a ring of lens bracket adhesive area, and the anti-interference module is disposed outside the adhesive area of ​​the bracket.

[0008] Furthermore, the resistor is a 1MΩ / 5% resistor, and the capacitor is a 1nF / 2KV capacitor.

[0009] The beneficial effects of this utility model include: improving the anti-static and anti-high frequency capabilities of the camera from the source design stage by starting with the layout design of the circuit board; and solving the failure of the camera module caused by static electricity and high frequency damage at the lowest cost through circuit layout, component selection, and grounding distribution strategy. Attached Figure Description

[0010] Figure 1 This is a schematic diagram of the top surface structure of the PCB board of this utility model;

[0011] Figure 2 This is a schematic diagram of the bottom structure of the PCB board of this utility model;

[0012] Figure 3 This is a side view structural diagram of the camera module of this utility model;

[0013] Figure 4 This is the circuit diagram of the photosensitive chip module in this utility model;

[0014] Figure 5 This is the circuit diagram of the connector module in this utility model;

[0015] Figure 6 This is the circuit diagram of the power chip module in this utility model;

[0016] Figure 7 This is a circuit diagram of the storage chip module in this utility model;

[0017] Figure 8 This is the circuit diagram of the anti-interference module in this utility model. Detailed Implementation

[0018] The present invention will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0019] One such Figure 1-8 The anti-static and high-frequency resistant camera module circuit board structure shown includes a PCB board,

[0020] The image sensor module 1 is the most important part of the camera module, used for image data acquisition; the connector module 2 serves as a bridge connecting the camera module and the mainboard; the power chip module 3 provides stable power input to the image sensor module 1, and is a sensitive electronic component; the EEPROM device 4 is used for storing camera module data, including programming and calibration data, and is also a sensitive electronic component; the housing screw holes 5 are used for positioning and connecting the camera module and the main unit via screws, and are peripheral components where static electricity may be transmitted to the camera module through the housing or fingers; the C36+R5 capacitor + resistor combination anti-interference module 6 is a selected device to enhance anti-static and high-frequency interference protection.

[0021] In this embodiment, the layout of the camera module circuit is as follows: five screw holes are placed on the upper and lower surfaces of the PCB, corresponding to the overall position of the device. A grounded copper strip is placed around the upper and lower surfaces of the screw holes on the PCB, so that the metal part of the screw can contact the copper strip to ground and release and conduct static electricity. The connector module 2 is placed on the back of the PCB, in a position that can be fastened to the motherboard. The sensitive electronic components, photosensitive chip module 1, power chip module 3, and storage chip module 4, are placed inside the lens bracket 8 of the camera module. The anti-interference module 6 needs to be placed away from the lens periphery and close to the edge of the board (the specific position needs to be determined according to the size of the PCB).

[0022] When selecting electronic components, the matching scheme of anti-interference module 6 is an important part of the selection. It is necessary to choose the largest possible package, such as 1206, 1210, etc. (within the size range that can be selected according to the actual size of the PCB). In this case, due to insufficient space, a 0805 package was selected. The selected component is a large-value resistor. In this embodiment, a 0805 / 1MΩ / 5% resistor is used. A large resistor can effectively buffer high voltage pulses above KV. A small-value capacitor is selected: in this embodiment, a 0805 / 1nF / 2KV capacitor is selected. A small capacitor can effectively filter high-frequency signals, and the capacitor and resistor are connected in parallel.

[0023] Regarding the grounding strategy for the module circuit layout: connect one end of the capacitor and resistor of the anti-interference module 6 in parallel to the DGND of the sensitive components inside the module, and connect the other end to the EGND of the screw hole 5 of the peripheral component. When laying out the traces, design the EGND at the edge of the PCB and the periphery of the lens, and design the DGND inside, with the distance between the two GNDs being greater than 250um.

[0024] The PCB layout of the camera module is divided into two areas: a separate peripheral contact area and an internal sensitive area. The photosensitive chip module 1, power chip module 3, and memory chip module 4 are placed in the internal sensitive area, while the screw holes 5 and anti-interference module 6 are located in the peripheral contact area. A ring of adhesive padding 7 is distributed along the inner side of the peripheral contact area to cover the internal sensitive components with the lens bracket 8. When ESD or high-frequency noise is conducted to the module through external contact surfaces such as screws or the housing, the ground wire isolates it, causing it to first pass through the EGND circuit to a large resistor and a small capacitor. The large resistor and small capacitor filter out some high-frequency signals, and the resistance provides some buffering for the ESD. At this point, the high-frequency and ESD signals, after being filtered and buffered by the combined scheme 3, have had their energy weakened. The weakened ESD and high-frequency signals no longer have their previous destructive power and can then enter the module through the other end of the combined scheme 3. At this point, the ESD and high-frequency signals received by the sensitive electronic components have been greatly reduced, and the damage to the sensitive electronic components has been reduced to a very low level, no longer capable of causing the electronic components to break down or fail. This solution effectively isolates unwanted intruders from external components, minimizing external interference and preventing direct damage to sensitive electronic components. As is well known, the ground wire is not an ideal zero-potential conductor; it has inherent impedance, and a voltage drop occurs when current flows through it. This voltage drop can also become noise interference. Separating different ground wires effectively isolates noise from one part of the circuit from coupling to another previously quiet part through two separate ground wires.

[0025] The technical solutions provided by the embodiments of this utility model have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of the embodiments of this utility model. The description of the above embodiments is only for helping to understand the principles of the embodiments of this utility model. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the embodiments of this utility model. Therefore, the content of this specification should not be construed as a limitation of this utility model.

Claims

1. A circuit board structure for a camera module that is anti-static and resistant to high frequencies, characterized in that: The PCB board includes a top surface with a separated peripheral contact area and an internal sensitive area. The PCB board is provided with a photosensitive chip module (1), a connector module (2), a power chip module (3), a storage chip module (4), and an anti-interference module (6). The photosensitive chip module (1) is located at the center of the internal sensitive area of ​​the PCB board. The power chip module (3) and the storage chip module (4) are arranged around the photosensitive chip module (1). The connector module (2) is located on the bottom surface of the PCB board. The anti-interference module (6) is located on the peripheral contact area of ​​the PCB board. The anti-interference module (6) includes a resistor and a capacitor arranged in parallel. The peripheral contact area of ​​the PCB board has multiple screw holes (5). The screw holes (5) are connected to a grounding copper strip on both the top and bottom surfaces of the PCB board as EGND. The photosensitive chip module (1), the power chip module (3), and the storage chip module (4) all have a grounding electrode DGND. One end of the anti-interference module (6) is connected to EGND, and the other end is connected to DGND.

2. The antistatic and high-frequency resistant camera module circuit board structure according to claim 1, characterized in that: The spacing between the EGND and DGND is greater than 250 μm.

3. The antistatic and high-frequency resistant camera module circuit board structure according to claim 1, characterized in that: The PCB board has a lens bracket adhesive area (7) around its outer contact area, and the anti-interference module (6) is located on the outside of the lens bracket adhesive area (7).

4. The antistatic and high-frequency resistant camera module circuit board structure according to claim 1, characterized in that: The resistor is a 1MΩ / 5% resistor, and the capacitor is a 1nF / 2KV capacitor.

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