An electronic component packaging press device

Abstract

The utility model relates to electronic component technical field, and disclose a kind of electronic component packaging press bonding device.The device improves press bonding packaging effect by sealing cavity, temperature sensor, three groups of heating pipe, vacuum pump and control panel, and temperature signal in sealing cavity is transmitted to control panel by temperature sensor, to independently control three groups of heating pipe, realize partition temperature control, and also carry out air extraction to the air extraction passage in two groups of packaging groove box by vacuum pump and air extraction hose, to not only can satisfy different press bonding temperature demand, ensure that packaging area temperature is uniform, but also can avoid that packaging glue solidifies and blocks in entry area, simultaneously discharge the air bubble generated in packaging process, improve electronic component packaging press bonding effect.

Description

Technical Field

[0001] This utility model relates to the field of electronic components technology, and in particular to an electronic component packaging and pressing device. Background Technology

[0002] Electronic components are the building blocks of electronic parts and small machines and instruments. They are usually composed of several parts and can be used interchangeably in similar products.

[0003] Chinese Patent Publication No. CN220969696U discloses a computer electronic component packaging device, including a carrier plate, support legs, clamping components, guide grooves, support frames, limiting components, linear modules, hydraulic rods, connecting plates, dispensing needles, positioning needles, and cooling components. Through their coordinated arrangement, the clamping components clamp the computer electronic components, and after packaging, the cooling components accelerate the cooling and drying of the electronic components after dispensing, ensuring the working efficiency of dispensing and packaging computer electrical components.

[0004] Regarding the above and existing related technologies, the inventors believe that the following defects often exist: During the packaging process, the temperature requirements of the packaging area at different locations are different. If the local temperature is too high or too low, it will cause problems such as poor curing of the packaging material, poor soldering of component pins or damage to the internal chip. Furthermore, the air in the packaging box and the volatile gases generated during the curing of the packaging material cannot be discharged in time, which will form serious bubbles or voids in the packaging layer, thus resulting in poor packaging effect. Utility Model Content

[0005] The technical problem to be solved by this utility model is that the existing technology has the disadvantage of poor packaging effect when packaging and pressing electronic components. To this end, we propose an electronic component packaging and pressing device.

[0006] To achieve the above objectives, this application adopts the following technical solution: an electronic component packaging and pressing device, comprising: a worktable, and a mounting frame fixedly installed on the upper surface of the worktable, a movable housing slidably connected to the upper surface of the worktable, a lower mold disposed inside the movable housing, an upper mold disposed above the lower mold, a pressure-applying component disposed inside the mounting frame, an auxiliary component for improving the packaging effect disposed between the upper mold and the lower mold, and a control panel disposed on one side of the movable housing; The auxiliary components include a sealing cavity disposed between the movable housing and the upper and lower molds, and a temperature sensor disposed on the inner wall of the sealing cavity. The temperature sensor is connected to the control panel. Heating tubes are disposed inside the sealing cavity, with three sets of heating tubes arranged symmetrically in pairs. Each of the three sets of heating tubes is independently and electrically connected to the control panel. Encapsulation slots are disposed opposite each other inside the upper and lower molds. An air extraction channel is opened on one side of each set of encapsulation slots. An air extraction hose is fixedly installed at one end of the air extraction channel. One end of the air extraction hose passes through the outside of the sealing cavity and is equipped with a vacuum pump. The encapsulation effect is improved by controlling the temperature of different areas and removing air bubbles.

[0007] Preferably, the upper surface of the lower mold is provided with a labyrinth-type sealing groove, and the bottom of the upper mold is provided with a corresponding sealing strip. The sealing strip is fitted and connected to the inner wall of the labyrinth-type sealing groove to increase the sealing performance.

[0008] Preferably, a filter is connected in series between the suction hose and the vacuum pump to prevent impurities from entering the vacuum pump.

[0009] Preferably, a cooling cavity is provided between the movable housing and the bottom of the lower mold. A serpentine cooling pipe is provided inside the cooling cavity. The two ends of the serpentine cooling pipe extend out of the sealed cavity. A circulating water pump and a coolant tank are respectively connected to the two ends of the serpentine cooling pipe. The input end of the circulating water pump is connected to the coolant tank for rapid cooling and fixation after sealing.

[0010] Preferably, a motor is fixedly installed on one side of the workbench, and a lead screw is fixedly installed at the output end of the motor. A moving groove is opened on the upper surface of the workbench, and one end of the lead screw passes through the interior of the moving groove. A nut seat is threadedly connected to the outer surface of the lead screw. The upper surface of the nut seat is fixed to the bottom of the moving housing. An infrared sensor is set at the bottom of the mounting frame, and an infrared positioning mark is set on the upper surface of the lower mold. The infrared sensor is connected to the control panel signal. Moving the lower mold facilitates the disassembly and assembly of electronic components.

[0011] Preferably, the pressurizing assembly includes a hydraulic cylinder fixedly mounted on the upper surface of the mounting frame, and a hydraulic rod disposed at the bottom of the hydraulic cylinder. The hydraulic cylinder is connected to the output end of the hydraulic pump. One end of the hydraulic rod passes through the lower part of the mounting frame and is fixedly mounted on a mounting plate. The bottom of the mounting plate is fixedly connected to the upper surface of the upper mold. A pressure sensor is disposed inside the mounting plate. The pressure sensor is connected to the control panel for signal transmission and pressing.

[0012] Preferably, the lower mold has a filling channel inside, which is connected to the inside of the encapsulation tank through a branch pipe channel. One end of the filling channel is provided with a filling hose, one end of which passes through the outside of the sealed cavity and is connected to the output end of the output pump. The input end of the output pump is connected to the filling glue bucket through a pipe. A one-way valve is provided on the outer surface of the filling hose to encapsulate the electronic components with encapsulation glue.

[0013] Preferably, sealing rings are provided at the connection between the air extraction hose and the sealing cavity, as well as at the connection between the filling hose and the sealing cavity, to increase the sealing performance.

[0014] The technical effects and advantages of this utility model are as follows: In this invention, the device improves the pressing and sealing effect through a sealed cavity, a temperature sensor, three sets of heating tubes, a vacuum pump, and a control panel. The temperature sensor transmits the temperature signal inside the sealed cavity to the control panel, thereby independently controlling the three sets of heating tubes to achieve zoned temperature control. The vacuum pump and suction hose evacuate the suction channels in the two sets of sealing slots, which not only meets the different pressing temperature requirements and ensures uniform temperature in the sealing area, but also prevents the sealing adhesive from solidifying and clogging the inlet area, and removes air bubbles generated during the sealing process, thus improving the sealing and pressing effect of electronic components. Attached Figure Description

[0015] The disclosure of this utility model is illustrated with reference to the accompanying drawings. It should be understood that the drawings are for illustrative purposes only and are not intended to limit the scope of protection of this utility model. In the drawings, the same reference numerals are used to refer to the same parts: Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram showing the disassembled mounting bracket and workbench of this utility model; Figure 3 This is a schematic diagram of the interior of the movable housing and the upper mold of this utility model; Figure 4 This is a schematic diagram showing the internal disassembly of the movable housing of this utility model; Figure 5 This is a schematic diagram of part of the lower mold structure of this utility model.

[0016] Legend: 1. Workbench; 2. Mounting bracket; 21. Infrared sensor; 3. Motor; 31. Lead screw; 32. Nut seat; 4. Moving housing; 5. Lower mold; 51. Filling channel; 52. Branch pipe channel; 53. Filling hose; 54. Output pump; 55. Filling glue bucket; 6. Upper mold; 7. Pressurization assembly; 71. Hydraulic cylinder; 72. Hydraulic rod; 73. Mounting plate; 731. Pressure sensor; 8. Auxiliary assembly; 81. Sealing cavity; 82. Temperature sensor; 83. Heating tube; 84. Encapsulation slot; 841. Air extraction channel; 85. Air extraction hose; 86. Vacuum pump; 861. Filter; 87. Labyrinth sealing groove; 88. Sealing strip; 89. Cooling cavity; 891. Serpentine cooling tube; 892. Circulating water pump; 893. Coolant tank; 9. Control panel. Detailed Implementation

[0017] It is readily understood that, based on the technical solution of this utility model, those skilled in the art can propose various interchangeable structural methods and implementations without altering the essential spirit of this utility model. Therefore, the following detailed embodiments and accompanying drawings are merely illustrative descriptions of the technical solution of this utility model and should not be considered as the entirety of this utility model or as limitations or restrictions on the technical solution of this utility model.

[0018] Reference Figure 1 As shown, this utility model provides a technical solution: an electronic component packaging and pressing device, including: a workbench 1, and a mounting bracket 2 fixedly installed on the upper surface of the workbench 1. A movable housing 4 is slidably connected to the upper surface of the workbench 1. A lower mold 5 is provided inside the movable housing 4. An upper mold 6 is provided above the lower mold 5. A pressure-applying component 7 is provided inside the mounting bracket 2. An auxiliary component 8 for improving the packaging effect is provided between the upper mold 6 and the lower mold 5. A control panel 9 is provided on one side of the movable housing 4.

[0019] Reference Figures 1-5As shown, in this embodiment: the auxiliary component 8 includes a sealing cavity 81 disposed between the movable housing 4 and the upper mold 6 and the lower mold 5, and a temperature sensor 82 disposed above the inner wall of the sealing cavity 81. The temperature sensor 82 is connected to the control panel 9. A sealing ring is also disposed on the top of the movable housing 4, which is in contact with the outer surface of the upper mold 6. A heating tube 83 is disposed inside the sealing cavity 81. Three sets of heating tubes 83 are symmetrically arranged in pairs. The three sets of heating tubes 83 are independently electrically connected to the control panel 9, and all three sets of heating tubes 83 are in contact with the outer wall of the lower mold 5. The three sets of heating tubes 83 are independently controlled. The heating temperature of heat pipe 83 enables zoned temperature control, which not only meets the different actual requirements for pressing temperature and ensures the temperature uniformity of the encapsulation area, but also prevents the encapsulating adhesive from easily solidifying in the inlet area and causing blockage, thereby improving the encapsulation effect. The upper mold 6 and the lower mold 5 are respectively provided with encapsulation slots 84. Each of the two sets of encapsulation slots 84 has an exhaust channel 841 on one side. An exhaust hose 85 is fixedly installed at one end of the exhaust channel 841. One end of the exhaust hose 85 passes through the outside of the sealing cavity 81. A vacuum pump 86 is provided at one end of the exhaust hose 85 to remove air bubbles.

[0020] The upper surface of the lower mold 5 is provided with a labyrinth-type sealing groove 87, and the bottom of the upper mold 6 is provided with a corresponding sealing strip 88. The sealing strip 88 is fitted and connected to the inner wall of the labyrinth-type sealing groove 87 to increase the sealing between the upper mold 6 and the lower mold 5.

[0021] A filter 861 is connected in series between the suction hose 85 and the vacuum pump 86 to prevent impurities from entering and damaging the vacuum pump 86.

[0022] A cooling chamber 89 is provided between the bottom of the movable housing 4 and the lower mold 5. A serpentine cooling pipe 891 is provided inside the cooling chamber 89. Both ends of the serpentine cooling pipe 891 extend out of the sealed chamber 81. A circulating water pump 892 and a coolant tank 893 are connected to the two ends of the serpentine cooling pipe 891, respectively. The input end of the circulating water pump 892 is connected to the coolant tank 893. The circulating water pump 892 is started after the pressing is completed. The circulating water pump 892 pumps the coolant in the coolant tank 893 into the serpentine cooling pipe 891, absorbs heat, and then flows back to the coolant tank 893 to achieve rapid solidification and cooling.

[0023] A motor 3 is fixedly installed on one side of the workbench 1. A lead screw 31 is fixedly installed at the output end of the motor 3. A moving groove is opened on the upper surface of the workbench 1. One end of the lead screw 31 passes through the interior of the moving groove. A nut seat 32 is threadedly connected to the outer surface of the lead screw 31. The upper surface of the nut seat 32 is fixed to the bottom of the moving housing 4. An infrared sensor 21 is set at the bottom of the mounting bracket 2. An infrared positioning mark is correspondingly set on the upper surface of the lower mold 5. The infrared sensor 21 is signal-connected to the control panel 9. The motor 3 drives the lead screw 31 to rotate, so that the nut seat 32 drives the moving housing 4 to slide in the moving groove of the workbench 1, thereby realizing the movement of the lower mold 5, which facilitates the installation and removal of electronic components. When the infrared sensor 21 detects the infrared positioning mark, it sends a signal to the control panel 9. The control panel 9 controls the motor 3 to stop running, so that the lower mold 5 and the upper mold 6 are aligned.

[0024] The pressurizing assembly 7 includes a hydraulic cylinder 71 fixedly mounted on the upper surface of the mounting frame 2, and a hydraulic rod 72 disposed at the bottom of the hydraulic cylinder 71. The hydraulic cylinder 71 is connected to the output end of the hydraulic pump. One end of the hydraulic rod 72 passes through the lower part of the mounting frame 2 and is fixedly mounted on a mounting plate 73. The bottom of the mounting plate 73 is fixedly connected to the upper surface of the upper mold 6. A pressure sensor 731 is disposed inside the mounting plate 73. The pressure sensor 731 is connected to the control panel 9. The hydraulic pump supplies hydraulic oil to the hydraulic cylinder 71. The hydraulic cylinder 71 pushes the hydraulic rod 72 downward, causing the mounting plate 73 and the upper mold 6 to move downward and contact and press against the lower mold 5. During this process, the pressure sensor 731 inside the mounting plate 73 can detect the pressure during pressing and transmit the signal to the control panel 9 to avoid excessive or insufficient pressure.

[0025] The lower mold 5 has a filling channel 51 inside. The filling channel 51 is connected to the inside of the encapsulation box 84 through the branch pipe channel 52. A filling hose 53 is provided at one end of the filling channel 51. One end of the filling hose 53 passes through the outside of the sealing cavity 81. One end of the filling hose 53 is connected to the output end of the output pump 54. The input end of the output pump 54 is connected to the filling glue bucket 55 through the pipe. A one-way valve is provided on the outer surface of the filling hose 53. The output pump 54 pumps the encapsulating glue in the filling glue bucket 55 into the filling hose 53 through the pipe and prevents backflow through the one-way valve. Then the encapsulating glue enters the encapsulation box 84 through the filling channel 51 and the branch pipe channel 52 to encapsulate the electronic components.

[0026] Sealing rings are provided at the connection between the air extraction hose 85 and the sealing cavity 81, as well as at the connection between the filling hose 53 and the sealing cavity 81, to increase the sealing performance.

[0027] Working principle: The operator places the electronic components into the packaging slot 84 inside the lower mold 5, and then starts the motor 3 through the control panel 9, which drives the lead screw 31 to rotate. This causes the nut seat 32 to move the movable housing 4 and the lower mold 5 downwards to the upper mold 6. When the infrared sensor 21 detects the infrared positioning mark, it sends a signal to the control panel 9, which then stops the motor 3, aligning the lower mold 5 and the upper mold 6. Next, the hydraulic pump supplies hydraulic oil to the hydraulic cylinder 71, which pushes the hydraulic rod 72 downwards, causing the mounting plate 73 and the upper mold 6 to move downwards and press against the lower mold 5. During this process, the pressure sensor 731 inside the mounting plate 73 can detect the pressure during pressing and transmit the signal to the control panel 9 to prevent excessive or insufficient pressure. At the same time, because the sealing strip 88 at the bottom of the upper mold 6 fits into the labyrinth sealing groove 87 on the upper surface of the lower mold 5, and the sealing ring at the top of the movable housing 4 fits tightly against the outer surface of the upper mold 6, the sealing cavity 81 between the upper mold 6 and the lower mold 5 is further sealed. The encapsulating adhesive in the filling container 55 is then pumped into the filling hose 53 via the output pump 54, and backflow is prevented by a one-way valve. The encapsulating adhesive then enters the encapsulation box 84 through the filling channel 51 and the branch pipe channel 52 to encapsulate the electronic components. At the same time, the three sets of heating tubes 83 are activated through the control panel 9, and the heating temperature of different encapsulation areas is adjusted according to actual needs. The power of the heating tubes 83 is adjusted in real time by the temperature sensor 82 in the sealing cavity 81 to ensure uniform temperature in the encapsulation area. This not only meets the pressing temperature requirements of different areas, but also prevents the encapsulating adhesive from solidifying too early in the inlet area and causing blockage. In addition, the vacuum pump 86 needs to be activated to evacuate the inside of the encapsulation box 84 through the suction hose 85 and the suction channel 841, thereby removing air bubbles between the encapsulating adhesive and the electronic components. Impurities are filtered out by the filter 861 to prevent damage to the vacuum pump 86. In addition, sealing rings are provided at the connection between the suction hose 85 and the sealing cavity 81, and at the connection between the filling hose 53 and the sealing cavity 81, to further ensure the sealing performance of the sealing cavity 81. Finally, after sealing is completed, the circulating water pump 892 can be started to pump the coolant in the coolant tank 893 into the serpentine cooling pipe 891 in the cooling cavity 89, thereby quickly absorbing heat and flowing back to the coolant tank 893, accelerating the curing of the sealing adhesive.

[0028] The technical scope of this utility model is not limited to the content described above. Those skilled in the art can make various modifications and variations to the above embodiments without departing from the technical concept of this utility model, and all such modifications and variations should fall within the protection scope of this utility model.

Claims

1. An electronic component packaging and pressing device, characterized in that: The device includes a workbench and a mounting bracket fixedly installed on the upper surface of the workbench. A movable housing is slidably connected to the upper surface of the workbench. A lower mold is disposed inside the movable housing. An upper mold is disposed above the lower mold. A pressure-applying component is disposed inside the mounting bracket. An auxiliary component for improving the sealing effect is disposed between the upper mold and the lower mold. A control panel is disposed on one side of the movable housing. The auxiliary components include a sealed cavity disposed between the movable housing and the upper and lower molds, and a temperature sensor disposed above the inner wall of the sealed cavity. The temperature sensor is connected to the control panel. A heating tube is disposed inside the sealed cavity. Three sets of heating tubes are arranged symmetrically in pairs. Each of the three sets of heating tubes is independently and electrically connected to the control panel. Encapsulation slots are disposed opposite each other inside the upper and lower molds. A vacuum channel is opened on one side of each set of encapsulation slots. A vacuum hose is fixedly installed at one end of the vacuum channel. One end of the vacuum hose passes through the outside of the sealed cavity and a vacuum pump is disposed at one end of the vacuum hose.

2. The electronic component packaging and pressing device according to claim 1, characterized in that: The upper surface of the lower mold is provided with a labyrinth-type sealing groove, and the bottom of the upper mold is provided with a corresponding sealing strip, which is fitted and connected to the inner wall of the labyrinth-type sealing groove.

3. The electronic component packaging and pressing device according to claim 1, characterized in that: A filter is connected in series between the suction hose and the vacuum pump.

4. The electronic component packaging and pressing device according to claim 1, characterized in that: A cooling chamber is provided between the movable housing and the bottom of the lower mold. A serpentine cooling pipe is provided inside the cooling chamber. Both ends of the serpentine cooling pipe extend out of the sealed cavity. A circulating water pump and a coolant tank are respectively connected to both ends of the serpentine cooling pipe. The input end of the circulating water pump is connected to the coolant tank.

5. The electronic component packaging and pressing device according to claim 1, characterized in that: A motor is fixedly installed on one side of the workbench, and a lead screw is fixedly installed at the output end of the motor. A moving groove is opened on the upper surface of the workbench, and one end of the lead screw passes through the interior of the moving groove. A nut seat is threadedly connected to the outer surface of the lead screw, and the upper surface of the nut seat is fixed to the bottom of the moving housing. An infrared sensor is set at the bottom of the mounting frame, and an infrared positioning mark is correspondingly set on the upper surface of the lower mold. The infrared sensor is connected to the control panel signal.

6. The electronic component packaging and pressing device according to claim 1, characterized in that: The pressurization assembly includes a hydraulic cylinder fixedly mounted on the upper surface of the mounting frame, and a hydraulic rod disposed at the bottom of the hydraulic cylinder. The hydraulic cylinder is connected to the output end of the hydraulic pump. One end of the hydraulic rod passes through the lower part of the mounting frame and is fixedly mounted on a mounting plate. The bottom of the mounting plate is fixedly connected to the upper surface of the upper mold. A pressure sensor is disposed inside the mounting plate and is connected to the control panel for signal transmission.

7. The electronic component packaging and pressing device according to claim 1, characterized in that: The lower mold has a filling channel inside, which is connected to the inside of the packaging box through a branch pipe channel. A filling hose is provided at one end of the filling channel. One end of the filling hose passes through the outside of the sealing cavity. One end of the filling hose is connected to the output end of the output pump. The input end of the output pump is connected to the filling bucket through a pipe. A one-way valve is provided on the outer surface of the filling hose.

8. The electronic component packaging and pressing device according to claim 7, characterized in that: Sealing rings are provided at the connection between the air extraction hose and the sealing cavity, as well as at the connection between the filling hose and the sealing cavity.

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