A membrane switch failure collection device

Abstract

The utility model belongs to the fault collection technical field, concretely relates to a membrane switch fault collection device, including the data acquisition card and cover assembly, heat dissipation subassembly, fixed support, fixed support for collecting switch fault, cover assembly is pressed in the top of data acquisition card, heat dissipation subassembly is located in the top of cover assembly, is used for the heat dissipation inside data acquisition card, fixed support is located in the both sides of cover assembly, and is connected with cover assembly fixedly, is used for fixing data acquisition card on any plane, fixed support is fixed below fixed support, fixes the piece on fixed support, and cover assembly forms the structure of half -enclosing type fixed data acquisition card, including board body, the both sides of board body are provided with the clamping plate with fixed support, and the clamping plate abuts on the terminal block on data acquisition card. The utility model reduces the installation time and difficulty, is convenient for maintenance and replacement heat dissipation subassembly, and can prevent the loosening of threaded connection structure.

Description

Technical Field

[0001] This invention belongs to the field of fault acquisition technology, specifically relating to a membrane switch fault acquisition device. Background Technology

[0002] Membrane switches, as a common electronic component, are widely used in various electronic devices, such as household appliances, industrial control equipment, and medical instruments. The main function of a membrane switch is to open or close a circuit by pressing a membrane, thereby controlling the device's operation. However, due to the frequent pressing during use, membrane switches are prone to malfunctions, such as poor contact or open circuits, which can affect the normal operation of the equipment.

[0003] Data acquisition cards are a crucial component in industrial automation and test and measurement. Their core function is to convert external analog or digital signals into computer-recognizable digital signals, mainly encompassing three steps: signal acquisition, signal conversion, and data transmission. In practical applications, data acquisition cards, combined with membrane switches, can monitor the operation of the membrane switches, collect and output switch fault information to the terminal, and analyze this data to determine if the switch is faulty. However, existing data acquisition cards have some problems in installation and use, such as complex installation, unstable fixing, and the fixing tools may affect heat dissipation. These problems affect the stability and reliability of the data acquisition cards. Utility Model Content

[0004] The purpose of this invention is to provide a membrane switch fault acquisition device that reduces installation time and difficulty, facilitates maintenance and replacement of heat dissipation components, and prevents the threaded connection structure from loosening.

[0005] The specific technical solution adopted in this utility model is as follows: A membrane switch fault acquisition device includes a data acquisition card for acquiring switch faults, a cover plate assembly, a heat dissipation component, fixed feet, and a fixed support. The cover plate assembly covers the top of the data acquisition card. The heat dissipation component is located on the top of the cover plate assembly for dissipating heat from the inside of the data acquisition card. The fixed feet are located on both sides of the cover plate assembly and are fixedly connected to the cover plate assembly for fixing the data acquisition card on any plane. The fixed support is fixed below the fixed feet, and a fastener is fixed to the fixed support. The cover plate assembly forms a semi-enclosed structure for fixing the data acquisition card.

[0006] In a preferred embodiment, the cover assembly includes a plate body, on which two clamping plates are provided on opposite sides of the fixed support legs. The clamping plates abut against the terminal blocks on the data acquisition card, and the two sides of the clamping plates extend vertically along the wiring terminals, forming a bayonet on the clamping plates.

[0007] In a preferred embodiment, a ring-shaped interface is provided in the middle of the plate, directly opposite the heat dissipation component, and the ring-shaped interface extends into the housing of the data acquisition card.

[0008] In a preferred embodiment, the inner side of the annular interface has a cavity, the cavities are at least symmetrically arranged, and a spring and a ball bearing are installed in the cavity. The spring abuts against the ball bearing, forcing part of the ball bearing to protrude from the window of the cavity.

[0009] In a preferred embodiment, the outer wall of the annular interface is provided with a flat adsorption cutting platform corresponding to the cavity, and the ball is made of any material that can be attracted by a magnet.

[0010] In a preferred embodiment, the heat dissipation assembly includes an annular frame, a fan is installed inside the annular frame, a vent plate is installed on the top of the annular frame, and a downwardly extending connecting ring is provided at the bottom of the annular frame.

[0011] In a preferred embodiment, the connecting ring platform and the annular interface are installed via a threaded connection.

[0012] In a preferred embodiment, the connecting ring platform has a matching groove at the position where the ball protrudes from the cavity.

[0013] The technical effects achieved by this utility model are as follows: In this application, the cover plate assembly adopts a semi-enclosed structure, which simplifies the assembly process. During installation, the cover plate assembly is simply pressed onto the data acquisition card and fixed on the fixed support using fasteners, reducing installation time and difficulty.

[0014] In this application, the annular interface and the connecting ring platform are connected by threads, which makes installation and disassembly convenient and facilitates maintenance and replacement of heat dissipation components. The engagement structure of the ball and the groove further enhances the stability of the connection and prevents the threaded connection from loosening. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure in this practical application; Figure 2 This is a schematic diagram of the cover plate assembly structure in this utility model; Figure 3 This is a practical book Figure 2 A schematic diagram of a half-section structure; Figure 4 This is a practical book Figure 1 A magnified structural diagram showing the details at point A; Figure 5 This is a schematic diagram of the separate structure of the heat dissipation component in this utility model; Figure 6 This is a practical book Figure 1 A schematic diagram of the sagittal cross-sectional structure.

[0016] The attached diagram lists the components represented by each number as follows: 1. Data acquisition card; 2. Cover plate assembly; 201. Plate body; 202. Annular interface; 207. Clamping plate; 203. Cavity; 204. Spring; 205. Ball bearing; 206. Adsorption cutting stage; 207. Clamping plate; 208. Bayonet; 3. Heat dissipation components; 301. Annular frame; 302. Fan; 303. Ventilation plate; 304. Connecting ring platform; 305. Groove; 4. Fix the support legs; 5. Fix the support base. Detailed Implementation

[0017] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0018] Many specific details are set forth in the following description in order to provide a full understanding of this utility model. However, this utility model may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed below.

[0019] Secondly, the term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of this utility model. The phrase "in a preferred embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that mutually excludes other embodiments.

[0020] Secondly, this utility model is described in detail with reference to the schematic diagrams. When detailing the embodiments of this utility model, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged, not according to the usual scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of this utility model. In addition, actual manufacturing should include the three-dimensional spatial dimensions of length, width, and depth.

[0021] Please see the appendix Figure 1 As shown, this utility model provides a membrane switch fault acquisition device, including a data acquisition card 1 for acquiring switch faults. The data acquisition card 1 is responsible for acquiring the status information of the membrane switch in real time, including fault information such as switch conduction, disconnection, and poor contact. The data acquisition card 1 converts the electrical signal of the membrane switch into an analyzable digital signal through its internal circuits and sensors.

[0022] It also includes a cover plate assembly 2, a heat dissipation component 3, a fixing foot 4, and a fixing bracket 5. The cover plate assembly 2 covers the top of the data acquisition card 1. The heat dissipation component 3 is located on the top of the cover plate assembly 2 and is used to dissipate heat inside the data acquisition card 1. The fixing foot 4 is located on both sides of the cover plate assembly 2 and is fixedly connected to the cover plate assembly 2. It is used to fix the data acquisition card 1 on any plane. The fixing bracket 5 is fixed below the fixing foot 4 and the fastener is fixed on the fixing bracket 5. The cover plate assembly 2 forms a semi-enclosed structure for fixing the data acquisition card 1.

[0023] Specifically, the fasteners include, but are not limited to, any fasteners in the prior art such as screws, bolts or self-tapping screws, as long as they can fix the fixed support 5, and are included in this application without further details.

[0024] Please see the appendix Figure 2 As shown, the cover plate assembly 2 includes a plate body 201. On the plate body 201, on both sides offset from the fixed support leg 4, there are clamping plates 207. The clamping plates 207 abut against the terminal block on the data acquisition card 1, and the two sides of the clamping plates 207 extend vertically along the wiring terminals. The clamping plates 207 form a bayonet 208.

[0025] More specifically, the fixed feet 4, fixed supports 5, and clamping plates 207 on the cover assembly 2, combined with each component, form a semi-enclosed covering structure. During fixing, the cover assembly 2 is pressed onto the data acquisition card 1 and fixed on the fixed support 5 using fasteners. The semi-enclosed fixing simplifies the assembly process, allowing direct assembly with the data acquisition card 1, making alignment and installation easy, reducing installation time and difficulty, and achieving convenient and quick installation. Furthermore, due to the special design structure, it can also provide necessary support and constraints for the data acquisition card 1, further ensuring stable and reliable fixing to the connected object.

[0026] Please see the appendix Figures 3-4 As shown, a ring-shaped interface 202 is provided in the middle of the board 201, directly opposite the heat dissipation component 3. The ring-shaped interface 202 extends into the housing of the data acquisition card 1. A cavity 203 is provided on the inner side of the ring-shaped interface 202. The cavities 203 are at least symmetrically arranged. A spring 204 and a ball bearing 205 are installed in the cavity 203. The spring 204 abuts against the ball bearing 205, forcing part of the ball bearing 205 to protrude from the window of the cavity 203.

[0027] Specifically, when there is external pressure on the ball 205, the spring 204 is compressed, and the ball 205 retracts into the cavity 203. When the external pressure is removed, the spring 204 releases its elastic energy, and part of the ball 205 protrudes out of the window of the cavity 203.

[0028] Please see the appendix Figures 3-4As shown, the outer wall of the annular interface 202 is provided with a flat adsorption cutting platform 206 corresponding to the cavity 203, and the ball 205 is made of any material that can be attracted by a magnet.

[0029] More specifically, a magnet is placed at the position of the adsorption cutting stage 206, which can attract the ball 205 to move into the cavity 203, at which time the spring 204 is in a compressed state.

[0030] Please see the appendix Figure 3 , Figure 5 and Figure 6 As shown, the heat dissipation assembly 3 includes an annular frame 301, a fan 302 is installed inside the annular frame 301, a vent plate 303 is installed on the top of the annular frame 301, and a connecting ring platform 304 extending downward is provided at the bottom of the annular frame 301.

[0031] Please see the appendix Figure 3 , Figure 5 and Figure 6 As shown, the connecting ring platform 304 and the ring interface 202 are installed by threaded connection.

[0032] More specifically, the design of extending the ring interface 202 into the housing of the data acquisition card 1 allows the heat dissipation component 3 to guide the hot air inside the housing to the outside through the ring interface 202, or to exchange the cool air outside with the housing of the data acquisition card 1, thereby achieving the purpose of heat dissipation inside the housing. Furthermore, the heat dissipation component 3 is connected to the ring interface 202 through the threaded design of the connecting ring platform 304, which improves the installation speed and makes it easier to disassemble and replace compared to the previous bolt fixing method.

[0033] Please see the appendix Figure 3 , Figure 5 and Figure 6 As shown, the connecting ring platform 304 has a matching groove 305 at the position where the ball 205 protrudes from the cavity 203.

[0034] More specifically, when the connecting ring platform 304 and the annular interface 202 are threadedly closed, the spring 204 abuts against the protruding position of the ball 205 and is locked inside the groove 305. The structure of the ball 205 engaging with the groove 305 can effectively cope with the loosening of the threaded connection due to vibration, and prevent relative rotation between the connecting ring platform 304 and the annular interface 202, thereby effectively preventing the threaded connection from loosening and enhancing the stability of the connection between the cover plate assembly 2 and the heat dissipation component 3.

[0035] The working principle of this utility model is as follows: First, the cover assembly 2 covers the top of the data acquisition card 1 with a semi-enclosed structure, and the data acquisition card 1 is firmly fixed on any plane by the fixed feet 4 and the fixed support 5. Then, the heat dissipation component 3 is connected to the inside of the housing of the data acquisition card 1 through the annular interface 202. The annular interface 202 is connected to the connecting ring platform 304 by threads, which makes installation and disassembly convenient. The ball bearing 205 and spring 204 structure inside the annular interface 202, when the connecting ring platform 304 and the annular interface 202 are threaded together, the ball bearing 205 is engaged in the groove 305 of the connecting ring platform 304. When it is necessary to retract, a magnet can be placed on the adsorption cutting platform 206 on the outer wall of the annular interface 202 to attract the ball bearing 205 to move into the cavity 203, compress the spring 204, twist the heat dissipation component 3, and remove the heat dissipation component 3 from the cover assembly 2.

[0036] The above description is merely a preferred embodiment of this utility model. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of this utility model, and these improvements and modifications should also be considered within the scope of protection of this utility model. Structures, devices, and operating methods not specifically described or explained in this utility model, unless otherwise specified or limited, shall be implemented using conventional methods in the art.

Claims

1. A membrane switch fault acquisition device, characterized in that: Including a data acquisition card (1) for acquiring switch fault data; and Cover assembly (2), which presses against the top of data acquisition card (1); Heat dissipation component (3), which is located on the top of the cover plate assembly (2) and is used to dissipate heat inside the data acquisition card (1); Fixed support (4), the fixed support (4) is provided on both sides of the cover plate assembly (2) and is fixedly connected to the cover plate assembly (2) for fixing the data acquisition card (1) on any plane; Fixed support (5), the fixed support (5) is fixed below the fixed support foot (4), the fastener is fixed on the fixed support (5), and the cover plate assembly (2) forms a semi-enclosed fixed data acquisition card (1) structure.

2. The membrane switch fault acquisition device according to claim 1, characterized in that: The cover plate assembly (2) includes a plate body (201). The plate body (201) has a retaining plate (207) on both sides that are offset from the fixed support (4). The retaining plate (207) abuts against the terminal block on the data acquisition card (1). The two sides of the retaining plate (207) extend vertically along the wiring terminal. A bayonet (208) is formed on the retaining plate (207).

3. The membrane switch fault acquisition device according to claim 2, characterized in that: A ring-shaped interface (202) is also provided in the middle of the plate (201) directly opposite the heat dissipation component (3), and the ring-shaped interface (202) extends into the housing of the data acquisition card (1); The inner side of the annular interface (202) is provided with a cavity (203). The cavity (203) is provided at least symmetrically. A spring (204) and a ball (205) are installed in the cavity (203). The spring (204) abuts against the ball (205), forcing part of the ball (205) to protrude from the window of the cavity (203).

4. The membrane switch fault acquisition device according to claim 3, characterized in that: The outer wall of the annular interface (202) is provided with a flat adsorption cutting platform (206) corresponding to the cavity (203), and the ball (205) is made of any material that can be attracted by a magnet.

5. The membrane switch fault acquisition device according to claim 3, characterized in that: The heat dissipation assembly (3) includes an annular frame (301), a fan (302) is installed inside the annular frame (301), a vent plate (303) is installed on the top of the annular frame (301), and a connecting ring platform (304) extending downward from the bottom of the annular frame (301).

6. The membrane switch fault acquisition device according to claim 5, characterized in that: The connecting ring platform (304) and the annular interface (202) are installed by threaded connection.

7. A membrane switch fault acquisition device according to claim 5, characterized in that: The connecting ring platform (304) has a matching groove (305) at the position where the ball (205) protrudes from the cavity (203).

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