Lithium battery protection circuit board with built-in copper heat dissipation layer

Abstract

The utility model discloses a lithium battery protection circuit board of built -in heat dissipation copper layer, include: a pair of substrate, a pair of heat dissipation interlayer is installed between the substrate, the upper surface square corner of substrate all inserts into bolt, the bolt is through the through -going barrel and passes through the substrate, the contact surface fixed link of through -going barrel and substrate. The utility model discloses the cooperation of substrate, bolt, through -going barrel and heat dissipation interlayer realizes the heat dissipation function, and the heat of electronic component on the circuit board will be transferred to heat dissipation interlayer, because copper plate and insulating plate in heat dissipation interlayer all have certain heat dissipation effect, and the multiple through -holes distributed in the inside copper plate can improve the contact area of copper plate and outside, the heat of electronic component during the operation of circuit board is convenient for export to outside, and then can reduce the probability of high temperature transmission to battery ontology, aggravate the occurrence probability of battery heating condition, guarantee the security of lithium battery and prolong its service life to a certain extent.

Description

Technical Field

[0001] This utility model relates to the field of lithium battery circuit board technology, and in particular to a lithium battery protection circuit board with a built-in heat dissipation copper layer. Background Technology

[0002] With the widespread adoption of electronic devices and the rapid development of electric vehicles, lithium batteries, with their significant advantages such as high energy density, long cycle life, and no memory effect, have become the mainstream choice in the field of energy storage. From portable smartphones and tablets to large electric vehicles and energy storage power stations, lithium batteries are ubiquitous, providing powerful support for the convenient life and sustainable development of modern society. However, lithium batteries inevitably generate heat during charging and discharging. This phenomenon mainly stems from the electrochemical reactions inside the battery and the resistive losses in the circuit. When a lithium battery is under abnormal operating conditions such as high-rate charging and discharging, overcharging, over-discharging, or short circuit, the heat generation will increase dramatically. If the heat cannot be dissipated effectively and in a timely manner, the internal temperature of the battery will rise rapidly. Traditional lithium battery protection circuit boards typically use ordinary printed circuit board (PCB) materials, which have poor thermal conductivity. During battery charging and discharging, the electronic components on the protection circuit board, such as integrated circuit chips and power transistors, generate a large amount of heat. Due to the limited thermal conductivity of PCB materials, this heat is difficult to transfer to the circuit board surface and dissipate quickly, resulting in excessively high local temperatures around the electronic components. The high temperature on the protection circuit board can also be transferred to the battery body, exacerbating the battery's heating situation and creating a vicious cycle that has a more serious impact on the safety and lifespan of lithium batteries. Utility Model Content

[0003] To address the above issues and overcome the shortcomings of existing technologies, this utility model provides a lithium battery protection circuit board with a built-in heat dissipation copper layer. This built-in heat dissipation layer effectively improves the poor thermal conductivity of traditional PCB materials. The heat dissipation layer transfers heat generated by electronic components to the outside environment, reducing the probability of high temperatures being transferred to the battery body and exacerbating battery overheating. This, to a certain extent, ensures the safety of the lithium battery and extends its service life. To achieve the above objectives, the technical solution adopted by this utility model is as follows: A lithium battery protection circuit board with a built-in heat dissipation copper layer includes: a pair of substrates, a heat dissipation interlayer installed between the pair of substrates, bolts inserted at the four corners of the upper surface of each substrate, the bolts passing through the substrates via through-tubes, the through-tubes being fixedly connected to the contact surface of the substrates, and multiple reserved holes distributed on the surface of the substrates, the reserved holes passing through the substrates and the heat dissipation interlayer.

[0004] Preferably, the heat dissipation interlayer includes: a copper plate located between a pair of substrates, an insulating plate installed on both the upper and lower surfaces of the copper plate, the insulating plate being connected to the substrates, and a plurality of through holes distributed inside the copper plate.

[0005] Preferably, the copper plate has a double-layer structure.

[0006] Preferably, the insulating plate is connected to the substrate and the copper plate through a connecting assembly, the connecting assembly including: a plurality of locking blocks, the plurality of locking blocks being fixedly connected to the upper and lower sides of the insulating plate respectively, and the plurality of locking blocks being engaged with the copper plate and the substrate respectively through a plurality of locking slots.

[0007] Preferably, the card block and the insulating plate are integrally formed.

[0008] Preferably, the portion of the reserved hole located inside the copper plate has an I-shaped structure, and the inner wall of the reserved hole in the I-shape is provided with an insulating coating.

[0009] Preferably, a support block is fitted onto the lower part of the outer wall of the bolt.

[0010] Compared with the prior art, the present invention has the following beneficial effects: (1) This utility model achieves heat dissipation function through the cooperation of substrate, bolt, through cylinder and heat dissipation jacket. When the substrate with heat dissipation jacket is made into a lithium battery circuit board and used, the heat generated by the electronic components on the circuit board will be transferred to the heat dissipation jacket. Since the copper plate and insulating plate in the heat dissipation jacket have a certain heat dissipation effect, and the multiple through holes distributed inside the copper plate can increase the contact area between the copper plate and the outside world, it is convenient for the heat generated by the electronic components during the operation of the circuit board to be discharged to the outside world, thereby reducing the probability of high temperature being transferred to the battery body and aggravating the battery heating situation, thus ensuring the safety of the lithium battery and extending its service life to a certain extent.

[0011] (2) This utility model achieves the installation and connection functions through the cooperation of substrate, bolt, through cylinder, heat dissipation interlayer and connecting components. During the installation process, firstly, a professional pressing tool is used to press two insulating plates with copper plate and two substrates respectively. The copper plate is located in the center and the two substrates are located on the outermost side. During this process, the card block can be embedded in the card slot for locking to ensure stable connection between the layers. No adhesive is needed during connection. Then, the pins of the electronic components are inserted into the circuit board through the reserved hole and soldered to complete the overall production of the circuit board. During subsequent installation, bolts are used to penetrate the circuit board through the through cylinder to connect it to the outside. During this process, a support block can be attached to the bottom of the bolt after penetration to keep a certain distance between the circuit board and the mounting base after installation. This can further improve the heat conduction efficiency of the circuit board to the outside. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 for Figure 1 A partial sectional view taken from below; Figure 3 for Figure 2 Enlarged view of point A in the middle.

[0013] The corresponding names of the reference numerals in the attached drawings are: 1-substrate, 2-bolt, 3-through cylinder, 4-copper plate, 5-insulating plate, 6-through hole, 7-block, 8-slot, 9-reserved hole, 10-insulating coating, 11-support block. Detailed Implementation

[0014] The present invention will be further described below with reference to the accompanying drawings and embodiments. The embodiments of the present invention include, but are not limited to, the following embodiments.

[0015] Example 1: As Figures 1-3 As shown, this utility model provides a lithium battery protection circuit board with a built-in heat dissipation copper layer, including: a pair of substrates 1. The pair of substrates 1 serve as the basic support structure of the circuit board, providing a stable installation and bearing platform for the entire circuit board. The material is usually selected to have good mechanical and insulation properties to ensure that the circuit board can withstand certain external forces during operation, while avoiding safety problems such as leakage. A heat dissipation interlayer is installed between a pair of substrates 1. This heat dissipation interlayer is the core component of the entire circuit board heat dissipation system, which can effectively conduct away the heat generated by the electronic components on the circuit board, preventing heat accumulation from damaging the battery and circuit board. Bolts 2 are inserted into the four corners of the upper surface of substrate 1. As an important component for connecting the circuit board to external devices, the bolts 2 are generally made of high-strength metals, such as stainless steel, to ensure the firmness and stability of the connection. The bolts 2 pass through substrate 1 through a through-tube 3. The through-tube 3 is fixedly connected to the contact surface of substrate 1. This design not only enhances the connection strength between bolt 2 and substrate 1, but also plays a positioning and guiding role during the installation of bolt 2, ensuring that bolt 2 can accurately pass through substrate 1. In addition, the through-tube 3 is made of insulating hard plastic material, so that bolt 2 will not affect the normal operation of the circuit board. Multiple reserved holes 9 are distributed on the surface of substrate 1. These reserved holes 9 pass through substrate 1 and heat dissipation interlayer. Their function is to provide insertion channels for the pins of electronic components, which facilitates the electrical connection between electronic components and circuit board. The distribution and number of reserved holes 9 are carefully designed according to the layout and connection requirements of electronic components on circuit board to ensure that each electronic component can be accurately installed and connected.

[0016] Example 2: The heat dissipation interlayer includes a copper plate 4, located between a pair of substrates 1. The copper plate 4 is a key heat dissipation component of the interlayer. Copper has excellent thermal conductivity, enabling it to quickly conduct heat away from the heat source. Insulating plates 5 are installed on both the top and bottom surfaces of the copper plate 4. These insulating plates 5 not only provide insulation to prevent electrical leakage and other safety accidents from the circuit board, but also assist the copper plate 4 in heat conduction. Specifically, the insulating plate 5 is an aluminum nitride ceramic sheet, which has excellent thermal conductivity and insulation properties. The insulating plate 5 is connected to the substrates 1, ensuring a tight bond between the heat dissipation interlayer and the substrates 1, forming a complete heat dissipation system. Multiple through holes 6 are evenly distributed inside the copper plate 4, greatly increasing the contact area between the copper plate 4 and the outside environment. When heat is conducted to the copper plate 4, the through holes 6 enable faster and more efficient heat transfer from the copper plate 4 to the external environment, thereby improving heat dissipation efficiency. The shape and size of the through holes 6 can be optimized according to actual heat dissipation requirements to achieve the best heat dissipation effect.

[0017] Example 3: The copper plate 4 has a double-layer structure. The two copper plates can be connected by a special process to form a whole and work together to dissipate heat. The double-layer structure of the copper plate 4 makes it easy to set through holes 6 inside for milling and turning.

[0018] Example 4: The insulating board 5 is connected to the substrate 1 and the copper plate 4 through a connecting assembly. The connecting assembly includes multiple locking blocks 7, which are fixed to the upper and lower sides of the insulating board 5 respectively. The multiple locking blocks 7 are engaged with the copper plate 4 and the substrate 1 through multiple locking slots 8 respectively. This locking method can ensure the stability of the connection between the layers. During the use of the circuit board, each layer will be subjected to various external forces, such as vibration and impact. The locking method can ensure that the layers will not loosen or separate, thereby ensuring the normal operation of the circuit board. Moreover, this connection method does not require the use of adhesive, avoiding connection failure caused by adhesive aging and peeling, and improving the reliability and durability of the circuit board.

[0019] Example 5: The card block 7 and the insulating plate 5 are integrally formed. This integrally formed structure makes the connection between the card block 7 and the insulating plate 5 more solid, with no connection gaps, thereby improving the sealing and insulation performance of the connection. The integrally formed structure can also reduce the process steps in the production process, reduce production costs, and improve production efficiency. At the same time, the integrally formed card block 7 has better mechanical properties and dimensional accuracy, and can be more accurately embedded in the card slot 8 to achieve a more reliable connection.

[0020] Example 6: The portion of the pre-drilled hole 9 located inside the copper plate 4 has an I-shaped structure. This I-shaped structure design not only enhances the mechanical strength of the pre-drilled hole 9 within the copper plate 4, preventing deformation or damage to the pre-drilled hole 9 during the insertion and soldering of electronic component pins, but also increases the contact area between the pre-drilled hole 9 and the copper plate 4, which is beneficial for heat conduction. The inner wall of the I-shaped pre-drilled hole 9 is provided with an insulating coating 10, which further enhances the insulation performance of the pre-drilled hole 9 and prevents safety accidents such as short circuits during the insertion of electronic component pins. The material of the insulating coating 10 is usually selected from materials with good insulation and high temperature resistance, such as polyimide (PI) film, to ensure that stable insulation performance can be maintained during the long-term operation of the circuit board.

[0021] Example 7: A support block 11 is fitted onto the lower part of the outer wall of bolt 2. The function of the support block 11 is to maintain a certain distance between the circuit board and the mounting base after the circuit board is installed. This design not only provides stable mounting support for the circuit board and prevents the circuit board from being worn or damaged due to direct contact with the mounting base, but also forms an air circulation channel between the circuit board and the mounting base. The air flow can further accelerate the heat conduction process of the circuit board to the outside and improve the heat dissipation efficiency. The material of the support block 11 is usually selected from materials with a certain degree of hardness and elasticity, such as rubber, to play a role in buffering and shock absorption, reducing the impact of external vibration on the circuit board. At the same time, the shape and size of the support block 11 can be designed according to actual installation requirements to ensure that different installation environments and heat dissipation requirements can be met.

[0022] Working principle: How the heat dissipation function works: When the lithium battery protection circuit board with a built-in heat dissipation copper layer is put into use, the various electronic components installed on the circuit board will generate heat during operation. This heat will first be transferred to the substrate 1, which is in direct contact with the electronic components. Since the substrate 1 has a heat dissipation interlayer, the heat will be further conducted into the heat dissipation interlayer. The heat dissipation interlayer is composed of a copper plate 4 and an insulating plate 5, both of which have a certain heat dissipation effect. Among them, the copper plate 4 is the key component for heat dissipation. Multiple through holes 6 are evenly distributed inside it. The existence of these through holes 6 greatly increases the contact area between the copper plate 4 and the outside world, so that heat can be transferred from the copper plate 4 to the outside environment more quickly and effectively. At the same time, the insulating plate 5 not only plays an insulating role, but also assists the copper plate 4 in heat conduction, together dissipating the heat on the circuit board. Through the above heat dissipation mechanism, the heat on the circuit board can be dissipated in time, effectively reducing the possibility of high temperature being transferred to the battery body, avoiding problems such as intensified internal chemical reactions and worsened heat generation due to high temperature, thereby ensuring the safety of the lithium battery to a certain extent and extending the service life of the lithium battery.

[0023] How the installation and connection functions work: During the circuit board assembly process, a professional pressing tool is first used to press and shape each layer. Specifically, two insulating boards 5 are pressed together with copper board 4 and two substrates 1, respectively, to form a tight bond. In this process, copper board 4 is located at the center, and the two substrates 1 are located on the outermost sides, forming a sandwich-like structure. During the pressing process, the connecting components function, and the locking blocks 7 are accurately embedded into the locking slots 8 to achieve the locking and fixing between the layers. This locking method ensures the stability of the connection between the layers, ensuring that the layers will not loosen or separate during subsequent use. Moreover, this connection method does not require the use of adhesives, avoiding connection failures caused by adhesive aging or peeling, thus improving the reliability and durability of the circuit board. After the components are assembled and secured, the pins of the electronic components are inserted into the circuit board through the pre-drilled holes 9, and then soldering is performed. Through soldering, a strong electrical connection is formed between the electronic components and the circuit board, ensuring that the electronic components can work normally. At the same time, the overall fabrication of the circuit board is completed. When the circuit board is subsequently installed on the equipment, bolts 2 are used to pass through the through-tube 3 to connect the entire circuit board to the outside. During the through-tube process, a support block 11 is fitted at the bottom of the bolt 2 to maintain a certain distance between the circuit board and the mounting base after installation. This design not only provides stable mounting support for the circuit board, but also forms an air circulation channel between the circuit board and the mounting base. The airflow can further accelerate the heat conduction process of the circuit board to the outside, improve heat dissipation efficiency, and ensure that the circuit board can maintain good working condition during long-term operation.

[0024] The above embodiments are merely one of the preferred embodiments of this utility model and should not be used to limit the scope of protection of this utility model. Any modifications or refinements made to the main design concept and spirit of this utility model that are not of substantial significance, but solve the same technical problem as this utility model, should be included within the scope of protection of this utility model.

Claims

1. A lithium battery protection circuit board with a built-in heat-dissipating copper layer, characterized in that, include: A pair of substrates (1) are provided with a heat dissipation interlayer between them. Bolts (2) are inserted into the four corners of the upper surface of each substrate (1). The bolts (2) pass through the substrate (1) through a through-tube (3). The through-tube (3) is fixedly connected to the contact surface of the substrate (1). Multiple reserved holes (9) are distributed on the surface of the substrate (1). The reserved holes (9) pass through the substrate (1) and the heat dissipation interlayer.

2. The lithium battery protection circuit board with a built-in heat dissipation copper layer according to claim 1, characterized in that, The heat dissipation interlayer includes: a copper plate (4), which is located between a pair of substrates (1), and an insulating plate (5) is installed on both the upper and lower surfaces of the copper plate (4). The insulating plate (5) is connected to the substrate (1), and a plurality of through holes (6) are distributed inside the copper plate (4).

3. The lithium battery protection circuit board with a built-in heat dissipation copper layer according to claim 2, characterized in that, The copper plate (4) has a double-layer structure.

4. The lithium battery protection circuit board with a built-in heat dissipation copper layer according to claim 1, characterized in that, The insulating plate (5) is connected to the substrate (1) and the copper plate (4) through a connecting assembly. The connecting assembly includes multiple locking blocks (7), which are fixed to the upper and lower surfaces of the insulating plate (5) respectively. The multiple locking blocks (7) are respectively locked to the copper plate (4) and the substrate (1) through multiple slots (8).

5. A lithium battery protection circuit board with a built-in heat-dissipating copper layer according to claim 4, characterized in that, The card block (7) and the insulating plate (5) are integrally formed.

6. A lithium battery protection circuit board with a built-in heat-dissipating copper layer according to claim 1, characterized in that, The reserved hole (9) located inside the copper plate (4) is an I-shaped structure, and the inner wall of the reserved hole (9) is provided with an insulating coating (10).

7. A lithium battery protection circuit board with a built-in heat-dissipating copper layer according to claim 1, characterized in that, A support block (11) is fitted below the outer wall of the bolt (2).

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