A multilayer wiring board drilling apparatus

Abstract

The utility model relates to multilayer circuit board processing technical field especially is a kind of multilayer circuit board drilling device, including processing station, the top center of processing station is equipped with through-hole, and the top of processing station and located the outside fixed mounting of through-hole has operation square, and the bottom of processing station is detachably installed with docking plate by bolt, and the bottom center of docking plate is fixedly installed with air pipe, the multilayer circuit board needing drilling is placed in operation square in the utility model, and it is fixed by processing mechanism, in the process of drilling multilayer circuit board, processing mechanism is extracted to discharge the chip generated, so that processing mechanism can realize the fixing and dust extraction treatment to adjacent size multilayer circuit board, so that for size similar multilayer circuit board can be efficiently and effectively completed job, which greatly expands its use range, improves the applicability of drilling device in actual production.

Description

Technical Field

[0001] This utility model relates to the field of multilayer circuit board processing technology, and in particular to a drilling device for multilayer circuit boards. Background Technology

[0002] A circuit board, also known as a PCB, is a board with printed conductors. Its main function is to reduce the space occupied by conductors and organize them in a clear layout. In the production process, after each layer of circuitry is made, optical equipment is used to position and press them together, so that multiple layers of circuitry are superimposed on a single circuit board, which is called a multilayer circuit board. In order to achieve conductivity between layers and to make positioning or alignment holes for future component insertion and soldering, holes need to be drilled in the circuit board.

[0003] For example, the high-quality drilling device for multilayer circuit boards disclosed in Chinese Patent No. CN220545212U works as follows: "First, the multilayer circuit board to be drilled is placed in the positioning slot on the positioning frame. The drilling motor is started to drive the drill bit to rotate at high speed. The servo motor is started to drive the threaded rod to rotate, thereby pushing the support arm to move. This, in turn, causes the drilling motor and drill bit on the support arm to move down to drill the multilayer circuit board. At the same time, the air pump and vacuum cleaner are started to suck up air. The downward movement of the support arm causes the dust collection head on the dust inlet branch pipe to move down, so that the debris generated around the drill bit during drilling can be sucked into the dust inlet branch pipe through the dust collection head." The dust is drawn into the dust collection box through the dust inlet pipe, and the debris and dust splashed around and at the bottom of the multi-layer circuit board enter the dust collection tank through the dust inlet channel and dust inlet hole, and are then sucked into the dust collection bin of the vacuum cleaner through the dust collection pipe, so that the dust and debris generated during drilling of multi-layer circuit boards are cleaned more thoroughly. The above document describes the cleaning of dust and debris during drilling of multi-layer circuit boards through structures such as dust collection head and dust collection box. However, multi-layer circuit boards come in a variety of sizes, and this device can only be used for drilling and dust collection of circuit boards of one size. It cannot be effectively used for other circuit boards of similar size, which greatly limits its scope of use and reduces the applicability of the drilling device in actual production. Utility Model Content

[0004] To address the shortcomings of existing technologies, this utility model provides the following technical solution: a drilling device for multilayer circuit boards, including a processing table, a connecting hole at the top center of the processing table, an operating frame fixedly installed on the top of the processing table and outside the connecting hole, a docking plate detachably installed at the bottom of the processing table by bolts, and a vent pipe fixedly installed at the bottom center of the docking plate. The operating frame contains a symmetrically sliding processing mechanism for fixing and vacuuming multi-layer circuit boards of adjacent sizes.

[0005] As an improvement to the above technical solution, the processing mechanism includes a placement plate, a drive motor, a bidirectional screw, a movable main board, a pressing block, a rubber pad, and a hose. The placement plate is fixedly installed inside the operating frame, and a horizontal slot is formed in the center of the top of the placement plate. The drive motor is fixedly installed on the right side of the operating frame, and the left end of the drive motor penetrates the inner right wall of the horizontal slot and extends into the horizontal slot. The bidirectional screw is fixedly installed at the output end of the drive motor that extends into the horizontal slot. A horizontal locking block is threadedly connected to the outer side of the bidirectional screw, and the movable main board is fixedly installed on the top of the horizontal locking block. The pressing block is fixedly installed on the top of the mobile motherboard. The side of the pressing block near the middle of the operating frame has an arc-shaped design. A dust suction hole is provided on the right side of the pressing block, and the left end of the dust suction hole extends out of the left side of the pressing block. The rubber pad is embedded in the bottom left side of the pressing block. Dust collection holes are provided on all four sides of the operating frame. The flexible hose is fixedly installed on the inner wall of the operating frame and located outside the dust collection holes. The end of the flexible hose away from the dust collection holes is fixedly installed on the right side of the pressing block and located outside the dust suction holes. A square groove is provided on the inner wall of the operating frame close to the bottom, and the dust collection holes communicate with the square groove.

[0006] As an improvement to the above technical solution, the top of the processing table, located inside the operation frame, is designed to be inclined.

[0007] As an improvement to the above technical solution, the top of the placement plate is provided with a mesh-like pattern of multiple cleaning holes.

[0008] As an improvement to the above technical solution, the inner walls of the front and rear sides of the operating frame are provided with stabilizing slots close to the bottom, and stabilizing blocks are fixedly installed on the front and rear sides of the mobile motherboard, with the stabilizing slots and stabilizing blocks slidingly engaging.

[0009] As an improvement to the above technical solution, a centralized cavity is formed between the top of the docking plate and the bottom of the placement plate.

[0010] The beneficial effects of this utility model are as follows: The multi-layer circuit board that needs to be drilled is placed in the operating frame and fixed by the processing mechanism. During the drilling process of the multi-layer circuit board, the processing mechanism sucks up and discharges the generated debris, so that the processing mechanism can fix and vacuum up multi-layer circuit boards of adjacent sizes. This makes it possible to complete the operation efficiently and effectively for multi-layer circuit boards of similar sizes, which greatly expands its application range and improves the applicability of the drilling device in actual production. Attached Figure Description

[0011] Figure 1 This is a front view of the drilling device of this utility model; Figure 2 This is a cross-sectional view of the internal structure of this utility model; Figure 3 This is an exploded view of the drilling device of this utility model; Figure 4 This utility model Figure 2 Enlarged view of the structure at point A in the middle.

[0012] Reference numerals: 1. Processing table; 11. Connecting hole; 2. Operating frame; 3. Connecting plate; 31. Vent pipe; 4. Placement plate; 41. Horizontal slot; 42. Drive motor; 43. Bidirectional screw; 44. Moving main board; 45. Pressing block; 46. Dust suction hole; 47. Rubber pad; 48. Dust collection hole; 49. Hose; 5. Frame groove. Detailed Implementation

[0013] To make the objectives, technical solutions, and advantages of this utility model clearer, the following provides a more detailed description of the utility model. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of the utility model.

[0014] Reference Appendix Figure 1 ,exist Figure 1 In the diagram, 'a' points to the front view and 'b' points to the right-side view. These views are only used to understand the scheme.

[0015] Please see Figure 1-4 This utility model provides a technical solution: a drilling device for multilayer circuit boards, including a processing table 1, a connecting hole 11 is provided at the center of the top of the processing table 1, an operating frame 2 is fixedly installed on the top of the processing table 1 and outside the connecting hole 11, and a docking plate 3 is detachably installed at the bottom of the processing table 1 by bolts, and a vent pipe 31 is fixedly installed at the center of the bottom of the docking plate 3. The operating box 2 has a symmetrical sliding processing mechanism for fixing and vacuuming multi-layer circuit boards of adjacent sizes.

[0016] In this implementation plan, the multilayer circuit board that needs to be drilled is placed in the operating frame 2 and fixed by the processing mechanism. During the drilling process of the multilayer circuit board, the processing mechanism will suck up and discharge the generated debris, so that the processing mechanism can fix and vacuum up multilayer circuit boards of adjacent sizes. This makes it possible to complete the operation efficiently and effectively for multilayer circuit boards of similar sizes.

[0017] Specifically, the processing mechanism includes a placement plate 4, a drive motor 42, a bidirectional screw 43, a movable main board 44, a pressing block 45, a rubber pad 47, and a hose 49. The placement plate 4 is fixedly installed inside the operating frame 2. A horizontal slot 41 is provided in the middle of the top of the placement plate 4. The drive motor 42 is fixedly installed on the right side of the operating frame 2. The left end of the drive motor 42 passes through the inner wall of the right side of the horizontal slot 41 and extends into the horizontal slot 41. The bidirectional screw 43 is fixedly installed at the output end of the drive motor 42 that extends into the horizontal slot 41. A horizontal locking block is threadedly connected to the outside of the bidirectional screw 43. The movable main board 44 is fixedly installed on the top of the horizontal locking block. The pressing block... The pressing block 45 is fixedly installed on the top of the mobile motherboard 44. The side of the pressing block 45 near the middle of the operating frame 2 has an arc-shaped design. A dust suction hole 46 is provided on the right side of the pressing block 45. The left end of the dust suction hole 46 extends out of the left side of the pressing block 45. A rubber pad 47 is embedded in the bottom left side of the pressing block 45. Dust collection holes 48 are provided inside all four sides of the operating frame 2. A flexible hose 49 is fixedly installed on the inner wall of the operating frame 2 and located outside the dust collection hole 48. The end of the flexible hose 49 away from the dust collection hole 48 is fixedly installed on the right side of the pressing block 45 and located outside the dust suction hole 46. A square groove 5 is provided on the inner wall of the operating frame 2 close to the bottom. The dust collection hole 48 is connected to the square groove 5.

[0018] In this embodiment, the multilayer circuit boards of similar size are pressed and vacuumed by the cooperation of the internal structure of the processing mechanism.

[0019] Specifically, the top of the processing table 1, located inside the operating frame 2, is designed with an inclined shape.

[0020] In this embodiment, it is easier for debris to move towards the center after being attracted by suction.

[0021] Specifically, the top of the placement plate 4 has multiple cleaning holes in a mesh pattern.

[0022] In this embodiment, cleaning the round holes makes it easier to remove and clean the debris on the top of the placement board 4 after the multilayer circuit board is processed.

[0023] Specifically, the inner walls of the front and rear sides of the operating frame 2 are provided with stabilizing slots close to the bottom, and the front and rear sides of the moving motherboard 44 are fixedly installed with stabilizing blocks, and the stabilizing slots and stabilizing blocks are slidably engaged.

[0024] In this embodiment, the stability of the mobile motherboard 44 during operation is increased.

[0025] Specifically, a central cavity is formed between the top of the docking plate 3 and the bottom of the placement plate 4.

[0026] In this embodiment, the debris collected in each dust collection hole 48 through the central cavity can be concentrated and enter the ventilation pipe 31.

[0027] In use, the bottom of the vent pipe 31 is connected to an external vacuum cleaner. The PLC controls the drive motor 42 and other electrical components. The multi-layer circuit board to be drilled is placed on top of the placement plate 4. The drive motor 42 is started, causing the bidirectional screw 43 to rotate. The bidirectional screw 43, through a horizontal locking block, moves the moving main board 44 to the left. The moving main board 44 then moves the pressing block 45 to the left, which in turn moves the rubber pad 47 to the left. Similarly, the rubber pad 47 on the other side works in the same way. The rubber pads 47 on both sides press and fix the multi-layer circuit board towards the center of the operating frame 2. At this time, an external drill bit is used to drill the multi-layer circuit board. During the drilling operation of multilayer circuit boards, a lot of debris is generated. The debris is sucked up by the dust collection holes 46 on the pressing block 45 inside the dust collection holes 48 on the front and rear sides of the operating frame 2. The debris is then drawn into the collection chamber by the cooperation of the hose 49, dust collection holes 48 and frame groove 5, and discharged through the vent pipe 31. With the cooperation of the rubber pads 47 on both sides and the dust collection holes 48, the multilayer circuit boards of adjacent sizes can be fixed and dusted. This allows the operation to be completed efficiently and effectively for multilayer circuit boards of similar sizes, which greatly expands its application range and improves the applicability of the drilling device in actual production.

[0028] The above embodiments are only used to illustrate the technical solution of this utility model, and are not intended to limit it.

Claims

1. A drilling device for multilayer circuit boards, comprising a processing table (1), characterized in that: The processing table (1) has a connecting hole (11) at the top center. An operating frame (2) is fixedly installed on the top of the processing table (1) and outside the connecting hole (11). A docking plate (3) is detachably installed on the bottom of the processing table (1) by bolts. A vent pipe (31) is fixedly installed at the bottom center of the docking plate (3). The operation box (2) is symmetrically and slidably equipped with a processing mechanism for fixing and vacuuming multi-layer circuit boards of adjacent sizes.

2. The drilling device for multilayer circuit boards according to claim 1, characterized in that: The processing mechanism includes a placement plate (4), a drive motor (42), a bidirectional screw (43), a movable main board (44), a pressing block (45), a rubber pad (47), and a hose (49). The placement plate (4) is fixedly installed inside the operating frame (2). A horizontal slot (41) is provided in the middle of the top of the placement plate (4). The drive motor (42) is fixedly installed on the right side of the operating frame (2). The left end of the drive motor (42) passes through the right inner wall of the horizontal slot (41) and extends into the horizontal slot (41). The bidirectional screw (43) is fixedly installed at the output end of the drive motor (42) that extends into the horizontal slot (41). A horizontal locking block is threadedly connected to the outside of the bidirectional screw (43). The movable main board (44) is fixedly installed on the top of the horizontal locking block. The pressing block (45) The pressing block (45) is fixedly installed on the top of the mobile motherboard (44). The side of the pressing block (45) near the middle of the operating frame (2) is designed with an arc surface. A dust suction hole (46) is opened on the right side of the pressing block (45). The left end of the dust suction hole (46) extends out of the left side of the pressing block (45). The rubber pad (47) is embedded in the bottom left side of the pressing block (45). Dust collection holes (48) are opened in the inner side of the operating frame (2). The hose (49) is fixedly installed on the inner wall of the operating frame (2) and located outside the dust collection hole (48). The end of the hose (49) away from the dust collection hole (48) is fixedly installed on the right side of the pressing block (45) and located outside the dust suction hole (46). A square groove (5) is opened on the inner wall of the operating frame (2) close to the bottom. The dust collection hole (48) is connected to the square groove (5).

3. The drilling device for multilayer circuit boards according to claim 1, characterized in that: The top of the processing table (1) and the inside of the operation box (2) are designed to be inclined.

4. The drilling device for multilayer circuit boards according to claim 2, characterized in that: The top of the placement plate (4) has a mesh-like structure with multiple cleaning holes.

5. The drilling device for multilayer circuit boards according to claim 2, characterized in that: The inner walls of the front and rear sides of the operation box (2) are provided with stabilizing slots close to the bottom. The front and rear sides of the mobile motherboard (44) are fixedly installed with stabilizing blocks. The stabilizing slots and stabilizing blocks are slidably engaged.

6. The drilling device for multilayer circuit boards according to claim 2, characterized in that: A central cavity is formed between the top of the docking plate (3) and the bottom of the placement plate (4).

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