Highly flat and low leakage current composite aluminum-based circuit board

Abstract

The utility model discloses a kind of high flat low leakage current composite aluminium base circuit board, it is related to circuit board technical field, including circuit board main body, circuit board frame, copper foil layer, insulating adhesive film upper layer, metal aluminium base and insulating adhesive film lower layer, the circuit board frame fixed installation is in the four side vertex edges of circuit board main body, and the inside intermediate installation of circuit board main body has copper foil layer.The utility model, when high flat low leakage current composite aluminium base circuit board is assembled, the insulating resin adhesive film contained in circuit board main body, played the isolation effect of metal aluminium base and copper foil surface current interaction, can greatly reduce product leakage current, greatly increase the security of circuit board when using, and circuit board main body adopts upper and lower adhesive film and clamps metal aluminium base, will make the thermal stress of metal aluminium base upper and lower consistent, so that aluminium base circuit board is under high temperature, flatness is high, guarantee component welding quality and reduce later assembly difficulty, improve the stability of circuit board overall structure.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, specifically to a high-flatness, low-leakage-current composite aluminum-based circuit board. Background Technology

[0002] Aluminum-based circuit boards are special printed circuit boards with aluminum alloy as the substrate, whose core functions are efficient heat dissipation and stable support. They can quickly conduct the heat generated by electronic components during operation to the outside environment, preventing component damage due to high temperatures and ensuring long-term stable operation of equipment. They are particularly suitable for high-heat-density applications such as LED lighting, automotive electronics, and power modules. At the same time, they possess good mechanical strength to protect the circuit structure and excellent electromagnetic shielding, reducing signal interference and improving the performance and reliability of electronic devices. They are a key component balancing heat dissipation, structural support, and electromagnetic compatibility.

[0003] A relevant reference is Chinese utility model patent CN213638342U, which discloses a high thermal conductivity composite aluminum-based printed circuit board. This high thermal conductivity composite aluminum-based printed circuit board includes a mounting base. A first heat sink is mounted on the upper end of the mounting base, and an aluminum-based circuit board is connected to the upper end of the first heat sink. A cavity is formed within the mounting base, and a second heat sink is connected to the top of the cavity. Several copper rods are evenly and orderly connected horizontally to the upper end of the second heat sink. The ends of the copper rods away from the second heat sink penetrate the cavity wall and connect to the lower end of the first heat sink. A fan is connected to the cavity via an adjustment mechanism, and a flexible hose is connected to the fan. The end of the flexible hose away from the fan is connected to the cavity wall. This utility model increases the airflow velocity around the circuit board, accelerating heat dissipation from the circuit board surface, thereby achieving high thermal conductivity for the composite aluminum-based printed circuit board.

[0004] Currently used high-flatness, low-leakage-current composite aluminum-based circuit boards still have the following problems: Aluminum substrates are commonly used heat dissipation materials in electronic devices (such as LED lighting, power modules, automotive electronics, etc.). If the leakage current exceeds the allowable range, it will cause multi-dimensional damage to the performance, safety and service life of the equipment. For example, it will damage the performance of the equipment, shorten its service life, and cause safety risks, threatening the safety of people and property. If the leakage current breaks through the safety protection design of the equipment, it will be directly related to the "risk of electric shock" and "fire hazard", which is particularly significant in civil and industrial high-voltage scenarios. Utility Model Content

[0005] The purpose of this invention is to provide a high-flatness, low-leakage-current composite aluminum-based circuit board to solve the problem mentioned in the background art where the current on the aluminum substrate exceeds the allowable range during use, causing damage to equipment performance and increasing safety risks.

[0006] To achieve the above-mentioned objectives, the present invention adopts the following technical solution: This utility model provides a high-flatness, low-leakage-current composite aluminum-based circuit board, comprising a circuit board body, a circuit board frame, a copper foil layer, an upper insulating film layer, a metal aluminum base, and a lower insulating film layer. The circuit board frame is fixedly installed on the four vertices of the circuit board body, and a copper foil layer is installed in the middle of the interior of the circuit board body. The copper foil layer is in contact with the surface of the upper insulating film layer below it, and a metal aluminum base and a lower insulating film layer are disposed below the upper insulating film layer. The metal aluminum base is located in the middle of the upper insulating film layer and the lower insulating film layer. The circuit board frame includes a telescopic rod that is movably connected in the middle, and a retaining strip extends from one side of the circuit board frame. A frame groove is provided on one side of the retaining strip and is opened inside the circuit board frame. An "L"-shaped presser is installed inside the frame groove.

[0007] Preferably, the circuit board body further includes a coating layer on its surface, and a potting film and a water-proof layer are installed below the surface of the circuit board body, with the water-proof layer being adhered to the bottom of the circuit board body through the potting film.

[0008] Preferably, the interior of the coating layer contains anti-salt spray components, and the potting film is simultaneously adhered to the bottom of the coating layer to wrap the exterior of the circuit board body.

[0009] Preferably, the card strip is located at the upper and lower ends of the circuit board body, and the presser has an elastic function, with the surface of the card strip and the bottom end of the presser being fixedly connected.

[0010] Preferably, the circuit board body contains an insulating resin film. The insulating resin film of the aluminum substrate is a thin film material composed of a resin matrix, thermally conductive filler, curing agent and additives. The circuit board body is made by sandwiching a metal aluminum base between upper and lower films.

[0011] Preferably, the lower layer of the insulating film is located inside the circuit board body, and the circuit board body is in adhesive contact with the copper foil layer through the potting film.

[0012] Preferably, the circuit board frame extends horizontally on both sides of the circuit board body via telescopic rods, and the pressers are equidistantly arranged on one side of the circuit board frame.

[0013] Compared with existing technologies, one or more of the above technical solutions have the following beneficial effects: 1. When assembling a high-flatness, low-leakage-current composite aluminum-based circuit board, the insulating resin film contained in the main body of the circuit board plays an isolation role in the current interaction between the aluminum base and the copper foil surface, which can significantly reduce the leakage current of the product and greatly increase the safety of the circuit board during use. In addition, the use of upper and lower films to sandwich the aluminum base in the main body of the circuit board will make the thermal stress of the aluminum base consistent, resulting in high flatness of the aluminum-based circuit board under high temperature conditions, ensuring the quality of component welding and reducing the difficulty of subsequent assembly, thus improving the stability of the overall structure of the circuit board. 2. When assembling a high-flatness, low-leakage-current composite aluminum-based circuit board, the core of the circuit board body is the insulating film layer. The resin insulating layer with consistent thermal conductivity on both the top and bottom does not significantly reduce the thermal conductivity of the composite aluminum-based circuit board. This ensures that the thermal conductivity of the circuit board body can still meet the requirements during use, avoiding local high temperatures that could lead to accelerated component aging and performance degradation, while also ensuring long-term stable output of the equipment. Attached Figure Description

[0014] The accompanying drawings, which form part of this specification, are used to provide a further understanding of this utility model. The illustrative embodiments of this utility model and their descriptions are used to explain this utility model and do not constitute an improper limitation of this utility model.

[0015] Furthermore, the terms "installation," "setup," "equipped with," "connection," "linking," and "socketing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram of the internal upper structure of the circuit board body of this utility model; Figure 3 This is a schematic diagram of the internal lower structure of the circuit board body of this utility model; Figure 4 This is a schematic diagram of the circuit board frame structure of this utility model; In the picture: 1. Circuit board body; 11. Coating layer; 12. Encapsulating film; 13. Waterproof layer; 2. Circuit board frame; 21. Telescopic rod; 22. Clamping strip; 23. Frame groove; 24. Presser; 3. Copper foil layer; 4. Upper layer of insulating film; 5. Metal aluminum base; 6. Lower layer of insulating film. Detailed Implementation

[0017] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.

[0018] Please see Figures 1-4 A high-flatness, low-leakage-current composite aluminum-based circuit board includes a circuit board body 1, a circuit board frame 2, a copper foil layer 3, an upper insulating film layer 4, a metal aluminum base 5, and a lower insulating film layer 6. The circuit board body 1 contains an insulating resin film. The aluminum substrate insulating resin film is a thin film material composed of a resin matrix, thermally conductive filler, curing agent, and additives. The circuit board body 1 uses upper and lower films to sandwich the metal aluminum base 5 in the middle. The circuit board body 1 also includes a coating layer 11 on its surface. A potting film 12 and a water-proof layer 13 are installed below the surface of the circuit board body 1. The water-proof layer 13 is adhered to the bottom of the circuit board body 1 through the potting film 12.

[0019] In this embodiment, the interior of the coating layer 11 contains anti-salt spray components, and the potting film 12 is simultaneously adhered to the bottom of the coating layer 11 to form a wrap around the exterior of the circuit board body 1. The lower insulating film layer 6 is located inside the circuit board body 1, and the circuit board body 1 is in adhesive contact with the copper foil layer 3 through the potting film 12.

[0020] The high-flatness, low-leakage-current composite aluminum-based circuit board of this utility model has an anti-salt spray component in the coating layer 11 that can greatly enhance the coating's corrosion resistance to the circuit board body 1 in a humid environment, achieve physical barrier, and extend the service life of the circuit board body 1. Meanwhile, the potting film 12 encapsulates the circuit board body 1, blocks moisture contact, provides moisture protection to the circuit board body 1, and prevents short circuits.

[0021] For details, please refer to the following: Figure 4 As shown, the circuit board frame 2 is fixedly installed on the four vertices of the circuit board body 1. The circuit board frame 2 includes a telescopic rod 21 that is movably connected in the middle, and a retaining strip 22 extends from one side of the circuit board frame 2. A frame groove 23 is provided on one side of the retaining strip 22 and is opened inside the circuit board frame 2. An "L"-shaped presser 24 is installed inside the frame groove 23.

[0022] In this embodiment, the card strip 22 is located at the upper and lower ends of the circuit board body 1, and the presser 24 has an elastic function. The surface of the card strip 22 and the bottom end of the presser 24 are fixedly connected. The circuit board frame 2 extends horizontally on both sides of the circuit board body 1 through the telescopic rod 21, and the presser 24 is equidistantly arranged on one side of the circuit board frame 2.

[0023] The high-flatness, low-leakage-current composite aluminum-based circuit board of this utility model has a circuit board frame 2 that uses a clamping strip 22 to fix the circuit board body 1 at the edge. At the same time, the clamping strip 22 uses a presser 24 to firmly install and fix the circuit board body 1 of different thicknesses, which can prevent vibration from causing equipment malfunction and provide support for installation force.

[0024] For details, please refer to the following: Figure 2 As shown, a copper foil layer 3 is installed in the middle of the interior of the circuit board body 1, and the copper foil layer 3 is attached to the surface of the upper insulating film layer 4 below it. A metal aluminum base 5 and a lower insulating film layer 6 are disposed below the upper insulating film layer 4, with the metal aluminum base 5 located between the upper insulating film layer 4 and the lower insulating film layer 6.

[0025] The high-flatness, low-leakage-current composite aluminum-based circuit board of this utility model has a high-strength insulating film upper layer 4 and a insulating film lower layer 6, which effectively isolate the current between different copper foils, prevent short circuits of the circuit board, and the insulating resin film on the back plays an isolation role in the current interaction between the metal aluminum base 5 and the copper foil layer 3, which can significantly reduce the leakage current of the product and increase the safety of the circuit board.

[0026] The above are merely preferred embodiments of this utility model, but the scope of protection of this utility model is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in this utility model, based on the technical solution and inventive concept of this utility model, should be included within the scope of protection of this utility model.

Claims

1. A high-flatness, low-leakage-current composite aluminum-based circuit board, comprising a circuit board body (1), a circuit board frame (2), a copper foil layer (3), an upper insulating film layer (4), a metal aluminum base (5), and a lower insulating film layer (6), characterized in that: The circuit board frame (2) is fixedly installed on the four vertex edges of the circuit board body (1), and a copper foil layer (3) is installed in the middle of the interior of the circuit board body (1). The copper foil layer (3) is attached to the surface of the upper insulating film layer (4) below, and a metal aluminum base (5) and a lower insulating film layer (6) are provided below the upper insulating film layer (4). The metal aluminum base (5) is located in the middle of the upper insulating film layer (4) and the lower insulating film layer (6). The circuit board frame (2) includes a telescopic rod (21) that is movably connected in the middle, and a retaining strip (22) extends from one side of the circuit board frame (2), and a frame groove (23) is provided on one side of the retaining strip (22) inside the circuit board frame (2), and an "L"-shaped presser (24) is installed inside the frame groove (23).

2. The high-flatness, low-leakage-current composite aluminum-based circuit board according to claim 1, characterized in that: The circuit board body (1) also includes a coating layer (11) on its surface, and a potting film (12) and a water-proof layer (13) are installed below the surface of the circuit board body (1), and the water-proof layer (13) is attached to the bottom of the circuit board body (1) through the potting film (12).

3. The high-flatness, low-leakage-current composite aluminum-based circuit board according to claim 2, characterized in that: The coating layer (11) contains anti-salt spray components, and the potting film (12) is simultaneously adhered to the bottom of the coating layer (11) to wrap the outside of the circuit board body (1).

4. The high-flatness, low-leakage-current composite aluminum-based circuit board according to claim 1, characterized in that: The card strip (22) is located at the upper and lower ends of the circuit board body (1), and the presser (24) has an elastic function. The surface of the card strip (22) and the bottom end of the presser (24) are fixedly connected.

5. The high-flatness, low-leakage-current composite aluminum-based circuit board according to claim 1, characterized in that: The circuit board body (1) contains an insulating resin film. The aluminum substrate insulating resin film is a thin film material composed of resin matrix, thermally conductive filler, curing agent and additives. The circuit board body (1) uses upper and lower films to sandwich the middle metal aluminum base (5).

6. The high-flatness, low-leakage-current composite aluminum-based circuit board according to claim 2, characterized in that: The lower layer (6) of the insulating adhesive film is located inside the circuit board body (1) and the circuit board body (1) is in adhesive contact with the copper foil layer (3) through the potting adhesive film (12).

7. A high-flatness, low-leakage-current composite aluminum-based circuit board according to claim 4, characterized in that: The circuit board frame (2) extends horizontally on both sides of the circuit board body (1) via telescopic rods (21), and the pressers (24) are equidistantly arranged on one side of the circuit board frame (2).

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