FPC bonding dispensing soldering production line

Abstract

The utility model discloses a kind of FPC sticking point glue soldering production lines, including copper plate feeding mechanism, sticking mechanism, first point glue mechanism, second point glue mechanism, soldering mechanism and snatch transplanting module;Sticking mechanism includes conveying device, FPC feeding device, snatch sticking device and first detection device;First point glue mechanism is equipped with coil placement area and snatch assembly device, snatch transplanting module is used to snatch fixture and reciprocatingly moves between first point glue mechanism, second point glue mechanism, soldering mechanism;In this way, through the design of each mechanism, to realize FPC, copper plate, coil between assembly, point glue, soldering etc. Operation, improve the production efficiency of product, especially, the setting of first detection device, to identify the position of FPC, copper plate, it is conducive to the accurate and faultless sticking position between FPC, copper plate, processing quality is stable and consistent, structural design is ingenious and reasonable, processing time is short, satisfy the use demand of user, wide range of application.

Description

Technical Field

[0001] This utility model relates to the field of FPC bonding technology, and in particular to an FPC bonding dispensing and soldering production line. Background Technology

[0002] Currently, some electronic products use FPC components, which include FPC, copper plates, and coils. In the traditional FPC component production process, the assembly of FPC, copper plates, and coils is usually completed step by step on different specialized equipment. The typical process flow is as follows: First, the copper plate and FPC are precisely positioned and bonded using a fixture; then, they are transferred to a dispensing device for dispensing in a designated area; after dispensing, they are transferred to an assembly station where the coil is assembled onto the FPC and copper plate, and then transferred to a soldering station for soldering to establish an electrical connection; finally, to ensure the mechanical strength of the connection between the coil and the FPC, dispensing is performed again to achieve structural reinforcement.

[0003] However, existing FPC component production efficiency is low. Because the assembly, dispensing, soldering and other processes between FPC, copper plate and coil are scattered in different equipment, the workpieces need to be frequently loaded, unloaded, positioned and transferred, resulting in long operation time. In addition, when the workpieces in each process are transferred between multiple equipment, they need to be repeatedly positioned. Each positioning may produce cumulative errors, resulting in slight deviations in the relative positions between FPC, copper plate and coil, which affects the consistency and reliability of the product, cannot meet the user's needs and has a limited scope of application.

[0004] Therefore, it is necessary to research a new technical solution to address the above problems. Utility Model Content

[0005] In view of this, the present invention addresses the deficiencies of the existing technology, and its main objective is to provide an FPC bonding, dispensing, and soldering production line. Through the design of various mechanisms, it realizes the assembly, dispensing, and soldering operations between FPC, copper plate, and coil, thereby improving the production efficiency of the product. In particular, the setting of the first detection device to identify the position of FPC and copper plate is conducive to accurate bonding position between FPC and copper plate, stable and consistent processing quality, meeting the user's needs, and has a wide range of applications.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] An FPC bonding, dispensing, and soldering production line includes a copper plate loading mechanism, a bonding mechanism, a first dispensing mechanism, a second dispensing mechanism, a soldering mechanism, and a gripping and transferring module, wherein the copper plate loading mechanism, bonding mechanism, first dispensing mechanism, soldering mechanism, and second dispensing mechanism are arranged sequentially from left to right;

[0008] The bonding mechanism includes a conveying device, an FPC feeding device, a gripping bonding device, and a first detection device. The first end and the last end of the conveying device are respectively connected to the copper plate feeding mechanism and the first dispensing mechanism. The copper plate feeding mechanism is used to feed the fixture containing the copper plate into the conveying device and move it to the gripping bonding device. The gripping bonding device is used to grip the FPC at the FPC feeding device and move the FPC to the fixture containing the copper plate on the conveying device, so that the FPC is bonded to the copper plate. The first detection device is used to detect the position of the copper plate and the FPC.

[0009] The first dispensing mechanism is used to dispense adhesive onto the copper plate and FPC on the fixture. A coil placement area and a gripping assembly device are provided on one side of the first dispensing mechanism. The coil placement area is used to store coils. The gripping assembly device is used to grip and move the coils from the coil placement area to the copper plate and FPC after dispensing and assemble them. The soldering mechanism is used to solder the coils on the fixture. The second dispensing mechanism is used to dispense adhesive onto the FPC and coils on the fixture. The gripping and transfer module is used to grip the fixture and move it back and forth between the first dispensing mechanism, the second dispensing mechanism, and the soldering mechanism.

[0010] As a preferred embodiment, both the first dispensing mechanism and the second dispensing mechanism include a dispensing head, a first mounting bracket, a first displacement module, a first movable seat, and a first translation device. The first displacement module is driven and connected to the dispensing head and is mounted on the first mounting bracket. The first movable seat is used for fixture placement and positioning. The first translation device is driven and connected to the first movable seat and is located below the dispensing head. The first movable seat moves to below the dispensing head or moves out of the corresponding dispensing mechanism under the control of the first translation device, so as to facilitate the gripping and transfer module to grip and transfer the dispensed workpiece to the next mechanism. The coil placement area and the gripping and assembly device are located on the side of the first movable seat of the first dispensing mechanism away from the dispensing head.

[0011] As a preferred embodiment, a second detection device is also provided. The second detection device is located beside the dispensing head and above the first movable seat. The second detection device of the first dispensing mechanism is used to detect the position of the copper plate and FPC in the fixture and determine the dispensing position of the copper plate and FPC. The second detection device of the second dispensing mechanism is used to detect the position of the FPC and coil in the fixture and determine the dispensing position of the FPC and coil.

[0012] As a preferred embodiment, the second dispensing mechanism is equipped with a UV curing device.

[0013] As a preferred embodiment, the soldering mechanism includes a soldering device, a second mounting bracket, a second displacement module, a second movable seat, and a second translation device. The second displacement module is driven and connected to the soldering device and is mounted on the second mounting bracket. The second movable seat is used for positioning the fixture. The second translation device is driven and connected to the second movable seat and is located below the soldering device. The second movable seat moves under the control of the second translation device to perform soldering operations or moves out of the soldering mechanism, so that the gripping and transfer module can grip and transfer the soldered fixture to the next mechanism.

[0014] As a preferred embodiment, the soldering mechanism is equipped with a dust collection device for absorbing the fumes generated during the soldering process. The dust collection device is connected to a dust collection hood, which is located behind the second movable seat and at the lower rear end of the soldering mechanism.

[0015] As a preferred embodiment, a pressing mechanism is also included. The pressing mechanism is used to press the copper plate and FPC after dispensing the adhesive and assembling the coil. The pressing mechanism is located between the first dispensing mechanism and the soldering mechanism. The pressing mechanism includes a pressing component, a third mounting bracket, a third displacement module, a third moving seat, and a third translation device. The third displacement module is driven and connected to the pressing component and is mounted on the third mounting bracket. The third translation device is driven and connected to the third moving seat and is located below the pressing component. The third moving seat is used for fixture placement and positioning. The third moving seat moves to below the pressing component or moves out of the pressing mechanism under the control of the third translation device, so as to facilitate the gripping and transfer module to grip and transfer the pressed workpiece to the next mechanism.

[0016] As a preferred embodiment, the pressing component is provided with a heating device.

[0017] As a preferred embodiment, the upper end of the pressing component is provided with a connecting plate, and the heating device is disposed between the pressing component and the connecting plate.

[0018] As a preferred embodiment, a return line is also provided. The return line is used to remove the processed workpiece from the fixture and transport the fixture to the copper plate loading mechanism. The return line includes a first return section and a second return section. The first return section is located to the right of the second dispensing mechanism, and the second return section is located behind the first return section and behind the bonding mechanism, the first dispensing mechanism, the soldering mechanism, and the second dispensing mechanism. One end of the second return section is connected to the first return section, and the other end of the second return section is connected to the copper plate loading mechanism.

[0019] Compared with the prior art, this utility model has obvious advantages and beneficial effects. Specifically, as can be seen from the above technical solution, it mainly uses the design of each mechanism to grab and move the FPC to the fixture of the conveying device so that the FPC is attached to the copper plate. With the setting of the grabbing and transferring module, the fixture with the FPC and copper plate is moved to the first dispensing mechanism, the soldering mechanism and the second dispensing mechanism in sequence to realize the assembly, dispensing and soldering operations between the FPC, copper plate and coil, which improves the production efficiency of the product. In particular, the setting of the first detection device is used to identify the position of the FPC and copper plate, which is conducive to the accurate bonding position between the FPC and copper plate, the stable and consistent processing quality, the ingenious and reasonable structural design, the short processing time, the meeting of user needs, and the wide range of applications.

[0020] Secondly, the second detection device identifies and confirms the dispensing position of the FPC, copper plate, and coil, which helps the dispensing head to perform dispensing operations on the workpiece based on the feedback of the dispensing position information, improving the dispensing effect and usability. At the same time, the UV curing device accelerates the solidification of the adhesive on the workpiece, thereby ensuring the strong connection between the coil and FPC, eliminating the need for subsequent cooling and solidification, and further reducing the production time of the product. Furthermore, the third detection device determines the solder position on the workpiece, ensuring the soldering effect of the coil, thereby improving the processing quality of the product.

[0021] Furthermore, the dust extraction device is designed to absorb the fumes generated during soldering, reducing their accumulation within the soldering mechanism and thus preventing safety hazards during the soldering process. This ensures the safe operation of the mechanism. Simultaneously, the pressing mechanism ensures the connection between the coil, FPC, and copper plate, thereby guaranteeing stable subsequent soldering operations. Additionally, the heating device heats the coil while performing the pressing operation, ensuring the connection between the FPC, copper plate, and coil, and ultimately ensuring consistent and stable product quality.

[0022] Furthermore, the reflow line allows the machined workpieces to be removed from the fixture and then transported to the copper plate loading mechanism. This eliminates the need to store a certain number of fixtures after use before moving them to the copper plate loading area for assembly, thus improving the utilization rate of the fixtures and enabling the automated use of the production line. This is highly practical.

[0023] To more clearly illustrate the structural features, technical means, and specific objectives and functions of this utility model, the following detailed description is provided in conjunction with the accompanying drawings and specific embodiments. Attached Figure Description

[0024] Figure 1 This is a perspective view of an embodiment of the present utility model;

[0025] Figure 2 This is a front view of an embodiment of the present utility model;

[0026] Figure 3 This is a schematic diagram of the bonding mechanism according to an embodiment of the present utility model;

[0027] Figure 4 This is a schematic diagram of the structure of the first dispensing mechanism according to an embodiment of the present utility model;

[0028] Figure 5 This is a schematic diagram of the structure of the second dispensing mechanism according to an embodiment of the present utility model;

[0029] Figure 6 This is a schematic diagram of the soldering mechanism according to an embodiment of the present invention;

[0030] Figure 7 This is a schematic diagram of the pressing mechanism according to an embodiment of the present invention;

[0031] Figure 8 This is a schematic diagram of the gripping and bonding device and locking component according to an embodiment of the present invention.

[0032] Explanation of reference numerals in the attached diagram:

[0033] 10. Copper plate loading mechanism;

[0034] 20. Bonding mechanism; 21. Workbench; 22. Conveying device; 221. Clearance hole; 23. FPC feeding device; 24. Gripping and bonding device; 241. Gripping head; 242. Mounting base; 243. Displacement device; 244. Adjustment device; 25. First detection device; 26. Locking assembly; 261. Locking part; 262. Second drive device; 27. Pushing device; 28. Opening assembly;

[0035] 30. First dispensing mechanism; 31. Dispensing head; 32. First mounting bracket; 33. First displacement module; 34. First movable seat; 35. First translation device;

[0036] 40. Second dispensing mechanism; 41. UV curing device;

[0037] 50. Soldering mechanism; 51. Soldering device; 52. Second mounting bracket; 53. Second displacement module; 54. Second movable seat; 55. Second translation device; 56. Dust collection device; 561. Dust collection hood;

[0038] 60. Pressing mechanism; 61. Pressing component; 62. Third mounting bracket; 63. Third displacement module; 64. Third moving seat; 65. Third translation device; 66. Heating device; 67. Connecting plate;

[0039] 70. Reflux line; 71. First reflux section; 72. Second reflux section. Detailed Implementation

[0040] Please refer to Figures 1 to 8 As shown, it illustrates the specific structure of an embodiment of the present invention.

[0041] An FPC bonding and soldering production line includes a copper plate loading mechanism 10, a bonding mechanism 20, a first dispensing mechanism 30, a second dispensing mechanism 40, a soldering mechanism 50, and a gripping and transferring module (not shown in the figure). The copper plate loading mechanism 10, bonding mechanism 20, first dispensing mechanism 30, soldering mechanism 50, and second dispensing mechanism 40 are arranged sequentially from left to right.

[0042] The bonding mechanism 20 includes a workbench 21, a conveying device 22, an FPC feeding device 23, a gripping bonding device 24, and a first detection device 25. The first end and the last end of the conveying device 22 are respectively connected to the copper plate feeding mechanism 10 and the first dispensing mechanism 30. The copper plate feeding mechanism 10 is used to feed the fixture containing the copper plate into the conveying device and move it to the gripping bonding device. The gripping bonding device 24 is used to grip the FPC at the FPC feeding device and move the FPC to the fixture containing the copper plate on the conveying device, so that the FPC is bonded to the copper plate. The first detection device 25 is used to detect the position of the copper plate and the FPC.

[0043] The first dispensing mechanism 30 is used to dispense adhesive onto the copper plate and FPC on the fixture. A coil placement area (not shown in the figure) and a gripping assembly device (not shown in the figure) are provided on one side of the first dispensing mechanism 30. The coil placement area is used to store coils. The gripping assembly device is used to grip and move the coils from the coil placement area to the copper plate and FPC after dispensing and assemble them. The soldering mechanism 50 is used to solder the coils on the fixture. The second dispensing mechanism 40 is used to dispense adhesive onto the FPC and coils on the fixture. The gripping transfer module is used to grip the fixture and move it back and forth between the first dispensing mechanism 30, the second dispensing mechanism 40, and the soldering mechanism 50.

[0044] The first dispensing mechanism 30 and the second dispensing mechanism 40 both include a dispensing head 31, a first mounting bracket 32, a first displacement module 33, a first movable seat 34, and a first translation device 35. The first displacement module 33 is driven to be connected to the dispensing head 31 and is disposed on the first mounting bracket 32. The first movable seat 34 is used for fixture placement and positioning. The first translation device 35 is driven to be connected to the first movable seat 34 and is located below the dispensing head 31. The first movable seat 34 moves to below the dispensing head or moves out of the corresponding dispensing mechanism under the control of the first translation device 35, so as to facilitate the gripping and transfer module to grip and transfer the dispensed workpiece to the next mechanism. The coil placement area and the gripping and assembly device are located on the side of the first movable seat of the first dispensing mechanism away from the dispensing head.

[0045] The soldering mechanism 50 includes a soldering device 51, a second mounting bracket 52, a second displacement module 53, a second movable seat 54, and a second translation device 55. The second displacement module 53 is driven to be connected to the soldering device 51 and is disposed on the second mounting bracket 52. The second movable seat 54 is used for the fixture to be placed and positioned. The second translation device 55 is driven to be connected to the second movable seat 54 and is located below the soldering device 51. The second movable seat 54 moves to the bottom of the soldering device 51 for soldering operation or moves out of the soldering mechanism 50 under the control of the second translation device 55, so that the gripping and transfer module can grip and transfer the soldered fixture to the next mechanism.

[0046] It should be noted that, depending on the user's actual usage, the gripping and transfer module can be omitted from the fixture gripping and transfer process. The fixture equipped with the FPC and copper plate can be moved manually at the first dispensing mechanism, the second dispensing mechanism, and the soldering mechanism. Furthermore, when manually moving the fixture equipped with the FPC and copper plate to the corresponding mechanism, the gripping assembly device can also be omitted. In this case, the coil can be manually removed from the coil placement area and assembled onto the FPC and copper plate. This allows for automated or semi-automated use of the production line. Thus, through the design of each mechanism, the gripping... The bonding device picks up the FPC and moves it to the fixture of the conveying device so that the FPC is bonded to the copper plate. In conjunction with the gripping and transfer module, the fixture with the FPC and copper plate is moved sequentially to the first dispensing mechanism, the soldering mechanism, and the second dispensing mechanism to realize the assembly, dispensing, and soldering operations between the FPC, copper plate, and coil, which improves the production efficiency of the product. In particular, the setting of the first detection device is used to identify the position of the FPC and copper plate, which is conducive to accurate bonding position between the FPC and copper plate, consistent processing quality, ingenious and reasonable structural design, short processing time, meeting the user's needs, and wide applicability.

[0047] Furthermore, a second detection device (not shown in the figure) is also provided. The second detection device is located beside the dispensing head 31 and above the first movable seat 34. The second detection device of the first dispensing mechanism 30 is used to detect the position of the copper plate and FPC on the fixture and determine the dispensing position of the copper plate and FPC. The second detection device of the second dispensing mechanism 40 is used to detect the position of the FPC and coil on the fixture and determine the dispensing position of the FPC and coil. Thus, the setting of the second detection device to identify the position of the FPC, copper plate and coil and confirm the dispensing position is beneficial for the dispensing head to perform dispensing operation on the workpiece based on the feedback of the dispensing position information, thereby improving the dispensing effect of the workpiece and improving usability.

[0048] Preferably, the second dispensing mechanism 40 is provided with a UV curing device 41. The UV curing device 41 is located on the side of the first mounting bracket 32 ​​away from the dispensing head 31. The light source of the UV curing device 41 is set downwards. The UV curing device 41 is located above the first moving seat 34. In use, after the dispensing head of the second dispensing mechanism dispenses adhesive to the coil, FPC, and coil, the first translation device controls the first moving seat containing the workpiece to move below the UV curing device for curing. This accelerates the solidification of the adhesive on the workpiece, thereby ensuring the strong connection between the coil and FPC. No subsequent cooling and solidification is required, further reducing the production time of the product.

[0049] Furthermore, the soldering mechanism 50 is equipped with a dust collection device 56 for absorbing the fumes generated during the soldering process. The dust collection device 56 is connected to a dust collection hood 561, which is located behind the second movable seat 54 and at the lower rear end of the soldering device 51. In this way, the dust collection device is set up to absorb the fumes generated during soldering, thereby reducing the accumulation of fumes in the soldering mechanism, avoiding safety hazards during the soldering process, and ensuring the safe use of the mechanism.

[0050] It also includes a pressing mechanism 60, which is used to press the copper plate and FPC after dispensing the glue and assembling the coil. The pressing mechanism 60 is located between the first dispensing mechanism 30 and the soldering mechanism 50. The pressing mechanism 60 includes a pressing component 61, a third mounting bracket 62, a third displacement module 63, a third moving seat 64, and a third translation device 65. The third displacement module 63 is driven and connected to the pressing component 61 and is set on the third mounting bracket 62. The third translation device 65 is driven and connected to the third moving seat 64 and is located below the pressing component 61. The third moving seat 64 is used for fixture placement and positioning. The third moving seat 64 moves to below the pressing component 61 or moves out of the pressing mechanism under the control of the third translation device 65, so that the gripping and transfer module can grip and transfer the pressed workpiece to the next mechanism. In this way, the setting of the pressing mechanism ensures the connection effect between the coil, FPC, and copper plate, thereby ensuring the stability of the subsequent soldering operation.

[0051] Furthermore, a heating device 66 is provided on the pressing component 61, and a connecting plate 67 is provided at the upper end of the pressing component 66. The heating device 66 is disposed between the pressing component 61 and the connecting plate 67. Preferably, the connecting plate 67 is a heat-insulating connecting plate. In this way, the setting of the heating device allows the coil to be heated while the pressing operation is performed, ensuring the connection effect between the FPC, the copper plate and the coil, thereby ensuring the consistent quality of the product. With the setting of the heat-insulating connecting plate, the heat of the heating device is prevented from being conducted to other objects such as the third displacement module, ensuring the stable use of the pressing mechanism.

[0052] Furthermore, a return line 70 is also provided. The return line 70 is used to remove the processed workpiece from the fixture and transport the fixture to the copper plate loading mechanism 10. The return line 70 includes a first return section 71 and a second return section 72. The first return section 71 is located to the right of the second dispensing mechanism 40, and the second return section 72 is located behind the first return section 71 and behind the bonding mechanism 20, the first dispensing mechanism 30, the soldering mechanism 50, and the second dispensing mechanism 40. One end of the second return section 72 is connected to the first return section 71, and the other end of the second return section 72 is connected to the copper plate loading mechanism 10. In this way, the need to store a certain number of fixtures after use and then move them to the copper plate loading area for assembly is eliminated, the utilization rate of the fixtures is improved, and the automation of the production line is realized, which is highly practical.

[0053] Furthermore, the first detection device 25 is provided in three parts. Among the three first detection devices 25, one first detection device 25 is located above the conveying device 22 to obtain the copper plate position information and detect whether the bonding position of the FPC and the copper plate meets the standard. Another first detection device 25 is located between the conveying device 22 and the FPC feeding device 23, and below the gripping and bonding device 24, to detect the FPC status information obtained by the gripping and bonding device. The last first detection device 25 is located above the FPC feeding device 23 to detect and obtain the FPC position information in the FPC feeding device.

[0054] The gripping and bonding device 24 includes a gripping head 241, a mounting base 242, a first driving device, and a displacement device 243. The gripping head 241 is adjustablely mounted on the mounting base 242 via an adjusting device 244. The first driving device is driven and connected to the gripping head to control the gripping head to grip the FPC. The first displacement device 243 is driven and connected to the mounting base 242 to control the gripping head to reciprocate to the conveying device 22, the first detection device 25 located between the conveying device and the FPC loading device, and the FPC loading device 23. Preferably, the adjusting device 244 is a rotating device. The device is driven by the gripper head to control its horizontal rotation and adjust the position of the FPC. The first detection device 25, the second detection device, and the third detection device are all CCD detection devices. In this way, the three first detection devices are used to identify the copper plate, the FPC, and the gripped FPC to obtain position information. The adjustment device is used to compensate for the gripping deviation before the FPC is bonded to the copper plate. The entire bonding process is fast, accurate, and automatic, which improves the bonding efficiency and quality of the FPC and the copper plate, ensures the stable and consistent quality of each product, reduces rework caused by incorrect positioning, and is highly practical.

[0055] A locking component 26 for locking the fixture position is also provided. The locking component 26 is disposed on the side of the conveying device 22 away from the FPC loading device 23. The locking component 26 includes a locking part 261 and a second driving device 262. The second driving device 262 is driven and connected to the locking part 261 to control the locking part to move toward the fixture of the conveying device and make contact with the fixture. The conveying device 22 is provided with a clearance hole 221 corresponding to the locking part. One end of the locking part 261 passes through the clearance hole 221 and contacts the fixture. Preferably, the locking component is provided with a sensing... The sensing unit (not shown in the figure) indicates whether the fixture is in place. This sensing unit is an infrared sensing unit. The locking component is designed to lock the position of the positioning fixture on the conveying device, thereby ensuring the bonding effect between the FPC and the copper plate and guaranteeing product quality consistency. Simultaneously, the sensing unit automatically senses the fixture's position and locks it with the locking component to prevent positional deviations. After bonding is complete, the locking component unlocks the fixture. The operation is simple and convenient, improving the bonding accuracy and quality between the FPC and the copper plate, and offering excellent usability.

[0056] Furthermore, the workbench is equipped with a defective product placement area and a pushing device 27. The defective product placement area is located on the right side of the conveying device 22, away from the FPC feeding device 23. The conveying device 22 is equipped with a defective product discharge port. The defective product placement area is connected to the defective product discharge port of the conveying device through a feeding plate. The pushing device is located on the other side of the conveying device and is positioned corresponding to the defective product discharge port. The pushing device includes a pushing part and a third driving device for controlling the displacement of the pushing part. When the third driving device controls the pushing part to push the substandard FPC, copper plate, and fixture to the defective product discharge port based on the information feedback from the first detection device, and then into the defective product placement area through the feeding plate, the defective products are removed from the conveying device and enter the defective product placement area, which is beneficial for the subsequent rework of the defective products and prevents them from entering subsequent processing steps.

[0057] Furthermore, an opening component 28 for opening or closing the defective product discharge port is provided at the defective product discharge port. The opening component includes a closing member and a fourth driving device for driving the closing member to move up and down. The closing member is located at the upper end of the defective product discharge port. In this way, the opening component is provided to prevent the fixture from coming into contact with the defective product discharge port during the transfer of the fixture on the conveying device, thereby affecting the transfer and use of the fixture on the conveying device and ensuring the stability of the fixture on the conveying device.

[0058] The key design feature of this utility model lies in its mechanism design. It utilizes a gripping and bonding device to grasp the FPC and move it to the fixture of the conveying device, allowing the FPC to adhere to the copper plate. Combined with the gripping and transfer module, the fixture containing the FPC and copper plate is sequentially moved to the first dispensing mechanism, the soldering mechanism, and the second dispensing mechanism. This enables assembly, dispensing, and soldering operations between the FPC, copper plate, and coil, improving production efficiency. In particular, the first detection device identifies the position of the FPC and copper plate, ensuring accurate bonding and consistent processing quality. The ingenious and reasonable structural design results in short processing time, meeting user needs and having a wide range of applications.

[0059] Secondly, the second detection device identifies and confirms the dispensing position of the FPC, copper plate, and coil, which helps the dispensing head to perform dispensing operations on the workpiece based on the feedback of the dispensing position information, improving the dispensing effect and usability. At the same time, the UV curing device accelerates the solidification of the adhesive on the workpiece, thereby ensuring the strong connection between the coil and FPC, eliminating the need for subsequent cooling and solidification, and further reducing the production time of the product. Furthermore, the third detection device determines the solder position on the workpiece, ensuring the soldering effect of the coil, thereby improving the processing quality of the product.

[0060] Furthermore, the dust extraction device is designed to absorb the fumes generated during soldering, reducing their accumulation within the soldering mechanism and thus preventing safety hazards during the soldering process. This ensures the safe operation of the mechanism. Simultaneously, the pressing mechanism ensures the connection between the coil, FPC, and copper plate, thereby guaranteeing stable subsequent soldering operations. Additionally, the heating device heats the coil while performing the pressing operation, ensuring the connection between the FPC, copper plate, and coil, and ultimately ensuring consistent and stable product quality.

[0061] Furthermore, the reflow line allows the machined workpieces to be removed from the fixture and then transported to the copper plate loading mechanism. This eliminates the need to store a certain number of fixtures after use before moving them to the copper plate loading area for assembly, thus improving the utilization rate of the fixtures and enabling the automated use of the production line. This is highly practical.

[0062] The above description is merely a preferred embodiment of the present utility model and does not constitute any limitation on the technical scope of the present utility model. Therefore, any minor modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model shall still fall within the scope of the technical solution of the present utility model.

Claims

1. An FPC bonding and soldering production line, characterized in that: It includes a copper plate feeding mechanism, a bonding mechanism, a first dispensing mechanism, a second dispensing mechanism, a soldering mechanism, and a gripping and transferring module, wherein the copper plate feeding mechanism, bonding mechanism, first dispensing mechanism, soldering mechanism, and second dispensing mechanism are arranged sequentially from left to right; The bonding mechanism includes a conveying device, an FPC feeding device, a gripping bonding device, and a first detection device. The first end and the last end of the conveying device are respectively connected to the copper plate feeding mechanism and the first dispensing mechanism. The copper plate feeding mechanism is used to feed the fixture containing the copper plate into the conveying device and move it to the gripping bonding device. The gripping bonding device is used to grip the FPC at the FPC feeding device and move the FPC to the fixture containing the copper plate on the conveying device, so that the FPC is bonded to the copper plate. The first detection device is used to detect the position of the copper plate and the FPC. The first dispensing mechanism is used to dispense adhesive onto the copper plate and FPC on the fixture. A coil placement area and a gripping assembly device are provided on one side of the first dispensing mechanism. The coil placement area is used to store coils. The gripping assembly device is used to grip and move the coils from the coil placement area to the copper plate and FPC after dispensing and assemble them. The soldering mechanism is used to solder the coils on the fixture. The second dispensing mechanism is used to dispense adhesive onto the FPC and coils on the fixture. The gripping and transfer module is used to grip the fixture and move it back and forth between the first dispensing mechanism, the second dispensing mechanism, and the soldering mechanism.

2. The FPC bonding and soldering production line according to claim 1, characterized in that: Both the first and second dispensing mechanisms include a dispensing head, a first mounting bracket, a first displacement module, a first movable seat, and a first translation device. The first displacement module is driven and connected to the dispensing head and is mounted on the first mounting bracket. The first movable seat is used for fixture placement and positioning. The first translation device is driven and connected to the first movable seat and is located below the dispensing head. The first movable seat moves to below the dispensing head or moves out of the corresponding dispensing mechanism under the control of the first translation device, so as to facilitate the gripping and transfer module to grip and transfer the dispensed workpiece to the next mechanism. The coil placement area and the gripping and assembly device are located on the side of the first movable seat of the first dispensing mechanism away from the dispensing head.

3. The FPC bonding and soldering production line according to claim 2, characterized in that: A second detection device is also provided. The second detection device is located on the side of the dispensing head and above the first movable seat. The second detection device of the first dispensing mechanism is used to detect the position of the copper plate and FPC in the fixture and determine the dispensing position of the copper plate and FPC. The second detection device of the second dispensing mechanism is used to detect the position of the FPC and coil in the fixture and determine the dispensing position of the FPC and coil.

4. The FPC bonding and soldering production line according to claim 1, characterized in that: The second dispensing mechanism is equipped with a UV curing device.

5. The FPC bonding and soldering production line according to claim 1, characterized in that: The soldering mechanism includes a soldering device, a second mounting frame, a second displacement module, a second movable seat, and a second translation device. The second displacement module is driven and connected to the soldering device and is mounted on the second mounting frame. The second movable seat is used for positioning the fixture. The second translation device is driven and connected to the second movable seat and is located below the soldering device. The second movable seat moves to below the soldering device for soldering operations or moves out of the soldering mechanism under the control of the second translation device, so that the gripping and transfer module can grip and transfer the soldered fixture to the next mechanism.

6. The FPC bonding and soldering production line according to claim 5, characterized in that: The soldering mechanism is equipped with a dust collection device for absorbing the fumes generated during the soldering process. The dust collection device is connected to a dust collection hood, which is located behind the second movable seat and at the lower rear end of the soldering mechanism.

7. The FPC bonding and soldering production line according to claim 1, characterized in that: It also includes a pressing mechanism, which is used to press the copper plate and FPC after dispensing the glue and assembling the coil. The pressing mechanism is located between the first dispensing mechanism and the soldering mechanism. The pressing mechanism includes a pressing component, a third mounting bracket, a third displacement module, a third moving seat, and a third translation device. The third displacement module is driven and connected to the pressing component and is set on the third mounting bracket. The third translation device is driven and connected to the third moving seat and is located below the pressing component. The third moving seat is used for fixture placement and positioning. The third moving seat moves to below the pressing component or moves out of the pressing mechanism under the control of the third translation device, so as to facilitate the gripping and transfer module to grip and transfer the pressed workpiece to the next mechanism.

8. The FPC bonding and soldering production line according to claim 7, characterized in that: The pressing component is equipped with a heating device.

9. The FPC bonding and soldering production line according to claim 8, characterized in that: A connecting plate is provided at the upper end of the pressing component, and the heating device is disposed between the pressing component and the connecting plate.

10. The FPC bonding and soldering production line according to claim 1, characterized in that: A return line is also provided, which is used to remove the processed workpiece from the fixture and transport the fixture to the copper plate loading mechanism. The return line includes a first return section and a second return section. The first return section is located to the right of the second dispensing mechanism, and the second return section is located behind the first return section and behind the bonding mechanism, the first dispensing mechanism, the soldering mechanism, and the second dispensing mechanism. One end of the second return section is connected to the first return section, and the other end of the second return section is connected to the copper plate loading mechanism.

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