A high-temperature-resistant plastic base

Abstract

The utility model relates to electronic equipment and electric appliance fittings technical field, specifically disclose a kind of plastic base of high temperature resistance, including plastic base main body, plastic base main body includes base layer, the surface of base layer is provided with high temperature resistant material layer, the top of plastic base main body is provided with mounting slot, the bottom of plastic base main body is provided with heat dissipation groove, the bottom of mounting slot inner cavity is provided with heat dissipation hole, and the inner cavity of heat dissipation hole is communicated with heat dissipation groove, the bottom of plastic base main body surface is provided with heat conduction hole, and the inner cavity of heat conduction hole is communicated with heat dissipation groove. Through the composite structure of base layer and high temperature resistant material layer combination heat dissipation groove, heat dissipation hole and the synergistic effect of heat conduction hole, while maintaining plastic product lightweight and low cost advantage, significantly improve temperature limit and realize efficient heat dissipation, have the advantages of effectively improving high temperature resistant performance, heat is quickly exported by composite heat dissipation structure, avoid high temperature deformation and performance degradation.

Description

Technical Field

[0001] This utility model relates to the field of electronic equipment and electrical accessories technology, specifically a high-temperature resistant plastic base. Background Technology

[0002] As the power density of electronic devices (such as routers, set-top boxes, and servers) and household appliances (such as electric kettles, coffee makers, and air fryers) continues to increase, the heat generated by their internal heating elements is significantly increasing. Automotive electronic components, operating in high-temperature environments such as engine compartments, also face severe heat dissipation challenges. Traditional solutions using injection-molded plastic bases made from common engineering plastics (such as ABS, PC, and PP) have significant drawbacks: these materials generally have a long-term operating temperature below 110°C, and under sustained high temperatures, they experience problems such as molecular chain breakage and stress relaxation, leading to warping, reduced mechanical strength, and even insulation degradation. More seriously, some plastics release volatile organic compounds at high temperatures, causing corrosion to delicate components inside enclosed equipment.

[0003] Existing improvement solutions mainly fall into two categories: one is to use metal materials such as aluminum alloy or stainless steel to manufacture the base. Although this solves the temperature resistance problem, it brings new problems such as a surge in cost (material cost increases by 3-5 times), increased weight (affecting portability), electromagnetic shielding (requiring additional treatment), and secondary processing (such as surface insulation treatment); the other is to use special engineering plastics such as PEEK and polyimide for integral molding. Although these materials can withstand temperatures above 250°C, they face industrialization obstacles such as expensive raw material prices (about 10-20 times that of ordinary plastics), complex injection molding processes (requiring special high-temperature injection molding machines), and low yield (prone to internal stress).

[0004] Especially in applications requiring a balance between insulation performance and heat dissipation efficiency, such as 5G base station equipment bases and new energy vehicle charging module brackets, existing technologies struggle to achieve a balance between material cost, processing difficulty, temperature resistance, and structural strength. This necessitates the development of a novel composite structure solution that maintains the advantages of lightweight, easy processing, and low cost of plastic products while breaking through the temperature resistance limits of traditional plastics and meeting the structural stability requirements under complex operating conditions. Utility Model Content

[0005] To address the shortcomings of existing technologies, this utility model provides a high-temperature resistant plastic base, which has the advantages of effectively improving high-temperature resistance, achieving rapid heat dissipation through a composite heat dissipation structure, and avoiding high-temperature deformation and performance degradation.

[0006] This application provides a high-temperature resistant plastic base, the technical solution of which is as follows: it includes a plastic base body, the plastic base body includes a base layer, the surface of the base layer is provided with a high-temperature resistant material layer, the top of the plastic base body is provided with an installation groove, the bottom of the plastic base body is provided with a heat dissipation groove, the bottom of the inner cavity of the installation groove is provided with a heat dissipation hole, and the inner cavity of the heat dissipation hole is connected to the heat dissipation groove, and the bottom of the surface of the plastic base body is provided with a heat conduction hole, and the inner cavity of the heat conduction hole is connected to the heat dissipation groove.

[0007] Furthermore, this application also proposes that the inner cavity of the base layer is provided with reinforcing ribs, and the material of the reinforcing ribs is steel.

[0008] Furthermore, this application also proposes that the high-temperature resistant material layer is bonded to the surface of the substrate through an adhesive layer.

[0009] Furthermore, this application also proposes that the base material is one of ABS, PC, PP or PC / ABS alloy.

[0010] Furthermore, this application also proposes that the material of the high-temperature resistant material layer is one of PPS, PA46, PBT or high-temperature nylon.

[0011] Furthermore, this application also proposes that the adhesive layer is a high-temperature adhesive layer or a compatibilizer layer.

[0012] As can be seen from the above, the high-temperature resistant plastic base and its manufacturing method provided in this application, through the composite structure of the base layer and the high-temperature resistant material layer combined with the synergistic effect of heat dissipation grooves, heat dissipation holes and heat conduction holes, significantly improves the temperature resistance limit and achieves efficient heat dissipation while maintaining the advantages of lightweight and low cost of plastic products. It has the advantages of effectively improving high-temperature resistance, achieving rapid heat dissipation through the composite heat dissipation structure, and avoiding high-temperature deformation and performance degradation. Attached Figure Description

[0013] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0014] Figure 1 This is a schematic diagram of the structure of this utility model;

[0015] Figure 2 This is a bottom view of the main body of the plastic base of this utility model;

[0016] Figure 3 This is a schematic diagram of the main structure of the plastic base of this utility model.

[0017] In the diagram: 1. Plastic base body; 101. Base layer; 102. Reinforcing rib; 103. Adhesive layer; 104. High temperature resistant material layer; 2. Heat conduction hole; 3. Mounting groove; 4. Heat dissipation hole; 5. Heat dissipation groove. Detailed Implementation

[0018] The following drawings will disclose several embodiments of this utility model. For clarity, many practical details will be described in the following description. However, it should be understood that these practical details should not be used to limit this utility model. That is, in some embodiments of this utility model, these practical details are not essential. In addition, for the sake of simplicity, some conventional structures and components will be shown in the drawings in a simple schematic manner.

[0019] Please see Figure 1-3 In existing technologies, the heat generated by electronic devices and household appliances during prolonged operation can easily cause traditional plastic bases to soften and deform. While all-metal bases are heat-resistant, they suffer from high cost, heavy weight, and poor insulation. High-temperature resistant special engineering plastics are difficult to popularize due to material costs and processing difficulties. For example, in scenarios such as routers and automotive electronic components, high-temperature environments often cause base structural failures, necessitating a solution that combines cost-effectiveness and heat resistance.

[0020] To address these issues, researchers noticed that traditional single materials could not balance the trade-off between cost and performance. By analyzing heat conduction paths, they discovered that targeted protection could be achieved in localized high-temperature areas through material composites. Further research revealed that applying a high-temperature resistant layer to the surface of the substrate material could both reduce costs and improve heat resistance. Simultaneously, optimizing the heat dissipation structure could prevent heat accumulation, thereby reducing the overall temperature rise.

[0021] Therefore, this application proposes a high-temperature resistant plastic base including a plastic base body 1. The body includes a base layer 101 and a high-temperature resistant material layer 104 laminated on the surface. An installation groove 3 is opened at the top and a heat dissipation groove 5 is opened at the bottom. A heat dissipation hole 4 communicating with the heat dissipation groove 5 is provided at the bottom of the installation groove 3. A heat conduction hole 2 communicating with the heat dissipation groove 5 is also provided on the bottom surface of the base body.

[0022] Among them, the base layer 101 refers to the base layer that bears the structural strength. It can be achieved by injection molding process, such as ABS, PC, PP or PC / ABS alloy, and its function is to provide mechanical support for the whole.

[0023] The high-temperature resistant material layer 104 refers to the functional layer covering the surface of the base layer 101. It can be composited through an adhesive process, such as one of PPS, PA46, PBT or high-temperature nylon. Its function is to isolate the substrate from thermal damage caused by high temperature.

[0024] Mounting slot 3 refers to a recessed structure used to fix electronic components. It can be formed by molding and its function is to provide positioning space for the components.

[0025] The heat dissipation groove 5 refers to the airflow channel opened at the bottom, which can be formed by the grooving process. Its function is to accelerate air circulation to remove heat.

[0026] The heat dissipation hole 4 refers to the through hole connecting the mounting groove 3 and the heat dissipation groove 5. Specifically, it can be made by drilling or integral molding process. Its function is to guide the heat from the mounting area into the heat dissipation groove 5.

[0027] The heat conduction hole 2 refers to the hole on the bottom surface that connects to the heat dissipation groove 5. Specifically, it can be designed to be arranged in an array. Its function is to promote heat exchange between the external air and the heat dissipation groove 5.

[0028] Specifically, the base layer 101, acting as a supporting framework, is injection molded to achieve the desired shape. A high-temperature resistant material layer 104 is bonded to the surface of the base layer 101 using an adhesive to prevent direct contact between the heat source and the substrate. The mounting groove 3 provides mounting space for electronic components, and its bottom heat dissipation holes 4 guide the heat generated by the components to the bottom heat dissipation groove 5. The heat dissipation groove 5 and the heat conduction holes 2 together form an airflow channel. External air enters the heat dissipation groove 5 through the heat conduction holes 2, carries away heat, and is then discharged from the end of the groove, forming a passive heat dissipation cycle.

[0029] Compared to existing technologies, traditional solutions rely on a single material to improve temperature resistance, leading to soaring costs or processing difficulties. This solution achieves localized high-temperature protection through a layered composite structure, enhancing the thermal stability of critical areas while maintaining the cost advantage of the base material. Compared to an all-metal base, this solution retains the insulating properties of plastic and is lighter; compared to monolithic engineering plastic molding solutions, this solution only requires the use of high-temperature resistant material on the surface layer, significantly reducing material usage and processing complexity.

[0030] Through the above technical solution, this application effectively prevents the plastic base from softening and deforming under high temperature environments, extending the service life of electronic devices. The layered structure design avoids heat conduction to the base layer 101, reducing the risk of thermal aging of the substrate. The heat dissipation grooves 5 and through holes work together to improve heat dissipation efficiency and reduce the local temperature rise. At the same time, while maintaining the insulation performance of the plastic material, this solution achieves low-cost high-temperature protection through structural optimization, meeting the dual requirements of lightweight and reliability of electronic devices.

[0031] This application further proposes a high-temperature resistant plastic base, wherein the inner cavity of the base layer 101 is provided with reinforcing ribs 102, and the material of the reinforcing ribs 102 is steel.

[0032] Among them, the reinforcing rib 102 refers to the strip-shaped or grid-shaped support structure embedded in the internal cavity of the base layer 101. Specifically, it can be achieved by stamping or pre-embedded injection molding, and is used to improve the mechanical strength and deformation resistance of the base layer 101.

[0033] Among them, steel refers to metal materials with iron-carbon alloy as the main component, specifically cold-rolled steel, stainless steel or carbon steel. Its high elastic modulus and tensile strength can effectively suppress the creep phenomenon of plastic materials at high temperatures.

[0034] Specifically, by incorporating steel reinforcing ribs 102 within the internal cavity of the plastic base layer 101, the high rigidity of the steel can offset the deformation stress caused by the thermal expansion of the plastic material when the plastic base is subjected to high temperatures. When the base is subjected to external loads or temperature changes, the steel reinforcing ribs 102 and the plastic base layer 101 form a composite structure, in which the plastic material provides insulation and lightweight properties, while the steel bears the main mechanical support, thereby achieving structural stability while maintaining a low-cost injection molding process.

[0035] Compared to existing technologies, traditional plastic bases lack metal reinforcement structures and rely solely on a single material to resist high-temperature deformation. While all-metal bases offer high strength, they sacrifice lightweight and insulation. This solution, by locally embedding steel reinforcing ribs 102, avoids the high cost and complex processing of all-metal bases while overcoming the insufficient rigidity of pure plastic materials.

[0036] Through the above technical solution, this application solves the problem of reduced mechanical strength of plastic base due to material softening in high temperature environment. The steel reinforcing rib 102 constrains the thermal deformation behavior of the plastic matrix, so that the base can still maintain structural integrity under high temperature working conditions, without the need to use expensive high-performance engineering plastics or complex processing technology.

[0037] This application further proposes that the high-temperature resistant material layer 104 is bonded to the surface of the base layer 101 by an adhesive layer 103.

[0038] The adhesive layer 103 refers to the intermediate medium layer used to connect different materials, which can be achieved using a high-temperature adhesive or a compatibilizer. High-temperature adhesives can maintain bonding strength at high temperatures, such as epoxy resin or silicone adhesives; compatibilizers can improve the interfacial bonding between different plastics, such as maleic anhydride grafted polymers. This feature achieves a stable bond between the high-temperature resistant material layer 104 and the base layer 101 through chemical bonding, avoiding the risk of interfacial separation caused by physical fixation.

[0039] In this context, "composite" refers to the process of combining the high-temperature resistant material layer 104 with the base layer 101 into an integral structure through hot pressing or coating processes. Specifically, this can be achieved using in-mold injection molding or secondary lamination processes. This feature allows different materials to form an integrated structure, avoiding the assembly gaps and thermal expansion differences caused by traditional split designs.

[0040] Specifically, the surface of the base layer 101 is pre-coated with an adhesive or has compatibilizer particles added. Then, through heating and pressurization, a high-temperature resistant material layer 104 is chemically bonded to the base layer 101. During this process, the adhesive layer 103 melts and flows at high temperatures, filling the microscopic voids between the base layer 101 and the high-temperature resistant material layer 104, forming a continuously transitioning interface structure. By controlling the thickness of the adhesive layer 103, for example, within the range of 0.05 mm to 0.2 mm, both bonding strength and material cost can be ensured without excessively increasing material costs.

[0041] Compared to existing technologies, traditional solutions often use mechanical snap-fits or bolts to connect the high-temperature resistant layer and the base layer 101, resulting in high contact thermal resistance and complex assembly processes. Furthermore, the all-plastic composite structure is prone to delamination and cracking at high temperatures due to differences in material shrinkage rates. This solution achieves molecular-level interfacial bonding through the adhesive layer 103, effectively eliminating assembly gaps and matching the thermal expansion coefficients of different materials to avoid stress concentration caused by temperature changes.

[0042] Through the above technical solution, this application solves the problem of easy interface separation of traditional plastic bases under high temperature environments, enabling a stable bond between the high-temperature resistant material layer 104 and the base layer 101, ensuring that heat can be quickly conducted to the heat dissipation structure through the adhesive layer 103. This solution significantly improves the structural integrity and service life of the base under continuous high-temperature conditions while maintaining the advantages of low-cost injection molding.

[0043] This application further proposes a high-temperature resistant plastic base, wherein the base layer 101 is made of one of ABS, PC, PP or PC / ABS alloy.

[0044] ABS refers to acrylonitrile-butadiene-styrene copolymer, which can be produced by injection molding. It has good mechanical strength and processing fluidity, and can reduce production costs while ensuring structural stability.

[0045] PC refers to polycarbonate, which can be produced by extrusion or molding processes. It has a high heat distortion temperature, which can improve the matrix's resistance to deformation in high-temperature environments.

[0046] PP refers to polypropylene, which can be achieved through a blending modification process. Its chemical resistance and low density help reduce the overall weight of the base.

[0047] Among them, PC / ABS alloy refers to a blend of polycarbonate and ABS, which can be achieved by a twin-screw melt blending process. It combines the heat resistance of PC and the toughness of ABS, and can balance material cost and performance requirements.

[0048] Specifically, the base layer 101 is formed by selecting one of ABS, PC, PP, or PC / ABS alloy as the matrix material and combining it with injection molding to form the main structure of the base. These materials can be processed within the conventional injection molding temperature range without the need for additional equipment. For example, when using PC / ABS alloy, its heat distortion temperature can cover the conventional operating temperature range of electronic devices, while maintaining a match with the coefficient of thermal expansion of the high-temperature resistant material layer 104, avoiding delamination problems caused by temperature differences.

[0049] Compared to existing technologies, traditional solutions using only ABS or PC materials have insufficient heat distortion temperatures, while all-metal or PEEK and other specialty engineering plastics are too expensive. This solution, by limiting the matrix material to conventional engineering plastics or their alloys, ensures heat resistance while keeping material costs within the range applicable to traditional injection molding processes, and requires no changes to existing production line equipment.

[0050] Through the above technical solution, this application effectively solves the problem of softening and deformation caused by insufficient heat resistance of traditional plastic bases, while avoiding the high cost of all-metal or special plastic solutions. The selected material can maintain structural stability within the normal operating temperature range of electronic devices, and when it works in conjunction with the high-temperature resistant material layer 104 and the heat dissipation structure, it can meet the comprehensive requirements of routers, automotive electronics, and other scenarios for lightweight, low-cost, and high-temperature resistant bases.

[0051] This application further proposes that the material of the high-temperature resistant material layer 104 is one of PPS, PA46, PBT or high-temperature nylon.

[0052] PPS refers to polyphenylene sulfide, which can be made from linear polymers. Its molecular chain contains benzene rings and thioether bonds, and it has excellent high temperature resistance and dimensional stability.

[0053] PA46 refers to polyamide 46, which can be prepared by the polycondensation reaction of butanediamine and adipic acid. Its molecular chain has a high density of amide groups, which gives the material good heat resistance and mechanical strength.

[0054] PBT refers to polybutylene terephthalate, which can be synthesized by transesterification. The rigid benzene ring structure in its molecular chain can increase the heat distortion temperature of the material.

[0055] High-temperature nylon refers to polyamide materials with a long-term service temperature exceeding 150°C, which can be achieved by introducing aromatic monomers or increasing the rigidity of the molecular chain.

[0056] Specifically, when a high-temperature resistant material layer 104 is laminated onto the surface of the base layer 101 of the plastic base body 1, any material selected from PPS, PA46, PBT, or high-temperature nylon can form a protective layer with high thermal stability on the surface of the base layer 101. When the base comes into contact with a high-temperature environment, this material layer resists thermal degradation through the rigid structure or high crystallinity of its molecular chains, while maintaining structural integrity through the inherent low coefficient of thermal expansion of the material. For example, when PPS is used, its melting point is above 280℃, and it can maintain its mechanical properties for a long time at 180℃; when PA46 is used, its glass transition temperature can reach 160℃, which can effectively block heat transfer to the base layer 101.

[0057] Compared to existing technologies, traditional solutions using conventional plastics such as ABS or PC as a single material generally have heat distortion temperatures below 120℃. This solution, however, improves the overall temperature resistance of the base to over 150℃ by adding a specific high-temperature resistant material layer 104 to the surface of the base layer 101. Compared to using a single high-temperature resistant base made entirely of PEEK or PI material, this solution only adds functional layers to critical areas exposed to high temperatures, maintaining the low-cost injection molding characteristics of the base layer 101 while avoiding the high cost of specialized engineering plastics.

[0058] Through the above technical solution, this application can effectively prevent the plastic base from softening and deforming under high temperature conditions, avoid the release of harmful substances due to material thermal decomposition, and maintain a stable assembly relationship between the base and electronic components. In scenarios with localized high temperatures, such as electric kettles and automotive electronic control units, the high-temperature resistant material layer 104 can block heat conduction to the plastic base layer 101, extending the service life of the base under high-temperature conditions.

[0059] This application further proposes that the adhesive layer 103 is a high-temperature adhesive layer or a compatibilizer layer.

[0060] The high-temperature adhesive layer refers to the adhesive material layer that can maintain its bonding performance under high-temperature conditions. Specifically, it can be achieved by using polyimide adhesive or silicone-modified epoxy resin adhesive. Its function is to ensure that the high-temperature resistant material layer 104 and the base layer 101 can maintain stable bonding under high-temperature conditions and avoid interface peeling due to the difference in thermal expansion coefficient.

[0061] The compatibilizer layer refers to a functional layer that can improve the interfacial compatibility of different materials. Specifically, it can be achieved by using maleic anhydride grafted polymer or styrene-ethylene-butene-styrene copolymer. Its function is to enhance the interfacial bonding force between the high-temperature resistant material layer 104 and the base layer 101 through physical entanglement or chemical bonding between molecular chains, and to prevent delamination caused by the difference in material shrinkage rate under high temperature environment.

[0062] Specifically, the high-temperature resistant material layer 104 is laminated to the surface of the base layer 101 via a high-temperature adhesive layer or a compatibilizer layer. When a high-temperature adhesive layer is used, the adhesive forms a heat-resistant cross-linked network structure after curing, which can maintain the bonding strength at high temperatures. When a compatibilizer layer is used, the active groups in the compatibilizer molecules interact with the molecular chains of the base layer 101 and the high-temperature resistant material layer 104, forming a stable interfacial transition zone. Both methods can effectively solve the problem of traditional adhesive materials being prone to failure at high temperatures, ensuring that the composite structure maintains its integrity in long-term high-temperature environments.

[0063] Compared to existing technologies, conventional plastic bases often use ordinary adhesives to bond different material layers. These adhesives are prone to thermal decomposition or softening at high temperatures, leading to a decrease in interfacial adhesion. This solution, however, selects a high-temperature adhesive or compatibilizer as the bonding layer 103, which can adapt to thermal stress changes under high-temperature environments, avoiding interfacial delamination and thus improving the overall structural reliability of the base.

[0064] Through the above technical solution, this application solves the problem of interface delamination caused by the high temperature failure of the adhesive layer 103 in traditional plastic bases, ensuring that the high temperature resistant material layer 104 and the base layer 101 can still maintain a stable bond under high temperature conditions, extending the service life of the base and maintaining its mechanical properties.

[0065] The above description is merely an embodiment of this utility model and is not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principle of this utility model should be included within the scope of the claims of this utility model.

Claims

1. A high-temperature resistant plastic base, comprising a plastic base body (1), characterized in that: The plastic base body (1) includes a base layer (101), the surface of which is provided with a high temperature resistant material layer (104). The top of the plastic base body (1) is provided with an installation groove (3), the bottom of which is provided with a heat dissipation groove (5). The bottom of the inner cavity of the installation groove (3) is provided with a heat dissipation hole (4), and the inner cavity of the heat dissipation hole (4) is connected to the heat dissipation groove (5). The bottom of the surface of the plastic base body (1) is provided with a heat conduction hole (2), and the inner cavity of the heat conduction hole (2) is connected to the heat dissipation groove (5).

2. The high-temperature resistant plastic base according to claim 1, characterized in that: The inner cavity of the base layer (101) is provided with reinforcing ribs (102), and the material of the reinforcing ribs (102) is steel.

3. The high-temperature resistant plastic base according to claim 1, characterized in that: The high-temperature resistant material layer (104) is bonded to the surface of the base layer (101) via an adhesive layer (103).

4. The high-temperature resistant plastic base according to claim 1, characterized in that: The base layer (101) is made of one of ABS, PC, PP or PC / ABS alloy.

5. A high-temperature resistant plastic base according to claim 1, characterized in that: The material of the high-temperature resistant material layer (104) is one of PPS, PA46, PBT or high-temperature nylon.

6. A high-temperature resistant plastic base according to claim 3, characterized in that: The adhesive layer (103) is a high-temperature adhesive layer or a compatibilizer layer.

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