Electronic device

Abstract

The application relates to the technical field of electronic equipment, and provides an electronic equipment which can solve the problem of large thickness of the electronic equipment in the related art. The electronic equipment comprises a shell and electronic devices, the shell comprises a middle frame and a back cover; the middle frame comprises a middle frame bottom wall and a middle frame side wall arranged at the edge of the middle frame bottom wall, the edge of the back cover is connected with the middle frame side wall, the middle frame bottom wall is provided with a device accommodating groove, the side close to the back cover of the device accommodating groove is provided with a groove opening, the device accommodating groove comprises a device groove bottom wall opposite to the groove opening and a device groove side wall arranged at the edge of the device groove bottom wall; the electronic devices comprise a vibration motor, the electronic devices are arranged in the device accommodating groove, a first adhesive layer is arranged between the device groove bottom wall and the electronic devices, an adhesive gap is arranged between the device groove side wall and the electronic devices, a second adhesive layer is filled in the adhesive gap, and the first adhesive layer and the second adhesive layer fix the electronic devices on the middle frame. The application can be used in electronic equipment such as mobile phones.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and more particularly to an electronic device. Background Technology

[0002] With the rapid iteration of information technology and the consumer electronics industry, electronic devices such as smartphones have evolved into core intelligent terminals integrating multiple functions such as communication, entertainment, office work, and sensing and monitoring. Their market size continues to expand, and technological competition is becoming increasingly fierce. In the current market environment, consumers have placed higher demands on the appearance, portability, and user experience of electronic devices. Thinness and lightness have become one of the core development trends in the field of electronic device design. This trend has directly driven the refined transformation of the layout design of internal electronic components.

[0003] Among them, how to arrange components inside electronic devices to meet the requirements of making electronic devices thinner and lighter has become one of the important issues in the industry. Utility Model Content

[0004] Embodiments of this application provide an electronic device to address the problem of excessive thickness in related electronic devices.

[0005] To achieve the above objectives, the embodiments of this application adopt the following technical solutions: In a first aspect, embodiments of this application provide an electronic device, including a housing and an electronic component. The housing includes a mid-frame and a rear cover. The mid-frame includes a bottom wall and a side wall disposed at the edge of the bottom wall. The edge of the rear cover is connected to the side wall of the mid-frame. A component receiving groove is provided on the bottom wall of the mid-frame. The component receiving groove has an opening on the side near the rear cover. The component receiving groove includes a bottom wall opposite to the opening and a side wall disposed at the edge of the bottom wall. The electronic component includes a vibration motor. The electronic component is disposed in the component receiving groove. A first adhesive layer is provided between the bottom wall of the component receiving groove and the electronic component. An adhesive gap is provided between the side wall of the component receiving groove and the electronic component. A second adhesive layer is filled in the adhesive gap. The first adhesive layer and the second adhesive layer fix the electronic component to the mid-frame.

[0006] The electronic device in this embodiment of the application has a first adhesive layer between the bottom wall of the device slot and the electronic device. This first adhesive layer can restrict the movement of the electronic device in the thickness direction of the electronic device. A second adhesive layer is filled in the adhesive gap between the side wall of the device slot and the electronic device. This second adhesive layer can restrict the movement of the electronic device in the vertical direction (e.g., the width and length directions) of the thickness direction of the electronic device, thereby fixing the electronic device to the middle frame. Since the electronic device is fixed by adhesive layers to the bottom wall and side wall of the device slot, it does not need to be fixed to the middle frame by a fixing plate, thus saving the space occupied by the fixing plate. This allows for a smaller thickness of the electronic device, contributing to its lightweight and thin design.

[0007] In some embodiments of the first aspect, an adhesive layer receiving groove is provided on the side wall of the device slot. The adhesive layer receiving groove is connected to the adhesive gap and is used to receive a portion of the second adhesive layer. This arrangement can, on the one hand, reduce the accumulation of the second adhesive layer at the slot opening, making cleaning easier; on the other hand, it can increase the contact area between the second adhesive layer and the bottom wall of the middle frame, thereby making the electronic device more firmly fixed in the device receiving groove.

[0008] In some embodiments of the first aspect, the adhesive layer receiving groove is spaced apart from the bottom wall of the device receiving groove along the depth direction. This arrangement reduces the path length for the second adhesive layer to flow into the adhesive layer receiving groove, allowing the second adhesive layer to enter the adhesive layer receiving groove more quickly, thereby reducing the accumulation of the second adhesive layer at the groove opening and facilitating cleaning.

[0009] In some embodiments of the first aspect, the adhesive gap has an inlet at one end near the groove opening, and the inlet is flared in the direction from the bottom wall of the device groove to the groove opening. This configuration allows the inlet to guide the second adhesive layer deeper into the adhesive gap when the second adhesive layer is applied, thereby reducing the accumulation of the second adhesive layer at the groove opening and facilitating cleaning.

[0010] In some embodiments of the first aspect, the device slot sidewall includes a guide section located at the edge of the slot opening and a sidewall section connecting the guide section and the bottom wall of the device slot; the bonding gap includes an inlet located between the guide section and the electronic device, the guide section being inclined relative to the sidewall section so that the inlet is flared in the direction close to the slot opening. This configuration allows the inlet to guide the second adhesive layer to the depth of the bonding gap when the second adhesive layer is applied, thereby reducing the accumulation of the second adhesive layer at the slot opening for easier cleaning; simultaneously, it also facilitates the processing of the guide section, thus helping to reduce the processing cost of the device receiving slot.

[0011] In some embodiments of the first aspect, the device receiving groove has a length direction and a width direction, and the number of device groove sidewalls is multiple, including two first groove sidewalls arranged opposite each other along the length direction and two second groove sidewalls arranged opposite each other along the width direction; each second groove sidewall has an adhesive gap with the electronic device. This arrangement can increase the adhesive area between the electronic device and the device receiving groove, thereby making the electronic device more firmly bonded.

[0012] In some embodiments of the first aspect, at least one first groove sidewall has an adhesive gap with the electronic device. This arrangement can further increase the adhesive area between the electronic device and the device receiving groove, thereby making the electronic device more firmly bonded.

[0013] In some embodiments of the first aspect, an elastic buffer layer is provided between the electronic device and the back cover. This arrangement allows the elastic buffer layer to absorb the force exerted by the back cover, thereby reducing compressive damage to the electronic device.

[0014] In some embodiments of the first aspect, the elastic cushioning layer is a foam layer. This configuration allows the foam layer to efficiently absorb the force exerted by the back cover, thereby further reducing compressive damage to electronic components.

[0015] In some embodiments of the first aspect, the electronic device is a foldable electronic device and includes multiple housings and a pivot mechanism disposed at the junction of two adjacent housings, the two adjacent housings being switchable between an unfolded state and a folded state; at least one housing is provided with electronic components. This configuration allows the foldable electronic device to have a smaller thickness in the folded state, thereby contributing to the thinner and lighter design of the foldable electronic device. Attached Figure Description

[0016] Figure 1 This is a cross-sectional schematic diagram of an electronic device in the related art; Figure 2 This is a front view of the electronic device (mobile phone) in the first embodiment of this application; Figure 3 for Figure 2 Rear view of the electronic device shown; Figure 4 for Figure 3 A cross-sectional view (AA) of the electronic device shown; Figure 5 for Figure 4 A magnified view of the location of electronic components in an electronic device; Figure 6 for Figure 3 A partial top view of the electronic device after the back cover has been removed; Figure 7 for Figure 3 The BB cross-sectional view of the electronic device shown; Figure 8 This is a front view of the electronic device in the second embodiment of this application when it is in the unfolded state; Figure 9 for Figure 8 A schematic diagram of the back of the electronic device shown; Figure 10 for Figure 8 A CC cross-sectional view of the electronic device shown; Figure 11 for Figure 10 The diagram shown illustrates the electronic device in its folded state. Figure 12 This is a front view of the electronic device in the deployed state according to the third embodiment of this application; Figure 13 for Figure 12 A schematic diagram of the back of the electronic device shown; Figure 14 for Figure 12 The electronic device shown is a DD cross-sectional view; Figure 15 for Figure 14 The diagram shows the electronic device in its folded state. Detailed Implementation

[0017] With the rapid iteration of information technology and the consumer electronics industry, electronic devices such as smartphones have evolved into core intelligent terminals integrating multiple functions such as communication, entertainment, office work, and sensing and monitoring. Their market size continues to expand, and technological competition is becoming increasingly fierce. In the current market environment, consumers have placed higher demands on the appearance, portability, and user experience of electronic devices. Thinness and lightness have become one of the core development trends in the field of electronic device design. This trend has directly driven the refined transformation of the layout design of internal electronic components.

[0018] Among them, how to arrange electronic components inside electronic devices to meet the requirements of making electronic devices thinner and lighter has become one of the important topics in the industry.

[0019] Figure 1 This is a cross-sectional schematic diagram of an electronic device in the related art. For example... Figure 1 As shown, the electronic device includes a housing 1, a display screen 71, electronic components 2, and a fixing plate 91.

[0020] The housing 1 includes a middle frame 11 and a back cover 14. The display screen 71 and the back cover 14 are arranged at intervals along the thickness direction of the electronic device. The middle frame 11 is connected between the display screen 71 and the back cover 14. The middle frame 11 includes a bottom wall 12 and a side wall 13 disposed at the edge of the bottom wall 12. The edges of the display screen 71 and the back cover 14 are respectively connected to the side wall 13 (e.g., glued to it).

[0021] The bottom wall 12 of the middle frame has a device receiving groove 15 on the side surface near the back cover 14. The electronic device 2 is disposed in the device receiving groove 15. A fixing plate 91 is disposed between the electronic device 2 and the back cover 14. The fixing plate 91 is connected to the bottom wall 12 of the middle frame by fasteners 92 (such as screws). The electronic device 2 includes, but is not limited to, a vibration motor 21.

[0022] In order to reduce the squeezing damage to the electronic device 2 by the fixed pressure plate 91, an intermediate buffer layer 93 is provided between the fixed pressure plate 91 and the electronic device 2. The intermediate buffer layer 93 can be a foam layer.

[0023] In the related technology, the electronic device 2 inside the electronic device is fixed to the middle frame 11 by a fixing plate 91. However, since the fixing plate 91 and the electronic device 2 are stacked in the thickness direction of the electronic device, the size of the entire electronic device assembly in the thickness direction of the electronic device is large, resulting in a large thickness of the electronic device, which is not conducive to the thinning of the electronic device.

[0024] Therefore, this application provides an electronic device in which electronic components are bonded to the bottom and side walls of a device receiving groove via an adhesive layer. This not only fixes the electronic components to the middle frame, but also saves the space occupied by the fixing plate, thereby reducing the thickness of the electronic device and making it lighter and thinner.

[0025] The electronic devices in this application embodiment can be mobile phones, tablets, or other electronic devices with internal electronic components such as vibration motors. The following uses a mobile phone as an example to specifically describe the electronic devices in this application embodiment. Other types of electronic devices can refer to the settings in the mobile phone embodiment, and will not be described in detail here.

[0026] Figure 2 This is a front view of the electronic device (mobile phone) in the first embodiment of this application. Figure 3 for Figure 2 Rear view of the electronic device shown. Figure 4 for Figure 3 A cross-sectional view (AA) of the electronic device shown. Figure 2 , Figure 3 and Figure 4 As shown, the electronic device includes a housing 1, electronic components 2, and a display screen 71.

[0027] like Figure 2 , Figure 3 and Figure 4 As shown, the housing 1 includes a middle frame 11 (also called a front shell or front frame) and a rear cover 14 (also called a battery cover). The display screen 71 and the rear cover 14 are spaced apart along the thickness direction Z of the electronic device, and the middle frame 11 is connected between the display screen 71 and the rear cover 14.

[0028] The mid-frame 11 includes a bottom wall 12 and a side wall 13 disposed at the edge of the bottom wall 12. The edge of the display screen 71 is connected to the side wall 13, for example, by bonding. The display screen 71, the bottom wall 12, and the side wall 13 form a first receiving space 101, within which accessories 72 of the display screen 71 are disposed. For example, when the display screen 71 is a liquid crystal display, the accessory 72 may be a backlight; or, when the display screen 71 is an OLED display, the accessory 72 may be a support film, a heat dissipation film, etc.

[0029] The edge of the back cover 14 is connected to the side wall of the middle frame 13, for example, by snap-fit. The back cover 14, the bottom wall of the middle frame 12, and the side wall of the middle frame 13 form a second accommodating space 102, which is used to accommodate the electronic device 2.

[0030] like Figure 4 and Figure 5 As shown, Figure 5 for Figure 4 The image shows a partial enlarged view of the electronic device 2. The bottom wall 12 of the middle frame is provided with a device receiving groove 15. The device receiving groove 15 has a groove opening 151 on the side near the rear cover 14. The device receiving groove 15 includes a device groove bottom wall 152 opposite to the groove opening 151, and a device groove side wall 153 disposed at the edge of the device groove bottom wall 152.

[0031] Electronic device 2 is disposed in device receiving groove 15. Electronic device 2 includes, but is not limited to, vibration motor 21, speaker, etc. A first adhesive layer 31 (such as glue layer) is provided between the bottom wall 152 of device groove and electronic device 2. An adhesive gap 4 is provided between the side wall 153 of device groove and electronic device 2. The adhesive gap 4 is filled with a second adhesive layer 32 (such as glue layer). The first adhesive layer 31 and the second adhesive layer 32 fix electronic device 2 to the middle frame 11.

[0032] In this embodiment of the electronic device, a first adhesive layer 31 is provided between the bottom wall 152 of the device slot and the electronic device 2. This first adhesive layer 31 restricts the movement of the electronic device 2 in the thickness direction Z of the electronic device. A second adhesive layer 32 is filled in the adhesive gap 4 between the side wall 153 of the device slot and the electronic device 2. This second adhesive layer 32 restricts the movement of the electronic device 2 in the vertical direction (e.g., the width direction X and length direction Y) of the thickness direction Z of the electronic device. Thus, the electronic device 2 can be fixed to the middle frame 11. Since the electronic device 2 is fixed by adhesive layers to the bottom wall 152 and side wall 153 of the device slot, it does not need to be fixed to the middle frame 11 by a fixing plate. This saves space occupied by the fixing plate, resulting in a thinner electronic device and contributing to its lightweight design.

[0033] In some embodiments, such as Figure 4 and Figure 5 As shown, an adhesive layer receiving groove 154 is provided on the side wall 153 of the device slot. The adhesive layer receiving groove 154 is connected to the adhesive gap 4 and is used to accommodate part of the second adhesive layer 32. By providing the adhesive layer receiving groove 154, on the one hand, when applying the second adhesive layer 32, sufficient space is ensured so that the second adhesive layer 32 sinks to the bottom of the adhesive layer receiving groove 154, thereby reducing the accumulation of the second adhesive layer 32 at the slot opening 151 and facilitating cleaning; on the other hand, by providing the adhesive layer receiving groove 154, the contact area between the second adhesive layer 32 and the bottom wall 12 of the middle frame is increased, thereby making the electronic device 2 more firmly fixed in the device receiving groove 15.

[0034] In some embodiments, such as Figure 4 and Figure 5 As shown, along the depth direction Z of the device receiving groove 15, the adhesive layer receiving groove 154 is spaced apart from the bottom wall 152 of the device groove. This arrangement allows the adhesive layer receiving groove 154 to be closer to the groove opening 151 of the device receiving groove 15. When applying the second adhesive layer 32, the path length of the second adhesive layer 32 flowing into the adhesive layer receiving groove 154 can be reduced, and the second adhesive layer 32 can enter the adhesive layer receiving groove 154 more quickly, thereby reducing the accumulation of the second adhesive layer 32 at the groove opening 151 and facilitating cleaning.

[0035] In some embodiments, such as Figure 4 and Figure 5 As shown, the bonding gap 4 has an inlet 41 at one end near the groove opening 151, along the direction from the bottom wall 152 of the device groove to the groove opening 151 (e.g. Figure 5The inlet 41 is flared outwards from bottom to top. That is, the width of the inlet 41 gradually increases along the direction from the bottom wall 152 of the device slot to the slot opening 151. With this configuration, the inlet 41 acts like a "funnel," guiding the second adhesive layer 32 to the depth of the adhesive gap 4 (i.e., near the bottom wall 152 of the device slot) when the second adhesive layer 32 is applied, thereby reducing the accumulation of the second adhesive layer 32 at the slot opening 151 and facilitating cleaning.

[0036] In some embodiments, such as Figure 5 As shown, the device slot sidewall 153 includes a guide section 1531 located at the edge of the slot opening 151, and a sidewall section 1532 connecting the guide section 1531 and the bottom wall 152 of the device slot; the bonding gap 4 includes an inlet 41 located between the guide section 1531 and the electronic device 2. The guide section 1531 is inclined relative to the sidewall section 1532 so that the inlet 41 is flared in the direction close to the slot opening 151. By inclining the guide section 1531 (i.e., the guide section 1531 is planar) to form the inlet 41, the processing of the guide section 1531 can be facilitated, such as by chamfering the edge of the slot opening 151 to form the guide section 1531, thereby helping to reduce the processing cost of the device receiving slot 15.

[0037] Among them, such as Figure 5 As shown, the adhesive layer receiving groove 154 can be provided in the side wall section 1532.

[0038] In order to ensure that the electronic device 2 is bonded more firmly, in some embodiments, such as Figure 5 , Figure 6 and Figure 7 As shown, Figure 6 for Figure 3 The image shown is a partial top view of the electronic device after the back cover 14 has been removed. Figure 7 for Figure 3 The diagram shows a BB cross-sectional view of the electronic device. The device receiving slot 15 has a length direction Y and a width direction X. It has multiple slot sidewalls 153, consisting of two first slot sidewalls 153a (i.e., the short sides of the device receiving slot 15) arranged opposite each other along the length direction Y, and two second slot sidewalls 153b (i.e., the long sides of the device receiving slot 15) arranged opposite each other along the width direction X. Each second slot sidewall 153b has an adhesive gap 4 with the electronic device 2, and the adhesive gap 4 is filled with a second adhesive layer 32. In other words, each long side of the device receiving slot 15 is bonded to the electronic device 2 through the second adhesive layer 32. This arrangement increases the bonding area between the electronic device 2 and the device receiving slot 15, thereby making the electronic device 2 more firmly bonded.

[0039] In order to accommodate the shape of the device receiving groove 15, such as Figure 4 and Figure 5 As shown, the shape of electronic device 2 can be a cuboid or a cuboid with chamfers.

[0040] To ensure a more secure bond for electronic component 2, in some embodiments, such as Figure 6 and Figure 7 As shown, at least one first groove sidewall 153a has an adhesive gap 4 between itself and the electronic device 2, and the adhesive gap 4 is filled with a second adhesive layer 32. That is, at least one short side of the device receiving groove 15 is bonded to the electronic device 2 through the second adhesive layer 32. This arrangement can further increase the bonding area between the electronic device 2 and the device receiving groove 15, thereby making the electronic device 2 bonded more firmly.

[0041] Among them, such as Figure 6 and Figure 7 As shown, each first groove sidewall 153a of the device receiving groove 15 has an adhesive gap 4 between it and the electronic device 2, and the adhesive gap 4 is filled with a second adhesive layer 32. However, it is not limited to this; it is also possible that one of the first groove sidewalls 153a of the device receiving groove 15 has an adhesive gap 4 between it and the electronic device 2, and the adhesive gap 4 is filled with a second adhesive layer 32.

[0042] To reduce the crush damage to the electronic device 2 caused by the back cover 14 under external force, in some embodiments, such as Figure 4 and Figure 5 As shown, an elastic buffer layer 5 is provided between the electronic device 2 and the back cover 14. By providing the elastic buffer layer 5, when the back cover 14 is deformed under external force, such as when the electronic device is dropped and the back cover 14 is deformed by hitting a protrusion, the elastic buffer layer 5 can absorb the force of the back cover 14, thereby reducing the squeezing damage to the electronic device 2 and thus helping to improve the service life of the electronic device 2.

[0043] The type of elastic buffer layer 5 is not unique; in some embodiments, such as... Figure 4 and Figure 5 As shown, the elastic buffer layer 5 can be a foam layer. With this configuration, the porous honeycomb or mesh structure of the foam layer can efficiently absorb the force of the back cover 14 through the synergistic effect of "pore compression-air discharge-structural deformation" when subjected to impact, thereby further reducing the squeezing damage to the electronic device 2. In other embodiments, the elastic buffer layer 5 may also be a rubber layer or a silicone layer.

[0044] Figure 8 This is a front view of the electronic device in the unfolded state according to the second embodiment of this application. Figure 9 for Figure 8 The diagram shows the back of the electronic device. Figure 10 for Figure 8 The shown is a CC cross-sectional view of the electronic device. Figure 11 for Figure 10 The diagram shows the electronic device in its folded state. Figures 8-11 The electronic devices shown are Figures 2-7 The main difference between the electronic devices shown is that they have different shapes. Figures 8-11 The electronic device shown is a foldable electronic device, as detailed below: like Figure 8 , Figure 9 and Figure 10 As shown, the electronic device is a foldable electronic device, and includes multiple housings 1, a display screen 71, electronic components 2, and a pivot mechanism 6 disposed at the junction of two adjacent housings 1. The two adjacent housings 1 can be in an unfolded state (e.g., Figure 10 (as shown) and folded state (e.g.) Figure 11 Switching between (as shown); at least one housing 1 is provided with an electronic device 2. With this configuration, the electronic device 2 does not need to be fixed to the middle frame 11 of the housing 1 by a fixing plate, thereby saving the space occupied by the fixing plate, and thus making the thickness of the foldable electronic device smaller in the folded state, which is conducive to the thinning and lightening of the foldable electronic device.

[0045] Among them, such as Figure 10 and Figure 11 As shown, there can be two housings 1, namely housing 1a and housing 1b. Housings 1a and 1b are used to support the display screen 71. The pivot mechanism 6 is an outward folding pivot mechanism and is located at the junction of housings 1a and 1b. Housings 1a and 1b can be in an unfolded state (e.g., Figure 10 (as shown) and folded state (e.g.) Figure 11 Switch between (as shown).

[0046] like Figure 8 and Figure 10 As shown, the display screen 71 includes a first screen area 711, a second screen area 712, and a third screen area 713 connected between the first screen area 711 and the second screen area 712. The first screen area 711 covers the housing 1a, the second screen area 712 covers the housing 1b, and the third screen area 713 covers the rotating shaft mechanism 6.

[0047] like Figure 8 and Figure 10 As shown, when housings 1a and 1b are in the unfolded state, housings 1a and 1b are arranged side by side, and the display screen 71 is unfolded, exposing the display area of ​​the display screen 71 to display image information to the user.

[0048] like Figure 11 As shown, when housing 1a and housing 1b are in a folded state, housing 1a and housing 1b are stacked on top of each other, and display screen 71 is located outside housing 1a, housing 1b and rotating mechanism 6. At this time, the first screen area 711 and the second screen area 712 of display screen 71 are parallel or approximately parallel (for example, the deviation is within 2°), and the cross-sectional shape of the third screen area 713 of display screen 71 is inverted U-shaped.

[0049] The display screen 71 can be entirely made of flexible screen structure, such as the first screen area 711, the second screen area 712, and the third screen area 713 of the display screen 71 are all flexible screen structures; of course, the display screen 71 can also have a flexible screen structure in the middle folding part, while the two sides are rigid screen structures, such as the first screen area 711 and the second screen area 712 of the display screen 71 are rigid screen structures, and the third screen area 713 is a flexible screen structure.

[0050] like Figure 10 As shown, the rotating shaft mechanism 6 includes a rotating shaft base 61, a shaft cover 62, and a swing arm assembly 63. The shaft cover 62 is located on the back side of the rotating shaft base 61 (i.e., the side of the rotating shaft base 61 away from the third screen area 713). The rotating shaft base 61 is connected to the housing 1a and the housing 1b respectively through the swing arm assembly 63.

[0051] The shaft cover 62 is an external part of the rotating shaft mechanism 6. When the housing 1a and housing 1b are in the unfolded state, the shaft cover 62 is located between the housing 1a and housing 1b and is used to cover the inner rotating shaft base 61 and the swing arm assembly 63.

[0052] Of course, in addition to being an outward folding hinge mechanism, the hinge mechanism 6 can also be an inward folding hinge mechanism. When the housing 1a and housing 1b are in a folded state, the display screen 71 is folded between the housing 1a and housing 1b.

[0053] like Figure 10 and Figure 11 As shown, both housing 1a and housing 1b include a middle frame 11 and a rear cover 14. The middle frame 11 includes a bottom wall 12 and a side wall 13 disposed at the edge of the bottom wall 12. The edge of the rear cover 14 is connected to the side wall 13.

[0054] like Figure 10 and Figure 11As shown, in the housing 1b, a device receiving groove 15 is provided on the bottom wall 12 of the middle frame. The device receiving groove 15 has a groove 151 on the side near the rear cover 14. The device receiving groove 15 includes a device groove bottom wall 152 opposite to the groove 151 and a device groove side wall 153 provided at the edge of the device groove bottom wall 152. An electronic device 2 is provided in the device receiving groove 15. A first adhesive layer 31 is provided between the device groove bottom wall 152 and the electronic device 2. An adhesive gap 4 is provided between the device groove side wall 153 and the electronic device 2. The adhesive gap 4 is filled with a second adhesive layer 32. The first adhesive layer 31 and the second adhesive layer 32 fix the electronic device 2 to the middle frame 11.

[0055] Of course, the electronic device 2 can be mounted on the housing 1a in addition to being mounted on the housing 1b.

[0056] For the specific structure of electronic component 2, component receiving groove 15, and bonding gap 4, please refer to [reference needed]. Figures 4-7 The structure is set up in the middle, and will not be elaborated on here.

[0057] Figure 12 This is a front view of the electronic device in the deployed state according to the third embodiment of this application. Figure 13 for Figure 12 The diagram shows the back of the electronic device. Figure 14 for Figure 12 The DD cross-sectional view of the electronic device shown. Figure 15 for Figure 14 The diagram shows the electronic device in its folded state. Figures 12-15 The electronic devices shown are Figures 2-7 The main difference between the electronic devices shown is their form factor, as detailed below: like Figure 12 , Figure 13 and Figure 14 As shown, the electronic device is a foldable electronic device, including a housing 1, a display screen 71, a hinge mechanism 6, and electronic components 2. There are three housings 1, namely housing 1a, housing 1b, and housing 1c. Housings 1a, 1b, and 1c are used to support the display screen 71.

[0058] There are two rotating shaft mechanisms 6, namely rotating shaft mechanism 6a and rotating shaft mechanism 6b. Rotating shaft mechanism 6a is an inward folding rotating shaft mechanism and is located at the junction of housing 1a and housing 1c, so that housing 1a and housing 1c can switch between unfolded and folded states. Rotating shaft mechanism 6b is an outward folding rotating shaft mechanism and is located at the junction of housing 1b and housing 1c, so that housing 1c and housing 1a can switch between unfolded and folded states.

[0059] like Figure 12 and Figure 14As shown, the display screen 71 includes a first screen area 711, a second screen area 712, two third screen areas 713, and a fourth screen area 714. The fourth screen area 714 is disposed between the first screen area 711 and the second screen area 712, and one third screen area 713 (e.g., Figure 12 The third screen area 713 on the left side is located between the first screen area 711 and the fourth screen area 714. Another third screen area 713 (e.g.) Figure 12 The third screen area 713 on the right side is located between the second screen area 712 and the fourth screen area 714; the first screen area 711 covers the housing 1a, the second screen area 712 covers the housing 1b, the fourth screen area 714 covers the housing 1c, and the two third screen areas 713 cover the rotating shaft mechanism 6a and the rotating shaft mechanism 6b respectively.

[0060] like Figure 12 and Figure 14 As shown, when housings 1a and 1c are in the unfolded state, and housings 1b and 1c are in the unfolded state, housings 1a, 1b and 1c are arranged side by side, and housing 1c is located between housings 1a and 1b; at this time, the display screen 71 unfolds, and the display area of ​​the display screen 71 is exposed to display image information to the user.

[0061] like Figure 15 As shown, when housings 1a and 1c are in a folded state, and housings 1b and 1c are also in a folded state, housings 1a, 1b, and 1c are stacked on top of each other. The second screen area 712 of the display screen 71 is located outside housing 1b. The second screen area 712 and the fourth screen area 714 are both located between housings 1a and 1c. At this time, any two of the first screen area 711, the second screen area 712, and the fourth screen area 714 of the display screen 71 are parallel or approximately parallel (for example, the deviation is within 2°). The cross-sectional shape of the two third screen areas 713 of the display screen 71 is U-shaped.

[0062] like Figure 14 and Figure 15 As shown, housings 1a, 1b, and 1c all include a middle frame 11 and a rear cover 14. The middle frame 11 includes a bottom wall 12 and a side wall 13 disposed at the edge of the bottom wall 12. The edge of the rear cover 14 is connected to the side wall 13.

[0063] like Figure 14 and Figure 15As shown, in the housing 1b, a device receiving groove 15 is provided on the bottom wall 12 of the middle frame. The device receiving groove 15 has a groove 151 on the side near the rear cover 14. The device receiving groove 15 includes a device groove bottom wall 152 opposite to the groove 151 and a device groove side wall 153 provided at the edge of the device groove bottom wall 152. An electronic device 2 is provided in the device receiving groove 15. A first adhesive layer 31 is provided between the device groove bottom wall 152 and the electronic device 2. An adhesive gap 4 is provided between the device groove side wall 153 and the electronic device 2. The adhesive gap 4 is filled with a second adhesive layer 32. The first adhesive layer 31 and the second adhesive layer 32 fix the electronic device 2 to the middle frame 11.

[0064] Of course, in addition to being mounted on housing 1b, electronic device 2 can also be mounted on housing 1a or housing 1c.

[0065] For the specific structure of electronic component 2, component receiving groove 15, and bonding gap 4, please refer to [reference needed]. Figures 4-7 The structure is set up in the middle, and will not be elaborated on here.

[0066] While the description of this application is presented in conjunction with some embodiments, this does not mean that the features of this application are limited to this embodiment. On the contrary, the purpose of describing the application in conjunction with embodiments is to cover other options or modifications that may arise based on the claims of this application. To provide a thorough understanding of this application, many specific details are included in the above description. This application may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of this application, some specific details will be omitted in the description. It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0067] In the embodiments of this application, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," "third," and "fourth" may explicitly or implicitly include one or more of that feature.

[0068] In the embodiments of this application, "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0069] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. The directional terms mentioned in the embodiments of this application, such as "upper," "lower," "left," "right," "inner," and "outer," are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. "Multiple" refers to at least two.

[0070] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0071] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. An electronic device, characterized in that, It includes a housing (1) and electronic components (2), the housing (1) including a middle frame (11) and a rear cover (14). The middle frame (11) includes a bottom wall (12) and a side wall (13) of the middle frame located at the edge of the bottom wall (12). The edge of the back cover (14) is connected to the side wall (13) of the middle frame. The bottom wall (12) of the middle frame is provided with a device receiving groove (15). The device receiving groove (15) has a slot (151) on the side near the back cover (14). The device receiving groove (15) includes a bottom wall (152) of the device groove opposite to the slot (151) and a side wall (153) of the device groove located at the edge of the bottom wall (152). The electronic device (2) includes a vibration motor (21). The electronic device (2) is disposed in the device receiving groove (15). A first adhesive layer (31) is provided between the bottom wall (152) of the device groove and the electronic device (2). An adhesive gap (4) is provided between the side wall (153) of the device groove and the electronic device (2). The adhesive gap (4) is filled with a second adhesive layer (32). The first adhesive layer (31) and the second adhesive layer (32) fix the electronic device (2) to the middle frame (11).

2. The electronic device according to claim 1, characterized in that, The device slot sidewall (153) is provided with an adhesive layer receiving groove (154), which is connected to the adhesive gap (4) and is used to receive part of the second adhesive layer (32).

3. The electronic device according to claim 2, characterized in that, Along the depth direction (Z) of the device receiving groove (15), the adhesive layer receiving groove (154) is spaced apart from the bottom wall (152) of the device groove.

4. The electronic device according to any one of claims 1 to 3, characterized in that, The bonding gap (4) has an inlet (41) at one end near the groove (151), and the inlet (41) is flared in the direction from the bottom wall (152) of the device groove to the groove (151).

5. The electronic device according to any one of claims 1 to 3, characterized in that, The device slot sidewall (153) includes a guide section (1531) located at the edge of the slot (151) and a sidewall section (1532) connecting the guide section (1531) and the device slot bottom wall (152). The bonding gap (4) includes an inlet (41) located between the guide section (1531) and the electronic device (2). The guide section (1531) is inclined relative to the side wall section (1532) so that the inlet (41) is flared in the direction close to the slot (151).

6. The electronic device according to any one of claims 1 to 5, characterized in that, The device receiving groove (15) has a length direction (Y) and a width direction (X). The number of device groove sidewalls (153) is multiple, and there are two first groove sidewalls (153a) arranged opposite each other along the length direction (Y) and two second groove sidewalls (153b) arranged opposite each other along the width direction (X). Each second groove sidewall (153b) has an adhesive gap (4) between it and the electronic device (2).

7. The electronic device according to claim 6, characterized in that, At least one of the first groove sidewalls (153a) has the adhesive gap (4) between it and the electronic device (2).

8. The electronic device according to any one of claims 1 to 7, characterized in that, An elastic buffer layer (5) is provided between the electronic device (2) and the back cover (14).

9. The electronic device according to claim 8, characterized in that, The elastic buffer layer (5) is a foam layer.

10. The electronic device according to any one of claims 1 to 9, characterized in that, The electronic device is a foldable electronic device and includes a plurality of housings (1) and a pivot mechanism (6) disposed at the junction of two adjacent housings (1), the two adjacent housings (1) can switch between an unfolded state and a folded state; at least one housing (1) is provided with the electronic device (2).

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