Waterproof electronic device

Abstract

The utility model discloses a waterproof electronic device relates to electronic equipment technical field. The waterproof electronic device includes bottom shell, face shell, fixed base and rubber coating, the bottom shell with face shell cooperation forms the containing cavity, the fixed base is fixed in the outer surface of containing cavity, the fixed base is used for cooperation fixed with rubber coating mold when rubber coating, to make rubber coating mold form rubber coating on the outer surface of containing cavity. Through the fixed base and rubber coating mold cooperation fixed containing cavity, avoid rotating or deviating in the rubber coating process, solved the problem of high sealing cost, inaccuracy of positioning and the risk of infiltration in traditional technology, has the advantages of improving rubber coating uniformity, enhancing waterproof performance and product yield.

Description

Technical Field

[0001] This utility model belongs to the field of electronic equipment technology, and in particular relates to a waterproof electronic device. Background Technology

[0002] Electronic devices, due to their reliance on batteries, require highly waterproof casings. Traditional electronic devices typically consist of a bottom shell and a top shell, which fit together to form a cavity for housing internal components such as batteries. Current technologies primarily use O-rings or adhesive bonding for sealing and fixing, but this method has several drawbacks: First, ensuring a tight seal requires extremely high precision in the fit between the bottom and top shells, significantly increasing mold manufacturing costs; second, strict control over the texturing process and color consistency is necessary during surface treatment to avoid color differences; and third, this sealing method struggles to guarantee the overall integrity of the device, easily leading to stepped differences and gaps. Summary of the Invention

[0003] The technical problem to be solved by this utility model is to provide a waterproof electronic device, which addresses the issue of high precision requirements for the fit between the bottom shell and the top shell in existing electronic devices.

[0004] To address the aforementioned issues, this utility model provides a waterproof electronic device, comprising a bottom shell, a top shell, a mounting base, and an adhesive layer. The bottom shell and the top shell are fitted together to form a receiving cavity. The mounting base is fixed to the outer surface of the receiving cavity. The mounting base is used to cooperate with the adhesive molding mold during adhesive molding to ensure accurate positioning of the receiving cavity and prevent the receiving cavity from rotating or shifting during adhesive molding, so that the adhesive molding mold forms an adhesive layer on the outer surface of the receiving cavity.

[0005] Furthermore, this application also proposes that the outer surface of the receiving cavity is provided with at least two fixing seats.

[0006] Furthermore, this application also proposes that the outer surface of the receiving cavity is provided with two fixing seats, and the two fixing seats are symmetrically arranged on opposite sides of the receiving cavity.

[0007] Furthermore, this application also proposes that the two fixing seats are respectively located on the bottom shell and the top shell.

[0008] Furthermore, this application also proposes that the two fixing seats are respectively located on opposite sides of the bottom shell.

[0009] Furthermore, this application also proposes that the bottom shell and the top shell are fixedly connected by screws.

[0010] Furthermore, this application also proposes that the bottom shell and the top shell are fixedly connected by snap fasteners.

[0011] Furthermore, this application also proposes that the bottom shell and the top shell be fixedly connected by quick-drying adhesive.

[0012] Furthermore, this application also proposes that the bottom shell and / or the top shell are provided with a glue-blocking part, which is used to prevent silicone from entering the interior of the receiving cavity from the gap between the bottom shell and the top shell during the encapsulation process.

[0013] Furthermore, this application also proposes that the waterproof electronic device further includes a motherboard and a battery, both of which are installed inside the housing cavity.

[0014] The waterproof electronic device provided in this embodiment of the utility model has at least the following advantages compared with the prior art: by fixing the cavity with the fixing seat and the overmolding mold, rotation or displacement during the overmolding process is avoided, which solves the problems of high sealing cost, inaccurate positioning and risk of glue leakage in the traditional technology. It has the advantages of improving the uniformity of the overmolding layer, enhancing waterproof performance and product yield. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a cross-sectional view of the waterproof electronic device provided in one embodiment of the present invention when it is not coated with glue; Figure 2 This is a cross-sectional view of a waterproof electronic device being coated with adhesive according to an embodiment of this utility model; Figure 3 A schematic diagram of the structure of a waterproof electronic device provided in one embodiment of this utility model.

[0017] The reference numerals in the accompanying drawings are as follows: 100 - Waterproof electronic equipment, 110 - Bottom shell, 120 - Front shell, 130 - Mounting base, 140 - Insulation layer, 150 - Motherboard, 160 - Battery. Detailed Implementation

[0018] To make the technical problems solved, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0019] In the description of this utility model, it should be understood that the terms "longitudinal," "radial," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0020] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0021] In existing technologies, the outer casing of electronic devices typically consists of a bottom shell 110 and a front shell 120 forming a housing cavity, inside which components such as a battery 160 are installed. Traditional sealing methods rely on O-rings or adhesive application processes, requiring extremely high precision in the fit between the bottom shell 110 and the front shell 120, and necessitating strict control of mold processing errors. This process easily leads to color differences after the outer casing surface treatment, and it is difficult to guarantee the consistency of the texture on the upper and lower covers, affecting the overall appearance of the device. During the overmolding process, due to the lack of an effective positioning structure, the housing cavity is prone to displacement or rotation, resulting in uneven distribution of the overmolding layer 140 and affecting waterproof performance.

[0022] To address the aforementioned issues, designers discovered that the key to the overmolding process lies in the stable positioning of the cavity. Traditional methods reduce offset by improving mold machining accuracy, but this significantly increases manufacturing costs. Through repeated experiments, it was found that setting an auxiliary positioning structure on the outer surface of the cavity effectively solves the problem. By analyzing the clamping method of the overmolding mold, a fixing seat 130 is proposed as a positioning reference point on the outer surface of the cavity, utilizing the corresponding structure of the mold to achieve bidirectional fixation.

[0023] Therefore, please refer to Figures 1 to 3This application proposes a waterproof electronic device 100 comprising a bottom shell 110, a front shell 120, a mounting base 130, and an adhesive layer 140. The bottom shell 110 and the front shell 120 cooperate to form a receiving cavity, and the mounting base 130 is fixed to the outer surface of the receiving cavity. During the adhesive layering process, the mounting base 130 cooperates with the mold to achieve precise positioning, prevent the cavity from rotating or shifting, and ensure that the adhesive layer 140 evenly covers the outer surface of the cavity to form a waterproof structure.

[0024] The bottom shell 110 refers to the shell component that forms the bottom support structure of the equipment, and can be manufactured using injection molding, for example, using ABS or PC materials. The top shell 120 refers to the top shell that cooperates with the bottom shell 110 to form a closed space, and its edge shape complements that of the bottom shell 110. The fixing seat 130 refers to the positioning boss set on the outer surface of the cavity, which can be a columnar structure integrally molded with the shell, such as a cylinder with a diameter of 5mm, and the surface can be provided with anti-slip textures. The overlay layer 140 refers to an elastic sealing layer formed by injection molding, for example, using liquid silicone material to form a continuous cover layer with a thickness of 1mm on the outer surface of the cavity.

[0025] Specifically, the bottom shell 110 and the front shell 120 are connected by snaps or screws to form a sealed receiving cavity, where electronic components are installed. Two fixing seats 130 are set at specific positions on the outer surface of the cavity. During the overmolding operation, the clamping mechanism of the overmolding mold precisely engages with the fixing seats 130. After the mold closes, liquid silicone is injected into the mold cavity and wraps around the outer surface of the cavity. The mechanical limiting effect provided by the fixing seats 130 completely eliminates the axial rotation and radial displacement of the cavity during the overmolding process, ensuring that the silicone is evenly distributed in the predetermined area. After the overmolding is completed, the silicone layer completely covers the surface of the cavity and forms a waterproof barrier, while the recessed structure formed at the fixing seats 130 does not affect the overall appearance of the equipment.

[0026] Compared to existing technologies, traditional solutions rely on improving the precision of the shell fit to ensure the quality of the overmolding, requiring repeated mold adjustments and resulting in a low yield rate. This solution reduces the requirements for shell fit precision by adding a fixing base 130 to form a physical positioning reference. The overmolding mold can be quickly positioned directly through the fixing base 130, eliminating the need for complex position calibration procedures. This design effectively solves the problems of color difference between the upper and lower covers and surface treatment consistency while ensuring waterproof performance, resulting in a seamless appearance between the overmolding layer 140 and the shell.

[0027] After the bottom shell 110 and the front shell 120 are assembled, they are coated with rubber, resulting in a high-quality surface and strong integration. This solves the overall waterproof reliability problem, enabling IP67 and IP68 waterproofing. The internal structure is simplified, eliminating the need for a waterproof structure and improving structural reliability. The precision requirements for external components are reduced; surface imperfections do not affect the appearance after coating. Differences in dimensions, scratches, and color variations between different parts are concealed by the outermost rubber layer 140. The coating temperature is low, preventing high temperatures from deforming the plastic shell during secondary coating, and ensuring that internal electronic components and the battery 160 are not damaged. The appearance is highly variable, allowing for easy switching between different styles, and the mold forming process is flexible.

[0028] Through the above technical solution, this application solves the core problem of unstable cavity positioning during the overmolding process. The positioning mechanism of the fixing seat 130 and the mold significantly improves the molding accuracy of the overmolding layer 140 and avoids sealing failure caused by cavity misalignment. This structural design simplifies the processing requirements of the outer shell, reduces mold development costs, and improves the overall appearance and waterproof reliability of the product.

[0029] Please see Figures 1 to 3 This application further proposes that the outer surface of the receiving cavity is provided with at least two fixing seats 130.

[0030] Among them, the fixed seat 130 refers to the positioning structure used to cooperate with the overmolding mold during the overmolding process. Specifically, it can be implemented by injection molding or metal insert. Its function is to restrict the degree of freedom of the receiving cavity through multi-point contact.

[0031] Among them, at least two fixed seats 130 refers to two or more positioning structures, which can be implemented in a symmetrical or asymmetrical manner. By increasing the number of fixed points, the clamping force applied by the overmolding mold can be dispersed, thereby avoiding positioning failure caused by single-point force.

[0032] Specifically, during the overmolding process, when the overmolding mold applies pressure to the receiving cavity, if only a single fixing seat 130 is provided, the receiving cavity may shift or rotate due to uneven force, resulting in inconsistent thickness of the overmolding layer 140 or localized missing coverage. By providing at least two fixing seats 130 on the outer surface of the receiving cavity, the overmolding mold can simultaneously clamp multiple fixing points, maintaining a stable posture of the receiving cavity within the mold, thereby ensuring that the overmolding material uniformly covers the target area. For example, the fixing seat 130 can be designed as a boss structure, forming a fitting relationship with the groove on the mold, further restricting displacement.

[0033] Compared to existing technologies, traditional overmolding processes typically rely on a single fixing point or the clamping force of the mold itself to secure the electronic device casing. This can easily lead to casing deformation or positioning deviation due to concentrated clamping force. This solution increases the number of fixing seats 130, distributing the clamping force to multiple contact points. This reduces the structural strength requirements of individual fixing points, improves positioning accuracy, and reduces reliance on mold fitting precision.

[0034] Through the above technical solution, this application solves the problem of unevenness of the overmolding layer 140 caused by shell misalignment during the overmolding process. The multi-point positioning mechanism effectively suppresses the rotation and displacement of the receiving cavity, ensuring that the overmolding layer 140 completely covers the shell surface, thereby improving the waterproof sealing performance of the electronic device. Furthermore, this solution reduces the requirements for shell assembly precision and simplifies mold design complexity.

[0035] Please see Figures 1 to 3 This application further proposes that the outer surface of the receiving cavity is provided with two fixing seats 130, and the two fixing seats 130 are symmetrically arranged on opposite sides of the receiving cavity.

[0036] Among them, the fixed seat 130 refers to the boss structure formed by injection molding or machining. Specifically, it can be achieved by using a metal insert or by integral molding with the bottom shell 110. Its function is to cooperate with the positioning groove of the overmolding mold to restrict the degree of freedom of the receiving cavity during the overmolding process.

[0037] The symmetrical arrangement on opposite sides means that the two fixed seats 130 are located at the two ends of the length or width of the cavity, respectively. Specifically, they can be achieved by adopting a mirror symmetry or central symmetry layout. Their function is to balance the clamping force applied by the overmolding mold and avoid the cavity from shifting due to force on one side.

[0038] Specifically, in the overmolding process, the receiving cavity is placed inside the cavity of the overmolding mold, at which point two fixing seats 130 are respectively embedded in the corresponding positioning slots of the mold. Since the fixing seats 130 are symmetrically distributed on both sides of the cavity, the clamping force applied when the mold closes is evenly distributed on both sides, preventing the receiving cavity from rotating or translating in the horizontal direction. In this state, liquid silicone is injected into the mold cavity and wraps around the outer surface of the receiving cavity, ultimately forming a complete and uniformly thick overmolding layer 140.

[0039] Compared to existing technologies, which typically use only a single fixing seat 130 or an asymmetrically distributed fixing structure, uneven force during the overmolding process can easily cause the cavity to tilt, resulting in offset or uneven thickness of the overmolding layer 140. The symmetrically arranged fixing seats 130, through a bidirectional constraint mechanism, effectively eliminate the torque imbalance problem caused by unilateral force application.

[0040] Through the above technical solution, this application solves the problem of defective coverage of the encapsulation layer 140 caused by misalignment of the cavity during the encapsulation process, ensuring that the silicone layer completely encapsulates the electronic device shell, avoiding local waterproof failure caused by encapsulation offset, and reducing the dependence on the fitting accuracy of the bottom shell 110 and the top shell 120.

[0041] This application further proposes two fixing seats 130 respectively located on the bottom shell 110 and the top shell 120.

[0042] The bottom shell 110 refers to the main structure that forms the bottom of the cavity. It can be made of injection-molded engineering plastic or metal material and is used to support the internal electronic components and form a sealed fit with the front shell 120.

[0043] Among them, the front shell 120 refers to the shell component that covers the bottom shell 110. Specifically, it can be made of the same or compatible material and molding process as the bottom shell 110. It is used to seal the cavity and together with the bottom shell 110 forms a waterproof structure.

[0044] The fixed base 130 refers to the positioning structure used to cooperate with the overmolding mold. Specifically, it can be implemented by a boss, slot or positioning post integrally formed with the bottom shell 110 or the top shell 120. Through a split design, it is integrated on the bottom shell 110 and the top shell 120 respectively to ensure the overall positioning stability of the cavity during the overmolding process.

[0045] Specifically, after the bottom shell 110 and the top shell 120 are assembled to form the receiving cavity, the fixing seats 130 are respectively distributed on the outer surfaces of the bottom shell 110 and the top shell 120. In the overmolding process, the overmolding mold holds the receiving cavity in a fixed position within the mold by clamping the fixing seats 130 on the bottom shell 110 and the top shell 120. Since the fixing seats 130 are respectively located on the bottom shell 110 and the top shell 120, the clamping force of the mold on the two shells is evenly distributed, avoiding excessive force on a single shell that could lead to deformation. At the same time, it eliminates the risk of relative displacement between the bottom shell 110 and the top shell 120, ensuring that the overmolding layer 140 completely covers the outer surface of the receiving cavity.

[0046] Compared to existing technologies, where the fixing structure is typically concentrated on a single housing, the other housing may shift during overmolding due to a lack of positioning support. This solution addresses this by distributing the fixing base 130 on both the bottom housing 110 and the top housing 120, allowing the mold to simultaneously constrain both housings, thus improving positioning accuracy and reducing reliance on the housing's fit precision.

[0047] Through the above technical solution, this application solves the problem of overall displacement caused by the lack of independent positioning structure between the bottom shell 110 and the top shell 120 during the overmolding process, effectively avoids uneven thickness or local glue leakage defects caused by shell displacement of the overmolding layer 140, and at the same time reduces the requirements for the assembly accuracy of the bottom shell 110 and the top shell 120, simplifies the production process and improves the yield of finished products.

[0048] Please see Figures 1 to 3 This application further proposes two fixing seats 130 respectively located on opposite sides of the bottom shell 110.

[0049] The fixed seat 130 refers to the positioning structure used to cooperate with the overmolding mold during the overmolding process. Specifically, it can be implemented by using a protrusion, a groove, or a metal insert with a positioning hole. It prevents the receiving cavity from shifting or rotating during overmolding through physical limiting.

[0050] The opposite sides of the bottom shell 110 refer to two areas of the bottom shell 110 that are symmetrical to each other in the horizontal direction. Specifically, they can be the shell surfaces on the left and right sides or the front and back sides of the bottom shell 110. By symmetrically distributing the fixing seats 130, the clamping force applied by the overmolding mold is balanced on both sides of the bottom shell 110, avoiding displacement caused by force on one side.

[0051] Specifically, during the overmolding process, fixing seats 130 are respectively provided on opposite sides of the bottom shell 110. The overmolding mold clamps the fixing seats 130 on both sides to fix the receiving cavity in a preset position. Since the fixing seats 130 are symmetrically distributed on both sides of the bottom shell 110, the clamping force applied by the mold forms a symmetrical constraint on the bottom shell 110, thereby eliminating cavity displacement or rotation caused by uneven force during the overmolding process. In addition, the fixing seats 130 are directly set on the bottom shell 110 rather than the top shell 120, which can avoid the positioning accuracy being affected by the assembly error between the top shell 120 and the bottom shell 110, and further ensure that the overmolding layer 140 uniformly covers the outer surface of the receiving cavity.

[0052] Compared with existing technologies, the existing technologies do not clearly define the setting position of the fixing seat 130, which may lead to reliance on unilateral or asymmetrical fixing during overmolding, easily causing cavity displacement due to unbalanced forces. In contrast, this solution uses symmetrically set fixing seats 130 to make the mold clamping force evenly distributed, which not only improves positioning stability, but also reduces the dependence on the fitting accuracy of the bottom shell 110 and the top shell 120, thereby simplifying mold design and reducing the risk of color difference.

[0053] Through the above technical solution, this application solves the problem of unevenness of the adhesive layer 140 caused by cavity misalignment during the encapsulation process, ensuring that the adhesive layer 140 completely covers the outer surface of the cavity and improves the waterproof performance of the electronic device. At the same time, the symmetrical layout of the mounting base 130 reduces the requirements for the assembly accuracy of the bottom shell 110 and the front shell 120, and reduces rework costs caused by fitting errors.

[0054] This application further proposes that the bottom shell 110 and the front shell 120 are fixedly connected by screws.

[0055] The screw fastening connection refers to the mechanical connection of the bottom shell 110 and the top shell 120 using threaded fasteners. Specifically, it can be achieved by using self-tapping screws, machine screws with nuts, or threaded holes. The screw fastening connection can provide a stable mechanical locking force, preventing the bottom shell 110 and the top shell 120 from shifting when subjected to external forces, thereby ensuring the fitting accuracy between the two.

[0056] Specifically, during assembly, threaded holes or through holes are pre-set at corresponding positions on the bottom shell 110 and the top shell 120. After the bottom shell 110 and the top shell 120 are aligned to form a receiving cavity, screws are screwed into the corresponding threaded holes, and the axial pressure generated by the threads tightly presses the two shells together. This connection method does not rely on glue curing time, the assembly process is highly reversible, and it is easy to disassemble for later maintenance. In addition, the distribution and number of screws can be adjusted according to the shell size, for example, one screw can be set at each of the four corners of the shell to form a uniform distribution of clamping force.

[0057] This application further proposes that the bottom shell 110 and the front shell 120 are fixedly connected by a snap fastener.

[0058] Among them, the snap-fit ​​connection refers to the connection achieved by the mechanical interlocking structure of the snap hook and the snap slot. Specifically, it can be achieved by setting an elastic snap hook on the edge of the bottom shell 110 and setting a snap slot at the corresponding position on the front shell 120. After the snap hook is embedded in the snap slot, an irreversible fixed state is formed.

[0059] The bottom shell 110 and the front shell 120 are two independent components that constitute the outer shell of the electronic device. They can be made of injection-molded plastic parts or metal stamping parts. The bottom shell 110 carries the internal components, and the front shell 120 covers the bottom shell 110 to form a closed structure.

[0060] Specifically, during the assembly of the bottom shell 110 and the front shell 120, the engagement relationship between the hook and the slot is positioned by a mechanical structure. When the bottom shell 110 and the front shell 120 are mated, the hook is compressed and undergoes elastic deformation until it is fully embedded in the slot and then returns to its original shape, forming a rigid connection. This method does not rely on the auxiliary fixation of glue or sealing rings. The glue-blocking part can be set around the buckle connection to prevent silicone from seeping into the receiving cavity during the glue application process.

[0061] This application further proposes that the bottom shell 110 and the top shell 120 be fixedly connected by quick-drying adhesive.

[0062] Among them, fast-drying adhesive refers to bonding materials with a curing time shorter than conventional adhesives. Specifically, cyanoacrylate adhesives can be used, and their curing time can be controlled within the range of 10-60 seconds. This feature prevents relative displacement between the bottom shell 110 and the top shell 120 before the overmolding process by quickly forming a bonding interface.

[0063] The fixed connection refers to the formation of a rigid, non-removable joint. This can be achieved by continuously applying an adhesive layer to the contact surfaces of the bottom shell 110 and the top shell 120, which completely fills the gap between the contact surfaces after curing. This feature is used to maintain the positioning accuracy of the bottom shell 110 and the top shell 120 during the overmolding process and to prevent the shell assembly from shifting due to external forces when the overmolding layer 140 is formed.

[0064] Specifically, the quick-drying adhesive forms a continuous sealing layer at the contact edge between the bottom shell 110 and the top shell 120, and after curing, it forms a mechanically interlocking structure. When pressure is applied by the overmolding mold, the rigid support of the quick-drying adhesive effectively resists the flow impact of the overmolding material. The volume shrinkage generated during the curing process is controlled within the microscopic gaps of the contact surface, preventing overall deformation of the shell assembly.

[0065] Compared to existing technologies, traditional O-ring seals require precise control of the dimensional tolerances of the housing mating surfaces, while quick-drying adhesives can compensate for assembly gaps through their flowability. Conventional dispensing processes require a curing time of more than 24 hours, while quick-drying adhesives can be applied immediately before the overmolding process. This improvement eliminates the secondary positioning process for the housing components before overmolding, and also avoids the risk of adhesive contamination caused by prolonged curing.

[0066] Through the above technical solution, this application reduces the shell assembly process time to less than 1 / 30 of the conventional process while ensuring waterproof performance, and eliminates the need for high-precision machining of the shell mating surfaces. The transparency of the quick-drying adhesive also avoids the color difference problem of adhesive marks that may occur in traditional dispensing processes, ensuring that the appearance of the product after overmolding remains consistent.

[0067] This application further proposes that the bottom shell 110 and / or the top shell 120 are provided with a glue-blocking part, which is used to prevent silicone from entering the interior of the receiving cavity from the gap between the bottom shell 110 and the top shell 120 during the coating process.

[0068] The adhesive-blocking part refers to the raised structure located on the edge of the bottom shell 110 or the front shell 120. It can be implemented using continuous flanges or intermittent protrusions, and its height and width can be adjusted according to the gap dimensions. This structure physically blocks the flow path of the silicone, preventing liquid silicone from seeping into the cavity during the encapsulation process.

[0069] The gap refers to the joint area formed after the bottom shell 110 and the front shell 120 are assembled. The gap width can be controlled by adjusting the assembly tolerance. The glue-blocking part forms a sealing barrier by covering this area.

[0070] Specifically, during the encapsulation process, liquid silicone is injected into the mold and encapsulates the outer surface of the cavity. The silicone baffle is tightly attached to the joint between the bottom shell 110 and the top shell 120, forming a continuous closed barrier interface. When the silicone is filled under pressure, the silicone baffle engages with the inner wall of the mold, forcing the silicone to flow along a predetermined path and preventing it from entering the cavity through gaps. After the mold closes, the silicone solidifies to form an encapsulation layer 140, and the silicone baffle is encapsulated within the encapsulation layer 140, while maintaining the internal sealing of the cavity.

[0071] In some specific embodiments, the adhesive blocking part can be an annular boss extending outward from the edge of the bottom shell 110, for example, the boss height is 0.5-1.2 mm and the width is 0.8-1.5 mm; or the adhesive blocking part can be a groove structure provided on the inner side of the front shell 120, the groove depth is 0.3-0.8 mm, used to accommodate overflowing silicone and form a mechanical interlock.

[0072] Compared to existing technologies, which rely on a high-precision fit between the bottom shell 110 and the top shell 120 for sealing and require strict control of assembly tolerances to prevent silicone leakage, this solution actively blocks the silicone flow path through a sealant baffle, reducing the requirements for assembly precision. Furthermore, the sealant baffle is directly integrated into the bottom shell 110 or the top shell 120, eliminating the need for additional seals and avoiding the risk of failure caused by O-ring aging or uneven dispensing.

[0073] Through the above technical solution, this application effectively prevents silicone from seeping into the interior of electronic devices during the encapsulation process, ensuring the safety of components such as the battery 160 and motherboard 150 inside the cavity, while reducing color difference problems caused by the complexity of the sealing structure and improving the overall appearance consistency.

[0074] Please see Figures 1 to 2 This application further proposes that the waterproof electronic device 100 also includes a motherboard 150 and a battery 160, both of which are installed inside the housing cavity.

[0075] Among them, the motherboard 150 refers to the core circuit unit that controls the operation of electronic equipment. Specifically, it can be implemented by using multi-layer printed circuit boards and electronic components soldered together. By fixing it inside the housing, the interference of the external environment on the circuit stability can be avoided.

[0076] Among them, battery 160 refers to the energy storage unit that provides electrical energy to electronic devices. Specifically, it can be implemented by using lithium-ion battery 160 or nickel-metal hydride battery 160 in conjunction with electrode contacts. By integrating it inside the housing, the power supply module and the device structure can be spatially integrated.

[0077] Specifically, the motherboard 150 is fixed to the inner flat area of ​​the bottom shell 110 of the receiving cavity by screws or clips, while the battery 160 is installed in the corresponding recessed area of ​​the front shell 120 by a slot or adhesive. The two are spatially isolated after the bottom shell 110 and the front shell 120 are closed. This layout allows the wiring of the motherboard 150 and the battery 160 to be directly connected through the internal pre-set wire channels, avoiding the sealing risks caused by external openings, while the overall sealing structure of the receiving cavity prevents liquid infiltration.

[0078] Compared to existing technologies, traditional solutions often employ an external, separate design for the battery 160 or install it in a separate area from the motherboard 150, resulting in low internal space utilization and the need for additional waterproofing structures. This solution integrates the motherboard 150 and battery 160 into the same sealed cavity, eliminating assembly errors caused by separate designs and achieving dual waterproofing protection through the overall cavity encapsulation layer 140.

[0079] Through the above technical solution, this application effectively solves the problem of complicated sealing structure caused by the dispersion of internal components of electronic devices. While ensuring power supply stability, it reduces the number of external openings and reduces the liquid intrusion path through spatial integration, thereby improving the overall waterproof reliability of the device and simplifying the assembly process.

[0080] The above-described embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model, and should all be included within the protection scope of this utility model.

Claims

1. A waterproof electronic device, characterized in that, It includes a bottom shell, a top shell, a fixing base, and an adhesive layer. The bottom shell and the top shell cooperate to form a receiving cavity. The fixing base is fixed to the outer surface of the receiving cavity. The fixing base is used to cooperate with the adhesive mold during adhesive coating so that the adhesive mold forms the adhesive layer on the outer surface of the receiving cavity.

2. The waterproof electronic device according to claim 1, characterized in that, The outer surface of the receiving cavity is provided with at least two of the fixing seats.

3. The waterproof electronic device according to claim 2, characterized in that, The outer surface of the receiving cavity is provided with two fixing seats, and the two fixing seats are symmetrically arranged on opposite sides of the receiving cavity.

4. The waterproof electronic device according to claim 3, characterized in that, The two fixing seats are respectively located on the bottom shell and the top shell.

5. The waterproof electronic device according to claim 3, characterized in that, The two fixing seats are respectively located on opposite sides of the bottom shell.

6. The waterproof electronic device according to claim 1, characterized in that, The bottom shell and the top shell are fixedly connected by screws.

7. The waterproof electronic device according to claim 1, characterized in that, The bottom shell and the top shell are fixedly connected by snap fasteners.

8. The waterproof electronic device according to claim 1, characterized in that, The bottom shell and the top shell are fixedly connected by quick-drying adhesive.

9. The waterproof electronic device according to claim 1, characterized in that, The bottom shell and / or the top shell are provided with a glue-blocking part, which is used to prevent silicone from entering the interior of the receiving cavity from the gap between the bottom shell and the top shell during the coating process.

10. The waterproof electronic device according to claim 1, characterized in that, The waterproof electronic device also includes a motherboard and a battery, both of which are installed inside the receiving cavity.

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