A new type of PCB stacking structure

Abstract

The utility model relates to PCB board material technical field, and disclose a kind of novel PCB board material stack structure, it is composed of from top to bottom top copper foil layer, middle PP layer and bottom copper foil layer, the middle PP layer includes multiple yellow PPs, and at least one optical absorption layer is equipped between the middle PP layer and top copper foil layer or bottom copper foil layer.This novel PCB board material stack structure, by at least one optical absorption layer between the middle PP layer and upper and lower copper foil layer, change yellow PP from black PP to the part of substrate material of PCB board, after pressing, compared with traditional PCB board material using full black PP material, can effectively reduce the dosage of black PP, save PP raw material cost, and the setting of optical absorption layer can guarantee the light-shielding and anti-transmission performance of board, and different stack structure settings can be set according to use scene Corresponding stack structure, and industry universality is strong.

Description

Technical Field

[0001] This utility model relates to the field of PCB board technology, specifically a novel PCB board stacking structure. Background Technology

[0002] Black PP is commonly used in PCB boards, made by laminating PP with added coloring agents. For example, a 1.6mm thick substrate is made by laminating eight sheets of black 7628PP. The advantage of black PP lies primarily in its unparalleled light-blocking and light-transmitting properties. Secondly, it brings a significant market premium and a high-end image. Potential slight improvements in thermal performance and UV protection are additional advantages.

[0003] Black PP is more expensive than ordinary yellow PP. Black PP requires the addition of high concentrations of carbon black pigment to achieve a deep black and opaque effect. The cost of carbon black itself is much higher than that of inorganic pigments (such as chromium compounds or iron compounds) used in ordinary yellow / brown PP. In addition, black PP is not a conventional PP and needs to be custom-made. Based on this, this application proposes a new type of PCB board stack structure to solve the above problems. Utility Model Content

[0004] To address the shortcomings of existing technologies, this utility model provides a novel PCB board stack structure. This novel PCB board stack structure reduces material costs by optimizing the PP stack, while ensuring the light-shielding and light-blocking performance of the board.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a novel PCB board stack structure, which consists of a top copper foil layer, a middle PP layer and a bottom copper foil layer from top to bottom, wherein the middle PP layer contains multiple yellow PP sheets, and an optical absorption layer is provided at least once between the middle PP layer and the top copper foil layer or the bottom copper foil layer.

[0006] Furthermore, optical absorption layers are provided on both the upper and lower sides of the intermediate PP layer. The optical absorption layers are made of black PP and are respectively located above and below multiple yellow PP sheets.

[0007] Furthermore, the optical absorption layer is black PP, which is disposed on top of multiple yellow PP sheets.

[0008] Furthermore, the top and bottom copper foil layers have a rough surface on the side closest to the yellow PP, and the upper and lower sides of the middle PP layer are provided with optical absorption layers, which are black resins coated on the rough surfaces of the top and bottom copper foil layers, respectively.

[0009] Furthermore, the side of the top copper foil layer closest to the yellow PP is textured, and the optical absorption layer is a black resin coated on the textured side of the top copper foil layer.

[0010] Furthermore, optical absorption layers are provided on both the upper and lower sides of the intermediate PP layer, which are respectively black resins coated on the uppermost yellow PP layer and the lowermost yellow PP layer near the copper foil.

[0011] Furthermore, the optical absorption layer is a black resin coated on the side of the topmost yellow PP closest to the copper foil.

[0012] Compared with the prior art, the technical solution of this application has the following beneficial effects:

[0013] This novel PCB board stack structure, by setting at least one optical absorption layer between the middle PP layer and the upper and lower copper foil layers, changes part of the substrate material of the PCB board from black PP to yellow PP. After lamination, compared with the traditional PCB board using all black PP material, it can effectively reduce the amount of black PP used, save PP raw material costs, and the setting of the optical absorption layer can ensure the light-shielding and light-blocking performance of the board. Different stack structures can be set according to the application scenario, making it highly applicable to the industry. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of Embodiment 1 of the present utility model;

[0015] Figure 2 This is a schematic diagram of the structure of Embodiment 2 of this utility model;

[0016] Figure 3 This is a schematic diagram of the structure of Embodiment 3 of this utility model;

[0017] Figure 4 This is a schematic diagram of the structure of Embodiment 4 of this utility model;

[0018] Figure 5 This is a schematic diagram of the structure of Embodiment 5 of this utility model;

[0019] Figure 6 This is a schematic diagram of the structure of Embodiment 6 of this utility model.

[0020] In the diagram: 1. Top copper foil layer; 2. Bottom copper foil layer; 3. Middle PP layer. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] This invention aims to optimize PP lamination to reduce material costs. For different application scenarios, this solution provides six different lamination structures.

[0023] Example 1, please refer to Figure 1 The PCB board is composed of a top copper foil layer 1, a middle PP layer 3 and a bottom copper foil layer 2 laminated together from top to bottom. The middle PP layer 3 contains multiple yellow PP sheets. Optical absorption layers are provided on both the upper and lower sides of the middle PP layer 3. The optical absorption layers are black PP sheets, which are respectively located above and below the multiple yellow PP sheets.

[0024] Example 2, please refer to Figure 2 The PCB board is composed of a top copper foil layer 1, a middle PP layer 3 and a bottom copper foil layer 2 laminated together from top to bottom. The middle PP layer 3 contains multiple yellow PP sheets. An optical absorption layer is provided between the middle PP layer 3 and the top copper foil layer 1. The optical absorption layer is a black PP sheet, which is located above the multiple yellow PP sheets.

[0025] Example 3, please refer to Figure 3 The PCB board is composed of a top copper foil layer 1, a middle PP layer 3 and a bottom copper foil layer 2 laminated together from top to bottom. The middle PP layer 3 contains multiple yellow PP sheets. The top copper foil layer 1 and the bottom copper foil layer 2 have a rough surface on the side closest to the yellow PP. Optical absorption layers are provided on the upper and lower sides of the middle PP layer 3, which are black resins coated on the rough surfaces of the top copper foil layer 1 and the bottom copper foil layer 2, respectively.

[0026] Example 4, please refer to Figure 4 The PCB board is composed of a top copper foil layer 1, a middle PP layer 3 and a bottom copper foil layer 2 laminated together from top to bottom. The middle PP layer 3 contains multiple yellow PP sheets. An optical absorption layer is provided between the middle PP layer 3 and the top copper foil layer 1. The side of the top copper foil layer 1 closest to the yellow PP is rough. The optical absorption layer is black resin coated on the rough surface of the top copper foil layer 1.

[0027] Example 5, please refer to Figure 5 The PCB board is composed of a top copper foil layer 1, a middle PP layer 3 and a bottom copper foil layer 2 laminated together from top to bottom. The middle PP layer 3 contains multiple yellow PP sheets. Optical absorption layers are provided on the upper and lower sides of the middle PP layer 3, which are black resins coated on the uppermost yellow PP and the lowermost yellow PP near the copper foil, respectively.

[0028] Example 6, please refer to Figure 6 The PCB board is composed of a top copper foil layer 1, a middle PP layer 3 and a bottom copper foil layer 2 laminated together from top to bottom. The middle PP layer 3 contains multiple yellow PP sheets. An optical absorption layer is provided between the middle PP layer 3 and the top copper foil layer 1. The optical absorption layer is a black resin coated on the side of the top yellow PP sheet closest to the copper foil.

[0029] By providing at least one optical absorption layer between the middle PP layer 3 and the upper and lower copper foil layers, the substrate material of the PCB board can be changed from black PP to yellow PP. After lamination, compared with the traditional PCB board using all black PP material, the amount of black PP used can be effectively reduced, saving PP raw material costs. Moreover, the setting of the optical absorption layer can ensure the light-shielding and light-blocking performance of the board. Different stacking settings can be set according to the application scenario, which has strong industry applicability.

[0030] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0031] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention.

Claims

1. A novel stack-up of PCB board materials, characterized in that, It is composed of top copper foil layer (1), middle PP layer (3) and bottom copper foil layer (2) from top to bottom, the middle PP layer (3) contains multiple yellow PPs, and at least one of the middle PP layer (3) and the top copper foil layer (1) or the bottom copper foil layer (2) is provided with an optical absorption layer.

2. The novel laminated structure of PCB board according to claim 1, characterized in that: The upper and lower sides of the middle PP layer (3) are both provided with optical absorption layers, the optical absorption layers are black PPs, and are respectively arranged above and below the multiple yellow PPs.

3. The novel laminated structure of PCB board according to claim 1, characterized in that: The optical absorption layer is black PP, which is arranged above the multiple yellow PPs.

4. The novel laminated structure of PCB board according to claim 1, characterized in that: The side of the top copper foil layer (1) and the bottom copper foil layer (2) close to the yellow PPs is a matte surface, the upper and lower sides of the middle PP layer (3) are both provided with optical absorption layers which are black resins coated on the matte surfaces of the top copper foil layer (1) and the bottom copper foil layer (2).

5. The novel laminated structure of PCB board according to claim 1, characterized in that: The side of the top copper foil layer (1) close to the yellow PPs is a matte surface, and the optical absorption layer is a black resin coated on the matte surface of the top copper foil layer (1).

6. The novel laminated structure of PCB board according to claim 1, characterized in that: The upper and lower sides of the middle PP layer (3) are both provided with optical absorption layer, which are black resins coated on the sides of the uppermost yellow PP and the lowermost yellow PP close to the copper foil.

7. The novel laminated structure of PCB board according to claim 1, characterized in that: The optical absorption layer is a black resin coated on the side of the uppermost yellow PP close to the copper foil.

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