A golden finger high-temperature adhesive tape stripping device

Abstract

The application provides a golden finger high-temperature adhesive tape tearing device, which mainly comprises a feeding mechanism, a carrying mechanism, an adhesive tape clamping mechanism and a waste collecting mechanism. The carrying mechanism can take out products from a carrier, and through a moving path design, cooperates with the adhesive tape clamping mechanism to complete the adhesive tape tearing action, and the waste collecting mechanism can collect the torn adhesive tape. Through the multi-mechanism cooperative design of the carrying mechanism, the adhesive tape clamping mechanism and the waste collecting mechanism, the golden finger adhesive tape tearing full-process automation can be realized, manual intervention is not needed, and the tearing efficiency is greatly improved.

Description

Technical Field

[0001] This utility model relates to SMT processing technology, specifically to a high-temperature tape removal device for gold fingers. Background Technology

[0002] The "gold fingers" on a PCB (printed circuit board) or FPC (flexible printed circuit board) refer to the narrow, elongated array of gold-plated conductive contacts along the edge of the circuit board. They are usually arranged in a comb-like pattern and are used to enable physical connections and signal transmission with other devices or circuit boards.

[0003] During the circuit board manufacturing process, the surface of the gold fingers is covered with high-temperature tape. The high-temperature tape can be used to protect the gold fingers and prevent them from being contaminated by solder dross, paint, etc. during processes such as wave soldering and high-temperature spraying, as well as to avoid physical damage.

[0004] Currently, the removal of protective tape from gold fingers during PCB manufacturing is still primarily done manually. However, manual operation requires using tweezers or blades to pry the tape ends off the substrate. This process is easily limited by tools and space constraints, and can also cause slight deformation of the PCB substrate. High-density components can further obstruct the process. During tape removal, tweezers and blades can also accidentally touch the surface of the gold fingers, scratching the plating and disrupting the conductive path. Furthermore, manual operation can only peel off one strip of tape at a time, resulting in low efficiency and difficulty keeping up with production line pace.

[0005] Therefore, how to overcome the shortcomings of the existing technology mentioned above has become the subject of this utility model. Utility Model Content

[0006] The purpose of this invention is to provide a high-temperature adhesive tape removal device for gold fingers, which can efficiently and automatically remove high-temperature adhesive tape for gold fingers.

[0007] To achieve the above objectives, the technical solution adopted by this utility model is: a high-temperature adhesive tape removal device for gold fingers, comprising:

[0008] A feeding mechanism, which is arranged along the X direction, is used to convey a carrier loaded with products;

[0009] The conveying mechanism includes an X-axis module, a Y-axis module, a Z-axis module, and a suction cup assembly. The X-axis module is drive-connected to the Y-axis module, and the Z-axis module is drive-connected to the Y-axis module. The suction cup assembly is connected to the lifting end of the Z-axis module. The conveying mechanism also includes an upward-facing camera, which is disposed on the side of the suction cup assembly and is used to take pictures from above to position the product.

[0010] A tape clamping mechanism includes a tape clamping assembly, which includes a first clamping plate, a second clamping plate, and a lifting cylinder. The first clamping plate and the second clamping plate are arranged parallel to each other vertically. The first clamping plate is fixed in position. The second clamping plate is connected to the drive end of the lifting cylinder. The lifting cylinder can drive the second clamping plate to move closer to or away from the first clamping plate. The tape clamping mechanism is used to peel off the tape in cooperation with the conveying mechanism.

[0011] The waste collection mechanism includes an anti-sticking gripper, a gripper separation cylinder, and a displacement drive. The anti-sticking gripper is connected to the drive end of the gripper separation cylinder, which can drive the anti-sticking gripper to open and close. The gripper separation cylinder is connected to the drive end of the displacement drive, which can drive the anti-sticking gripper to enter or leave the waste clamping position.

[0012] In the above solution, the collaborative design of multiple mechanisms, including the conveying mechanism, the tape clamping mechanism, and the waste collection mechanism, enables the full automation of the gold finger tape removal process without manual intervention, significantly improving removal efficiency. At the same time, the visual positioning of the camera ensures the accuracy of the action and achieves accurate product pickup.

[0013] In a further technical solution, the conveying mechanism also includes a product fixing component. This product fixing component is disposed on both sides of the suction cup component. The product fixing component includes a fixing member, a lifting drive member, and a horizontal drive member. The horizontal drive member is connected to the drive end of the lifting drive member, and the fixing member is connected to the drive end of the horizontal drive member. The lifting drive member and the horizontal drive member can drive the fixing member to move vertically up and down and horizontally extend and retract, thereby pressing the product edge firmly during tape peeling. By providing a liftable and retractable fixing member, the product is auxiliaryly fixed during tape tearing, preventing displacement or falling of the product when the tape is peeled off.

[0014] In a further technical solution, the feeding mechanism includes a conveying module, a blocking module, and a lifting module. The conveying module includes a drive motor, a belt, and a support. The belt is connected to the support via rollers, and the drive motor is driven by the belt. The blocking module is positioned in front of the lifting module in the conveying direction and can move vertically to block the carrier. The lifting module is positioned below the support and can move vertically to lift the carrier. In the above solution, by setting up the conveying module, blocking module, and lifting module, the conveying and fixing of the carrier can be achieved in coordination, realizing automated loading and unloading.

[0015] A further technical solution includes a steel sheet transfer mechanism, which is positioned above the feeding mechanism to remove the steel sheet covering the carrier and to re-cover it after the tape is removed. The steel sheet transfer mechanism includes a steel sheet adsorption component, a lifting component, and a Y-axis module. The steel sheet adsorption component is connected to the lifting component, and the lifting component is connected to the Y-axis module. Some products require steel sheets to be pressed into the carrier to prevent displacement during transport. By setting up the steel sheet transfer mechanism, the steel sheet can be removed and re-covered before and after the tape is removed.

[0016] A further technical solution includes a bottom-mounted camera positioned below the moving path of the suction cup assembly. This bottom-mounted camera can photograph the product from below to confirm whether the tape has been completely removed. This bottom-mounted camera inspection ensures complete tape removal and prevents any remaining tape from being left behind.

[0017] In a further technical solution, the tape clamping mechanism also includes an X-axis drive module. The tape clamping assembly is drivenly connected to the X-axis drive module, which can drive the tape clamping assembly to move along the X-direction. By designing the X-axis drive module, the tape clamping assembly can move towards the suction cup assembly during the tape tearing process. Compared to the movement of a single suction cup assembly, this reduces the tape peeling time and decreases the overall volume of the device along the X-direction, improving space utilization.

[0018] In a further technical solution, the surface of the first clamping plate of the tape clamping mechanism is covered with napped polyester fiber fabric, and the surface of the second clamping plate is covered with a polyurethane elastomer layer.

[0019] By combining the napped polyester fiber fabric on the surface of the first clamping plate with the polyurethane elastomer layer on the surface of the second clamping plate, the friction between the clamping plate and the tape can be increased, ensuring that the tape is held in place without slipping. At the same time, it avoids scratching the gold fingers due to rigid contact and improves the reliability of simultaneous peeling of multiple tapes.

[0020] In a further technical solution, the displacement drive component of the waste collection mechanism includes a rotary cylinder, and the gripper separation cylinder is connected to the rotating end of the rotary cylinder. The rotary cylinder can drive the anti-stick gripper to rotate to adjust the gripping angle or transfer waste tape to the waste box. By setting the rotary cylinder, the angle of the anti-stick gripper can be adjusted to adapt to the tape angle when tearing the tape. In addition, the rotary cylinder can also drive the anti-stick gripper to transfer waste, thereby realizing continuous operation.

[0021] In a further technical solution, the displacement drive component of the waste collection mechanism also includes a Y-axis drive module. The rotary cylinder is connected to the Y-axis drive module, which drives the anti-stick gripper to move along the Y direction and, in conjunction with the rotary cylinder, realizes the picking up, placing, and transferring of waste tape. Driven by the Y-axis drive module, the anti-stick gripper can move laterally into the gripping position when holding waste tape and can move out of the gripping position when discarding waste, thereby avoiding interference with the tape-tearing action.

[0022] In a further technical solution, the anti-stick gripper surface of the waste collection mechanism is coated with a Teflon coating. The low-stickiness of the Teflon coating effectively prevents waste tape from sticking to the gripper, ensuring the stability of waste collection and avoiding equipment jamming caused by tape residue.

[0023] The gold finger high-temperature tape removal device provided in this application has the following technical advantages compared with the prior art:

[0024] The conveying mechanism can remove the product from the carrier and, through its movement path design, cooperates with the tape clamping mechanism to complete the tape tearing action. The waste collection mechanism can collect the torn tape. Through the collaborative design of the conveying mechanism, tape clamping mechanism, and waste collection mechanism, the entire process of removing gold finger tape can be automated without manual intervention, significantly improving tearing efficiency. At the same time, the visual positioning of the overhead camera ensures the accuracy of the action, enabling accurate picking and placing of products. Attached Figure Description

[0025] Appendix Figure 1 This is a schematic diagram of the overall structure of the device according to an embodiment of the present utility model;

[0026] Appendix Figure 2 This is a top view of the overall structure of the device according to an embodiment of the present utility model;

[0027] Appendix Figure 3 This is a schematic diagram of the feeding mechanism according to an embodiment of the present utility model;

[0028] Appendix Figure 4 This is a partial structural schematic diagram of the suction cup assembly of the conveying mechanism in an embodiment of this utility model;

[0029] Appendix Figure 5 This is a schematic diagram of the tape clamping mechanism in an embodiment of the present invention;

[0030] Appendix Figure 6 This is a schematic diagram of the waste collection mechanism in an embodiment of the present invention;

[0031] Appendix Figure 7 This is a schematic diagram of the tape-tearing process in an embodiment of this utility model;

[0032] Appendix Figure 8 This is a schematic diagram of the steel sheet transfer mechanism in an embodiment of this utility model;

[0033] In the attached diagrams: 100-Gold finger high-temperature tape removal equipment; 1-Feeding mechanism; 11-Conveying module; 12-Blocking module; 13-Lifting module; 2-Transporting mechanism; 21-X-axis module; 22-Y-axis module; 23-Z-axis module; 24-Suction cup assembly; 241-Vacuum nozzle; 242-Mounting plate; 25-Upper camera; 3-Tape clamping mechanism; 31-First clamping plate; 32-Second clamping plate; 33-Lifting cylinder; 34-X-direction drive module; 4-Waste collection mechanism; 41-Anti-sticking gripper; 41a-Teflon coating; 42-Gripper separation cylinder; 43-Rotating cylinder; 5-Steel sheet transfer mechanism; 51-Steel sheet adsorption assembly; 52-Lifting assembly; 53-Y-direction module; 6-Lower camera; 7-Tape. Detailed Implementation

[0034] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0035] The terms "first," "second," etc., used in this article do not specifically refer to order or sequence, nor are they intended to limit this case; they are merely used to distinguish components or operations described using the same technical terms.

[0036] The terms "connection" or "positioning" as used in this article can refer to two or more components or devices making direct physical contact with each other, or making indirect physical contact with each other, or to two or more components or devices operating or moving with each other.

[0037] The terms “include,” “including,” and “have” used in this article are all open-ended, meaning they include but are not limited to.

[0038] The terms “front,” “back,” “up,” “down,” “left,” and “right” used in this article are directional terms. In this case, they are only used to describe the positional relationship between the structures and are not intended to limit the specific direction of the protection scheme or its actual implementation.

[0039] See appendix Figure 1 and attached Figure 2 This application provides a high-temperature adhesive tape removal device 100 for gold fingers, including a feeding mechanism 1, a conveying mechanism 2, an adhesive tape clamping mechanism 3, and a waste collection mechanism 4. For example... Figure 1As shown in the figure, the X direction is the feeding direction, the Y direction is the horizontal direction perpendicular to the X direction, and the Z direction is the vertical direction.

[0040] The feeding mechanism 1 is arranged along the X direction and is used to transport a carrier loaded with products. The products can be PCB (printed circuit board) or FPC (flexible printed circuit board), etc. Each carrier contains multiple products. In this embodiment, there are 8 PCBs in each carrier that need to have their gold finger tape removed.

[0041] The conveying mechanism 2 includes a gantry frame and a suction cup assembly 24. The gantry frame includes an X-axis module 21, a Y-axis module 22, and a Z-axis module 23. The X-axis module 21 is drive-connected to the Y-axis module 22, and the Z-axis module 23 is drive-connected to the Y-axis module 22. The suction cup assembly 24 is connected to the lifting end of the Z-axis module 23, thereby enabling the suction cup module to move in these three directions. (See attached diagram) Figure 4 The suction cup assembly 24 includes multiple sets of vacuum nozzles 241 arranged in a matrix on the mounting plate 242. These vacuum nozzles 241 are connected to an air source, thereby enabling the suction of multiple products at once. In a possible embodiment, a rotating module may be added between the Z-axis module 23 and the suction cup assembly 24 to adjust the angle of the suction cup assembly 24.

[0042] To achieve accurate product adsorption, the conveying mechanism 2 also includes an upward-facing camera 25 for taking pictures from above to position the product. The upward-facing camera 25 is located on the side of the suction cup assembly 24, so the gantry can also move the upward-facing camera 25 to the target position to take pictures.

[0043] See appendix Figure 5 The tape clamping mechanism 3 includes a tape clamping assembly, which comprises a first clamping plate 31, a second clamping plate 32, and a lifting cylinder 33. The first clamping plate 31 and the second clamping plate 32 are arranged parallel to each other vertically. The first clamping plate 31 is fixed in position, and the second clamping plate 32 is connected to the drive end of the lifting cylinder 33. The lifting cylinder 33 can move the second clamping plate 32 closer to or further away from the first clamping plate 31 to achieve the tape clamping and releasing actions. Through the coordinated cooperation of the tape clamping mechanism 3 and the conveying mechanism 2, the tape is peeled off from the gold fingers.

[0044] like Figure 6 As shown, the waste collection mechanism 4 includes an anti-sticking gripper 41, a gripper separation cylinder 42, and a displacement drive. The anti-sticking gripper 41 is connected to the drive end of the gripper separation cylinder 42, which can drive the anti-sticking gripper 41 to open and close. The gripper separation cylinder 42 is connected to the drive end of the displacement drive, which can drive the anti-sticking gripper 41 to enter or leave the waste clamping position.

[0045] The carrier carrying the product is transported to the transport position via the feeding mechanism 1. Then, the camera 25 of the transport mechanism 2 takes a picture of the product for positioning. After positioning, the suction cup assembly 24 of the transport mechanism 2 picks up the product and moves it to the side of the tape clamping mechanism 3. Then, the suction cup assembly 24 moves laterally so that the end of the tape enters between the first clamping plate 31 and the second clamping plate 32. Subsequently, the first clamping plate 31 and the second clamping plate 32 clamp together. The transport mechanism 2 first moves upward a certain distance so that the end of the tape is torn at a certain angle. Then, the transport mechanism 2 moves horizontally, and the tape is torn until only a small part of the end is connected to the gold fingers. At this time, the waste collection mechanism 4 enters the waste clamping position under the drive of the displacement drive, and the anti-sticking claw 41 clamps the tape 7 (e.g., Figure 7 As shown), the suction cup assembly 24 leaves and puts the product with the torn tape back into the carrier, the tape clamping mechanism 3 releases the tape end, and the waste collection mechanism 4 leaves the clamping position under the drive of the displacement drive component, completing the entire tape tearing action.

[0046] This equipment, through the collaborative design of multiple mechanisms including the conveying mechanism 2, the tape clamping mechanism 3, and the waste collection mechanism 4, can automate the entire process of removing gold finger tape without manual intervention, greatly improving the removal efficiency. At the same time, the visual positioning of the upper camera 25 ensures the accuracy of the action and achieves accurate product picking.

[0047] To prevent the product from falling off the suction cup assembly 24 during tape removal, in this embodiment, the conveying mechanism 2 also includes a product fixing assembly. The product fixing assembly is located on both sides of the suction cup assembly 24 and includes a fixing member, a lifting drive member, and a horizontal drive member. The horizontal drive member is connected to the drive end of the lifting drive member, and the fixing member is connected to the drive end of the horizontal drive member. Before the suction cup assembly 24 adsorbs the product and prepares to remove the tape, the lifting drive member and the horizontal drive member drive the fixing members on both sides to descend vertically first, then retract horizontally, moving the fixing members below the product. Then, the lifting drive member drives the fixing members to rise, pressing down on the product edge, thereby assisting in fixing the product during tape removal and preventing displacement or falling during tape peeling. After the tape is peeled off, the lifting drive member and the horizontal drive member move the fixing members away to facilitate subsequent placement of the product back into the carrier.

[0048] like Figure 3As shown, the feeding mechanism 1 includes a conveying module 11, a blocking module 12, and a lifting module 13. These are all conventional structures and will be described briefly. The conveying module 11 includes a drive motor, a belt, and a support frame. The belt is connected to the support frame via rollers. The drive motor is connected to the belt drive, and the belt rotates under the drive motor to convey the carrier. The blocking module 12 is located in front of the lifting module 13 in the conveying direction. The blocking module 12 can move up and down vertically to block the carrier. The lifting module 13 is located below the support frame and can move up and down vertically to lift the carrier. In the above scheme, by setting up the conveying module 11, the blocking module 12, and the lifting module 13, the conveying and fixing of the carrier can be achieved, realizing automated loading and unloading. In addition, multiple blocking modules 12 and lifting modules 13 can be set along the conveying module 11 according to actual needs. For example, in this embodiment, two blocking modules 12 and two lifting modules 13 are set, so that the conveying component can alternately pick up and put down materials from the two carriers, thereby improving the production cycle.

[0049] Some products need to be pressed into a carrier by steel sheets to prevent displacement during transportation. Therefore, in this embodiment, the equipment also includes a steel sheet transfer mechanism 5, which is located above the feeding mechanism 1. Figure 8 As shown, the steel sheet transfer mechanism 5 includes a steel sheet adsorption assembly 51, a lifting assembly 52, and a Y-axis module 53. The steel sheet adsorption assembly 51 is connected to the lifting assembly 52, and the lifting assembly 52 is connected to the Y-axis module 53. By setting up the steel sheet transfer mechanism, the steel sheet can be moved away and covered before and after the tape is torn.

[0050] Preferably, the device further includes a bottom-viewing camera 6, which is positioned below the moving path of the suction cup assembly 24 and can photograph the product from below to confirm whether the tape has been completely removed. After the tape peeling action is completed, the conveying mechanism 2 moves the product above the bottom-viewing camera 6 for a second inspection to ensure that the tape has been completely removed and to prevent any individual pieces of tape from being left uncleaned.

[0051] In this embodiment, the tape clamping mechanism 3 further includes an X-axis drive module 34. The tape clamping assembly is drivenly connected to the X-axis drive module 34, which can drive the tape clamping assembly to move along the X direction. During the tape tearing process, the tape clamping assembly does not remain stationary but can move towards the suction cup assembly 24. Compared to the movement of a single suction cup assembly 24, this reduces the tape peeling time and also reduces the size of the device along the X direction, improving space utilization.

[0052] To ensure the tape ends are securely clamped and do not slip, the surface of the first clamping plate 31 of the tape clamping mechanism 3 is covered with a napped polyester fiber fabric (commonly known as quilted fabric), and the surface of the second clamping plate 32 is covered with a polyurethane elastomer layer (commonly known as urethane rubber). This increases the friction between the clamping plates and the tape, ensuring the tape is held securely without slippage, while also preventing rigid contact from scratching the gold fingers and improving the reliability of simultaneous peeling of multiple tapes.

[0053] The displacement drive of the waste collection mechanism 4 may include a rotary cylinder 43, and a gripper separation cylinder 42 connected to the rotating end of the rotary cylinder 43. The rotary cylinder 43 can drive the anti-stick gripper 41 to rotate to adjust the gripping angle or transfer the waste tape to the waste box. In a possible embodiment, the displacement drive of the waste collection mechanism 4 may also include a Y-axis drive module. The rotary cylinder 43 is connected to the Y-axis drive module, which can drive the anti-stick gripper 41 to move along the Y direction and cooperate with the rotary cylinder 43 to pick up, put down and transfer the waste tape. Driven by the Y-axis drive module, the anti-stick gripper 41 can move laterally into the gripping position when gripping the waste tape and can move out of the gripping position when discarding the waste, thereby avoiding interference with the tape tearing action.

[0054] The surface of the anti-stick gripper 41 of the waste collection mechanism 4 is coated with a Teflon coating 41a. The low-stickiness of the Teflon coating 41a effectively prevents waste tape from sticking to the gripper, ensuring the stability of waste collection and avoiding equipment jamming caused by tape residue.

[0055] The complete working process of the gold finger high-temperature tape removal device provided in this embodiment is as follows:

[0056] The conveying module 11 of the feeding mechanism 1 conveys the carrier loaded with PCB boards along the X direction. When the carrier reaches the preset working position, the blocking module 12 extends to block the carrier from moving forward. Then, the lifting module 13 rises to lift the carrier away from the conveying module 11 to achieve positioning and fixation. At this time, the steel sheet transfer mechanism 5 is activated. Its Y-axis module 53 drives the lifting component 52 and the steel sheet adsorption component 51 to move above the carrier. The lifting component 52 descends so that the steel sheet adsorption component 51 contacts and adsorbs the steel sheet covering the PCB board. Then, the lifting component 52 rises and the Y-axis module 53 moves the steel sheet to the temporary storage position.

[0057] After the steel sheet is removed, the X-axis module 21 and Y-axis module 22 of the conveying mechanism 2 drive the Z-axis module 23 and the suction cup assembly 24 to move above the carrier; the overhead camera 25 takes pictures of the PCB board to position it and obtain its location information. After positioning, the Z-axis module 23 descends, the vacuum nozzle 241 of the suction cup assembly 24 picks up the PCB board, and then the Z-axis module 23 rises, the conveying mechanism 2 moves the PCB board to one side of the tape clamping mechanism 3, and moves the end of the tape between the first clamping plate 31 and the second clamping plate 32 from the side.

[0058] The lifting cylinder 33 of the tape clamping mechanism 3 drives the second clamping plate 32 to rise and close with the first clamping plate 31 to clamp the end of the tape; the Z-axis module 23 of the conveying mechanism 2 drives the PCB board to rise slightly (so that the tape is kept taut), and then the X-axis drive module 34 of the tape clamping mechanism 3 drives the first clamping plate 31 and the second clamping plate 32 to move along the X-axis, while the X-axis module 21 of the conveying mechanism 2 drives the PCB board to move in the opposite direction (the two move towards each other), and the tape is peeled off from the PCB board by relative displacement.

[0059] After the tape is completely peeled off, the rotary cylinder 43 of the waste collection mechanism 4 drives the gripper separation cylinder 42 and the anti-stick gripper 41 to rotate to the side of the peeled tape; the gripper separation cylinder 42 drives the anti-stick gripper 41 to close to hold the waste tape. Subsequently, the Z-axis module 23 of the conveying mechanism 2 drives the PCB board to rise, so that the waste tape is completely separated from the PCB board. At the same time, the lifting cylinder 33 of the tape holding mechanism 3 drives the second clamping plate 32 to descend and release the tape; the rotary cylinder 43 rotates and drives the anti-stick gripper 41 to move the waste tape to the top of the recycling bin. The gripper separation cylinder 42 drives the anti-stick gripper 41 to open, so that the waste tape falls into the recycling bin.

[0060] After waste collection is completed, the transport mechanism 2 moves the PCB board above the downward-facing camera 6. The downward-facing camera 6 photographs the gold finger area of ​​the PCB board from below for the first re-inspection to confirm the absence of residual adhesive. After passing the re-inspection, the transport mechanism 2 moves the PCB board to the unloading position (above the carrier). The Z-axis module 23 descends to place the PCB board back onto the carrier, and the suction cup assembly 24 releases the PCB board. Subsequently, the upward-facing camera 25 performs a second re-inspection of the PCB board on the carrier to confirm whether the PCB board is placed at an angle.

[0061] After the second re-inspection is passed, the steel sheet transfer mechanism 5 transfers the temporarily stored steel sheet to the top of the carrier, and the lifting component 52 descends to cover the PCB board with the steel sheet and releases it. Finally, the lifting module 13 of the feeding mechanism 1 descends, the carrier falls back to the conveying module 11, the blocking module 12 retracts, and the conveying module 11 sends the carrier and PCB board out of the equipment along the X direction, completing the entire tearing process.

[0062] The above embodiments are only for illustrating the technical concept and features of this utility model, and are intended to enable those skilled in the art to understand the content of this utility model and implement it accordingly. They should not be construed as limiting the scope of protection of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be included within the scope of protection of this utility model.

Claims

1. A high-temperature adhesive tape removal device for gold fingers, characterized in that, include: Feeding mechanism (1), which is arranged along the X direction, is used to convey a carrier loaded with products; The conveying mechanism (2) includes an X-axis module (21), a Y-axis module (22), a Z-axis module (23), and a suction cup assembly (24). The X-axis module (21) is connected to the Y-axis module (22), and the Z-axis module (23) is connected to the Y-axis module (22). The suction cup assembly (24) is connected to the lifting end of the Z-axis module (23). The conveying mechanism (2) also includes an upward-facing camera (25), which is located on the side of the suction cup assembly (24) and is used to take pictures from above to position the product. The tape clamping mechanism (3) includes a tape clamping assembly, which includes a first clamping plate (31), a second clamping plate (32), and a lifting cylinder (33). The first clamping plate (31) and the second clamping plate (32) are arranged parallel to each other. The first clamping plate (31) is fixed in position. The second clamping plate (32) is connected to the driving end of the lifting cylinder (33). The lifting cylinder (33) can drive the second clamping plate (32) to move closer to or away from the first clamping plate (31). The tape clamping mechanism (3) is used to peel off the tape in cooperation with the conveying mechanism (2). The waste collection mechanism (4) includes an anti-sticking gripper (41), a gripper separation cylinder (42), and a displacement drive. The anti-sticking gripper (41) is connected to the drive end of the gripper separation cylinder (42), which can drive the anti-sticking gripper (41) to open and close. The gripper separation cylinder (42) is connected to the drive end of the displacement drive, which can drive the anti-sticking gripper (41) to enter or leave the waste clamping position.

2. The gold finger high-temperature tape removal device according to claim 1, characterized in that: The conveying mechanism (2) further includes a product fixing component, which is disposed on both sides of the suction cup assembly (24). The product fixing component includes a fixing component, a lifting drive component, and a horizontal drive component. The horizontal drive component is connected to the drive end of the lifting drive component, and the fixing component is connected to the drive end of the horizontal drive component. The lifting drive component and the horizontal drive component can drive the fixing component to move vertically up and down and horizontally extend and retract, so as to press the product edge tightly during the tape peeling process.

3. The gold finger high-temperature tape removal device according to claim 1, characterized in that: The feeding mechanism (1) includes a conveying module (11), a blocking module (12), and a lifting module (13). The conveying module (11) includes a drive motor, a belt, and a support. The belt is connected to the support via rollers, and the drive motor is connected to the belt drive. The blocking module (12) is located in front of the lifting module (13) in the conveying direction. The blocking module (12) can move up and down in the vertical direction to block the vehicle. The lifting module (13) is located below the support. The lifting module (13) can move up and down in the vertical direction to lift the vehicle.

4. The gold finger high-temperature tape removal device according to claim 1, characterized in that: It also includes a steel sheet transfer mechanism (5), which is located above the feeding mechanism (1) and is used to remove the steel sheet covering the carrier and to re-cover the steel sheet after the tape is removed; the steel sheet transfer mechanism (5) includes a steel sheet adsorption assembly (51), a lifting assembly (52) and a Y-axis module (53), the steel sheet adsorption assembly (51) is connected to the lifting assembly (52), and the lifting assembly (52) is connected to the Y-axis module (53).

5. The gold finger high-temperature tape removal device according to claim 1, characterized in that: It also includes a bottom-mounted camera (6), which is positioned below the moving path of the suction cup assembly (24). The bottom-mounted camera (6) is capable of shooting the product from bottom to top to confirm whether the tape has been completely removed.

6. The gold finger high-temperature tape removal device according to claim 1, characterized in that: The tape clamping mechanism (3) further includes an X-direction drive module (34), and the tape clamping assembly is connected to the X-direction drive module (34). The X-direction drive module (34) can drive the tape clamping assembly to move along the X direction.

7. The gold finger high-temperature tape removal device according to claim 1, characterized in that: The first clamping plate (31) of the tape clamping mechanism (3) is covered with a napped polyester fiber fabric, and the second clamping plate (32) is covered with a polyurethane elastomer layer.

8. The gold finger high-temperature tape removal device according to claim 1, characterized in that: The displacement drive component of the waste collection mechanism (4) includes a rotary cylinder (43), and the gripper separation cylinder (42) is connected to the rotating end of the rotary cylinder (43). The rotary cylinder (43) can drive the anti-stick gripper (41) to rotate to adjust the clamping angle or transfer the waste tape to the waste box.

9. The gold finger high-temperature tape removal device according to claim 8, characterized in that: The displacement drive component of the waste collection mechanism (4) also includes a Y-direction drive module. The rotary cylinder (43) is connected to the Y-direction drive module. The Y-direction drive module can drive the anti-sticking gripper (41) to move along the Y direction and cooperate with the rotary cylinder (43) to realize the picking, placing and transferring of waste tape.

10. The gold finger high-temperature tape removal device according to claim 1, characterized in that: The surface of the anti-stick gripper (41) of the waste collection mechanism (4) is coated with a Teflon coating (41a).

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