A two-sided heat dissipation vapor chamber

Abstract

The utility model discloses a kind of two-side heat-dissipating temperature equalizing plate, temperature equalizing plate is L-shaped setting, including vertical part and horizontal part, vertical part and / or horizontal part are equipped on boss;Vertical part, horizontal part and boss three all include shell and fill in the porous structure of corresponding shell inner cavity, the shell of three constitutes integrated outer shell sealing structure, the porous structure of three constitutes integrated capillary filling body;Capillary filling body is placed in outer shell sealing structure, the inner cavity of outer shell sealing structure is filled with cooling medium;The inner cavity of outer shell sealing structure is equipped with support column;Outer shell sealing structure, capillary filling body and support column three are 3D printing integrated molding structure.The utility model is through the cooperation of vertical part, horizontal part and boss, the high-power component and device distributed on the two surfaces of circuit board are integrated heat dissipation, without setting multiple temperature equalizing plate to carry out heat dissipation, reduce cost, save assembly space, reduce assembly difficulty, improve the heat uniformity of product whole.

Description

Technical Field

[0001] This utility model relates to the field of heat exchanger technology, specifically to a heat exchanger that dissipates heat from both sides. Background Technology

[0002] In electronic devices, vapor chambers act as efficient heat transfer devices to dissipate heat from high-power-density components. Traditional vapor chambers are mostly flat, and their heat absorption area is limited to a two-dimensional plane, making it difficult to further improve heat transfer efficiency within a limited space. Specifically, traditional vapor chambers only absorb heat on their top and bottom surfaces. When the heat source in an electronic device is distributed across two surfaces, multiple vapor chambers are required for heat dissipation, leading to increased costs, occupying more space within the electronic device's internal cavity, and increasing assembly complexity.

[0003] For example, Chinese patent document CN216960323U describes a three-dimensional circuit board structure. In this document, a first circuit board and a second circuit board are arranged perpendicularly to each other in space. For this three-dimensional circuit board structure, multiple heat spreaders are required to dissipate heat from the high-power components on the first and second circuit boards. These high-power components include, but are not limited to, chips. For this type of three-dimensional circuit board structure, multiple heat spreaders are needed for heat dissipation. Utility Model Content

[0004] This invention proposes a heat dissipation plate with heat dissipation on both sides to solve the problem that the heat dissipation plate cannot dissipate heat on both sides.

[0005] This utility model discloses a heat dissipation plate with two sides. The heat dissipation plate is L-shaped and includes a vertical part and a horizontal part. The vertical part and / or the horizontal part is provided with a boss. The vertical portion, the horizontal portion, and the boss each include a shell and a porous structure filled in the corresponding inner cavity of the shell. The shells of the three portions constitute an integral outer shell sealing structure. The inner cavities of the shells of the three portions are connected to form the inner cavity of the outer shell sealing structure. The porous structures of the three portions constitute an integral capillary filler. The capillary filler is placed inside the outer shell sealing structure, and the inner cavity of the outer shell sealing structure is filled with a cooling medium. The inner cavity of the outer shell sealing structure is provided with a support column, which passes through the capillary filler; the peripheral wall of the support column is connected to the capillary filler, and the two end faces of the support column are respectively connected to the inner walls of the two sides of the outer shell sealing structure. The outer casing sealing structure, the capillary filler, and the support column are a 3D printed integral structure. The vertical section, horizontal section, and boss work together to dissipate heat from the high-power components distributed on both sides of the circuit board.

[0006] Furthermore, the housing of the vertical portion is a first housing, and the porous structure of the vertical portion is a first porous structure; the housing of the horizontal portion is a second housing, and the porous structure of the horizontal portion is a second porous structure. The support column includes a first support column disposed in the first housing and a second support column disposed in the second housing; The axial direction of the first support column is parallel to the horizontal part and passes through the first porous structure; the peripheral wall of the first support column is connected to the first porous structure, and the two end faces of the first support column are respectively connected to the inner walls of the two sides of the first shell. The second support column is parallel to the vertical portion along its axis and passes through the second porous structure; the peripheral wall of the second support column is connected to the second porous structure, and the two end faces of the second support column are respectively connected to the inner walls of both sides of the second housing. Using the above solution, the outer shell sealing structure is reinforced by the support column.

[0007] Furthermore, the boss is located inside the corner where the vertical part and the horizontal part connect; The inner side of the corner where the vertical part connects to the horizontal part is adapted to be connected to the circuit board, and the boss is arranged opposite to the high-power components on the circuit board. The aperture of the capillary filler on the side closer to the circuit board is smaller than the aperture of the capillary filler on the side farther from the circuit board. Using this method, the cooling medium is distributed within the pores of the capillary filler through capillary action.

[0008] Furthermore, the capillary filler is provided with micron-sized pores and nano-sized pores; The nanopores have a pore size of 800 nm to 10 μm, and the proportion of the nanopore size is 5% to 10%. The micron-sized pores have a diameter of 50-100 μm, and the proportion of micron-sized pores is 90%~95%.

[0009] Furthermore, a filling hole is provided on the side wall of the outer casing sealing structure, and the cooling medium is adapted to be injected into the inner cavity of the outer casing sealing structure through the filling hole; The filling hole is adapted to be sealed by welding after the cooling medium is injected into the inner cavity of the outer shell sealing structure, so as to seal the inner cavity of the outer shell sealing structure.

[0010] Furthermore, a filling pipe connected to the filling hole is provided on the outer wall of the outer casing sealing structure. This design reduces the difficulty of injecting cooling medium into the outer casing sealing structure.

[0011] Furthermore, the cooling medium is Freon, acetone, or ammonia.

[0012] Furthermore, the outer casing sealing structure, the capillary filler, and the support column are made of the same material; The outer sealing structure is an aluminum alloy outer shell, the capillary filler is an aluminum alloy filler, and the support column is an aluminum alloy support column. This approach reduces the difficulty of 3D printing a single, integrated molding process.

[0013] Furthermore, the outer corner of the bend where the vertical part connects to the horizontal part is rounded.

[0014] Furthermore, the outer wall of the outer casing sealing structure is provided with an ear plate.

[0015] By adopting the above technical solution, this utility model has the following beneficial effects compared with the prior art: By combining the vertical section, horizontal section and boss, heat is dissipated from the high-power components distributed on both sides of the circuit board, eliminating the need for multiple heat dissipation plates, reducing costs, saving assembly space and reducing assembly difficulty. The sealing structure of the outer shell is reinforced by setting up support columns; Complex-shaped heat spreaders are manufactured using 3D printing in a single piece, reducing manufacturing difficulty. The porous structure is placed inside the bosses to improve the heat dissipation effect of the heat spreader.

[0016] The above description of the disclosed content and the following description of the embodiments are intended to demonstrate and explain the spirit and principle of the present invention, and to provide a further explanation of the scope of the patent application of the present invention. Attached Figure Description

[0017] The specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings.

[0018] Figure 1 This is a three-dimensional schematic diagram (a) of the temperature distribution plate in this utility model; Figure 2 This is a partial cross-sectional schematic diagram (I) of the temperature distribution plate in this utility model; Figure 3 This is a schematic diagram of the capillary filler in this utility model; Figure 4 This is a partial cross-sectional schematic diagram (II) of the temperature distribution plate in this utility model; Figure 5 This is a three-dimensional schematic diagram (II) of the temperature distribution plate in this utility model.

[0019] Explanation of icon numbers: 1. Vertical part; 11. First shell; 12. First porous structure; 2. Horizontal part; 21. Second shell; 22. Second porous structure; 3. Boss; 31. Third shell; 32. Third porous structure; 4. Support column; 41. First support column; 42. Second support column; 5. Filling hole; 6. Filling tube; 7. Ear plate. Detailed Implementation

[0020] The following specific embodiments illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. Although the description of this utility model will be presented in conjunction with preferred embodiments, this does not mean that the features of this utility model are limited to this embodiment. On the contrary, the purpose of describing the utility model in conjunction with the embodiments is to cover other options or modifications that may be derived based on the claims of this utility model. To provide a deep understanding of this utility model, many specific details will be included in the following description. This utility model may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of this utility model, some specific details will be omitted in the description. It should be noted that, without conflict, the embodiments and features in the embodiments of this utility model can be combined with each other.

[0021] In the description of this embodiment, it should be noted that the terms "upper", "lower", "inner", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship that the utility model product is usually placed in during use. They are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the utility model.

[0022] The terms “first”, “second”, etc., are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0023] In the description of this embodiment, it should also be noted that, unless otherwise explicitly specified and limited, the terms "provided with," "set up," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this embodiment based on the specific circumstances.

[0024] This invention provides a heat dissipation plate with heat dissipation on both sides for heat dissipation of circuit boards.

[0025] Please see Figures 1-2As shown, the heat spreader is L-shaped and includes a vertical section 1, a horizontal section 2, and a boss 3. The vertical section 1 is vertically positioned, while the horizontal section 2 is horizontally positioned. The lower end of the vertical section 1 is connected to the left end of the horizontal section 2 to form an L-shaped structure. The boss 3 is positioned on the vertical section 1, or on the horizontal section 2, or on both the vertical section 1 and the horizontal section 2. The vertical section 1, the horizontal section 2, and the boss 3 are a 3D-printed integral structure.

[0026] In this embodiment, the boss 3 is disposed on the horizontal portion 2. The boss 3 is located on the inner side of the corner where the vertical portion 1 and the horizontal portion 2 connect, that is, the boss 3 is distributed on the top of the horizontal portion 2. The inner side of the corner where the vertical portion 1 and the horizontal portion 2 connect is suitable for connecting to a circuit board for heat dissipation. The boss 3 is disposed opposite to high-power components on the circuit board for heat dissipation of high-power components.

[0027] In this embodiment, the outer corner of the bend where the vertical part 1 connects to the horizontal part 2 is rounded.

[0028] The shape of the boss 3 includes, but is not limited to, cuboids, cylinders, etc. In this embodiment, the boss 3 is a cuboid.

[0029] Vertical portion 1, horizontal portion 2, and boss 3 each include a shell and a porous structure filling the corresponding shell cavity. The shells of vertical portion 1, horizontal portion 2, and boss 3 constitute an integral outer shell sealing structure. The inner cavities of the shells of vertical portion 1, horizontal portion 2, and boss 3 are interconnected to form the inner cavity of the outer shell sealing structure. The porous structures of vertical portion 1, horizontal portion 2, and boss 3 constitute an integral capillary filler. The capillary filler is placed within the outer shell sealing structure, and the inner cavity of the outer shell sealing structure is filled with a cooling medium. The cooling medium is suitable for distribution within the pores of the capillary filler. The cooling medium includes, but is not limited to, Freon, acetone, and ammonia.

[0030] The cooling medium is distributed in the pores of the capillary filler through capillary action.

[0031] Existing Chinese patent document CN114812241A describes a composite capillary structure applied to a thin heat exchanger. This document describes how the capillary structure (i.e., the capillary filler in this application) is applied to the heat exchanger, and how the cooling medium operates on the heat exchanger. Therefore, the combination of the cooling medium and the capillary filler is prior art, and will not be elaborated upon in this application.

[0032] In this embodiment, please refer to Figures 2-4As shown, the shell of the vertical part 1 is the first shell 11, and the porous structure of the vertical part 1 is the first porous structure 12. The first porous structure 12 is fixed inside the first shell 11. The shell of the horizontal part 2 is the second shell 21, and the porous structure of the horizontal part 2 is the second porous structure 22. The second porous structure 22 is fixed inside the second shell 21. The shell of the boss 3 is the third shell 31, and the porous structure of the boss 3 is the third porous structure 32. The third porous structure 32 is fixed inside the third shell 31. The first shell 11, the second shell 21, and the third shell 31 constitute an integral outer shell sealing structure, and the inner cavities of the first shell 11, the second shell 21, and the third shell 31 are connected. The third porous structure 32 is disposed on top of the second porous structure 22. The first porous structure 12, the second porous structure 22, and the third porous structure 32 constitute an integral capillary filler. The outer corner of the connection between the first porous structure 12 and the second porous structure 22 is rounded.

[0033] In this embodiment, the thickness of the capillary filler is 2mm-8mm.

[0034] The inner cavity of the outer shell sealing structure is equipped with a support column 4 to support the inner cavity of the outer shell sealing structure and improve the strength of the heat spreader. The support column 4 passes through the capillary filler. The peripheral wall of the support column 4 is connected to the capillary filler, and the two end faces of the support column 4 are respectively connected to the two inner walls of the outer shell sealing structure. The shape of the support column 4 includes, but is not limited to, a cuboid or a cylinder. Preferably, the support column 4 is a cylinder to reduce the molding difficulty.

[0035] In this embodiment, please refer to Figure 4 As shown, the support column 4 includes a first support column 41 and a second support column 42. The first support column 41 is disposed within the first housing 11. The axial direction of the first support column 41 is parallel to the horizontal portion 2, meaning the first support column 41 is horizontally disposed. The first support column 41 horizontally passes through the first porous structure 12. The peripheral wall of the first support column 41 is connected to the first porous structure 12, and the front and rear end faces of the first support column 41 are respectively connected to the front and rear inner walls of the first housing 11. The second support column 42 is disposed within the second housing 21. The axial direction of the second support column 42 is parallel to the vertical portion 1, meaning the second support column 42 is vertically disposed. The second support column 42 vertically passes through the second porous structure 22. The peripheral wall of the second support column 42 is connected to the second porous structure 22. The upper and lower end faces of the second support column 42 are respectively connected to the upper and lower inner walls of the second housing 21.

[0036] In this embodiment, there are five first support columns 41, spaced apart within the first housing 11. There are fourteen second support columns 42, spaced apart within the second housing 21.

[0037] Furthermore, the pore size of the capillary filler on the side closer to the circuit board is smaller than the pore size on the side farther from the circuit board. The capillary filler contains micron-sized pores and nano-sized pores. The nano-pores have a pore size of 800 nm-10 μm and account for 5%~10% of the total pore size. The micron-sized pores have a pore size of 50-100 μm and account for 90%~95% of the total pore size.

[0038] For further details, please refer to Figure 4 As shown, a filling hole 5 is provided on the side wall of the outer casing sealing structure. Cooling medium is suitable for being injected into the inner cavity of the outer casing sealing structure through the filling hole 5. The filling hole 5 is suitable for being sealed by welding after the cooling medium is injected into the inner cavity of the outer casing sealing structure, thereby sealing the inner cavity of the outer casing sealing structure.

[0039] Please see Figure 5 As shown, to reduce the difficulty of injecting the cooling medium into the inner cavity of the outer shell sealing structure, a filling pipe 6 connected to the filling hole 5 is provided on the outer wall of the outer shell sealing structure. When the cooling medium is ammonia, the cooling medium is injected into the outer shell sealing structure in liquid form.

[0040] In this embodiment, the filling hole 5 is located on the second housing 21, at the end of the second housing 21 furthest from the first housing 11 (i.e., the right end of the second housing 21). The filling hole 5 is horizontally positioned. The filling pipe 6 is horizontally positioned on the right side of the second housing 21. Cooling medium can be injected into the inner cavity of the outer shell sealing structure through the filling pipe 6. After the cooling medium is injected into the outer shell sealing structure, the operator can cut off the filling pipe 6 and seal the filling hole 5 by welding to seal the inner cavity of the outer shell sealing structure, thereby effectively preventing the cooling medium from leaking out of the outer shell sealing structure.

[0041] Furthermore, an ear plate 7 is provided on the outer wall of the housing sealing structure. The heat spreader can be fixed inside the electronic device through the ear plate 7.

[0042] In this embodiment, the outer shell sealing structure, capillary filler, support column 4, filling tube 6, and ear plate 7 are all 3D printed as a single integrated structure. The outer shell sealing structure, capillary filler, support column 4, filling tube 6, and ear plate 7 are all made of the same material: aluminum alloy. The outer shell sealing structure is an aluminum alloy shell, the capillary filler is an aluminum alloy filler, and the support column 4 is an aluminum alloy support column. The filling tube 6 is an aluminum alloy tube. The ear plate 7 is an aluminum alloy ear plate.

[0043] In existing technologies, the outer sealing structure and the capillary filler are processed independently, and then welded together after both are completed. The structure of the vapor chamber needs to be sufficiently simple to achieve this welding assembly. Therefore, in existing technologies, porous structures cannot be incorporated into the bosses of the vapor chamber. In summary, existing vapor chamber assembly methods are inefficient, complex to operate, and unable to manufacture vapor chambers with complex shapes.

[0044] Compared to existing technologies, this invention utilizes 3D printing to create a complex-shaped vapor chamber, reducing manufacturing difficulty. Furthermore, the porous structure within the boss enhances heat dissipation. This invention, through the combined use of vertical sections, horizontal sections, and bosses, effectively dissipates heat from high-power components distributed across both sides of the circuit board, eliminating the need for multiple vapor chambers, thus reducing costs, saving assembly space, and simplifying assembly. The invention also reinforces the outer casing's sealing structure by incorporating support columns.

[0045] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A heat dissipation plate with heat dissipation on both sides, characterized in that, The temperature distribution plate is L-shaped and includes a vertical part (1) and a horizontal part (2), with a boss (3) on the vertical part (1) and / or the horizontal part (2). The vertical part (1), the horizontal part (2), and the boss (3) each include a shell and a porous structure filled in the corresponding inner cavity of the shell. The shells of the three parts constitute an integral outer shell sealing structure. The inner cavities of the shells of the three parts are connected to form the inner cavity of the outer shell sealing structure. The porous structures of the three parts constitute an integral capillary filler. The capillary filler is placed inside the outer shell sealing structure, and the inner cavity of the outer shell sealing structure is filled with a cooling medium. The inner cavity of the outer shell sealing structure is provided with a support column (4), which passes through the capillary filler; the peripheral wall of the support column (4) is connected to the capillary filler, and the two end faces of the support column (4) are respectively connected to the inner walls of the two sides of the outer shell sealing structure. The outer shell sealing structure, the capillary filler and the support column (4) are a 3D printed integrated structure.

2. The temperature distribution plate according to claim 1, characterized in that, The shell of the vertical part (1) is a first shell (11), and the porous structure of the vertical part (1) is a first porous structure (12); the shell of the horizontal part (2) is a second shell (21), and the porous structure of the horizontal part (2) is a second porous structure (22). The support column (4) includes a first support column (41) disposed in the first housing (11) and a second support column (42) disposed in the second housing (21). The first support column (41) is parallel to the horizontal part (2) and passes through the first porous structure (12); the peripheral wall of the first support column (41) is connected to the first porous structure (12), and the two end faces of the first support column (41) are respectively connected to the inner walls of the two sides of the first shell (11). The axial direction of the second support column (42) is parallel to the vertical part (1) and passes through the second porous structure (22); the peripheral wall of the second support column (42) is connected to the second porous structure (22), and the two end faces of the second support column (42) are respectively connected to the inner walls of the two sides of the second housing (21).

3. The temperature distribution plate according to claim 1, characterized in that, The boss (3) is located inside the corner where the vertical part (1) and the horizontal part (2) are connected; The inner side of the corner where the vertical part (1) connects to the horizontal part (2) is adapted to be connected to the circuit board, and the boss (3) is arranged opposite to the high-power components on the circuit board; The pore size of the capillary filler on the side closer to the circuit board is smaller than the pore size of the capillary filler on the side farther from the circuit board.

4. The temperature distribution plate according to claim 1, characterized in that, The capillary filler is provided with micron-pores and nano-pores; The nanopores have a pore size of 800 nm to 10 μm, and the proportion of the nanopore size is 5% to 10%. The micron-sized pores have a diameter of 50-100 μm, and the proportion of micron-sized pores is 90%~95%.

5. The temperature distribution plate according to claim 1, characterized in that, A filling hole (5) is provided on the side wall of the outer shell sealing structure, and the cooling medium is adapted to be injected into the inner cavity of the outer shell sealing structure through the filling hole (5); The filling hole (5) is adapted to be sealed by welding after the cooling medium is injected into the inner cavity of the outer shell sealing structure, so as to seal the inner cavity of the outer shell sealing structure.

6. The temperature distribution plate according to claim 5, characterized in that, The outer wall of the outer casing sealing structure is provided with a filling pipe (6) that communicates with the filling hole (5).

7. The temperature distribution plate according to claim 1, characterized in that, The cooling medium is Freon, acetone, or ammonia.

8. The temperature distribution plate according to claim 1, characterized in that, The outer shell sealing structure, the capillary filler and the support column (4) are made of the same material; The outer shell sealing structure is an aluminum alloy shell, the capillary filler is an aluminum alloy filler, and the support column (4) is an aluminum alloy support column.

9. The temperature distribution plate according to claim 1, characterized in that, The outer corner of the corner where the vertical part (1) connects to the horizontal part (2) is rounded.

10. The temperature distribution plate according to claim 1, characterized in that, The outer wall of the outer casing sealing structure is provided with an ear plate (7).

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