Circuit board line structure with non-penetrating press-fit hole

Abstract

The utility model provides a kind of circuit board line structure with non-penetrating press-fit hole, it includes first multilayer circuit board, connecting layer and second multilayer circuit board.First multilayer circuit board includes first body, first patterning line, first via, first via line.First via is set in first body, first via line is set in first via, and first patterning line is set on first body.Connecting layer is set on the first patterning line of first multilayer circuit board, and covers first via, to form first non-penetrating press-fit hole.Second multilayer circuit board is set on connecting layer, including second body, second patterning line, second via, second via line.Second via line is set in second via, and second patterning line is set on second body, second via is set in second body and on connecting layer, to form second non-penetrating press-fit hole.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to a circuit board structure with non-penetrating pressure fitting holes. Background Technology

[0002] Please see Figure 3 This is a cross-sectional view of a circuit board structure 2 with non-penetrating press-fit holes in the prior art. For example... Figure 3 As shown, the circuit board structure 2 with a non-penetrating press-fit hole has an upper circuit board 21, a lower circuit board 22, and a connecting layer 23. When the upper circuit board 21 and the lower circuit board 22 are bonded together by the connecting layer 23, the connecting layer 23 will deform under pressure and overflow adhesive into the press-fit hole 24. This causes the connecting layer 23, which uses insulating material, to affect the conductivity of the metal cylinder 25 (circuit layer) provided in the press-fit hole 24.

[0003] On the other hand, during the manufacturing process of the circuit board circuit structure of the existing backplane system, corrosive chemicals such as etching solutions inevitably seep into the press-fit hole 24, thereby damaging the structure of the metal cylinder 25 set in the press-fit hole 24. As a result, the pins that need to be inserted into the metal cylinder 25 cannot fit tightly with the metal cylinder 25.

[0004] Therefore, how to provide a circuit board structure with non-penetrating press-fit holes to solve the above problems has become an urgent research topic. Utility Model Content

[0005] In view of the above problems, this utility model proposes a circuit board structure with a non-penetrating press-fit hole, including a first multilayer circuit board, a connecting layer, and a second multilayer circuit board. The first multilayer circuit board includes a first body, a first patterned circuit, a first through-hole, and a first through-hole circuit. The first through-hole is disposed in the first body, the first through-hole circuit is disposed in the first through-hole, and the first patterned circuit is disposed on the first body. The connecting layer is disposed on the first patterned circuit of the first multilayer circuit board and covers the first through-hole to form a first non-penetrating press-fit hole. The second multilayer circuit board is disposed on the connecting layer and includes a second body, a second patterned circuit, a second through-hole, and a second through-hole circuit. The second through-hole circuit is disposed in the second through-hole, the second patterned circuit is disposed on the second body, and the second through-hole is disposed in the second body and on the connecting layer to form a second non-penetrating press-fit hole.

[0006] In a preferred embodiment of the present invention, the first non-penetrating press-fit hole is formed by placing a first protective material in the first through hole and removing the first protective material by mechanical drilling; the second non-penetrating press-fit hole is formed by placing a second protective material in the second through hole and removing the second protective material by mechanical drilling.

[0007] In a preferred embodiment of the present invention, the first non-penetrating press-fit hole is formed by placing a first protective material in the first through hole and removing the first protective material by a laser drill hole; the second non-penetrating press-fit hole is formed by placing a second protective material in the second through hole and removing the second protective material by the laser drill hole.

[0008] In a preferred embodiment of the present invention, the first patterned circuit is formed by disposing the first protective material in the first through hole, thereby forming a first surface circuit patterned on the first body.

[0009] In a preferred embodiment of the present invention, the second patterned circuit is formed by disposing the second protective material in the second through hole, thereby forming a second surface circuit patterned on the second body.

[0010] In a preferred embodiment of the present invention, the first patterned circuit is disposed on the first body and below the first body of the first multilayer circuit board.

[0011] In a preferred embodiment of the present invention, the second patterned circuit is disposed on the second body and below the second body of the second multilayer circuit board.

[0012] In a preferred embodiment of the present invention, the first protective material and the second protective material include an insulating material.

[0013] In a preferred embodiment of the present invention, the insulating material includes a resin material and an ink material.

[0014] In a preferred embodiment of the present invention, the first multilayer circuit board further includes a first inner layer circuit, and the second multilayer circuit board further includes a second inner layer circuit. The first inner layer circuit is disposed in the first body, and the second inner layer circuit is disposed in the second body.

[0015] As described above, the circuit board circuit structure with non-penetrating pressure fitting holes of this utility model can prevent the insulating layer from being squeezed and deformed and overflowing into the through-hole circuits in the non-penetrating pressure fitting holes when connecting multilayer circuit board structures. It can also prevent corrosive chemicals such as etching solutions from seeping into the through-hole circuits in the non-penetrating pressure fitting holes. Therefore, it can improve product reliability, avoid affecting the electrical connection quality of the circuit, and be further widely used in connecting multilayer circuit board structures with non-penetrating pressure fitting holes. Attached Figure Description

[0016] Figures 1A to 1G A flowchart illustrating the steps involved in fabricating a circuit board structure with non-penetrating press-fit holes according to this utility model.

[0017] Figure 2 A cross-sectional view of the circuit board structure with non-penetrating press-fit holes for this utility model;

[0018] Figure 3 This is a cross-sectional view of a circuit board structure with non-penetrating press-fit holes in the prior art.

[0019] Explanation of reference numerals in the attached figures:

[0020] 1: Circuit board structure with non-penetrating press-fit holes;

[0021] 11: First multilayer circuit board; 110: First non-penetrating press-fit hole; 111: First body; 112: First inner layer circuitry; 113: First through-hole circuitry; 114: First through-hole; 115: First dielectric layer; 116: First protective material; 117: First surface circuitry; 118: First patterned circuitry; 119: First opening;

[0022] 12: Second multilayer circuit board; 120: Second non-penetrating press-fit hole; 121: Second body; 122: Second inner layer circuitry; 123: Second through-hole circuitry; 124: Second through-hole; 125: Second dielectric layer; 126: Second protective material; 127: Second surface circuitry; 128: Second patterned circuitry; 129: Second opening;

[0023] 13: Connection layer;

[0024] 2: Circuit board structure with non-penetrating press-fit holes;

[0025] 21: Upper circuit board; 22: Lower circuit board; 23: Connecting layer; 24: Press-fit hole; 25: Metal cylinder. Detailed Implementation

[0026] Please see Figures 1A to 1G This is a flowchart illustrating the steps involved in fabricating a circuit board structure with non-penetrating press-fit holes according to this utility model. Figure 1AThe invention provides a first multilayer circuit board 11 and a second multilayer circuit board 12. The first multilayer circuit board 11 includes a first body 111, a first inner layer circuit 112, a first through-hole circuit 113, a first through-hole 114, and a first surface circuit 117. The first through-hole 114 is disposed in the first body 111 and penetrates the first body. The first through-hole circuit 113 is disposed in the first through-hole 114. The first surface circuit 117 is disposed on the surface of the first body 111 and below the surface of the first body 111. The first body 111 includes multiple first dielectric layers 115, and the first inner layer circuit 112 is embedded in the first dielectric layers 115 of the first body 111. It should be noted that since the first multilayer circuit board 11 and the second multilayer circuit board 12 have the same structure, therefore, in Figure 1A Different labels are used to indicate the same structure. The second multilayer circuit board 12 includes a second body 121, a second inner layer circuit 122, a second through-hole circuit 123, a second through-hole 124, and a second surface circuit 127. The second through-hole 124 is disposed in the second body 121 and penetrates the second body 121. The second through-hole circuit 123 is disposed in the second through-hole 124. The second surface circuit 127 is disposed on the surface of the second body 121 and below the surface of the first body. The second body 121 includes multiple second dielectric layers 125, and the second inner layer circuit 122 is embedded in the second dielectric layers 125 of the second body 121.

[0027] At Figure 1B In the process, a first protective material 116 is filled into the first through-hole 114 to cover the first through-hole line 113, so that the first through-hole line 113 in the first through-hole 114 is covered by the first protective material 116 and is not exposed. Similarly, a second protective material 126 is filled into the second through-hole 124 to cover the second through-hole line 123, so that the second through-hole line 123 in the second through-hole 124 is covered by the second protective material 126 and is not exposed. The first protective material 116 is filled level with the first through-hole 114, meaning that after the first protective material 116 is filled into the first through-hole 114, its height is flush with the first surface line 117. Likewise, the second protective material 126 is filled level with the second through-hole 124, meaning that after the second protective material 126 is filled into the second through-hole 124, its height is flush with the second surface line 127. In embodiments of this utility model, the first protective material 116 and the second protective material 126 include insulating materials, which include resin materials, ink materials and other non-conductive materials.

[0028] At Figure 1CIn this embodiment, a patterning process is used to pattern the first surface line 117 to form a first patterned line 118, and to pattern the second surface line 127 to form a second patterned line 128. In this embodiment, the patterning method includes steps such as developing and etching to form patterned lines.

[0029] At Figure 1D In the process, the first multilayer circuit board 11 and the second multilayer circuit board 12 are connected by a connecting layer 13. The connecting layer 13 is disposed on the first patterned line 118 of the first multilayer circuit board 11 and covers the first through hole 114, and the connecting layer 13 is disposed under the second patterned line 128 of the second multilayer circuit board 12.

[0030] At Figure 1E In this process, positioning is achieved through drilling into the first protective material 116 and the second protective material 126. For example... Figure 1E As shown, in order to accurately locate the positions of the first non-penetrating press-fit hole 110 and the second non-penetrating press-fit hole 120 in subsequent steps, Figure 1E First, a first opening 119 and a second opening 129 are formed in the first protective material 116 and the second protective material 126 by mechanical means to perform a positioning action.

[0031] At Figure 1F In the process, the first protective material 116 disposed in the first through hole 114 is removed by drilling to form the first non-penetrating press-fit hole 110, and the second protective material 126 disposed in the second through hole 124 is removed to form the second non-penetrating press-fit hole 120. Accordingly, the circuit board circuit structure 1 with non-penetrating press-fit holes of the present invention is completed.

[0032] Furthermore, in another embodiment of this utility model, such as Figure 1G As shown, the first protective material 116 disposed in the first through hole 114 can also be removed by laser to form the first non-penetrating press-fit hole 110, and the second protective material 126 disposed in the second through hole 124 can be removed to form the second non-penetrating press-fit hole 120, so as to complete the circuit board circuit structure 1 with non-penetrating press-fit holes of this utility model.

[0033] It should be noted that, for the sake of simplicity, only one first non-penetrating press-fit hole 110 and one second non-penetrating press-fit hole 120 are shown in the accompanying drawings of this utility model. In reality, multiple first non-penetrating press-fit holes 110 and multiple second non-penetrating press-fit holes 120 are formed in the first multilayer circuit board 11 and the second multilayer circuit board 12, respectively. Furthermore, in Figure 1FIn the step of forming the first non-penetrating press-fit hole 110 and the second non-penetrating press-fit hole 120 by drilling, the final formed first non-penetrating press-fit hole 110 and second non-penetrating press-fit hole 120 will leave the tip shape of the drill bit at the tip position, while Figure 1G In the step of forming the first non-penetrating crimp hole 110 and the second non-penetrating crimp hole 120 by laser, the first non-penetrating crimp hole 110 and the second non-penetrating crimp hole 120 will have a laser-processed arc shape at the tip position. However, regardless of the shape, it will not affect the conductivity of the subsequent insertion and fixing of the pin to the first non-penetrating crimp hole 110 and the second non-penetrating crimp hole 120.

[0034] Please see Figure 2 This is a cross-sectional view of the circuit board circuit structure 1 with non-penetrating press-fit holes according to the present invention. The circuit board circuit structure 1 with non-penetrating press-fit holes includes a first multilayer circuit board 11, a second multilayer circuit board 12, and a connecting layer 13. The first multilayer circuit board 11 includes a first body 111, a first inner layer circuit 112, a first through-hole circuit 113, a first through-hole 114, and a first patterned circuit 118. The first inner layer circuit 112 and the first through-hole 114 are disposed in the first body 111, the first patterned circuit 118 is disposed on the surface of the first body 111 and below the surface of the first body, and the first through-hole circuit 113 is disposed in the first through-hole 114. The connecting layer 13 is disposed on the first patterned circuit 118 of the first multilayer circuit board 11 and covers the first through-hole 114 and the first through-hole circuit 113 to form a first non-penetrating press-fit hole 110. The second multilayer circuit board 12 is disposed on the connection layer 13 and includes a second body 121, a second inner layer circuit 122, a second through-hole circuit 123, a second through-hole 124, and a second patterned circuit 128. The second patterned circuit 128 is disposed on the surface of the second body 121 and below the surface of the second body 121. The second through-hole circuit 123 is disposed in the second through-hole 124. The second inner layer circuit 122 and the second through-hole 124 are disposed in the second body 121, and the second through-hole 124 and the second through-hole circuit 123 are disposed on the connection layer 13 to form a second non-penetrating press-fit hole 120.

[0035] As described above, the first non-penetrating press-fit hole 110 is formed by pre-setting a first protective material 116 on the first through-hole line 113 in the first through-hole 114, and then removing the first protective material 116 by mechanical drilling or laser drilling. The second non-penetrating press-fit hole 120 is formed by pre-setting a second protective material 126 on the second through-hole line 123 in the second through-hole 124, and then removing the second protective material 126 by mechanical drilling or laser drilling.

[0036] Furthermore, the first surface line 117 is disposed on the surface and under the surface of the first body 111 of the first multilayer circuit board 11. The second surface line 127 is disposed on the surface and under the surface of the second body 121 of the second multilayer circuit board 12. The first patterned line 118 is formed by patterning the first surface line 117 on and under the surface of the first body 111 after disposing of the first protective material 116 in the first through hole 114 and covering the first through hole line 113. The second patterned line 128 is formed by patterning the second surface line 127 on and under the surface of the second body 121 after disposing of the second protective material 126 in the second through hole 124 and covering the second through hole line 123. In other words, before forming the first patterned circuit 118 and the second patterned circuit 128, a first protective material 116 is pre-set in the first through hole 114 and a second protective material 126 is pre-set in the second through hole 124 to protect the first through hole circuit 113 in the first through hole 114 and the second through hole circuit 123 in the second through hole 124, thereby preventing the first through hole circuit 113 and the second through hole circuit 123 from being corroded by the chemicals used to form the patterned circuit, such as etching liquids and other chemicals. Furthermore, by pre-setting the first protective material 116 in the first through hole 114 and pre-setting the second protective material 126 in the second through hole 124, the aforementioned connecting layer 13 can be prevented from being squeezed and overflowing onto the first through hole line 113 and the second through hole line 123 in the first through hole 114 and the second through hole 124 when connecting the first multilayer circuit board 11 and the second multilayer circuit board 12. This further prevents the connecting layer 13, which uses insulating material, from affecting the conductivity of the first through hole line 113 and the second through hole line 123.

[0037] In summary, by pre-setting protective material within the non-penetrating pressure-fitting holes of this utility model, the circuit board circuit structure can prevent the insulating layer from being squeezed and deformed and overflowing onto the through-hole circuits within the non-penetrating pressure-fitting holes when connecting multilayer circuit board structures. It also prevents corrosive chemicals such as etching solutions from seeping into the through-hole circuits within the non-penetrating pressure-fitting holes. Therefore, it can improve product reliability, avoid affecting the electrical connection quality of the circuit, and can be widely applied to connecting multilayer circuit board structures with non-penetrating pressure-fitting holes.

Claims

1. A circuit board structure with non-penetrating press-fit holes, characterized in that, include: A first multilayer circuit board includes a first body, a first patterned circuit, a first through hole, and a first through hole circuit. The first through hole is disposed in the first body, the first through hole line is disposed in the first through hole, and the first patterned line is disposed on the first body; A connecting layer is disposed on the first patterned line of the first multilayer circuit board and covers the first through-hole to form a first non-penetrating press-fit hole; and A second multilayer circuit board, disposed on the connection layer, includes a second body, a second patterned circuit, a second through hole, and a second through hole circuit; wherein the second through hole circuit is disposed in the second through hole, the second patterned circuit is disposed on the second body, and the second through hole is disposed in the second body and on the connection layer to form a second non-penetrating press-fit hole.

2. The circuit board circuit structure with non-penetrating pressure fitting holes according to claim 1, characterized in that, The first non-penetrating press-fit hole is formed by placing a first protective material in the first through hole and removing the first protective material by mechanical drilling. The second non-penetrating press-fit hole is formed by placing a second protective material in the second through hole and removing the second protective material by mechanical drilling.

3. The circuit board circuit structure with non-penetrating pressure fitting holes according to claim 1, characterized in that, The first non-penetrating press-fit hole is formed by placing a first protective material in the first through hole and removing the first protective material by laser drilling. The second non-penetrating press-fit hole is formed by placing a second protective material in the second through hole and removing the second protective material by laser drilling.

4. The circuit board circuit structure with non-penetrating pressure fitting holes according to claim 2, characterized in that, The first patterned circuit is formed by depositing the first protective material in the first through hole, and by patterning a first surface circuit on the first body.

5. The circuit board circuit structure with non-penetrating pressure fitting holes according to claim 3, characterized in that, The second patterned circuit is formed by providing the second protective material in the second through hole, and by patterning a second surface circuit on the second body.

6. The circuit board circuit structure with non-penetrating pressure fitting holes according to claim 4, characterized in that, The first patterned circuit is disposed on the first body and below the first body of the first multilayer circuit board.

7. The circuit board circuit structure with non-penetrating pressure fitting holes according to claim 5, characterized in that, The second patterned circuit is disposed on the second body and under the second body of the second multilayer circuit board.

8. The circuit board circuit structure with non-penetrating pressure fitting holes according to claim 4 or 5, characterized in that, The first protective material and the second protective material both include an insulating material.

9. The circuit board circuit structure with non-penetrating pressure fitting holes according to claim 8, characterized in that, The insulating material includes a resin material and an ink material.

10. The circuit board circuit structure with non-penetrating pressure fitting holes according to claim 1, characterized in that, The first multilayer circuit board further includes a first inner layer circuit, and the second multilayer circuit board further includes a second inner layer circuit. The first inner layer circuit is disposed in the first body, and the second inner layer circuit is disposed in the second body.

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