A vehicle-mounted domain controller

Abstract

The utility model relates to a kind of vehicle-mounted field controllers, including the metal middle frame of the main body shell that constitutes separate first cavity and second cavity, the cooling fan of being fixed in the metal middle frame outer surface and being located first cavity, the core circuit board and main circuit board of being sealed and contained in second cavity, the top cover and bottom cover respectively covering the top and bottom of metal middle frame, the metal middle frame side wall is equipped with the vent hole of intercommunication first cavity and external environment and the heat dissipation fin of being convex to the metal middle frame outer surface, the independent air duct formed by vent hole, heat dissipation fin and cooling fan is formed in the first cavity, and the air duct and second cavity airflow are physically isolated.The utility model provides a kind of vehicle-mounted field controller architecture with improved heat dissipation efficiency, optimized space utilization and enhanced reliability.

Description

Technical Field

[0001] This utility model relates to automotive electronic control equipment, and more particularly to a structural design of an in-vehicle domain controller for a smart cockpit system. Background Technology

[0002] In existing automotive domain controller architectures, the cooling system and circuit board are typically housed in the same spatial environment. A typical design integrates the cooling fan within a metal casing, placing it adjacent to the core circuit board and main circuit board. This architecture has the following limitations in practical applications: 1. Limitations on heat dissipation efficiency: The airflow generated by the cooling fan needs to flow through the circuit board area, and electronic components will obstruct the airflow, resulting in a low actual effective airflow utilization rate. 2. Insufficient space utilization: To accommodate the cooling fan, the circuit board often needs to have a U-shaped clearance notch, which reduces the utilization rate of the effective wiring area of ​​the circuit board; 3. Environmental protection challenges: The heat dissipation and ventilation holes are directly connected to the circuit board housing space, which increases the risk of external dust or moisture entering through the ventilation holes and also puts forward higher requirements for the design of electromagnetic compatibility performance. 4. Limited flexibility for expansion: The size of the ventilation holes is usually small due to the need to take into account the electromagnetic shielding effectiveness, which limits the optimization potential of the heat dissipation airflow.

[0003] These factors collectively affect the heat dissipation stability and long-term reliability of the vehicle domain controller in harsh environments. Utility Model Content

[0004] In view of this, the present invention provides an in-vehicle domain controller architecture that improves heat dissipation efficiency, optimizes space utilization, and enhances reliability.

[0005] The objective of this utility model is achieved through the following technical solution: An on-board domain controller, comprising: The metal frame forms the main outer shell that separates the first and second cavities; A cooling fan is fixed to the outer surface of the metal frame and located in the first cavity; The core circuit board and the main circuit board are sealed and housed in the second cavity; The top and bottom covers the top and bottom of the metal frame, respectively. The metal frame sidewall is provided with ventilation holes connecting the first cavity to the external environment and heat dissipation fins protruding from the outer surface of the metal frame. An independent air duct consisting of ventilation holes, heat dissipation fins and a cooling fan is formed in the first cavity. The air duct is physically isolated from the airflow of the second cavity and conducts heat only through the heat dissipation boss.

[0006] By dividing the metal frame into independent first chambers (airflow zone) and second chambers (circuit board housing area), physical isolation of airflow between the heat dissipation system and electronic components is achieved. The cooling fan is externally located in the first chamber, forming a dedicated airflow channel with side wall ventilation holes and protruding heat sink fins. Airflow does not need to pass through the circuit board area, significantly reducing wind resistance loss. The second chamber provides sealed housing for the core circuit board and main circuit board, preventing external dust and moisture from intruding through ventilation holes, while simultaneously improving electromagnetic compatibility performance. The double coverage of the top and bottom covers enhances structural sealing, completely decoupling the heat dissipation airflow channel from the circuit board space, achieving both reduced overall size and high heat dissipation efficiency and reliability. The metal frame, as the main outer shell, serves both mechanical support and thermal management functions, and its integrated design reduces assembly complexity. This architecture fundamentally overcomes the systemic defects of traditional solutions, such as low airflow utilization, weak EMC shielding, and insufficient dust resistance, providing a scalable foundation for high-power chip heat dissipation.

[0007] Preferably, the metal frame has a heat dissipation protrusion facing the inner wall of the second cavity. The heat dissipation protrusion is integrally formed with the heat dissipation fins and is directly opposite the heat source area of ​​the core circuit board or the main circuit board.

[0008] The integrated design of the heat dissipation bumps and fins eliminates interfacial thermal resistance and improves thermal conductivity. The bumps directly face the heat source areas of the circuit board, forming a directional heat dissipation path to ensure heat is quickly transferred from the chip source to the external fins. The bump structure on the inner wall of the metal frame avoids the need for additional heat dissipation components, simplifying the manufacturing process. The directional thermal design adapts to different power chip layouts, enhancing architectural compatibility.

[0009] Preferably, the outer surface of the metal frame is provided with a fan mounting groove, in which the cooling fan is embedded and positioned by a limiting bone.

[0010] The fan mounting slot and the limiting rib work together to achieve precise positioning and mechanical fixation of the cooling fan, preventing connection failures caused by vibration and displacement. The recessed structure reduces the fan's protrusion height, helping to control the overall thickness of the device. External surface mounting does not encroach on circuit board space, providing space for high-density wiring. The slot structure guides airflow in a directional manner, reducing turbulence losses.

[0011] Preferably, the core circuit board and the main circuit board are stacked together and electrically interconnected through a board-to-board connector.

[0012] The stacked architecture optimizes vertical space utilization and reduces device planar size. Board-to-board connectors enable high-density signal transmission between two circuit boards, replacing traditional wire harness connections and reducing the risk of impedance interference. The compact stacked layout enhances the spatial sealing of the second cavity, allowing for more design margin for heat dissipation airflow.

[0013] Preferably, it also includes an adapter circuit board, which is located above the main circuit board and connected to the main circuit board via a board-to-board connector.

[0014] The layered design of the adapter circuit board physically separates low-speed signal connectors from high-speed chips, reducing electromagnetic crosstalk. The upper-layer adapter board handles the interface functions of the main circuit board, allowing the main circuit board to focus on high-power chip placement. The modular architecture enhances hardware configuration flexibility, facilitating adaptation to the functional requirements of different vehicle models.

[0015] Preferably, the ventilation holes are irregularly shaped holes, including fan-shaped holes and / or elongated holes.

[0016] The irregularly shaped perforation design breaks through the area limitations of traditional circular perforations, providing a larger ventilation cross-sectional area with the same sidewall area. Fan-shaped perforations expand the air intake area, while elongated perforations extend the airflow path, synergistically improving the convection efficiency of the heat dissipation duct. The asymmetrical perforation structure can be customized according to the fluid dynamics characteristics of the duct, optimizing the uniformity of airflow distribution.

[0017] Preferably, the space between the heat dissipation boss and the heat source is filled with a thermally conductive interface material.

[0018] The thermally conductive interface material fills the microscopic gaps between the chip and the heat dissipation bump, eliminating the air insulation layer and significantly reducing contact thermal resistance. The material's plasticity adapts to surface unevenness, ensuring uniform heat dissipation across the entire heat dissipation bump. This filler layer buffers thermal expansion stress, protecting the reliability of the chip's soldered structure.

[0019] Preferably, a metal bracket is provided between the core circuit board and the metal frame, and the metal bracket is screwed to the metal frame.

[0020] The metal bracket provides mechanical support between the circuit board and the mid-frame, preventing board deformation and damage to components. The screw-on fixing method facilitates disassembly and maintenance, and the bracket's grounding design enhances electromagnetic shielding effectiveness. The suspended mounting structure prevents the circuit board from directly contacting the mid-frame, reducing the impact of heat conduction on low-temperature components.

[0021] Preferably, the adapter circuit board is equipped with a low-speed signal connector, and the main circuit board or core circuit board is equipped with a system-in-package chip and a high-speed signal connector.

[0022] The hierarchical layout of signal connectors isolates vulnerable low-speed signals (such as power and CAN bus) to the adapter board, while high-speed signals (such as video bus) are directly connected to the main chip, reducing the risk of signal attenuation. Centralized placement of system-in-package (SoC) chips shortens high-speed trace distances and improves signal integrity. Physical separation design simplifies wiring complexity.

[0023] Preferably, the heat dissipation boss is detachably connected to an auxiliary heat dissipation component, which is any one or a combination of the following: heat pipe, vapor chamber, or thermoelectric cooler.

[0024] The detachable interface enables modular upgrades to the cooling system. The basic model only requires natural heat dissipation through the metal frame, while the high-performance model can be equipped with heat pipes or vapor chambers to enhance heat conduction. For extreme conditions, a semiconductor cooling chip can be added for active temperature control. This design allows the same hardware platform to be adapted to chips with different thermal power consumption, reducing redundant R&D investment. Plug-and-play components simplify the maintenance process.

[0025] The advantages of this utility model compared to the prior art are: This utility model's vehicle-mounted domain controller provides the following technical improvements by reconfiguring the internal spatial layout of the domain controller: 1. Physical isolation of airflow between heat dissipation and circuit space: The independent air duct cavity (first cavity) formed by the metal frame and the circuit board housing cavity (second cavity) allow the heat dissipation airflow to not pass through dense areas of electronic components, which helps to reduce airflow energy loss; the ventilation holes and heat dissipation fins are specially arranged in the air duct cavity, and the irregular hole design can improve the ventilation efficiency per unit area, creating conditions for optimizing heat dissipation airflow.

[0026] 2. Ensuring the integrity of circuit board space: The cooling fan is placed on the surface of the metal frame, avoiding the need for U-shaped notches on the circuit board in traditional solutions, so that the core circuit board and the main circuit board can obtain a complete and usable wiring area; the dual circuit board stacked architecture combined with the sealed cavity design is conducive to achieving a compact layout of the equipment in the horizontal direction.

[0027] 3. Enhanced environmental tolerance: The second cavity forms a continuous closed structure with the top cover, bottom cover and metal frame, reducing the possibility of dust and moisture intruding into the circuit board area; the airflow physical isolation design frees the ventilation hole size from electromagnetic compatibility constraints, which can improve the overall electromagnetic shielding effectiveness.

[0028] 4. Platform-based expansion capability: The heat dissipation boss is integrally molded into the inner wall of the metal frame, and with the detachable heat dissipation component interface, it is easy to adapt to the heat dissipation requirements of chips with different thermal power consumption; the layered architecture of the adapter circuit board supports the flexible configuration of interface function modules, providing an implementation foundation for multi-vehicle platform applications. Attached Figure Description

[0029] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 This is an exploded view of the vehicle-mounted domain controller of Embodiment 1 of this utility model.

[0031] Figure 2This is a structural diagram of the vehicle-mounted domain controller of Embodiment 1 of this utility model.

[0032] Figure 3 This is a structural diagram of the vehicle-mounted domain controller in Embodiment 1 of this utility model.

[0033] Figure 4 This is a top view of the main structure of the vehicle-mounted domain controller in Embodiment 1 of this utility model.

[0034] Figure 5 for Figure 4 A cross-sectional view of region A in the middle.

[0035] Figure 6 This is a structural diagram of the two circuit boards of the vehicle domain controller in Embodiment 1 of this utility model.

[0036] Figure 7 This is a plan view of the metal frame of the vehicle domain controller according to Embodiment 1 of this utility model.

[0037] Figure 8 This is a three-dimensional structural diagram of the metal frame of the vehicle-mounted domain controller according to Embodiment 1 of this utility model.

[0038] Figure 9 This is a three-dimensional structural view of the metal frame of the vehicle domain controller in Embodiment 1 of this utility model from another perspective.

[0039] Figure 10 This is an exploded view of the vehicle-mounted domain controller of Embodiment 2 of this utility model.

[0040] Figure 11 This is a perspective view of the vehicle-mounted domain controller of Embodiment 2 of this utility model.

[0041] Figure 12 This is a schematic diagram of the architecture of the two circuit boards of the vehicle domain controller in Embodiment 2 of this utility model.

[0042] Figure 13 This is a schematic diagram of the two circuit boards of the vehicle domain controller in Embodiment 2 of this utility model from another perspective.

[0043] Figure 14 This is a three-dimensional structural diagram of the metal frame of the vehicle-mounted domain controller according to Embodiment 2 of this utility model.

[0044] Figure 15 This is a top view of the vehicle-mounted domain controller of Embodiment 2 of this utility model.

[0045] Figure 16 for Figure 15 Sectional view of region B in the middle.

[0046] Figure 17 This is a plan view of the metal frame of the vehicle-mounted domain controller according to Embodiment 2 of this utility model.

[0047] Figure 18 This is a three-dimensional structural diagram of the metal frame of the vehicle-mounted domain controller according to Embodiment 2 of this utility model.

[0048] Figure 19 This is a three-dimensional structural view of the metal frame of the vehicle domain controller in Embodiment 2 of this utility model from another perspective.

[0049] The labeling is explained as follows: Example 1: 10 Heat dissipation base plate, 11 Heat dissipation boss, 12 Heat dissipation fins, 20 Rear base plate, 30 Front base plate, 31 Screw post, 32 Screw post, 40 Fan base plate, 41 Fan mounting slot, 42 Limiting rib, 50 Right side plate, 51 Ventilation hole, 60 Left side plate, 61 Ventilation hole, 100 Metal frame, 130 Fan-shaped ventilation hole, 140 Rectangular ventilation hole, 200 Cooling fan, 300 Top cover, 400 Thermal interface material, 500 Core circuit board, 510 System-in-Package (SIP) chip, 520 Board-to-board BTB connector female, 530 External connector, 600 Metal bracket, 700 Main circuit board, 710 Board-to-board BTB connector male, 720 External connector, 750 Onboard antenna, 760 Onboard antenna, 770 Onboard antenna, 800 Bottom cover, 900 Screws.

[0050] Example 2: 10 Heat dissipation base plate, 11 Heat dissipation boss, 12 Heat dissipation fins, 20 Rear base plate, 30 Front base plate, 31 Screw post, 32 Screw post, 40 Fan base plate, 41 Fan mounting slot, 42 Limiting rib, 50 Right side plate, 51 Ventilation hole, 60 Left side plate, 61 Ventilation hole, 100 Metal frame, 200 Heat dissipation fan, 300 Top cover, 400 Thermal interface material, 500 Core circuit board, 600 Metal bracket, 700 Main circuit board, 710 System-in-Package (SIP) chip, 720 Board-to-board BTB connector male, 730 External connector, 750 Onboard antenna, 760 Onboard antenna, 770 Onboard antenna, 800 Bottom cover, 900 Screws, 410 Board-to-board BTB connector female, 420 External connector. Detailed Implementation

[0051] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0052] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0053] It should be noted that similar reference numerals and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. In the description of the embodiments of this application, it should be understood that the terms "upper," "lower," "left," "right," "vertical," "horizontal," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the figures, or the orientation or positional relationship commonly used when the product of this application is in use, or the orientation or positional relationship commonly understood by those skilled in the art. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0054] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0055] The technical solutions in this application will now be described with reference to the accompanying drawings. Example 1

[0056] An innovative architecture for an in-vehicle domain controller is mainly composed of the following components: metal frame 100, cooling fan 200, top cover 300, thermal interface material 400, core circuit board 500, metal bracket 600, main circuit board 700, bottom cover 800, and screws 900.

[0057] An innovative architecture for an in-vehicle domain controller, the main assembly process of which includes the following: (1) Assemble the cooling fan 200 onto the metal frame 100. It can be fixed to the metal frame with screws, or it can be pre-fixed to the metal frame by snap-fitting, or it can simply be placed on the metal frame. After the top cover 300 is assembled, use the local protrusion feature of the top cover to press the cooling fan onto the metal frame. (2) Assemble the top cover 300 onto the metal frame 100, which can be fixed to the metal frame with screws; (3) The thermal interface material 400 provides a heat conduction channel from the heat source SOC to the metal frame 100. The thermal interface material can be pre-coated onto the heat dissipation protrusion of the metal frame or pre-coated onto the surface of the heat source chip on the core circuit board 500. (4) Assemble the core circuit board 500 onto the metal frame 100. It can be fixed to the metal frame with screws. After the core circuit board is assembled and fixed onto the metal frame, the thermal interface material fills the gap between the heat dissipation protrusion and the heat source on the metal frame and remains in the form between the heat dissipation protrusion and the heat source under assembly pressure. (5) Assemble the metal bracket 600 onto the core circuit board 500, and fix it to the metal frame with screws; (6) Assemble the main circuit board 700 onto the metal frame 100; (7) Connect the wires on the cooling fan 200 to the main circuit board 700 to achieve electrical connection; (8) Assemble the bottom cover 800 onto the metal frame 100; (9) Pass screw 900 through the bottom cover and the main circuit board to simultaneously fix the bottom cover and the main circuit board to the metal frame.

[0058] Among the various components constituting the domain controller, the metal frame 100 is the main structure, and all other components are directly or indirectly fixed to the metal frame. The metal frame protects the two circuit boards and also dissipates heat from the heat source. The cooling fan 200 provides active air cooling for the domain controller through forced convection heat transfer. The top cover 300 notches above the metal frame and guides airflow, forming an air duct together with the ventilation holes and heat dissipation fins on the metal frame. The thermal interface material 400 fills the gaps between the heat source and the heat dissipation protrusions on the metal frame, filling microscopic gaps, reducing contact thermal resistance, dissipating heat evenly, and preventing localized overheating. The core circuit board 500 and the main circuit board 700 are the carriers for the domain controller to implement various functions, with various chips and electronic components arranged on the circuit boards to achieve these functions. The metal bracket 600 supports the circuit boards and also provides shielding and grounding for them. The bottom cover 800 protects the two internal circuit boards. The screws 900 secure the bottom cover and the circuit boards.

[0059] Unlike traditional automotive domain controller architectures, the new domain controller architecture no longer embeds the cooling fan between two circuit boards. Instead, the cooling fan is externally mounted on the metal frame, above the core circuit board. This novel architectural layout completely solves the problems described in the background technology description. Since the cooling fan 200 is externally mounted on the metal frame 100, the ventilation holes on the metal frame near the fan and near the heatsink fins, along with the heatsink fins, are all located outside the metal frame. These ventilation holes do not connect with the two circuit boards embedded within the metal frame. This innovative layout, externalizing the cooling fan within the metal frame, allows the cooling fan, its associated ventilation holes and airflow to be distributed in independent spaces from the two circuit boards. This decoupling of system cooling and EMC (electromagnetic compatibility) is achieved through this architectural layout. The benefits include maximum flexibility in the size of the ventilation holes, freed from EMC constraints; and the airflow within the domain controller is no longer obstructed by electronic components on the two circuit boards, preventing airflow loss.

[0060] The size of ventilation holes has been significantly improved. Traditionally, to ensure EMC (electromagnetic compatibility) performance, they were limited to circular or polygonal shapes, with dimensions restricted to around 3 mm. The new design allows for various shapes and larger sizes. For example, the fan-shaped ventilation hole 130 can have each fan segment increased to approximately 10 mm. The narrow rectangular ventilation hole 140 on the left side has a width of approximately 4 mm, corresponding to the spacing between the heatsink fins, and a length that can be increased to approximately 20 mm. These fan-shaped and rectangular ventilation holes are just examples; more variations and larger sizes are possible depending on actual needs. This greater flexibility in shape and size design increases the effective ventilation area and the effective airflow into the system when the cooling fan is operating. The low system impedance of the cooling fan within the domain controller further enhances its effectiveness, typically achieving around 90% of its maximum airflow. In this way, while ensuring the heat dissipation performance remains unchanged, the maximum airflow of the cooling fan can be smaller, allowing for the selection of a smaller cooling fan, which is beneficial for reducing the size or envelope volume of the domain controller; while maintaining the airflow of a traditional cooling fan will result in better heat dissipation performance than a traditional domain controller.

[0061] The heat dissipation fins 12, along with the fan-shaped ventilation holes 130 and the rectangular ventilation holes 140, constitute the airflow structure when the cooling fan is working.

[0062] To more clearly present the new domain controller architecture, a cross-sectional diagram of the domain controller architecture is created to clearly show its architectural layout. In the cross-sectional view, we can see its internal structure. The core circuit board 500 and the main circuit board 700 are arranged in a top-to-bottom layout and are embedded in the metal frame 100. The metal frame 100 is the main shell of the entire vehicle domain controller architecture. The cooling fan 200 is located outside the metal frame. The top cover 300 is located above the metal frame, and the bottom cover 800 is located below the metal frame. Inside the metal frame 100, in response to the heat source, there is a heat dissipation boss 11. Above the heat dissipation boss are several outwardly protruding heat dissipation fins 12. The heat dissipation boss and the heat dissipation fins are integrated to ensure efficient heat conduction. At the same time, the ventilation holes 130 on the right side and 140 on the left side of the metal frame provide unobstructed heat exchange between the cooling fan and the cooler air outside the domain controller and the warmer air inside, ensuring that hot air is exhausted from inside the domain controller to the outside and cool air is entered from outside the domain controller to the inside.

[0063] Compared to traditional domain controller architectures, the new architecture fundamentally changes the design by moving the cooling fan from an embedded to an external position—that is, from inside the metal frame to the outside—located above the core circuit board. This new architecture decouples the cooling function from the system, allowing for greater flexibility in the design of ventilation holes and airflow channels, thus fundamentally improving heat dissipation performance and EMC (electromagnetic compatibility) performance. Furthermore, because the two circuit boards are spatially enclosed by the metal frame and bottom cover, and the ventilation holes on the metal frame do not connect to the two circuit boards, the risk of moisture, dust, and other foreign objects intruding into the circuit board area inside the metal frame is greatly reduced. Therefore, the new domain controller architecture offers better protection and reliability.

[0064] The cooling fan 200 is mounted on top of the core circuit board 500. This layout allows the cooling fan to be placed outside the metal frame without taking up space on the two circuit boards. This eliminates the U-shaped gap between the two circuit boards (after filling the gap), and the overall size of the two circuit boards can be reduced, thereby reducing the overall size of the domain controller.

[0065] The innovative domain controller architecture allows for the use of smaller cooling fans, reducing fan costs. Simultaneously, the area of ​​the two circuit boards is effectively utilized, reducing form factor and clearance, further lowering their cost. The overall smaller form factor of the domain controller also reduces the size and weight of the metal frame, further decreasing its cost. Therefore, the innovative domain controller architecture results in lower hardware costs.

[0066] The architecture of the two circuit boards is further elaborated below: The core circuit board 500 has a system-in-package (SiP) chip 510 mounted on it; the board-to-board BTB connector female 520 is located below the core circuit board, so the BTB connector female is usually placed on the core board; the external connector 530 usually places the connector that needs to transmit high-speed signals on the core circuit board, that is, the high-speed connector is usually placed on the same circuit board as the SiP chip.

[0067] The main circuit board 700 has a board-to-board BTB connector male 710 attached to it. 710 and 520 provide the electrical connection between the core circuit board and the main circuit board. External connectors 720, typically power connectors and connectors for transmitting low-speed signals, are also located on the main circuit board. Additionally, several onboard antennas 750, 760, and 770 are attached to the main circuit board, providing functions such as Wi-Fi antennas and BitTorrent antennas.

[0068] The following further elaborates on the description of the metal frame of the innovative vehicle domain controller architecture. The metal frame 100 is the main shell of the entire domain controller, playing a role in realizing multiple functions: first, to support and fix the two circuit boards; second, to connect and fix the top cover and bottom cover; third, to dissipate heat from the heat sources on the two circuit boards; and fourth, to protect the ICs, electronic components, and electronic circuits on the two circuit boards from moisture, dust, and other foreign objects.

[0069] The metal frame has a recessed structure inside, which can be roughly divided into two areas: area L1 is used to place the core circuit board; area L2 is used to place the main circuit board.

[0070] The internal structure of the metal frame includes: A heat dissipation base plate 10 is attached to a heat dissipation protrusion 11 and external heat dissipation fins 12. The rear base plate 20 has several screw posts attached to it. The front base plate 30 has several screw posts 31 and 32 attached to it. The fan base plate 40 has a fan mounting slot 41 on its outside for accommodating the cooling fan, and a limiting rib 42 for positioning the cooling fan. The right side panel 50 has ventilation holes 51 attached to it. The left side panel 60 has ventilation holes 61 attached to it.

[0071] The right ventilation hole 51, heat dissipation fins 12, and left ventilation hole 61 together form an air duct, which allows the airflow generated by the cooling fan to carry away heat in the air duct, achieving efficient heat dissipation.

[0072] Furthermore, this patent proposes an innovative vehicle-mounted domain controller architecture with excellent compatibility and scalability. Its key feature is the innovative construction of a system architecture compatible with high, medium, and low configurations, which can be replicated and expanded for application on different platforms and projects. Compared to traditional host architecture solutions, the vehicle-mounted domain controller proposed in this patent is superior in performance, cost, reliability, size, weight, and heat dissipation. The structural design uses a metal frame as the main housing. Depending on the thermal design power (TDP) of the selected main chip (SOC, System on Chip) for different domain controllers (low, medium, high heat generation), the die-cast metal frame (made of aluminum or magnesium alloy) itself possesses the heat dissipation capability to handle lower TDP. When higher-intensity heat dissipation of the SOC is required, a fan (FAN) is embedded in the metal frame to achieve active air cooling. When heat dissipation of the high heat generation of the SOC is required, a fan (FAN) is embedded in the metal frame. At the same time, heat pipes, vapor chambers, folded fin heat sinks, and thermoelectric coolers (TECs) are also embedded in the metal frame to achieve efficient heat conduction of the SOC, thus realizing a thermal solution that combines efficient heat conduction with active air cooling. Example 2

[0073] An innovative architecture for an in-vehicle domain controller is proposed, which is mainly composed of a metal frame 100, a cooling fan 200, a top cover 300, a core circuit board 500, a metal bracket 600, a thermal interface material 400, a main circuit board 700, a bottom cover 800, screws 900, and other components.

[0074] An innovative architecture for an in-vehicle domain controller, the main assembly process of which includes the following: (1) Assemble the cooling fan 200 onto the metal frame 100. It can be fixed to the metal frame 100 with screws 900, or it can be pre-fixed to the metal frame 100 by snap-fitting, or it can simply be placed on the metal frame 100. After the top cover 300 is assembled, use the local protrusion feature of the top cover 300 to press the cooling fan 200 onto the metal frame 100. (2) Assemble the top cover 300 onto the metal frame 100, which can be fixed to the metal frame 100 with screws 900; (3) Assemble the core circuit board 500 onto the metal frame 100, which can be fixed to the metal frame 100 with screws 900; (4) Assemble the metal bracket 600 onto the core circuit board 500, and fix it to the metal frame 100 with screws 900; (5) The thermal interface material 400 provides a heat conduction channel from the heat source SOC to the metal frame 100. The thermal interface material 400 is pre-coated onto the heat source surface of the main circuit board 700 or the top of the heat dissipation boss 11 of the metal frame. (6) After the main circuit board 700 is assembled, the heat dissipation boss 11 is directly pressed with the heat source of the main circuit board through the clearance area of ​​the core circuit board 500, and the thermal interface material 400 fills the gap and remains in the form between the heat dissipation boss and the heat source under the assembly pressure. (7) Assemble the bottom cover 800 onto the metal frame 100; (8) Pass the screw 900 through the bottom cover 800 and the main circuit board 700 to simultaneously fix the bottom cover 800 and the main circuit board 700 to the metal frame 100.

[0075] The heat dissipation boss 11 protrudes upward through the clearance area of ​​the core circuit board 500, and its top surface directly contacts the bottom surface of the SIP chip 710 of the main circuit board 700. An assembly clearance is maintained between the clearance edge of the core circuit board and the sidewall of the heat dissipation boss to avoid mechanical interference.

[0076] To illustrate the architecture of the vehicle domain controller in Embodiment 2 in more detail, the architecture of the two circuit boards is first introduced. The core circuit board 500 adopts a partial clearance design, with clearance holes (not labeled in the figure) opened in the area corresponding to the heat dissipation boss 11 of the metal frame. The remaining part is arranged with board-to-board (BTB) connector female 410 (since this connector is located below the core circuit board 500, the BTB female is usually arranged on the core circuit board 500); and external connectors 420 are arranged (usually connectors that need to transmit low-speed signals are arranged on the core circuit board 500). The core circuit board 500 and the main circuit board 700 form a hierarchical structure with one above the other in the layout. The clearance design ensures that the heat dissipation boss 11 can directly access the heat source area of ​​the main circuit board 700, and is spatially located at the rear end of the main circuit board 700.

[0077] The main circuit board 700 has a system-in-package (SIP) chip 710 attached to it; a board-to-board (BTB) connector male 720, 720 and 410 realize the electrical connection between the core circuit board 500 and the main circuit board 700; an external connector 730, since the SIP chip is located on the main circuit board 700, the connector that usually needs to transmit high-speed signals is also located on the main circuit board 700, that is, the high-speed connector is usually placed on the same circuit board as the SIP chip.

[0078] In addition, several onboard antennas 750, 760, and 770 are integrated / arranged on the main circuit board 700 to enable wireless communication functions such as WiFi and Bluetooth (BT).

[0079] Based on the change in the architecture of the two circuit boards, the corresponding metal frame 100, cooling fan 200, etc., will also be adjusted accordingly. The cooling fan 200 is mounted above the main circuit board 700. This layout allows the cooling fan 200 to be placed outside the metal frame 100, and it does not occupy the space of the two circuit boards in terms of spatial structure. In this way, the U-shaped gap between the two circuit boards can be eliminated (after filling the gap), and the external dimensions of the two circuit boards can be appropriately reduced, thereby reducing the overall size of the domain controller. In terms of the layout of the cooling fan 200, compared with the first domain controller architecture, it is moved from being mounted above the core circuit board 500 to being mounted above the main circuit board 700. By optimizing the circuit board stacking layout, the overall height can be reduced, further reducing the size of the entire domain controller in terms of height. Compared with the domain controller architecture of Example 1, the spatial layout is more compact.

[0080] The innovative domain controller architecture allows for the use of a smaller cooling fan 200, reducing the cost of the cooling fan 200. Simultaneously, the area of ​​the two circuit boards is effectively utilized, reducing their size and clearance, further lowering their cost. With the overall domain controller size reduced, the metal frame 100 also becomes smaller and lighter, further reducing its cost. Therefore, this second innovative domain controller architecture also offers lower hardware costs.

[0081] Based on the spatial relationship between the two circuit boards and the arrangement of the SIP chip on the main circuit board 700, unlike the traditional automotive domain controller architecture, the second innovative domain controller architecture no longer embeds the cooling fan 200 between the two circuit boards. Instead, the cooling fan 200 is externally placed outside the metal frame 100, above the main circuit board 700. This novel architectural layout completely solves the problems described in the background technology: (1) Since the cooling fan 200 is externally mounted on the metal frame 100, in terms of airflow design, the ventilation holes on the metal frame 100 near the fan and the ventilation holes on the metal frame 100 near the heat sink fins are all located outside the metal frame 100. The ventilation holes on both sides will not be connected to the two circuit boards embedded inside the metal frame 100. This innovative architectural layout of externally mounting the cooling fan 200 on the metal frame 100 makes the cooling fan 200 and the ventilation holes and airflow of the cooling fan 200 and the two circuit boards distributed in independent spaces. From the architectural layout, the decoupling of system heat dissipation and system EMC electromagnetic compatibility is achieved. The benefit is that the size of the ventilation holes on both sides has the greatest flexibility and is no longer constrained by the system EMC electromagnetic compatibility. When the cooling fan 200 is working, the airflow in the domain controller is no longer blocked by the electronic components on the two circuit boards and loses airflow.

[0082] The size of ventilation holes has changed dramatically. Traditionally, to ensure EMC (electromagnetic compatibility) performance, they could only be designed as circular or polygonal shapes, limited to about 3 millimeters in size. The new design allows for various shapes and larger sizes. For example, the right-hand fan-shaped ventilation hole 130 can have each fan section increased to about 10 millimeters. The left-hand narrow rectangular ventilation hole 140 has a width of about 4 millimeters, corresponding to the spacing between the heatsink fins, and a length of about 20 millimeters. These fan-shaped and rectangular ventilation holes are just examples; more variations are possible depending on actual needs, and the sizes can be designed to be larger to meet specific requirements, resulting in more efficient ventilation. The flexible shape and size design increases the effective ventilation area, which in turn increases the effective airflow into the system when the cooling fan 200 is working. The system impedance of the cooling fan 200 when operating in the domain controller is very small, which greatly increases the effective airflow of the cooling fan 200, generally reaching about 90% of the maximum airflow. Thus, while ensuring the heat dissipation performance remains unchanged, the maximum airflow of the cooling fan 200 can be smaller, allowing for the selection of a smaller cooling fan 200, which is beneficial for reducing the size or envelope volume of the domain controller. If the airflow of the traditional cooling fan 200 is maintained, the heat dissipation performance will be better than that of a traditional domain controller.

[0083] The domain controller in Example 2 is similar in design to the metal frame 100 in the first example in terms of structural scheme. The metal frame 100 is the main shell of the entire domain controller and plays a role in realizing multiple functions: first, to support and fix the two circuit boards; second, to connect and fix the top cover 300 and the bottom cover 800; third, to dissipate heat from the heat sources on the two circuit boards; and fourth, to protect the ICs, electronic components, and electronic circuits on the two circuit boards from moisture, dust, and other foreign objects.

[0084] The interior of the metal frame 100 has an inwardly concave structure, which can be roughly divided into two areas: area L1 is used to place the core circuit board 500; area L2 is used to place the main circuit board 700.

[0085] The internal structure of the metal frame 100 includes a heat dissipation base plate 10; heat dissipation bosses 11 are attached to the heat dissipation base plate 10, and heat dissipation fins 12 are attached to the outside; a rear base plate 20, on which several screw posts are attached; a front base plate 30, on which several screw posts 31 and 32 are attached; a fan base plate 40, on which a fan mounting groove 41 is located for accommodating a cooling fan 200, and a limiting rib 42 is located for positioning the cooling fan 200; a right side plate 50, on which ventilation holes 51 are attached; and a left side plate 60, on which ventilation holes 61 are attached.

[0086] The right ventilation hole 51 and heat dissipation fins 12, and the left ventilation hole 61 together form an air duct, which allows the airflow generated by the cooling fan 200 to carry away heat in the air duct, achieving efficient heat dissipation.

[0087] Furthermore, this patent proposes an innovative vehicle-mounted domain controller architecture with excellent compatibility and scalability. Its key feature is the innovative construction of a host system architecture compatible with high, medium, and low configurations. It is replicable and expandable for application on different platforms and projects. Compared to traditional host architecture solutions, the vehicle-mounted domain controller proposed in this patent is superior in performance, cost, reliability, size, weight, and heat dissipation. The structural design uses a metal frame 100 as the main housing. Depending on the thermal design power (TDP) of the selected main chip (SOC, System on Chip) for different domain controllers (low, medium, high heat generation), the die-cast metal frame (made of aluminum or magnesium alloy) itself possesses the heat dissipation capability to handle lower TDP. When higher-intensity heat dissipation of the SOC is required, a fan (FAN) can be embedded in the metal frame 100 as the main body to achieve active air cooling. When heat dissipation of the high heat generation of the SOC is required, a fan (FAN) can be embedded in the metal frame 100 as the main body. At the same time, heat pipes, vapor chambers, folded fin heat sinks, and thermoelectric coolers (TECs) are also embedded in the SOC and the metal frame 100 to achieve efficient heat conduction of the SOC, thus realizing a thermal solution that combines efficient heat conduction with active air cooling.

[0088] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A vehicle-mounted domain controller, characterized in that, include: The metal frame (100) forms the main outer shell that separates the independent first cavity and the second cavity; A cooling fan (200) is fixed to the outer surface of the metal frame (100) and located in the first cavity; The core circuit board (500) and the main circuit board (700) are sealed and housed in the second cavity; The top cover (300) and the bottom cover (800) respectively cover the top and bottom of the metal frame (100); The sidewall of the metal frame (100) is provided with ventilation holes (130, 140) connecting the first cavity to the external environment and heat dissipation fins (12) protruding from the outer surface of the metal frame (100); an independent air duct consisting of ventilation holes (130, 140), heat dissipation fins (12) and heat dissipation fan (200) is formed in the first cavity, and the air duct is physically isolated from the airflow of the second cavity.

2. The vehicle-mounted domain controller according to claim 1, characterized in that, The metal frame (100) has a heat dissipation boss (11) facing the inner wall of the second cavity. The heat dissipation boss (11) is integrally formed with the heat dissipation fins (12) and is directly opposite the heat source area of ​​the core circuit board (500) or the main circuit board (700).

3. The vehicle-mounted domain controller according to claim 1, characterized in that, The outer surface of the metal frame (100) is provided with a fan mounting groove (41), and the cooling fan (200) is embedded in the mounting groove (41) and positioned by a limiting bone (42).

4. The vehicle-mounted domain controller according to claim 1, characterized in that, The core circuit board (500) and the main circuit board (700) are stacked together and electrically interconnected through board-to-board connectors (520, 710).

5. The vehicle domain controller according to claim 4, characterized in that, It also includes an adapter circuit board, which is located above the main circuit board (700) and connected to the main circuit board (700) via board-to-board connectors (410, 720).

6. The vehicle-mounted domain controller according to claim 1, characterized in that, The ventilation holes (130, 140) are irregularly shaped holes, including fan-shaped holes (130) and / or elongated holes (140).

7. The vehicle-mounted domain controller according to claim 2, characterized in that, The space between the heat dissipation boss (11) and the heat source is filled with a thermally conductive interface material (400).

8. The vehicle domain controller according to claim 1, characterized in that, A metal bracket (600) is provided between the core circuit board (500) and the metal frame (100), and the metal bracket (600) is screwed to the metal frame (100).

9. The vehicle domain controller according to claim 5, characterized in that, The adapter circuit board is equipped with a low-speed signal connector, and the main circuit board (700) or core circuit board is equipped with a system-in-package chip and a high-speed signal connector.

10. The vehicle domain controller according to claim 2, characterized in that, The heat dissipation boss (11) is detachably connected to an auxiliary heat dissipation component, which is any one or a combination of the following: heat pipe, heat spreader, or semiconductor cooling chip.

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