An electronic device

Abstract

The application relates to the technical field of electronic equipment, and provides an electronic equipment, which comprises a shell, a circuit board structure located in the shell, the circuit board structure comprising a first circuit board, a flexible connecting plate and a second circuit board, the flexible connecting plate being used for electrically connecting the first circuit board and the second circuit board, the flexible connecting plate being in a curved state, the first circuit board and the second circuit board being fixedly connected in the shell respectively, the flexible connecting plate comprising at least one conductive layer and at least one insulating layer which are stacked along the thickness direction of the flexible connecting plate, a stress neutral plane generated by the curved state of the flexible connecting plate being located in any one of the at least one conductive layer, or a stress neutral line generated by the curved state of the flexible connecting plate being located in the range of the thickness of any one of the at least one conductive layer. The circuit board structure in the electronic equipment is low in cost, large in board-level layout area, and low in risk of fatigue fracture of the conductive layer.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and more particularly to an electronic device. Background Technology

[0002] Electronic devices typically require various circuit boards, which are often electrically connected via adapter boards. This involves soldering two circuit boards to an adapter board, forming a sandwich structure: circuit board-adapter board-circuit board. However, with changes in soldering processes and the reduction in circuit board thickness, the yield rate of sandwich structures is significantly affected. Furthermore, sandwich structures suffer from increased weight and wasted board space. Therefore, a circuit board connection solution that addresses the low yield, heavy weight, and wasted board space inherent in sandwich structures is urgently needed. Utility Model Content

[0003] This application provides an electronic device that uses a circuit board structure to replace the sandwich architecture formed by soldering in related technologies, thereby reducing the area occupied by the board layout, facilitating rework and heat dissipation, and reducing the risk of fatigue fracture of the conductive layer.

[0004] In a first aspect, an electronic device is provided, comprising: a housing; and a circuit board structure located within the housing; wherein the circuit board structure includes a first circuit board, a flexible connecting plate, and a second circuit board, the flexible connecting plate being used to electrically connect the first circuit board and the second circuit board, the flexible connecting plate being in a bent state, the first circuit board and the second circuit board being fixedly connected within the housing, the flexible connecting plate including at least one conductive layer and at least one insulating layer stacked along the thickness direction of the flexible connecting plate, the stress neutral surface generated by the flexible connecting plate in the bent state being located within any one of the at least one conductive layer, or the stress neutral line generated by the flexible connecting plate in the bent state being located within the thickness range of any one of the at least one conductive layer; when the flexible connecting plate is in an unfolded state, the length direction of the first circuit board, the length direction of the flexible connecting plate, and the length direction of the second circuit board are parallel, and the first circuit board, the flexible connecting plate, and the second circuit board are sequentially arranged along the length direction of the flexible connecting plate; the length direction of the flexible connecting plate is perpendicular to the thickness direction of the flexible connecting plate.

[0005] The electronic device provided in this application includes a circuit board structure. This circuit board structure uses a flexible connecting plate to electrically connect a first circuit board and a second circuit board, replacing the sandwich structure formed by soldering in related technologies. Therefore, it can avoid occupying the board-level layout area of ​​the first and second circuit boards. The open sandwich structure facilitates device rework and heat dissipation. Since the stress neutral plane generated by the flexible connecting plate in a bent state is located within any one of the at least one conductive layer, or the stress neutral line generated by the flexible connecting plate in a bent state is located within the thickness range of any one of the at least one conductive layer, the stress borne by the conductive layer when bent is small, thereby preventing the risk of fatigue fracture of the conductive layer.

[0006] In some implementations of the first aspect, at least one conductive layer, a conductive layer of the first circuit board, and a conductive layer of the second circuit board are integrally formed; at least one insulating layer, an insulating layer of the first circuit board, and an insulating layer of the second circuit board are integrally formed. In this implementation, the circuit board structure is a one-piece molded structure, which is simple and easy to implement.

[0007] In some implementations of the first aspect, the first surface of the first circuit board and the first surface of the second circuit board are disposed opposite to each other. The circuit board structure also includes a buffer component, with a first end abutting against the first surface of the first circuit board and a second end abutting against the first surface of the second circuit board. In this implementation, the buffer component can support the first and second circuit boards, keeping them in relative positions. By providing the buffer component, excess space in the circuit board structure can be reduced, thereby reducing the micro-motion space of the circuit board structure and preventing fatigue breakage of the flexible connection board.

[0008] In some implementations of the first aspect, the circuit board structure further includes a first shielding cover disposed on a first surface of the first circuit board, covering at least one device on the first surface of the first circuit board; the buffer component includes the first shielding cover and a buffer body, abutting a first end of the buffer body against the first shielding cover, and abutting a second end of the buffer body against the first surface of the second circuit board; the buffer body is formed of a buffering material, or the buffer body includes a supporting member. In this implementation, by adding a buffer body to the first shielding cover, and utilizing the first shielding cover as part of the buffer component, the structure is simple and easy to implement.

[0009] In some implementations of the first aspect, the first circuit board and the second circuit board are fixedly connected to the housing by screws, the screws passing through the first circuit board along its thickness direction and the second circuit board along its thickness direction; the buffer component includes a sleeve fitted onto the screw, the first end of the sleeve abutting against the first surface of the first circuit board, and the second end of the sleeve abutting against the first surface of the second circuit board. In this implementation, by adding a buffer body to the first shielding cover, and utilizing the first shielding cover as part of the buffer component, the structure is simple and easy to implement.

[0010] In some implementations of the first aspect, the buffer component includes a support member, with a first end of the support member soldered to a first surface of a first circuit board and a second end of the support member soldered to a first surface of a second circuit board. In this implementation, using a support member as the buffer component results in a simple structure that is easy to implement.

[0011] In some implementations of the first aspect, the circuit board structure further includes a first shielding cover and a second shielding cover. The first shielding cover is disposed on a first surface of the first circuit board and covers at least one device on the first surface of the first circuit board. The second shielding cover is disposed on a first surface of the second circuit board and covers at least one device on the first surface of the second circuit board. The end of the first shielding cover facing away from the first circuit board abuts against the end of the second shielding cover facing away from the second circuit board. The buffer component includes the first shielding cover and the second shielding cover. In this implementation, the two abutting shielding covers are used as buffer components, resulting in a simple structure that is easy to implement.

[0012] In some implementations of the first aspect, the first surface of the first circuit board and the first surface of the second circuit board are disposed opposite each other. The circuit board structure also includes a heat dissipation component disposed between the first surface of the first circuit board and the first surface of the second circuit board. In this implementation, the heat dissipation effect of the circuit board structure is improved by providing a heat dissipation component, thereby ensuring the stability of the circuit board structure.

[0013] In some implementations of the first aspect, the circuit board structure further includes a first shielding cover, which is disposed on a first surface of the first circuit board and covers at least one device on the first surface of the first circuit board. The side of the first shielding cover facing the at least one device is the inner side of the first shielding cover, and the side of the first shielding cover facing away from the at least one device is the outer side of the first shielding cover. The heat dissipation component includes a first heat sink and a second heat sink. The first heat sink is disposed on the outer side of the first shielding cover and at least partially covers the first shielding cover. The second heat sink is disposed on the inner side of the first shielding cover. The first heat sink and the second heat sink are formed of a heat-dissipating material. In this implementation, heat sinks are disposed on the inner and outer sides of the first shielding cover, respectively, to improve the heat dissipation effect of the circuit board structure.

[0014] In some implementations of the first aspect, the heat dissipation component further includes a metal member, the first end of which is fixed in the first heat sink, and the second end of which is located outside the first heat sink. In this implementation, the metal member extends outward from the heat sink outside the first shield, and using a metal member can further improve the heat dissipation effect.

[0015] In some implementations of the first aspect, the flexible connecting plate further includes a first electromagnetic shielding layer and / or a second electromagnetic shielding layer. The first electromagnetic shielding layer is located on the inner side of the flexible connecting plate, and the second electromagnetic shielding layer is located on the outer side of the flexible connecting plate. In a bending state: the side of the flexible connecting plate that is compressed is the inner side of the flexible connecting plate, and the side of the flexible connecting plate that is stretched is the outer side of the flexible connecting plate. In this implementation, by providing the first electromagnetic shielding layer and / or the second electromagnetic shielding layer in the flexible connecting plate, electromagnetic shielding of the flexible connecting plate is achieved, preventing interference from the flexible circuit board to external devices.

[0016] In some implementations of the first aspect, the first electromagnetic shielding layer includes a grounded copper foil or an electromagnetic shielding film; the second electromagnetic shielding layer includes a grounded copper foil or an electromagnetic shielding film. In this implementation, the electromagnetic shielding layer can be a grounded copper foil or an electromagnetic shielding film, a simple and easy method to implement.

[0017] In some implementations of the first aspect, the bending angle of the inner side of the flexible connecting plate is α, where 0° < α ≤ 275°. The inner side of the flexible connecting plate refers to the side where the flexible connecting plate is compressed under bending conditions. In this implementation, the bending angle of the inner side of the flexible connecting plate has a large range, making it suitable for scenarios with different bending angle requirements and thus having a wide range of applications.

[0018] In some implementations of the first aspect, α = 90° or α = 180°.

[0019] Secondly, a circuit board structure is provided, comprising a first circuit board, a flexible connecting plate, and a second circuit board. The flexible connecting plate is used to electrically connect the first circuit board and the second circuit board. In the electronic device, the flexible connecting plate is in a bent state. The first circuit board and the second circuit board are respectively fixedly connected to the housing of the electronic device. The flexible connecting plate includes at least one conductive layer and at least one insulating layer stacked along the thickness direction of the flexible connecting plate. The stress neutral surface generated by the flexible connecting plate in the bent state is located within any one of the at least one conductive layer, or the stress neutral line generated by the flexible connecting plate in the bent state is located within the thickness range of any one of the at least one conductive layer. When the flexible connecting plate is in an unfolded state, the length direction of the first circuit board, the length direction of the flexible connecting plate, and the length direction of the second circuit board are parallel, and the first circuit board, the flexible connecting plate, and the second circuit board are arranged sequentially along the length direction of the flexible connecting plate. The length direction of the flexible connecting plate is perpendicular to the thickness direction of the flexible connecting plate.

[0020] In some implementations of the second aspect, at least one conductive layer, a conductive layer of the first circuit board, and a conductive layer of the second circuit board are integrally formed; at least one insulating layer, an insulating layer of the first circuit board, and an insulating layer of the second circuit board are integrally formed.

[0021] In some implementations of the second aspect, the first surface of the first circuit board and the first surface of the second circuit board are disposed opposite to each other, and the circuit board structure further includes a buffer component, the first end of the buffer component abutting against the first surface of the first circuit board, and the second end of the buffer component abutting against the first surface of the second circuit board.

[0022] In some implementations of the second aspect, the circuit board structure further includes a first shielding cover disposed on a first surface of the first circuit board, the first shielding cover covering at least one device on the first surface of the first circuit board; the buffer component includes the first shielding cover and a buffer body, a first end of the buffer body abutting against the first shielding cover, and a second end of the buffer body abutting against the first surface of the second circuit board; the buffer body is formed of a buffering material, or the buffer body includes a support member.

[0023] In some implementations of the second aspect, the first circuit board and the second circuit board are fixedly connected to the housing by screws, the screws passing through the first circuit board along the thickness direction of the first circuit board and the screws passing through the second circuit board along the thickness direction of the second circuit board; the buffer component includes a sleeve sleeved on the screw, the first end of the sleeve abutting against the first surface of the first circuit board and the second end of the sleeve abutting against the first surface of the second circuit board.

[0024] In some implementations of the second aspect, the buffer component includes a support member, the first end of which is soldered to the first surface of the first circuit board, and the second end of which is soldered to the first surface of the second circuit board.

[0025] In some implementations of the second aspect, the circuit board structure further includes a first shield and a second shield. The first shield is disposed on a first surface of the first circuit board and covers at least one device on the first surface of the first circuit board. The second shield is disposed on a first surface of the second circuit board and covers at least one device on the first surface of the second circuit board. The end of the first shield facing away from the first circuit board abuts against the end of the second shield facing away from the second circuit board. The buffer component includes the first shield and the second shield.

[0026] In some implementations of the second aspect, the first surface of the first circuit board and the first surface of the second circuit board are disposed opposite to each other, and the circuit board structure also includes a heat dissipation component disposed between the first surface of the first circuit board and the first surface of the second circuit board.

[0027] In some implementations of the second aspect, the circuit board structure further includes a first shielding cover, which is disposed on a first surface of the first circuit board and covers at least one device on the first surface of the first circuit board. The side of the first shielding cover facing at least one device is the inner side of the first shielding cover, and the side of the first shielding cover away from at least one device is the outer side of the first shielding cover. The heat dissipation component includes a first heat sink and a second heat sink. The first heat sink is disposed on the outer side of the first shielding cover and at least partially covers the first shielding cover. The second heat sink is disposed on the inner side of the first shielding cover. The first heat sink and the second heat sink are formed of a heat dissipation material.

[0028] In some implementations of the second aspect, the heat dissipation component further includes a metal member, the first end of which is fixed in the first heat sink, and the second end of which is located outside the first heat sink.

[0029] In some implementations of the second aspect, the flexible connecting plate further includes a first electromagnetic shielding layer and / or a second electromagnetic shielding layer, wherein the first electromagnetic shielding layer is located on the inner side of the flexible connecting plate and the second electromagnetic shielding layer is located on the outer side of the flexible connecting plate; in the bending state: the side of the flexible connecting plate that is compressed is the inner side of the flexible connecting plate, and the side of the flexible connecting plate that is stretched is the outer side of the flexible connecting plate.

[0030] In some implementations of the second aspect, the first electromagnetic shielding layer includes a grounded copper foil or an electromagnetic shielding film; the second electromagnetic shielding layer includes a grounded copper foil or an electromagnetic shielding film.

[0031] In some implementations of the second aspect, the bending angle of the inner side of the flexible connecting plate is α, where 0°<α≤275°, and the inner side of the flexible connecting plate is the side of the flexible connecting plate that is compressed in the bending state.

[0032] In some implementations of the second aspect, α = 90° or α = 180°.

[0033] It is understandable that the beneficial effects of the second aspect mentioned above can be found in the relevant description of the first aspect mentioned above, and will not be repeated here. Attached Figure Description

[0034] Figure 1 This is a cross-sectional schematic diagram of the sandwich architecture for the electrical connection between the motherboard and the module board in related technologies;

[0035] Figure 2 This is a cross-sectional view of a circuit board structure in an electronic device according to an embodiment of this application;

[0036] Figure 3 These are schematic diagrams of the circuit board structure in the unfolded state in different embodiments of this application from different angles.

[0037] Figure 4 This is a partial cross-sectional view of the circuit board structure in the unfolded state according to an embodiment of this application;

[0038] Figure 5 This is a partial cross-sectional view of the circuit board structure in the unfolded state according to another embodiment of this application;

[0039] Figure 6 This is a partial cross-sectional view of the circuit board structure in the unfolded state according to another embodiment of this application;

[0040] Figure 7 This is a partial cross-sectional view of the circuit board structure in the unfolded state in another embodiment of this application.

[0041] Figure 8 This is a schematic diagram of the various layers and stress neutral surfaces in the flexible connecting plate when the circuit board structure in one embodiment of this application is in a bent state.

[0042] Figure 9 This is a schematic diagram of a method for fixing a circuit board structure in an electronic device according to an embodiment of this application;

[0043] Figure 10 This is a cross-sectional view of a circuit board structure in an electronic device according to another embodiment of this application.

[0044] Figure 11 This is a cross-sectional view of the circuit board structure in an electronic device according to another embodiment of this application.

[0045] Figure 12 This is a cross-sectional view of the circuit board structure in an electronic device according to another embodiment of the present application.

[0046] Figure 13 This is a cross-sectional view of the circuit board structure in an electronic device according to another embodiment of the present application.

[0047] Figure 14 This is a cross-sectional structural diagram of the circuit board structure in an electronic device according to several embodiments of this application;

[0048] Figure 15 This is a cross-sectional structural diagram of the circuit board structure in an electronic device according to several embodiments of this application;

[0049] Figure 16 This is a cross-sectional structural diagram of the circuit board structure in an electronic device according to several embodiments of this application;

[0050] Figure 17 This is a cross-sectional view of the circuit board structure in an electronic device according to another embodiment of this application.

[0051] Figure 18 This is a partial cross-sectional view of the circuit board structure in the unfolded state in several embodiments of this application. Detailed Implementation

[0052] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0053] In the description of the embodiments of this application, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" and "second" may explicitly or implicitly include at least one of that feature.

[0054] In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise expressly and specifically limited.

[0055] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0056] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0057] In the description of this application, it should be understood that the terms "inner", "outer", "side", "upper", "bottom", "front", "rear", etc., indicating the orientation or positional relationship are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0058] In the description of this application, it should be noted that the term "and / or" is merely a description of the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can represent three situations: A exists alone, A and B exist simultaneously, and B exists alone.

[0059] References to "one embodiment" or "some embodiments" in the embodiments described in this application mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0060] It should also be noted that the same reference numerals are used to represent the same components or parts in the same embodiment of this application. For the same parts in one embodiment of this application, the reference numerals may only be used to mark one part or component as an example in the figure. It should be understood that the reference numerals are also applicable to other identical parts or components.

[0061] The technical solutions provided in the embodiments of this application will be described below with reference to the accompanying drawings.

[0062] Currently, electronic devices typically require the installation of various circuit boards with different functions, and these circuit boards often need to be electrically connected to each other. The commonly used method for electrical connection is to solder through an adapter board. This structure, which is soldered through an adapter board, can be called a sandwich architecture.

[0063] For example, in many consumer electronics products, the system-on-a-chip (SOC) is located on the motherboard, and one or more other functional module boards are soldered onto the motherboard. The module boards are electrically connected to the motherboard by soldering with an adapter board.

[0064] To facilitate understanding, the sandwich architecture is illustrated below with reference to the accompanying drawings.

[0065] Figure 1 The diagram shown is a cross-sectional view of a sandwich architecture for the electrical connection between the motherboard and the module board in related technologies.

[0066] like Figure 1 As shown, the sandwich architecture includes a module board 110, a main board 120, a first adapter board 131, and a second adapter board 132. A first device 121 and a second device 122 are disposed on the main board 120. The first board surface 111 on the module board 110 is disposed opposite to the second board surface 123 of the main board 120. The two ends of the first adapter board 131 are respectively welded to the first board surface 111 and the second board surface 123, and the two ends of the second adapter board 132 are also respectively welded to the first board surface 111 and the second board surface 123.

[0067] like Figure 1 As shown, multiple pads are respectively provided on the module board 110 and the main board 120. Pads are provided at both ends of the first adapter board 131 and both ends of the second adapter board 132. A first solder joint 141 is formed between a pad at one end of the first adapter board 131 and a pad on the first board surface 111. A second solder joint 142 is formed between a pad at the other end of the first adapter board 131 and a pad on the second board surface 123. A third solder joint 143 is formed between a pad at one end of the second adapter board 132 and a pad on the first board surface 111. A fourth solder joint 144 is formed between a pad at the other end of the second adapter board 132 and a pad on the second board surface 123.

[0068] It should also be understood that a pad can be set on the motherboard 120 at the position corresponding to the first device 121 and the second device 122, and the first device 121 and the second device 122 are soldered to the corresponding pads.

[0069] Understandably, the aforementioned "adapter board" can also be called a "frame" or "FB board".

[0070] like Figure 1 The sandwich architecture shown has many technical problems, such as: the high cost due to the need for multiple soldering processes; the high yield rate due to changes in soldering technology and thinner circuit boards; the need for soldering requiring corresponding pads on the first board surface 111 of module board 110 and the second board surface 123 of motherboard 120, which occupies board area and wastes board layout area; the high cost of reworking components within the cavity formed by the sandwich architecture; and the difficulty in dissipating heat within the enclosed cavity.

[0071] To address the aforementioned technical problems, this application provides a circuit board structure comprising a first circuit board, a flexible connecting plate, and a second circuit board. The flexible connecting plate electrically connects the first and second circuit boards. The flexible connecting plate is in a bent state. The first and second circuit boards are respectively fixedly connected to the housing of an electronic device. The flexible connecting plate includes at least one conductive layer and at least one insulating layer stacked along its thickness direction. The stress neutral surface generated by the flexible connecting plate in its bent state is located within any one of the at least one conductive layer, or the stress neutral line generated by the flexible connecting plate in its bent state is located within the thickness range of any one of the at least one conductive layer. When the flexible connecting plate is in its unfolded state, the length directions of the first circuit board, the flexible connecting plate, and the second circuit board are parallel, and the first circuit board, the flexible connecting plate, and the second circuit board are sequentially arranged along the length direction of the flexible connecting plate. The length direction of the flexible connecting plate is perpendicular to its thickness direction. The circuit board structure in this application adopts a rigid-flexible architecture, using a flexible connecting plate to electrically connect the first circuit board and the second circuit board, replacing the sandwich architecture formed by soldering in related technologies. Therefore, it can avoid occupying the board-level layout area of ​​the first and second circuit boards, allowing the first and second circuit boards to achieve more effective layout area within a limited board area. In addition, the circuit board structure in this application can be regarded as an open sandwich architecture, which facilitates component rework. Furthermore, the open sandwich architecture can promote heat dissipation.

[0072] It should also be understood that during the use of electronic devices, many user operations will cause micro-movements to the flexible connection board of the circuit board structure. Repeated micro-movements cause the copper foil to bend repeatedly, which makes the flexible connection board prone to fatigue breakage. In the circuit board structure of this application, since the stress neutral surface generated by the flexible connection board in the bending state is located in any one of the at least one conductive layer, or the stress neutral line generated by the flexible connection board in the bending state is located within the thickness range of any one of the at least one conductive layer, the stress borne by the conductive layer when bending is smaller, thereby reducing the risk of fatigue fracture of the conductive layer.

[0073] This application also provides an electronic device, which includes a housing and the aforementioned circuit board structure. The circuit board structure is located inside the housing, and the first circuit board and the second circuit board in the circuit board structure are respectively fixedly connected to the housing of the electronic device.

[0074] For example, the housing of an electronic device may include a front cover, a middle frame, and a rear cover; the first circuit board and the second circuit board may both be fixedly connected to the middle frame; or the first circuit board may be fixedly connected to the middle frame, and the second circuit board may be fixedly connected to the front cover; or the first circuit board may be fixedly connected to the middle frame, and the second circuit board may be fixedly connected to the front cover. This application does not limit or elaborate on the connection positions of the circuit board structure in the electronic device.

[0075] It is understood that the electronic device in the embodiments of this application may also include other parts required for the electronic device to perform its functions. Depending on the type of electronic device, the specific composition of other parts may vary, and this application will not limit or elaborate on this.

[0076] It should also be understood that the electronic device in this application can be any possible electronic device, and this application does not limit the specific type of electronic device.

[0077] For example, the electronic devices provided in the embodiments of this application can be handheld devices (such as mobile terminals), various portable laptops, various tablet computers, gaming devices, wearable devices, smart cameras, handheld computers (or portable computers), netbooks, personal digital assistants (PDAs), etc. This application does not limit or enumerate the specific types of electronic devices.

[0078] For ease of understanding, the heat dissipation structure in this application will be described exemplarily below with reference to the accompanying drawings.

[0079] See Figure 2 This is a cross-sectional view of the circuit board structure in an electronic device according to an embodiment of this application. Figure 3 Figure a in the text is Figure 2 The circuit board structure shown is in its unfolded state (side view). Figure 3 Figure b in the text is Figure 2 The diagram shows a top view of the circuit board structure in its unfolded state.

[0080] like Figure 2 As shown, the circuit board structure 200 includes: a first circuit board 210, a flexible connecting plate 220, and a second circuit board 230. The flexible connecting plate 220 is used to electrically connect the first circuit board 210 and the second circuit board 230, wherein the flexible connecting plate 220 is in a bent state.

[0081] like Figure 3 Figure a in the middle and Figure 3 As shown in Figure b, the Z direction represents the thickness direction of the flexible connecting plate 220, the X direction represents the length direction of the flexible connecting plate 220, and the Y direction represents the width direction of the flexible connecting plate 220. The X, Y, and Z directions are perpendicular to each other. It should be understood that the Z direction also represents the thickness direction of the first circuit board 210 and the second circuit board 230, the X direction also represents the length direction of the first circuit board 210 and the second circuit board 230, and the Y direction also represents the width direction of the first circuit board 210 and the second circuit board 230.

[0082] like Figure 3 Figure a in the middle and Figure 3 As shown in Figure b, when the flexible connecting plate 220 is in the unfolded state, the length direction of the first circuit board 210, the length direction of the flexible connecting plate 220, and the length direction of the second circuit board 230 are parallel, and the first circuit board 210, the flexible connecting plate 220, and the second circuit board 230 are arranged sequentially along the length direction of the flexible connecting plate 220.

[0083] It should be understood that when an object bends, the neutral plane refers to the ideal interface within the object where it experiences neither tensile nor compressive stress; while the neutral axis is the ideal boundary line within a cross-section of the object parallel to the bending direction, where it experiences neither tensile nor compressive stress. For example, the neutral axis can be the intersection of the cross-section of the object parallel to the bending direction and the neutral plane.

[0084] In this embodiment, the flexible connecting plate 220 includes at least one conductive layer and at least one insulating layer stacked along the thickness direction of the flexible connecting plate 220. The stress neutral surface generated when the flexible connecting plate 220 is in a bent state is located within any one of the at least one conductive layer, or the stress neutral line generated when the flexible connecting plate 220 is in a bent state is located within the thickness range of any one of the at least one conductive layer.

[0085] In some embodiments, at least one conductive layer in the flexible connecting plate 220, a conductive layer in the first circuit board 210, and a conductive layer in the second circuit board 230 are integrally formed; at least one insulating layer in the flexible connecting plate 220, an insulating layer in the first circuit board 210, and an insulating layer in the second circuit board 230 are integrally formed. Alternatively, at least one conductive layer in the flexible connecting plate 220, a conductive layer in the first circuit board 210, and a conductive layer in the second circuit board 230 may be formed from the same conductive material; at least one insulating layer in the flexible connecting plate 220, an insulating layer in the first circuit board 210, and an insulating layer in the second circuit board 230 may be formed from the same insulating layer. Alternatively, the first circuit board 210, the flexible connecting plate 220, and the second circuit board 230 are integrally formed.

[0086] For example, such as Figure 2 , Figure 3 Figure a in the middle and Figure 3 As shown in Figure b, a first device 211 and a second device 212 are disposed on the surface of the first circuit board 210 facing the second circuit board 230.

[0087] For example, a pad can be provided on the first circuit board 210 at the position corresponding to the first device 211 and the second device 212, respectively. Figure 2 (Not shown in the image), the first device 211 and the second device 212 are soldered onto their respective pads.

[0088] It should be understood that, Figure 2 , Figure 3 Figure a in the middle and Figure 3 In the embodiment shown in Figure b, the number and position of the first device 211 and the second device 212 are merely examples. In other embodiments, more or fewer devices may be provided on the surface of the first circuit board 210 facing the second circuit board 230. In some embodiments, one or more devices may also be provided on the side of the first circuit board 210 facing away from the second circuit board 230. In some embodiments, devices may also be provided on both sides of the second circuit board 230. The position and number of devices provided in the circuit board structure are not limited or described in detail here.

[0089] Figure 3 Figure c in the figure is a top view of the circuit board structure in an unfolded state according to another embodiment of this application. Figure 3As shown in Figure c, the circuit board structure 300 includes: a first circuit board 310, a first flexible connecting plate 320, a second circuit board 230, a second flexible connecting plate 340, and a third circuit board 350, wherein: the first flexible connecting plate 320 is used to electrically connect the first circuit board 310 and the second circuit board 330, and the second flexible connecting plate 340 is used to electrically connect the second circuit board 330 and the third circuit board 350.

[0090] like Figure 3 As shown in Figure c, for the first flexible connecting plate 320, the X direction represents the length direction of the first flexible connecting plate 320, the Y direction represents the width direction of the first flexible connecting plate 320, and the X direction, Y direction and the thickness direction of the first flexible connecting plate 320 are perpendicular to each other.

[0091] like Figure 3 As shown in Figure c, for the second flexible connecting plate 340, the Y direction represents the length direction of the second flexible connecting plate 340, the X direction represents the width direction of the second flexible connecting plate 340, and the X direction, Y direction and the thickness direction of the second flexible connecting plate 340 are perpendicular to each other.

[0092] It is understood that when the circuit board structure 300 is installed in an electronic device, both the first flexible connecting plate 320 and the second flexible connecting plate 340 can be bent. The bending angle and bending direction of the first flexible connecting plate 320 and the second flexible connecting plate 340 can be set as needed. This application embodiment does not limit or elaborate on this.

[0093] exist Figure 3 In the embodiment shown in Figure c, the circuit board structure 300 includes three circuit boards and two flexible connecting plates, with adjacent circuit boards connected by the flexible connecting plates. In other embodiments, a circuit board structure may include more circuit boards and flexible connecting plates. This application does not limit or elaborate on the number of circuit boards and flexible connecting plates in the circuit board structure.

[0094] It should be understood that, Figure 2 and Figure 3 The stacked layers in the circuit board structure are not shown in the embodiments shown. For ease of understanding, the stacked structure in the circuit board structure and the integrated molding of the first circuit board 210, the flexible connecting plate 220 and the second circuit board 230 are illustrated below with reference to the accompanying drawings.

[0095] Figures 4 to 7 This is a partial cross-sectional view of the circuit board structure in its unfolded state, as shown in several embodiments of this application. It should be understood that... Figures 4 to 7In the embodiment shown, the first circuit board 210, the flexible connecting plate 220, and the second circuit board 230 are all integrally molded structures. For the sake of brevity in the drawings and description, Figures 4 to 7 The various embodiments illustrate only the stacking of the flexible connecting plate 220 and partial stacking of the first circuit board 210 and the second circuit board 230.

[0096] like Figure 4 As shown, in this embodiment, the flexible connecting plate 220 includes an insulating layer 401 and a conductive layer 402 stacked along the thickness direction of the flexible connecting plate 220.

[0097] It should be understood that Figure 4 The conductive layer 402 shown can also be called the wiring layer, that is, the conductive layer 402 has wiring that enables the first circuit board 210 and the second circuit board 230 to be electrically connected.

[0098] For example, Figure 4 The insulating layer 401 shown can be a flexible circuit board ink layer, that is, the insulating layer 401 can be formed by coating the conductive layer 402 with flexible circuit board ink.

[0099] For example, Figure 4 The insulating layer 401 shown can also be a flexible substrate layer, wherein the flexible substrate can be any of the following: polyimide (PI), polyester (PET), liquid crystal polymer (LCP), polytetrafluoroethylene (PTFE), thermoplastic polyurethane (TPU), flexible glass, etc.

[0100] like Figure 5 As shown, in this embodiment, the flexible connecting plate 220 includes a first insulating layer 501, a first conductive layer 502, a second insulating layer 503, an adhesive layer 504, and a second conductive layer 505 stacked along the thickness direction of the flexible connecting plate 220, wherein the second insulating layer 503 and the second conductive layer 505 are bonded together by the adhesive layer 504.

[0101] For example, the material of adhesive layer 504 can be adhesive, which can also be called glue, so adhesive layer 504 can also be called glue layer.

[0102] It should be understood that Figure 5 The first conductive layer 502 shown can also be called a wiring layer, that is, the first conductive layer 502 has wiring that enables the first circuit board 210 and the second circuit board 230 to be electrically connected.

[0103] For example, Figure 5 The first insulating layer 501 shown can be a flexible circuit board ink layer, that is, the first insulating layer 501 can be formed by coating the first conductive layer 502 with flexible circuit board ink.

[0104] For example, Figure 5 The second insulating layer 503 shown can be a flexible substrate layer, wherein the flexible substrate can be any of the following: polyimide (PI), polyester (PET), liquid crystal polymer (LCP), polytetrafluoroethylene (PTFE), thermoplastic polyurethane (TPU), flexible glass, etc.

[0105] For example, Figure 5 The second conductive layer 505 shown can be a wiring layer. In this case, the first conductive layer 502 and the second conductive layer 505 together realize the electrical connection between the first circuit board 210 and the second circuit board 230. Alternatively, the second conductive layer 505 can also be a ground copper foil (GND). In this case, the function of the second conductive layer 505 is to provide electromagnetic shielding for the area where the flexible connecting plate 220 is located.

[0106] like Figure 6 As shown, in this embodiment, the flexible connecting plate 220 includes a first insulating layer 601, a first conductive layer 602, a second insulating layer 603, a first adhesive layer 604, a second conductive layer 605, a third insulating layer 606, a second adhesive layer 607, and a third conductive layer 608 stacked along the thickness direction of the flexible connecting plate 220; wherein the second insulating layer 603 and the second conductive layer 605 are bonded together by the first adhesive layer 604, and the third insulating layer 606 and the third conductive layer 608 are bonded together by the second adhesive layer 607. Figure 6 In the embodiment shown, each layer of the flexible connecting plate 220 is integrally structured with a layer of the first circuit board 210 and the second circuit board 230.

[0107] For example, the first adhesive layer 604 can also be referred to as the first adhesive layer, and the second adhesive layer 607 can also be referred to as the second adhesive layer; the materials of the first adhesive layer 604 and the second adhesive layer 607 can be adhesives, and the types of adhesives are not described or limited in this application embodiment.

[0108] For example, the first conductive layer 602 and the second conductive layer 605 can both be wiring layers, while the third conductive layer 608 is a grounded copper foil. In this case, the first conductive layer 602 and the second conductive layer 605 together realize the electrical connection between the first circuit board 210 and the second circuit board 230; the function of the third conductive layer 608 is to provide electromagnetic shielding for the area where the flexible connecting plate 220 is located.

[0109] For example, the second conductive layer 605 can be a wiring layer, while the first conductive layer 602 and the third conductive layer 608 are both grounded copper foils. In this case, the second conductive layer 605 is used to realize the electrical connection between the first circuit board 210 and the second circuit board 230; the first conductive layer 602 and the third conductive layer 608 are used to provide electromagnetic shielding for the area where the flexible connecting plate 220 is located.

[0110] For example, the first conductive layer 602, the second conductive layer 605, and the third conductive layer 608 can all be wiring layers. In this case, the first conductive layer 602, the second conductive layer 605, and the third conductive layer 608 together realize the electrical connection between the first circuit board 210 and the second circuit board 230.

[0111] For example, Figure 6 The first insulating layer 601 shown can be a flexible circuit board ink layer, that is, the first insulating layer 601 can be formed by coating the first conductive layer 602 with flexible circuit board ink.

[0112] For example, Figure 6 The second insulating layer 603 shown can be a flexible substrate layer, wherein the flexible substrate can be any of the following: polyimide (PI), polyester (PET), liquid crystal polymer (LCP), polytetrafluoroethylene (PTFE), thermoplastic polyurethane (TPU), flexible glass, etc.

[0113] For example, Figure 6The third insulating layer 606 shown can be a flexible substrate layer, wherein the flexible substrate can be any of the following: polyimide (PI), polyester (PET), liquid crystal polymer (LCP), polytetrafluoroethylene (PTFE), thermoplastic polyurethane (TPU), flexible glass, etc.

[0114] like Figure 7 As shown, in this embodiment, the flexible connecting plate 220 includes a first conductive layer 701, a first insulating layer 702, a second insulating layer 703, a second conductive layer 704, a third insulating layer 705, and a third conductive layer 707 stacked along the thickness direction of the flexible connecting plate 220. Figure 7 In the embodiment shown, the first conductive layer 701, the first insulating layer 702, the second conductive layer 704, the third insulating layer 705, the adhesive layer 706, and the third conductive layer 707 in the flexible connecting plate 220 are integrally formed with a layer of the first circuit board 210 and the second circuit board 230, respectively; the second insulating layer 703 in the flexible connecting plate 220 is made of a different material than the same layer in the first circuit board 210 and the second circuit board 230.

[0115] For example, the adhesive layer 706 can also be called an adhesive layer. The material of the adhesive layer 706 can be an adhesive. This application embodiment does not elaborate on or limit the type of adhesive.

[0116] For example, in Figure 7 In the illustrated embodiment, the first circuit board 210 includes a fourth insulating layer 213, and the second circuit board 230 includes a fifth insulating layer 231. Figure 7 In the circuit board structure shown, the fourth insulating layer 213, the fifth insulating layer 231, and the second insulating layer 703 are located on the same layer; wherein, the second insulating layer 703 can be an adhesive layer, while the fourth insulating layer 213 and the fifth insulating layer 231 can be polypropylene (PP) layers. In other embodiments, the fourth insulating layer 213 and the fifth insulating layer 231 can also be made of other materials, which are not limited or described in detail in this application.

[0117] For example, in Figure 7 In the illustrated embodiment, the circuit board structure is partially lacking ink, or in other words, the area on the circuit board structure corresponding to the flexible connecting plate 220 lacks an ink layer. Specifically: in Figure 7 In the embodiment shown, the first conductive layer 701 is the outermost layer of the flexible connecting plate 220; as Figure 7As shown, a first ink layer 214 is provided in the area corresponding to the first circuit board 210 on the circuit board structure, and a second ink layer 232 is provided in the area corresponding to the second circuit board 230 on the circuit board structure. Figure 7 In the circuit board structure shown, the first ink layer 214 and the second ink layer 232 are located on the same layer.

[0118] In some other embodiments, an ink layer may also be provided on the first conductive layer 701. In this case, the ink layer 214, the second ink layer 232 and the ink layer on the first conductive layer 701 are the same ink layer, or the ink layer 214, the second ink layer 232 and the ink layer on the first conductive layer 701 are respectively the regions in the same ink layer that correspond to the first circuit board 210, the second circuit board 230 and the flexible connecting plate 220.

[0119] For example, the first conductive layer 701 and the second conductive layer 704 can both be wiring layers, while the third conductive layer 707 is a grounded copper foil. In this case, the first conductive layer 701 and the second conductive layer 704 together realize the electrical connection between the first circuit board 210 and the second circuit board 230; the function of the third conductive layer 707 is to provide electromagnetic shielding for the area where the flexible connecting plate 220 is located.

[0120] For example, the second conductive layer 704 can be a wiring layer, while the first conductive layer 701 and the third conductive layer 707 are both grounded copper foils. In this case, the second conductive layer 704 is used to realize the electrical connection between the first circuit board 210 and the second circuit board 230; the first conductive layer 701 and the third conductive layer 707 are used to provide electromagnetic shielding for the area where the flexible connecting plate 220 is located.

[0121] For example, the first conductive layer 701, the second conductive layer 704, and the third conductive layer 707 can all be wiring layers. In this case, the first conductive layer 701, the second conductive layer 704, and the third conductive layer 707 together realize the electrical connection between the first circuit board 210 and the second circuit board 230.

[0122] For example, Figure 7 The first insulating layer 702 shown can be a flexible substrate layer, wherein the flexible substrate can be any of the following: polyimide (PI), polyester (PET), liquid crystal polymer (LCP), polytetrafluoroethylene (PTFE), thermoplastic polyurethane (TPU), flexible glass, etc.

[0123] For example, Figure 7 The third insulating layer 705 shown can be a flexible substrate layer, wherein the flexible substrate can be any of the following: polyimide (PI), polyester (PET), liquid crystal polymer (LCP), polytetrafluoroethylene (PTFE), thermoplastic polyurethane (TPU), flexible glass, etc.

[0124] It should be understood that Figure 4 and Figure 7 The description mainly focuses on the stacked layers in the first circuit board 210, the flexible connecting plate 220, and the second circuit board 230. For the sake of brevity and convenience, the following descriptions are provided: Figure 4 and Figure 7 The components on the first circuit board 210 and the second circuit board 230 are not shown in the figure, but in fact any required components can be placed on the first circuit board 210 and the second circuit board 230.

[0125] It should be understood that the conductive layer in the embodiments of this application can be made of copper. Therefore, in some embodiments, the conductive layer can also be called a copper layer. The embodiments of this application do not limit or elaborate on the material of the conductive layer.

[0126] The following is combined with Figure 4 The embodiment shown illustrates, by way of example, the process of integrally forming the first circuit board 210, the flexible connecting plate 220, and the second circuit board 230.

[0127] In some embodiments, the first circuit board 210 and the second circuit board 230 require the same number of stacked layers, the corresponding stacked layers of the first circuit board 210 and the second circuit board 230 are made of the same material, and the stacked layers of the flexible circuit board 220 are the same as two adjacent layers in the stacked layers of the first circuit board 210. The integral molding process of the first circuit board 210, the flexible connecting plate 220 and the second circuit board 230 includes the following steps:

[0128] (1) The various stacks are stacked according to the first circuit board 210 and the second circuit board 230 to form a complete circuit board. In the top view of the complete circuit board, the complete circuit board can be divided into a first region, a second region and a third region. The stacks corresponding to the first region are the stacks required by the first circuit board 210, and the stacks corresponding to the third region are the stacks required by the second circuit board 230. The second region corresponds to the flexible connecting plate 220, but the stacks corresponding to the second region are more than the stacks required by the flexible connecting plate 220.

[0129] (2) Using partial cavity circuit board technology, the complete circuit board is opened in the second region until the two layers required for the remaining flexible connecting board 220 in the second region are reached, so as to form the flexible connecting board 220 in the second region; after opening, the first circuit board 210 and the second circuit board 230 are formed in the first region and the third region respectively.

[0130] In some other embodiments, the number of layers required for the first circuit board 210 is greater than the number of layers required for the second circuit board 230, but the materials of the corresponding layers of the first circuit board 210 and the second circuit board 230 are the same, and the layers of the flexible circuit board 220 are the same as two adjacent layers in the layer of the first circuit board 210. The integral molding process of the first circuit board 210, the flexible connecting plate 220 and the second circuit board 230 includes the following steps:

[0131] (1) The various layers are stacked according to the first circuit board 210 to form a complete circuit board. In the top view of the complete circuit board, the complete circuit board can be divided into a first region, a second region and a third region. The stacked layers corresponding to the first region are the stacked layers required by the first circuit board 210. The second region corresponds to the flexible connecting plate 220 and the stacked layers corresponding to the second region are more than the stacked layers required by the flexible connecting plate 220. The third region corresponds to the second circuit board 230 and the stacked layers corresponding to the third region are more than the stacked layers required by the second circuit board 230.

[0132] (2) Using partial cavity circuit board technology, the complete circuit board is opened in the second region until the two layers required for the remaining flexible connecting board 220 in the second region are completed, thereby forming the flexible connecting board 220 in the second region; the third region is opened until the stacked layers required for the remaining second circuit board 230 in the third region are completed, thereby forming the second circuit board 230 in the third region; after the two opening operations, the first circuit board 210 is formed in the first region.

[0133] It is understood that the aforementioned integrated molding process for the first circuit board 210, the flexible connecting plate 220, and the second circuit board 230 is merely an example. Other embodiments may employ similar methods to form the circuit board structure through integrated molding, and this application does not impose any limitations or elaborate on this.

[0134] It should also be understood that during the one-piece molding process, mechanical deep milling can be used to open the second area. When using mechanical deep milling to open the cover, the processing accuracy is relatively low, which may result in the dielectric layer not being completely removed. As a result, dielectric material will usually remain on the conductive layer, and the bending performance of the resulting flexible connecting plate 220 will be low, for example, the number of dynamic bends of the flexible connecting plate 220 is greater than or equal to 25. Alternatively, a combination of mechanical deep milling and laser deep milling can be used to open the second area. When using a combination of mechanical deep milling and laser deep milling to open the cover, the processing accuracy is relatively high, no dielectric material will remain on the conductive layer, and the bending performance of the resulting flexible connecting plate 220 will be high, for example, the number of dynamic bends of the flexible connecting plate 220 is greater than or equal to 1000.

[0135] For example, in Figure 5 In the embodiment shown, the second conductive layer 504 can not only provide electromagnetic shielding for the area where the flexible connecting plate 220 is located, but also the grounded copper foil, which can also be called a copper foil layer, can serve as a copper shield during laser deep ablation when the second area is opened to form the flexible connecting plate 220, thus eliminating the need for additional copper shielding and reducing production costs.

[0136] It should be understood that the conductive layer in the embodiments of this application can be made of copper. Therefore, in some embodiments, the conductive layer can also be called a copper layer. The embodiments of this application do not limit or elaborate on the material of the conductive layer.

[0137] For ease of understanding, the following will use... Figure 6 Taking the illustrated embodiment as an example, combined with Figure 8 An exemplary description is provided on how to control the stress neutral surface generated by the flexible connecting plate 220 in a bent state within a conductive layer, or how to control the stress neutral line generated by the flexible connecting plate 220 in a bent state within the thickness range of a conductive layer.

[0138] Figure 8 This is a schematic diagram of the various layers and stress neutral surfaces in the flexible connecting plate when the circuit board structure in one embodiment of this application is in a bent state. The unfolded state of the circuit board structure in this embodiment is shown in [reference needed]. Figure 6 .

[0139] by Figure 6 For example, when Figure 6 When the flexible connecting plate 220 shown is bent, Figure 6 Each layer of the flexible connecting plate 220 shown affects the position of the stress neutral plane (or stress neutral line) within the flexible connecting plate 220. Therefore, when... Figure 6 When the stress neutral plane generated by the flexible connecting plate 220 in a bent state is controlled within a conductive layer, it is actually necessary to consider factors such as... Figure 8 The 8-layer structure shown is in Figure 8 The eight layers in the structure are L1, L2, L3, L4, L5, L6, L7 and L8.

[0140] It should be understood that Figure 8 The 8-layer structure shown is Figure 6 The correspondence between the layers is as follows: L1 is the third conductive layer 608 (e.g., GND), L2 is the second adhesive layer 607, L3 is the third insulating layer 606 (e.g., PI layer), L4 is the second conductive layer 605 (e.g., wiring layer or GND), L5 is the first adhesive layer 604, L6 is the second insulating layer 603 (e.g., PI layer), L7 is the first conductive layer 602 (e.g., wiring layer or GND), and L8 is the first insulating layer 601 (e.g., flexible circuit board ink layer).

[0141] like Figure 8 As shown, h0, h1, h2, h3, h4, h5, h6, and h7 are the inner surfaces of L1, L2, L3, L4, L5, L6, L7, and L8, respectively, and h8 is the outer surface of L8; h0 is used as the reference surface. The position of the stress neutral surface is represented by the distance y between the stress neutral surface and h0, and y satisfies equation (1):

[0142]

[0143] In equation (1): y represents the position of the stress neutral surface, which is the distance between the stress neutral surface and the reference surface h0; Ei represents the elastic modulus of the Li layer; Ai represents the cross-sectional area of ​​the Li layer; yi represents the distance between the center of the Li layer and the reference surface h0.

[0144] It is understandable that the elastic modulus Ei of the Li layer can be obtained based on the material of the Li layer, and the cross-sectional area Ai of the Li layer is the cross-sectional area of ​​the Li layer when the flexible connecting plate 220 is in the unfolded state. Ai is equal to the product of the thickness and width of the Li layer. The distance yi between the center of the Li layer and the reference surface h0 can be calculated based on the flexible connecting plate 220 being in the unfolded state.

[0145] According to equation (1) above, the magnitude of y can be controlled by controlling the thickness of each layer, thereby controlling the stress neutral surface at L1, L4, or L7, such as... Figure 8 As shown, in this embodiment, the stress neutral surface is controlled at L4.

[0146] like Figure 8As shown, the bending radius R of the flexible connecting plate 220 under this force is equal to the radius of the arc formed by the outer surface h8 of L8. Since the stress neutral plane is located at L4, the strain of the conductive layer L4 is ε, and the strain ε directly determines the fatigue life of the conductive layer L4. The strain ε satisfies the following equation (2):

[0147]

[0148] In equation (2): ε represents the strain of the conductive layer L4; y Cu R represents the distance from the center of conductive layer L4 to the neutral plane; R represents the bending radius.

[0149] It should be understood that the smaller the bending radius R, the greater the strain ε of the conductive layer L4, and the higher the risk of fracture of the conductive layer L4.

[0150] Understandably, the conductive layer can be made of copper, which has the highest elastic modulus, approximately 110-130 GPa; PI has a medium elastic modulus, approximately 2.5-3 GPa; and adhesive (also known as glue) has the lowest elastic modulus, approximately 0.1-2 GPa. Controlling the location of the stress neutral plane can be achieved by reducing the thickness of the high-elastic-modulus conductive layer (e.g., replacing a 1-ounce copper layer with a 0.5-ounce copper layer) and increasing the thickness of the low-elastic-modulus adhesive and / or PI layers.

[0151] It should also be understood that when dealing with flexible connecting plate structures, the flexible connecting plates can be made into symmetrical stacks such as copper-PI-copper, so that the stress neutral plane is centered.

[0152] It should be understood that the bending radius R can be used to represent the degree of bending of the flexible connecting plate 220. Alternatively, it can be represented by the bending angle of the inner side of the flexible connecting plate 220, where the inner side is the side of the flexible connecting plate 220 that is compressed during bending. For example: Figure 8 The angle α marked in the figure is the bending angle of the inner side of the flexible connecting plate 220.

[0153] In some embodiments, the bending angle α on the inner side of the flexible connecting plate 220 ranges from 0° to 275°.

[0154] It should be understood that the bending angle is 0° when the flexible connecting plate 220 does not bend; Figure 2 In the embodiment shown, the bending angle of the inner side of the flexible connecting plate 220 is 180°.

[0155] It should be understood that the circuit board structure 200 needs to be fixed inside the housing of the electronic device. Specifically, the first circuit board 210 and the second circuit board 230 in the circuit board structure 200 are fixed inside the housing.

[0156] In some embodiments, the housing of the electronic device may include a front cover, a middle frame, and a rear cover; the first circuit board 210 and the second circuit board 230 may both be fixedly connected to the middle frame; or the first circuit board 210 may be fixedly connected to the middle frame, and the second circuit board 230 may be fixedly connected to the front cover; or the first circuit board 210 may be fixedly connected to the middle frame, and the second circuit board 230 may be fixedly connected to the front cover. This application embodiment does not limit or elaborate on the connection position of the circuit board structure 200 in the electronic device.

[0157] For ease of understanding, the following description, in conjunction with the accompanying drawings, provides an exemplary illustration of how the circuit board structure 200 is fixed in an electronic device.

[0158] Figures 9 to 13 This is a cross-sectional schematic diagram of the circuit board structure in an electronic device according to several embodiments of this application.

[0159] Figure 9 Figure a in the figure is a cross-sectional view of the circuit board structure fixed inside the housing in one embodiment of this application. Figure 9 Figure b in the text is Figure 9 The top view of the structure shown in Figure a. Figure 9 Figure a in the middle and Figure 9 As shown in Figure b, the first circuit board 210 and the second circuit board 230 are connected to the housing via connecting components. Figure 9 On (not shown), with the first circuit board 210 and the second circuit board 230 fixed, the flexible connecting plate 220 forms as shown. Figure 9 The bending state is shown in Figure a.

[0160] like Figure 9 Figure a in the middle and Figure 9 As shown in Figure b, the connecting components include: a first connector 901, a second connector 902, a third connector 903, and a fourth connector. Figure 9 (Not shown in the image). Wherein: the first circuit board 210 is connected to the housing via the second connector 902 and the fourth connector; the second circuit board 230 is connected to the housing via the first connector 901 and the third connector 903.

[0161] In some embodiments, the first connector 901, the second connector 902, the third connector 903, and the fourth connector are formed by adhesive, that is, the first circuit board 210 and the second circuit board 230 are glued to the housing by adhesive.

[0162] In some embodiments, the first connector 901, the second connector 902, the third connector 903 and the fourth connector can be BTB connectors, that is, the first circuit board 210 and the second circuit board 230 are fixed in the housing by the BTB connectors.

[0163] It should be understood that the full English name of BTB connector is Board-to-Board Connectors. This application embodiment will not elaborate on BTB connectors.

[0164] Figure 10 Figure a in the figure is a cross-sectional view of the circuit board structure fixed inside the housing in one embodiment of this application. Figure 10 Figure b in the text is Figure 10 The top view of the structure shown in Figure a. Figure 10 Figure a in the middle and Figure 10 As shown in Figure b, the first circuit board 210 and the second circuit board 230 are connected to the housing via connecting components. Figure 10 On (not shown), with the first circuit board 210 and the second circuit board 230 fixed, the flexible connecting plate 220 forms as shown. Figure 10 The bending state is shown in Figure a.

[0165] like Figure 10 Figure a in the middle and Figure 10 As shown in Figure b, the connecting components include: a first connector 1001, a second connector 1002, a third connector 1003, a fourth connector 1004, a fifth connector 1005, a sixth connector 1006, and a seventh connector (…). Figure 10 (not shown in the image) and the eighth connector ( Figure 10 (Not shown in the image). Wherein: the first circuit board 210 is connected to the housing via the third connector 1003, the fourth connector 1004, the seventh connector and the eighth connector; the second circuit board 230 is connected to the housing via the first connector 1001, the second connector 1002, the fifth connector 1005 and the sixth connector 1006.

[0166] In some embodiments, the first connector 1001, the second connector 1002, the third connector 1003, the fourth connector 1004, the fifth connector 1005, the sixth connector 1006, and the seventh connector are formed by adhesive, that is, the first circuit board 210 and the second circuit board 230 are glued to the housing by adhesive.

[0167] In some embodiments, the first connector 1001, the second connector 1002, the third connector 1003, the fourth connector 1004, the fifth connector 1005, the sixth connector 1006, and the seventh connector can be BTB connectors, that is, the first circuit board 210 and the second circuit board 230 are fixed in the housing through BTB connectors.

[0168] It should be understood that the full English name of BTB connector is Board-to-Board Connectors. This application embodiment will not elaborate on BTB connectors.

[0169] Figure 11 Figure a in the figure is a cross-sectional view of the circuit board structure fixed inside the housing in one embodiment of this application. Figure 11 Figure b in the text is Figure 11 The top view of the structure shown in Figure a. Figure 11 Figure a in the middle and Figure 11 As shown in Figure b, the first circuit board 210 and the second circuit board 230 are connected to the housing via a screw structure. Figure 11 On (not shown), with the first circuit board 210 and the second circuit board 230 fixed, the flexible connecting plate 220 forms as shown. Figure 11 The bending state is shown in Figure a.

[0170] like Figure 11 Figure a in the middle and Figure 11 As shown in Figure b, the screw structure includes a first screw 1110 and a second screw 1120. The first screw 1110 includes a first nail body 1111, and the second screw 1120 includes a second nail body 1121. Both the first nail body 1111 and the second nail body 1121 penetrate the first circuit board 210 and the second circuit board 230. The portions of the first nail body 1111 and the second nail body 1121 extending from one side of the first circuit board 210 connect the first circuit board 210 to the housing, and the portions of the first nail body 1111 and the second nail body 1121 extending from one side of the second circuit board 230 connect the second circuit board 230 to the housing.

[0171] Figure 12 Figure a in the figure is a cross-sectional view of the circuit board structure fixed inside the housing in one embodiment of this application. Figure 12 Figure b in the text is Figure 12 The top view of the structure shown in Figure a. Figure 12 Figure a in the middle and Figure 12 As shown in Figure b, the first circuit board 210 and the second circuit board 230 are connected to the housing via a screw structure. Figure 12 On (not shown), with the first circuit board 210 and the second circuit board 230 fixed, the flexible connecting plate 220 forms as shown. Figure 12 The bending state is shown in Figure a.

[0172] like Figure 12 Figure a in the middle and Figure 12As shown in Figure b, the screw structure includes: a first screw 1210, a second screw 1220, a third screw 1230, and a fourth screw 1240. The first screw 1210 includes a first nail body 1211, the second screw 1220 includes a second nail body 1221, the third screw 1230 includes a third nail body 1231, and the fourth screw 1240 includes a fourth nail body 1241. The first nail body 1211, the second nail body 1221, the third nail body 1231, and the fourth nail body 1241 all penetrate the first circuit board 210 and the second circuit board 230. The portions of the first nail body 1211, the second nail body 1221, the third nail body 1231, and the fourth nail body 1241 that protrude from one side of the first circuit board 210 connect the first circuit board 210 to the housing, and the portions of the first nail body 1211, the second nail body 1221, the third nail body 1231, and the fourth nail body 1241 that protrude from one side of the second circuit board 230 connect the second circuit board 230 to the housing.

[0173] Figure 13 Figure a in the figure is a cross-sectional view of the circuit board structure fixed inside the housing in one embodiment of this application. Figure 13 Figure b in the text is Figure 13 The top view of the structure shown in Figure a. Figure 13 Figure a in the middle and Figure 13 As shown in Figure b, the first circuit board 210 and the second circuit board 230 are connected to the housing via a screw structure. Figure 13 On (not shown), with the first circuit board 210 and the second circuit board 230 fixed, the flexible connecting plate 220 forms as shown. Figure 13 The bending state is shown in Figure a.

[0174] like Figure 13 Figure a in the middle and Figure 13 As shown in Figure b, the screw structure includes: a first screw 1310, a second screw 1320, a third screw 1330, and a fourth screw ( Figure 13 (Not shown in the image). Wherein: the second screw 1320 and the fourth screw connect the first circuit board 210 to the housing, and the first screw 1310 and the third screw 1330 connect the second circuit board 230 to the housing.

[0175] Understandably, in Figures 9 to 13 In the illustrated embodiment, a first device and a second device are disposed on the surface of the first circuit board 210 facing the second circuit board 230. For simplicity, Figures 9 to 13 The first and second devices were not labeled; Figures 9 to 13 In the illustrated embodiment, a pad can be respectively provided on the first circuit board 210 at the position corresponding to the first device and the second device. Figures 9 to 13 (Not shown in the image), the first and second devices are soldered onto their corresponding pads.

[0176] It should be understood that Figures 9 to 13 This is merely an example and not intended to limit the way circuit board structures are fixed in electronic devices.

[0177] It should be understood that multiple devices can be disposed on the first circuit board 210 and the second circuit board 230 in the circuit board structure 200. In order to avoid interference to the devices, the circuit board structure 200 may also include a device shielding structure. The device shielding structure is described below with reference to the accompanying drawings.

[0178] Figure 14 This is a cross-sectional schematic diagram of the circuit board structure in an electronic device according to several embodiments of this application.

[0179] Figure 14 Figure a in the figure is a cross-sectional view of a circuit board structure including a device shielding structure according to an embodiment of this application. For example... Figure 14 As shown in Figure a, a first device 211 and a second device 212 are disposed on a first circuit board 210. In this embodiment, the device shielding structure is a shielding cover 1410 disposed on the first circuit board 210, which covers the first device 211 and the second device 212 to form shielding protection for the first device 211 and the second device 212.

[0180] Figure 14 Figure b in the figure is a cross-sectional view of a circuit board structure including a device shielding structure according to another embodiment of this application. Figure 14 In Figure b, a first device 211 and a second device 212 are disposed on a first circuit board 210. In this embodiment, the device shielding structure is a shielding film 1420 disposed on the first circuit board 210, which covers the first device 211 and the second device 212 to form shielding protection for the first device 211 and the second device 212.

[0181] For example, the shielding film 1420 can be formed by coating the first device 211 and the second device 212 on the first circuit board 210 with shielding material, which will not be described in detail in this embodiment.

[0182] Understandably, in Figure 14 In the embodiment shown, a pad can be provided on the first circuit board 210 at the position corresponding to the first device 211 and the second device 212, and the first device 211 and the second device 212 are soldered to the corresponding pads.

[0183] It should be understood that Figure 14The device shielding structure is merely described exemplarily. In other embodiments, more or fewer devices may be disposed on the first circuit board 210, and corresponding device shielding structures may be provided on the first circuit board 210 to protect these devices. In other embodiments, one or more devices may be disposed on the second circuit board 230, and corresponding device shielding structures may also be provided on the second circuit board 230 to protect these devices. This application embodiment does not limit or elaborate on these aspects.

[0184] It should also be understood that the circuit board structure 200 is fixed in the electronic device. When the user uses the electronic device, the circuit board structure 200 will undergo multiple micro-movements. In order to solve the problem of fatigue breakage of the flexible connecting board caused by multiple micro-movements, a buffer component can be set in the circuit board structure 200 to reduce the excess movement space in the circuit board structure 200, thereby reducing the micro-movement space of the circuit board structure 200 and avoiding fatigue breakage of the flexible connecting board 220.

[0185] In some embodiments, the first surface of the first circuit board 210 and the first surface of the second circuit board 230 are disposed opposite to each other. The circuit board structure further includes a buffer component, the first end of which abuts against the first surface of the first circuit board 210, and the second end of which abuts against the first surface of the second circuit board 230. The buffer component has a certain rigidity and supports the first circuit board and the second circuit board, so that the first circuit board 210 and the second circuit board 230 can maintain a fixed relative position, thereby reducing the micro-movement of the flexible connecting plate 220 and avoiding fatigue breakage of the flexible connecting plate 220.

[0186] The buffer component is described below with reference to the accompanying drawings.

[0187] Figure 15 This is a cross-sectional schematic diagram of the circuit board structure in an electronic device according to several embodiments of this application.

[0188] Figure 15 Figure a in the figure is a cross-sectional view of a circuit board structure including a buffer component according to an embodiment of this application. Figure 15 As shown in Figure a, a first circuit board 210 is provided with a first device 211 and a second device 212, and a shielding cover 1510 covering the first device 211 and the second device 212. A buffer body 1520 is provided on the shielding cover 1510, one end of the buffer body 1520 abutting against the shielding cover 1510, and the other end of the buffer body 1520 abutting against the surface of the second circuit board 230. In this embodiment, the buffer component includes the shielding cover 1510 and the buffer body 1520. The buffer body 1520 is formed of a buffering material, such as foam, rubber gasket, or TIM (Thermal Interface Materials) material, and this application does not limit this.

[0189] Figure 15 Figure b in the figure is a cross-sectional view of a circuit board structure including a buffer component according to another embodiment of this application. Figure 15 Figure b shows a first circuit board 210 with a first device 211 and a second device 212, and a shielding cover 1530 covering the first device 211 and the second device 212. A first support member 1541 and a second support member 1542 are provided on the shielding cover 1530. Both the first support member 1541 and the second support member 1542 have one end abutting against the shielding cover 1530 and the other end abutting against the surface of the second circuit board 230. In this embodiment, the buffer component includes the shielding cover 1530, the first support member 1541, and the second support member 1542.

[0190] For example, the first support member 1541 and the second support member 1542 can be columnar structures or plate-like structures, and the embodiments of this application do not limit or elaborate on this.

[0191] It is understood that the first support member 1541 and the second support member 1542 may be structures that are part of the shielding cover 1530, or the first support member 1541 and the second support member 1542 may not be structures that are part of the shielding cover 1530. This application does not impose any restrictions on this.

[0192] In some embodiments, the second circuit board 230 has components disposed on its surface facing the first circuit board 210. An additional shielding cover can be provided in the circuit board structure to cover the components on the second circuit board 230. The circuit board structure may include the shielding cover and shielding cover 1530 for covering the components on the surface of the second circuit board 230. One end of the shielding cover 1530 facing away from the first circuit board abuts against the other shielding cover facing away from the second circuit board. Thus, the first and second shielding covers can provide support for the first circuit board 210 and the second circuit board 230. In this embodiment, the buffer component includes the first and second shielding covers.

[0193] Figure 15 Figure c in the figure is a cross-sectional view of a circuit board structure including a buffer component according to another embodiment of this application. Figure 15 In Figure c, a first device 211 and a second device 212 are disposed on the first circuit board 210. The first circuit board 210 and the second circuit board 230 are fixedly connected to the housing of the electronic device by a screw structure 1550. Figure 15(Figure c not shown); the screw structure 1550 includes a screw body 1551, which passes through the first circuit board 210 along its thickness direction and through the second circuit board 230 along its thickness direction. In this embodiment, the buffer component includes a sleeve 1560 surrounding the screw body 1551, one end of which abuts against the surface of the first circuit board 210, and the other end of which abuts against the surface of the second circuit board 230.

[0194] It is understood that when a circuit board structure contains multiple screw structures, a sleeve can be fitted onto the screw body of one or more screw structures, and one or more sleeves can form a buffer component. This application does not impose any restrictions on this.

[0195] Figure 15 Figure d in the diagram is a cross-sectional view of a circuit board structure including a buffer component according to another embodiment of this application. Figure 15 In Figure d, a first device 211 and a second device 212 are disposed on the first circuit board 210. The first circuit board 210 and the second circuit board 230 are fixedly connected to the housing of the electronic device by a screw structure 1570. Figure 15 (Diagram d not shown) The screw structure 1570 includes a screw body 1571, which passes through the first circuit board 210 along its thickness direction and through the second circuit board 230 along its thickness direction. In this embodiment, the buffer component includes a support member 1580, one end of which is welded to the surface of the first circuit board 210, and the other end of which is welded to the surface of the second circuit board 230.

[0196] For example, the support member 1580 may be disposed near the nail body 1571, and the axis of the support member 1580 may be parallel to the axis of the nail body 1571.

[0197] For example, the support member 1580 can be a columnar structure or a plate structure, and the embodiments of this application do not limit or elaborate on this.

[0198] It is understood that the number of support members 1580 can be one or more, and this application embodiment does not limit or elaborate on this.

[0199] It should also be understood that the above description of buffer components is merely an example and is not intended to limit the specific types of buffer components in the circuit board structure.

[0200] Understandably, in Figure 15In the various embodiments shown, a pad can be provided on the first circuit board 210 at the position corresponding to the first device 211 and the second device 212, and the first device 211 and the second device 212 are soldered to the corresponding pads.

[0201] It should also be understood that in the electronic device, the first circuit board 210 and the second circuit board 230 are arranged opposite to each other, forming a cavity between the first circuit board 210, the flexible connecting plate 220, and the second circuit board 230. Heat dissipation components can be installed within the cavity to improve the heat dissipation capacity of the circuit board structure and the electronic device.

[0202] The heat dissipation component is described below with reference to the accompanying drawings.

[0203] Figure 16 This is a cross-sectional schematic diagram of the circuit board structure in an electronic device according to several embodiments of this application.

[0204] Figure 16 Figure a in the figure is a cross-sectional view of a circuit board structure including a heat dissipation component according to an embodiment of this application. For example... Figure 16 As shown in Figure a, a first circuit board 210 is provided with a first device 211 and a second device 212, and a shielding cover 1610 covering the first device 211 and the second device 212. A first heat sink 1620 is provided on the side of the shielding cover 1610 facing the second circuit board 230, and a second heat sink 1630 is provided on the side of the shielding cover 1610 facing the first device 211 and the second device 212.

[0205] In this embodiment, the heat dissipation component includes a first heat sink 1620 and a second heat sink 1630, such as Figure 6 As shown in Figure a, the first heat sink 1620 partially covers the shield 1610; the second heat sink 1630 covers the first device 211 and the second device 212. Exemplarily, the first heat sink 1620 and the second heat sink 1630 can be formed of a heat dissipation material, such as thermally conductive gel or TIM material. This application does not limit or elaborate on the type of heat dissipation material.

[0206] Figure 16 Figure b in the figure is a cross-sectional view of a circuit board structure including a heat dissipation component according to another embodiment of this application. Figure 16 Figure b shows that a first device 211 and a second device 212 are disposed on a first circuit board 210, and a shielding cover 1640 covers the first device 211 and the second device 212. A first heat sink 1650 is disposed on the side of the shielding cover 1640 facing the second circuit board 230, and a second heat sink 1660 is disposed on the side of the shielding cover 1640 facing the first device 211 and the second device 212.

[0207] like Figure 16 As shown in Figure b, a metal component 1670 extends outward from the first heat sink 1650. One end of the metal component 1670 is disposed in the first heat sink 1650, and the other end of the metal component 1670 extends outward from the first heat sink 1650.

[0208] For example, the second end of the metal member 1670 is located outside the cavity formed by the first circuit board 210, the flexible connecting plate 220, and the second circuit board 230, so as to realize the outer side of the circuit board structure for dissipating heat.

[0209] In this embodiment, the heat dissipation component includes a first heat sink 1650, a second heat sink 1660, and a metal component 1670, such as... Figure 6 As shown in Figure b, the first heat sink 1620 partially covers the shield 1610; the second heat sink 1630 covers the first device 211 and the second device 212. Exemplarily, the first heat sink 1620 and the second heat sink 1630 can be formed of a heat dissipation material, such as thermally conductive gel or TIM material; the metal component 1670 can be made of copper. This application embodiment does not limit or elaborate on the type of heat dissipation material or the material of the metal component 1670.

[0210] Understandably, in Figure 16 In the various embodiments shown, a pad can be provided on the first circuit board 210 at the position corresponding to the first device 211 and the second device 212, and the first device 211 and the second device 212 are soldered to the corresponding pads.

[0211] It should also be understood that the above description of buffer components is merely an example and is not intended to limit the specific types of buffer components in the circuit board structure.

[0212] It should also be understood that the bending angle on the inner side of the flexible connection plate can also be called the bending angle of the circuit board structure. Figure 2 The illustrated embodiments, and Figures 9 to 16 In any of the embodiments shown, the bending angle of the inner side of the flexible connecting plate 220 is 180°. In other embodiments, the bending angle of the inner side of the flexible connecting plate 220 may be other values.

[0213] For example, Figure 17 This is a cross-sectional view of the circuit board structure in an electronic device according to another embodiment of this application. Figure 17 As shown, the circuit board structure includes a first circuit board 1710, a flexible connecting plate 1720, and a second circuit board 1730; the circuit board structure also includes a shielding cover 1740. Figure 17As shown, a first device 1711 and a second device 1712 are disposed on a first circuit board 1710. In this embodiment, a shielding cover 1740 covers the first device 1711 and the second device 1712 to form a shielding protection for the first device 1711 and the second device 1712. Figure 17 In the embodiment shown, the bending angle of the inner side of the flexible connecting plate 1720 is 90°.

[0214] Understandably, in Figure 17 In the embodiment shown, a pad can be provided on the first circuit board 1710 at the position corresponding to the first device 1711 and the second device 1712, and the first device 1711 and the second device 1712 are soldered to the corresponding pads.

[0215] For example, the first circuit board 1710 is connected to the housing via the first connector 1851. Figure 17 Inside (not shown), the second circuit board 1730 is connected to the housing (not shown) via the second connector 1852. Figure 17 (Not shown in the image). The first circuit board 1710 and the second circuit board 1730 are formed by adhesive through the first connector 1851 and the second connector 1852, that is, the first circuit board 1710 and the second circuit board 1730 are glued to the inside of the housing by adhesive.

[0216] It should be understood that the bending angle of the inner side of the flexible connecting plate, or the bending angle of the circuit board structure, can be set as needed, and the embodiments of this application do not limit or elaborate on this.

[0217] In some cases, electromagnetic shielding is required for the traces within the flexible interconnect board. For example, if the first circuit board 210 is a motherboard and the second circuit board 230 is an RF board, the RF board generates high-frequency, high-speed signals that can interfere with signals on other circuit boards. Shielding the trace layers within the flexible interconnect board can prevent interference from the RF board's high-frequency, high-speed signals. The following is an exemplary description of how to achieve shielding for the trace layers within the flexible interconnect board.

[0218] In some embodiments, when the flexible connecting plate 220 is fixed in the housing and is in a bent state: the side of the flexible connecting plate 220 that is compressed is the inner side of the flexible connecting plate 220, and the side of the flexible connecting plate 220 that is stretched is the outer side of the flexible connecting plate 220; when the wiring in the flexible connecting plate 220 has electromagnetic shielding requirements, the flexible connecting plate 220 may: only provide a first electromagnetic shielding layer, or only provide a second electromagnetic shielding layer, or both a first electromagnetic shielding layer and a second electromagnetic shielding layer may be provided simultaneously; wherein: the first electromagnetic shielding layer refers to the electromagnetic shielding layer located on the inner side of the flexible connecting plate 220, and the second electromagnetic shielding layer refers to the electromagnetic shielding layer located on the outer side of the flexible connecting plate 220.

[0219] For example, for Figures 4 to 7 In the embodiments shown, each layer with electromagnetic shielding function is either a first electromagnetic shielding layer or a second electromagnetic shielding layer, which will not be elaborated further in this application.

[0220] Figure 18 This is a partial cross-sectional view of the circuit board structure in the unfolded state in several embodiments of this application.

[0221] It should be understood that Figure 18 The electromagnetic shielding layer in the flexible connecting plate 220 is described by way of example. For the sake of brevity and convenience, the following description is provided: Figure 18 The components on the first circuit board 210 and the second circuit board 230 are not shown, nor is the stacked structure of the first circuit board 210 and the second circuit board 230 shown.

[0222] Figure 18 Figure a in the figure is a partial cross-sectional view of the circuit board structure in an unfolded state according to an embodiment of this application. Figure 18 As shown in Figure a, the flexible connection plate 220 includes the following layers stacked along the thickness direction of the flexible connection plate 220: a second electromagnetic shielding layer 1811, a first insulating layer 1812, a wiring layer 1813, a second insulating layer 1814, and a first electromagnetic shielding layer 1815. Both the second electromagnetic shielding layer 1811 and the first electromagnetic shielding layer 1815 can be grounded copper foil. That is, shielding of the wiring layer 1813 can be achieved by placing grounded copper foil on both sides of the wiring layer 1813, thus preventing signal interference from the wiring layer 1813 to either side of the flexible connection plate 220.

[0223] For example, the first insulating layer 1812 can be a flexible substrate layer, wherein the flexible substrate can be any of the following: polyimide (PI), polyester (PET), liquid crystal polymer (LCP), polytetrafluoroethylene (PTFE), thermoplastic polyurethane (TPU), flexible glass, etc.

[0224] For example, the second insulating layer 1814 can be a flexible substrate layer, wherein the flexible substrate can be any of the following: polyimide (PI), polyester (PET), liquid crystal polymer (LCP), polytetrafluoroethylene (PTFE), thermoplastic polyurethane (TPU), flexible glass, etc.

[0225] Figure 18 Figure b in the figure is a partial cross-sectional view of the circuit board structure in the unfolded state according to another embodiment of this application. Figure 18 As shown in Figure b, the flexible connecting plate 220 includes the following layers stacked along its thickness direction: a flexible ink layer 1821, a first insulating layer 1822, a wiring layer 1823, a second insulating layer 1824, and an electromagnetic shielding layer 1825. The electromagnetic shielding layer 1825 is a grounded copper foil, or it can be an electromagnetic shielding film. By placing the electromagnetic shielding layer 1825 on one side of the wiring layer 1823, shielding of the wiring layer is achieved, thus preventing the wiring layer 1823 from causing signal interference to the inner side of the flexible connecting plate 220.

[0226] For example, the first insulating layer 1822 can be a flexible substrate layer, wherein the flexible substrate can be any of the following: polyimide (PI), polyester (PET), liquid crystal polymer (LCP), polytetrafluoroethylene (PTFE), thermoplastic polyurethane (TPU), flexible glass, etc.

[0227] For example, the second insulating layer 1824 can be a flexible substrate layer, wherein the flexible substrate can be any of the following: polyimide (PI), polyester (PET), liquid crystal polymer (LCP), polytetrafluoroethylene (PTFE), thermoplastic polyurethane (TPU), flexible glass, etc.

[0228] Figure 18Figure c in the figure is a partial cross-sectional view of the circuit board structure in the unfolded state in another embodiment of this application. Figure 18 As shown in Figure c, the flexible connection plate 220 includes the following layers stacked along the thickness direction of the flexible connection plate 220: a second electromagnetic shielding layer 1831, a first insulating layer 1832, a wiring layer 1833, a second insulating layer 1834, and a first electromagnetic shielding layer 1835. The second electromagnetic shielding layer 1831 can be a grounded copper foil, and the first electromagnetic shielding layer 1835 can be an electromagnetic shielding film. Shielding of the wiring layer 1833 is achieved by respectively setting grounded copper foil and electromagnetic shielding film on both sides of the wiring layer 1833, thus ensuring that the wiring layer 1833 does not cause signal interference to either side of the flexible connection plate 220.

[0229] For example, the first insulating layer 1832 can be a flexible substrate layer, wherein the flexible substrate can be any of the following: polyimide (PI), polyester (PET), liquid crystal polymer (LCP), polytetrafluoroethylene (PTFE), thermoplastic polyurethane (TPU), flexible glass, etc.

[0230] For example, the second insulating layer 1834 can be a flexible substrate layer, wherein the flexible substrate can be any of the following: polyimide (PI), polyester (PET), liquid crystal polymer (LCP), polytetrafluoroethylene (PTFE), thermoplastic polyurethane (TPU), flexible glass, etc.

[0231] It should be understood that Figure 18 The trace layer shown is the conductive layer mentioned above. The material of the trace layer can be copper. This application does not limit or elaborate on the material of the conductive layer.

[0232] It should also be understood that the electromagnetic shielding film in the embodiments of this application can be an electromagnetic interference (EMI) shielding film adhered to the layer on which the electromagnetic shielding film is attached, or the electromagnetic shielding film can be an electromagnetic shielding layer formed by coating a shielding material on the layer on which the electromagnetic shielding film is attached. The embodiments of this application do not limit or elaborate on the specific type of shielding material.

[0233] It should also be understood that Figure 18 This description primarily focuses on the electromagnetic shielding layer in the flexible connecting plate 220. Therefore, only a portion of the stacked structure of the flexible connecting plate is shown. Some layers require adhesive (or glue) for bonding, or there may be an adhesive layer between some adjacent layers. For the sake of brevity, this description is not explicitly stated. Figure 18 No indication was given in the text.

[0234] It should be understood that the conductive layer in the embodiments of this application can be made of copper. Therefore, in some embodiments, the conductive layer can also be called a copper layer. The embodiments of this application do not limit or elaborate on the material of the conductive layer.

[0235] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. An electronic device, characterized in that, The electronic device includes: case; A circuit board structure, wherein the circuit board structure is located within the housing; The circuit board structure includes a first circuit board, a flexible connecting plate, and a second circuit board. The flexible connecting plate is used to electrically connect the first circuit board and the second circuit board. The flexible connecting plate is in a bent state. The first circuit board and the second circuit board are respectively fixedly connected to the housing. The flexible connecting plate includes at least one conductive layer and at least one insulating layer stacked along the thickness direction of the flexible connecting plate. The stress neutral surface generated by the flexible connecting plate in the bent state is located within any one of the at least one conductive layer, or the stress neutral line generated by the flexible connecting plate in the bent state is located within the thickness range of any one of the at least one conductive layer. When the flexible connecting plate is in the unfolded state, the length directions of the first circuit board, the flexible connecting plate, and the second circuit board are parallel, and the first circuit board, the flexible connecting plate, and the second circuit board are arranged sequentially along the length direction of the flexible connecting plate; the length direction of the flexible connecting plate is perpendicular to the thickness direction of the flexible connecting plate.

2. The electronic device according to claim 1, characterized in that, The at least one conductive layer, a conductive layer of the first circuit board, and a conductive layer of the second circuit board are integral structures; the at least one insulating layer, an insulating layer of the first circuit board, and an insulating layer of the second circuit board are integral structures.

3. The electronic device according to claim 1 or 2, characterized in that, The first surface of the first circuit board is disposed opposite to the first surface of the second circuit board. The circuit board structure further includes a buffer component, the first end of which abuts against the first surface of the first circuit board, and the second end of which abuts against the first surface of the second circuit board.

4. The electronic device according to claim 3, characterized in that, The circuit board structure further includes a first shielding cover, which is disposed on a first surface of the first circuit board and covers at least one device on the first surface of the first circuit board; the buffer component includes the first shielding cover and a buffer body, abutting the first end of the buffer body against the first shielding cover and abutting the second end of the buffer body against the first surface of the second circuit board; the buffer body is formed of a buffering material, or the buffer body includes a support member.

5. The electronic device according to claim 3, characterized in that, The first circuit board and the second circuit board are fixedly connected to the housing by screws. The screws pass through the first circuit board along the thickness direction and the second circuit board along the thickness direction. The buffer component includes a sleeve sleeved on the screws. The first end of the sleeve abuts against the first surface of the first circuit board and the second end of the sleeve abuts against the first surface of the second circuit board.

6. The electronic device according to claim 3, characterized in that, The buffer component includes a support member, the first end of which is welded to the first surface of the first circuit board, and the second end of which is welded to the first surface of the second circuit board.

7. The electronic device according to claim 3, characterized in that, The circuit board structure further includes a first shield and a second shield. The first shield is disposed on a first surface of the first circuit board and covers at least one device on the first surface of the first circuit board. The second shield is disposed on a first surface of the second circuit board and covers at least one device on the first surface of the second circuit board. The end of the first shield facing away from the first circuit board abuts against the end of the second shield facing away from the second circuit board. The buffer component includes the first shield and the second shield.

8. The electronic device according to claim 1 or 2, characterized in that, The first surface of the first circuit board is disposed opposite to the first surface of the second circuit board. The circuit board structure further includes a heat dissipation component disposed between the first surface of the first circuit board and the first surface of the second circuit board.

9. The electronic device according to claim 8, characterized in that, The circuit board structure further includes a first shielding cover, which is disposed on a first board surface of the first circuit board. The first shielding cover covers at least one device on the first board surface of the first circuit board. The side of the first shielding cover facing the at least one device is the inner side of the first shielding cover, and the side of the first shielding cover away from the at least one device is the outer side of the first shielding cover. The heat dissipation component includes a first heat sink and a second heat sink. The first heat sink is disposed on the outside of the first shield and at least partially covers the first shield. The second heat sink is disposed on the inside of the first shield. The first heat sink and the second heat sink are formed of a heat dissipation material.

10. The electronic device according to claim 9, characterized in that, The heat dissipation component also includes a metal component, the first end of which is fixed in the first heat sink, and the second end of which is located outside the first heat sink.

11. The electronic device according to any one of claims 1 to 10, characterized in that, The flexible connecting plate further includes a first electromagnetic shielding layer and / or a second electromagnetic shielding layer, wherein the first electromagnetic shielding layer is located on the inner side of the flexible connecting plate and the second electromagnetic shielding layer is located on the outer side of the flexible connecting plate; in the bending state: the side of the flexible connecting plate that is compressed is the inner side of the flexible connecting plate, and the side of the flexible connecting plate that is stretched is the outer side of the flexible connecting plate.

12. The electronic device according to claim 11, characterized in that, The first electromagnetic shielding layer includes a grounded copper foil or an electromagnetic shielding film; the second electromagnetic shielding layer includes a grounded copper foil or an electromagnetic shielding film.

13. The electronic device according to any one of claims 1 to 10, characterized in that, The bending angle of the inner side of the flexible connecting plate is α, where 0° < α ≤ 275°. The inner side of the flexible connecting plate is the side of the flexible connecting plate that is compressed in the bending state.

14. The electronic device according to claim 13, characterized in that, α = 90°, or α = 180°.

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