Heat dissipation device and electronic device

Abstract

The application discloses a heat dissipation device and electronic equipment. The heat dissipation device comprises a heat absorption part, an adapter and a heat dissipation part. The heat absorption part has a containing space for containing heat dissipation fluid. The heat absorption part is provided with at least one inlet and at least one outlet communicating with the containing space. The size of the inlet along a first direction is smaller than the size of the inlet along a second direction. The size of the outlet along the first direction is smaller than the size of the outlet along the second direction. A first surface of the heat absorption part is used for adhering to a heating component. A first end of the adapter is matched with the inlet or the outlet to detachably connect the inlet or the outlet. A second end of the adapter is different from the first end. The second end of the adapter is used for detachably connecting a flow guide pipe. The heat dissipation part is used for being communicated between the inlet and the outlet of the heat absorption part through the flow guide pipe and the adapter, so that the heat dissipation fluid can transmit the absorbed heat to the heat dissipation part through the flow guide pipe and return to the heat absorption part through the inlet. The first direction and the first surface satisfy a vertical condition. The second direction and the first direction satisfy a vertical condition.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology for electronic devices, and more particularly to a heat dissipation device and electronic device. Background Technology

[0002] Electronic devices can be cooled by water, for example, by connecting a power pump to a radiator and a cold block through pipes. The cold block is in direct contact with the heat source, and the cooling is achieved by circulating coolant between the radiator and the cold block.

[0003] However, for higher heat dissipation efficiency requirements, the inlet and outlet water flow rate or inlet and outlet water velocity of the cold head also needs to be large, which leads to the selection of larger diameter pipe fittings. However, larger diameter pipe fittings will increase the overall size of the cold head and be more limited by the installation space. Utility Model Content

[0004] The first aspect of this application provides a heat dissipation device, which includes...

[0005] The heat-absorbing part has a receiving space for receiving heat dissipation fluid; the heat-absorbing part is provided with at least one inlet and at least one outlet communicating with the receiving space, the dimension of the inlet along a first direction is smaller than its dimension along a second direction, and the dimension of the outlet along the first direction is smaller than its dimension along the second direction; the first surface of the heat-absorbing part is used to adhere to the heating element.

[0006] An adapter, wherein a first end of the adapter is adapted to the inlet or the outlet for detachable connection to the inlet or the outlet, and a second end of the adapter is different from its first end, and the second end of the adapter is used for detachable connection to a guide tube;

[0007] A heat dissipation section is connected between the inlet and outlet of the heat absorption section via the guide pipe and the adapter, so that the heat dissipation fluid can transfer the absorbed heat to the heat dissipation section through the guide pipe and return to the heat absorption section through the inlet;

[0008] Wherein, the first direction is perpendicular to the first surface, and the second direction is perpendicular to the first direction.

[0009] In some modified embodiments of the first aspect of this application, the aforementioned heat dissipation device, wherein the radial cross-section of the second end of the adapter is circular, and the dimension of the second end of the adapter along the first direction is greater than the dimension of its first end along the first direction.

[0010] In some modified embodiments of the first aspect of this application, the aforementioned heat dissipation device, wherein the first end of the adapter includes an inner layer and an outer layer stacked together;

[0011] An accommodating space is formed between the inner layer and the outer layer, and the accommodating space is used to accommodate the inlet or the outlet;

[0012] The outer layer has at least one sealing protrusion on one side surface facing the inner layer, the sealing protrusion being used to abut against the outer wall of the inlet or the outlet.

[0013] In some modified embodiments of the first aspect of this application, the aforementioned heat dissipation device, wherein the sealing protrusion is elastic; or

[0014] The sealing protrusion is integrally formed with the outer layer.

[0015] In some modified embodiments of the first aspect of this application, the aforementioned heat dissipation device, wherein the number of inlets on the heat absorption section is different from the number of outlets; or

[0016] The number of inlets on the heat-absorbing section is equal to the number of outlets.

[0017] In some modified embodiments of the first aspect of this application, the aforementioned heat dissipation device is provided with a flow channel in the heat absorption section, and both the inlet and the outlet are connected to the flow channel;

[0018] In this configuration, several of the inlets connect to the flow channel to form parallel heat dissipation paths; or several of the inlets connect to the flow channel to form interconnected heat dissipation paths.

[0019] In some modified embodiments of the first aspect of this application, the aforementioned heat dissipation device, wherein the inlet and the outlet are disposed opposite to the heat absorption portion;

[0020] The dimensions of the inlet and the outlet in the first direction are smaller than the dimensions of the heat-absorbing part in the first direction.

[0021] In some modified embodiments of the first aspect of this application, the aforementioned heat dissipation device, wherein the outer wall of the second end of the adapter is threaded; or

[0022] The second end of the adapter has an adhesive area on its outer wall.

[0023] In some modified embodiments of the first aspect of this application, the aforementioned heat dissipation device further includes a power device;

[0024] The power unit is disposed between the heat absorption section and the heat dissipation section to provide the driving force for the heat dissipation fluid to enter the heat dissipation section through the outlet.

[0025] A second aspect of this application also provides an electronic device, which includes...

[0026] An electronic device body, wherein at least one heating element is provided within the electronic device body;

[0027] A heat dissipation device, comprising:

[0028] A heat-absorbing part, the first surface of which is attached to the heat-generating element; the heat-absorbing part has a receiving space for receiving heat dissipation fluid; the heat-absorbing part is provided with at least one inlet and at least one outlet communicating with the receiving space, the size of the inlet along a first direction is smaller than its size along a second direction, and the size of the outlet along the first direction is smaller than its size along the second direction;

[0029] An adapter, wherein a first end of the adapter is adapted to the inlet or the outlet for detachable connection to the inlet or the outlet, and a second end of the adapter is different from its first end, and the second end of the adapter is used for detachable connection to a guide tube;

[0030] The heat dissipation section is spaced apart from the heat-generating element; the heat dissipation section is arranged one-to-one with the outlet; the heat dissipation section is used to connect the inlet and outlet of the heat absorption section through the guide pipe and the adapter, so that the heat dissipation fluid can transfer the absorbed heat to the heat dissipation section through the guide pipe and return to the heat absorption section through the inlet;

[0031] Wherein, the first direction is perpendicular to the first surface, and the second direction is perpendicular to the first direction.

[0032] Compared to existing technologies, the heat dissipation device provided in this application reduces the thickness of the inlet and outlet by designing the dimensions of the inlet and outlet in the first direction to be smaller than those in the second direction. It also incorporates an adapter to connect to the guide pipe, and the dimensions of the second end of the adapter are not limited, thus not affecting the heat absorption efficiency of the heat dissipation device. This achieves heat dissipation efficiency while ensuring an ultra-thin heat absorption section, and reduces the space constraints during the installation of the heat absorption section. This solves the problem of space constraints during the installation of existing water cooling heads due to their large size. Attached Figure Description

[0033] The above and other objects, features, and advantages of exemplary embodiments of this application will become readily understood by reading the following detailed description with reference to the accompanying drawings. In the drawings, several embodiments of this application are illustrated by way of example and not limitation, with the same or corresponding reference numerals denoteing the same or corresponding parts, wherein:

[0034] Figure 1 A schematic diagram of the first structure of the heat dissipation device provided in this embodiment is shown.

[0035] Figure 2A schematic diagram of a second structure of the heat dissipation device provided in this embodiment is shown.

[0036] Figure 3 A schematic diagram of the adapter structure in the heat dissipation device provided in this embodiment is shown.

[0037] Figure 4 A schematic diagram of a second type of adapter structure in the heat dissipation device provided in this embodiment is shown.

[0038] Figure 5 A schematic diagram of a third type of adapter structure in the heat dissipation device provided in this embodiment is shown.

[0039] Figure 6 A schematic diagram of a third structure of the heat dissipation device provided in this embodiment is shown.

[0040] Figure 7 A schematic diagram of a fourth structure of the heat dissipation device provided in this embodiment is shown.

[0041] Figure 8 The diagram illustrates the state and connection of the adapter and the inlet in the heat dissipation device provided in this embodiment.

[0042] The reference numerals in the attached figures are as follows: 1. Heat absorption part; 11. Inlet; 12. Outlet; 13. First surface; 2. Adapter; 2. Inner layer; 21. Outer layer; 22. Sealing protrusion; 23. First end; 24. Second end; 25. Heat dissipation part; 3. Guide tube; 4. First direction a; Second direction b. Detailed Implementation

[0043] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0044] It should be noted that, unless otherwise stated, the technical or scientific terms used in this application shall have the ordinary meaning as understood by one of ordinary skill in the art to which this application pertains.

[0045] The technical solution of this application embodiment is to solve the above-mentioned technical problems, and the general idea is as follows:

[0046] Example 1

[0047] Reference Appendix Figure 1 Appendix Figure 2 and attached Figure 6The heat dissipation device provided in this application includes a heat-absorbing part 1, an adapter 2, and a heat dissipation part 3. The heat-absorbing part 1 has a receiving space for receiving heat dissipation fluid. The heat-absorbing part 1 is provided with at least one inlet 11 and at least one outlet 12 communicating with the receiving space. The dimension of the inlet 11 along a first direction a is smaller than its dimension along a second direction b, and the dimension of the outlet 12 along the first direction a is smaller than its dimension along the second direction b. The first surface 13 of the heat-absorbing part 1 is used to attach to a heat-generating element (not shown in the figure). The first end 24 of the adapter 2 is adapted to the inlet 11 or the outlet 12. The inlet 11 or the outlet 12 is detachably connected. The second end 25 of the adapter 2 is different from its first end 24. The second end 25 of the adapter 2 is used to detachably connect the guide pipe 4. The heat dissipation part 3 is used to connect the inlet 11 and the outlet 12 of the heat absorption part 1 through the guide pipe 4 and the adapter 2, so that the heat dissipation fluid can transfer the absorbed heat to the heat dissipation part 3 through the guide pipe 4 and return to the heat absorption part 1 through the inlet 11. The first direction a is perpendicular to the first surface 13, and the second direction b is perpendicular to the first direction a.

[0048] Understandably, in order to solve the problem of space constraints during installation due to the large thickness of existing water cooling heads, the heat dissipation device provided in this embodiment sets the inlet 11 and outlet 12 on the heat absorption part 1 to be smaller in the first direction a than in the second direction b. With the help of the adapter 2, the inlet 11 and outlet 12 are connected to the conventional guide pipe 4. This ensures that the inlet 11 and outlet 12 are smaller in the direction perpendicular to the first surface 13 to achieve the effect of an ultra-thin heat absorption part 1, without affecting the flow rate and velocity of the heat dissipation fluid in the heat dissipation device, thus ensuring heat dissipation efficiency.

[0049] The heat dissipation device provided in this embodiment can be used, but is not limited to, in electronic devices such as mobile phones, computers, laptops, and tablets. It is easy to understand that the heat-generating component can be, but is not limited to, devices that generate heat during operation, such as CPUs and GPUs. The heat dissipation device provided in this embodiment absorbs heat by having its first surface 13 of the heat-absorbing part 1 in close contact with the heat-generating component. It also utilizes the guide pipe 4 to transfer the heat dissipation fluid to the heat dissipation part 3. Heat is dissipated during the transfer process and within the flow channels inside the heat dissipation part 3. Therefore, it can be understood that... Figure 6As shown, the heat dissipation device provided in this embodiment may further include a power unit 5; the power unit 5 is located between the heat absorption section 1 and the heat dissipation section 3 to provide driving force for the heat dissipation fluid to enter the heat dissipation section 3 through the outlet 12; the inlet 11 of the heat absorption section 1 and the outlet of the heat dissipation section 3 are connected through the guide pipe 4, thereby realizing the circulation of the heat dissipation fluid between the heat absorption section 1 and the heat dissipation section 3 for heat absorption and heat dissipation. The power unit 5 may be, but is not limited to, a pump body, to provide the flow power of the heat dissipation fluid between the heat absorption section 1 and the heat dissipation section 3. The power unit 5 may be arranged one-to-one with the inlet 11, or multiple inlets 11 may share the same power unit 5, i.e. Figure 7 The state shown.

[0050] The heat-absorbing part 1 can be a rigid structure with high thermal conductivity, such as a thermally conductive metal cavity, a thermally conductive metal flow channel, a water-cooling head, etc. The shape and size of the heat-absorbing part 1 are not limited here and can be designed and adjusted according to actual needs, such as a cuboid, a disk, etc. It can have a large first surface 13 for attaching to the heat-generating element to absorb heat with high efficiency. Correspondingly, the heat-absorbing part 1 has a space, which can be a cavity or a flow channel, allowing the heat dissipation fluid to carry away heat during the process of flowing in, filling, and flowing out of the heat-absorbing part 1. It is understood that the heat dissipation fluid can be, but is not limited to, water, deionized water, ethylene glycol aqueous solution, propylene glycol aqueous solution, fluorinated liquid, etc., which is easily understood by those skilled in the art and will not be elaborated here. Referring to the heat absorption part 1, the first direction a can be a direction perpendicular to the first surface 13 or a direction approximately perpendicular to the first surface 13. The second direction b can be perpendicular to the first direction a or approximately perpendicular. Taking the inlet 11 as an example, the second direction b can be the insertion direction of the inlet 11. That is, for the adapter 2, the second direction b is not the axis of the adapter 2.

[0051] In this embodiment, both the inlet 11 and the outlet 12 extend or protrude from the heat absorption section 1. The dimensions of the inlet 11 and the outlet 12 along the first direction a are smaller than their respective dimensions along the second direction b. Therefore, the radial cross-sections of the inlet 11 and the outlet 12 can be, but are not limited to, a raceway circle, an ellipse, a rectangle, etc. The dimensions of the inlet 11 and the outlet 12 in the first direction a can be, but are not limited to, 1-4 mm, i.e., smaller than the dimensions of a conventional guide tube 4 or a conventional port. This effectively reduces the dimensions in the first direction a when used with the adapter 2 and the guide tube 4, preventing space constraints caused by increasing the overall size of the heat absorption section 1 in the first direction a. The shapes and dimensions of the inlet 11 and the outlet 12 can be the same or different. In this embodiment, they can be set to have the same shape and size corresponding to the adapter 2, thereby reducing the design and production costs of the adapter 2 and improving its versatility. In this embodiment, the inlet 11 and the outlet 12 can be arranged relative to each other, for example... Figure 1As shown, the inlet 11 and outlet 12 are respectively disposed on opposite sides of the heat absorption section 1; at least one of the inlet 11 and outlet 12 can be disposed parallel to the first surface 13 to meet special space constraints, for example Figure 2 As shown, inlet 11 is arranged opposite to and parallel to the first surface 13, and outlet 12 is parallel to the first surface 13 and arranged on the side of the heat absorption section 1. It can be understood that the dimensions of inlet 11 and outlet 12 in the first direction a can be less than or equal to the dimension of the heat absorption section 1 in the first direction a. With this arrangement, regardless of whether inlet 11 and outlet 12 are located on the side of the heat absorption section 1 or relative to the first surface 13, the dimension of the heat absorption section 1 in the first direction a will not increase relative to the guide pipe 4, effectively reducing space constraints. In this embodiment, when inlet 11 or outlet 12 is arranged opposite to and parallel to the first surface 13, the axial dimension of the adapter 2 can be designed to be larger so that the orthogonal projection of the second end 25 of the adapter 2 in the first direction a does not cover the heat absorption section 1, that is, the area where the second end 25 of the adapter 2 does not overlap with the heat absorption section 1, preventing the larger dimension of the second end 25 of the adapter 2 from affecting the overall dimension of the heat absorption section 1. (Refer to Appendix) Figure 7 In this embodiment, the number of inlets 11 and / or outlets 12 can be increased according to actual needs. The number of inlets 11 and outlets 12 can be the same or different. Accordingly, the power unit 5 needs to be set in a one-to-one correspondence with the inlets 11. For example, when the number of inlets 11 is greater than the number of outlets 12, there can be two inlets 11 working together with one outlet 12. For another example, when the number of inlets 11 is less than the number of outlets 12, there can be two outlets 12 working together with one inlet 11.

[0052] The heat dissipation part 3 can be a rigid structure with high thermal conductivity, and can be, but is not limited to, a heat sink, a heat spreader, or other structures that can dissipate heat. It can be in the form of having several flow channels inside, or it can be in the form of having a capillary structure inside.

[0053] The guide tube 4 can be a rigid tube with high thermal conductivity, such as a heat-conducting metal tube, or it can be a tube with a certain degree of elasticity, such as a plastic tube. The guide tube 4 can be, but is not limited to, a circular tube, and its diameter can be, but is not limited to, 5-14mm. The connection between the guide tube 4 and the heat absorption part 1 can be achieved by sleeved the guide tube 4 on the second end of the adapter 2 or by inserting the guide tube 4 into the second end of the adapter 2. The guide tube 4 and the second end of the adapter 2 can be bonded to each other or screwed together. This setting is easy for those skilled in the art to understand and implement, and will not be elaborated here.

[0054] Among them, reference appendix Figure 3The adapter 2 is a rigid structure or a slightly elastic structure, serving as a connecting carrier between the heat absorption section 1 and the guide tube 4. The adapter 2 is hollow inside. The first end 24 of the adapter 2 is adapted to the shape and size of the inlet 11 and the outlet 12, allowing it to be inserted into or sleeved onto the inlet 11 or the outlet 12. The second end 25 of the adapter 2 can be, but is not limited to, a circular interface, only suitable for conventional guide tubes 4. The axial dimension of the adapter 2 can be designed and adjusted according to actual needs. At least two different lengths of adapter 2 can be designed, for example, see attached figure. Figure 1 When the inlet 11 and outlet 12 are located on the side of the heat absorption section 1, a shorter adapter 2 can be selected, as shown in the attached diagram. Figure 2 When the inlet 11 and / or outlet 12 are located on the side opposite to the first surface 13, a longer adapter 2 can be selected so that the second end 25 of the adapter 2 extends out of the area of ​​the heat-absorbing part 1. In this embodiment, the adapter 2 can be configured to be detachable from the inlet 11 or outlet 12, and the connection method can be, but is not limited to, a sealed sleeve, a sealed plug, etc.; in this embodiment, the adapter 2 can also be configured to be integrally formed with the heat-absorbing part 1.

[0055] As listed above, by designing the dimensions of the inlet 11 and outlet 12 in the first direction a to be smaller than their dimensions in the second direction b, the thickness of the inlet and outlet is reduced. The adapter 2 is set in a coordinated manner to connect with the guide pipe 4, and the size of the second end 25 of the adapter 2 is not restricted, so as not to affect the heat absorption efficiency of the heat dissipation device. The heat dissipation efficiency is guaranteed under the premise of achieving an ultra-thin heat absorption part 1, and the degree of space restriction during the installation of the heat absorption part 1 is reduced. Thus, the problem of space restriction during the installation of the existing water cooling head with a large size is solved.

[0056] In this article, the term "and / or" is merely a description of the relationship between related objects, indicating that there can be three relationships, such as A and / or B. Specifically, it can be understood as: A and B can be included at the same time, A can exist alone, or B can exist alone, and any of the above three situations can be met.

[0057] Further, see attached document. Figure 1 and attached Figure 2 In the heat dissipation device provided in this embodiment, the radial cross-section of the second end 25 of the adapter 2 is circular, and the dimension of the second end 25 of the adapter 2 along the first direction a is greater than the dimension of its first end 24 along the first direction a.

[0058] It is understandable that, in order to achieve the effect of the ultra-thin heat absorption part 1 without affecting the heat dissipation efficiency, the radial cross-section of the second end 25 of the adapter 2 can be set to a circle in this embodiment, so that it can be adapted to connect to a conventional guide pipe 4. At the same time, the dimension of the second end 25 of the adapter 2 along the first direction a is larger than the dimension of its first end 24 along the first direction a, so that the flow rate of the second end 25 of the adapter 2 per unit time is greater than the flow rate of its first end 24, thereby ensuring the flow rate and flow of the heat dissipation fluid and even the heat dissipation efficiency. It is also understandable that the dimension of the second end 25 of the adapter 2 in the second direction b can be greater than or equal to the dimension of its first end 24 in the second direction b, which can also improve the flow rate and flow. Of course, it is understandable that the dimension of the second end 25 in the second direction b can be adjusted according to the actual design based on the heat dissipation requirements, the flow rate requirements of the heat dissipation fluid, etc., for example, it can be Figure 3 The form shown, which is larger than the dimension of the first end 24 in the second direction b, could be, for example, a... Figure 4 The form shown is smaller than the size of the first end 24 in the second direction b. For example, it could also be... Figure 5 The form shown is equal to or approximately equal to the dimension of the first end 24 in the second direction b.

[0059] Further, see attached document. Figure 8 In the heat dissipation device provided in this embodiment, in a specific implementation, the first end 24 of the adapter 2 includes an inner layer 21 and an outer layer 22 stacked together; an accommodating space is formed between the inner layer 21 and the outer layer 22, the accommodating space being used to accommodate the inlet 11 or the outlet 12; at least one sealing protrusion 23 is provided on the side surface of the outer layer 22 facing the inner layer 21, the sealing protrusion 23 being used to abut against the outer wall of the inlet 11 or the outlet 12.

[0060] It is understandable that, in order to ensure the sealing performance when the adapter 2 is connected to the inlet 11 or outlet 12, in this embodiment, the first end 24 of the adapter 2 can be configured to include an inner layer 21 and an outer layer 22. The inner layer 21 and the outer layer 22 can be rigid structures or partially elastic structures. The accommodating space between the inner layer 21 and the outer layer 22 is used to accommodate the inlet 11 or outlet 12. It is easy to understand that the shape of the inner layer 21 is adapted to the shape of the inlet 11 or outlet 12 so that the outer wall of the inner layer 21 fits against the inner wall of the inlet 11 or outlet 12. The shape of the outer layer 22 can be adapted to the inlet 11 or outlet 12 or can be different from the shape of the inlet 11 or outlet 12, as long as the dimension of the outer layer 22 along the first direction a is smaller than its dimension along the second direction b. The accommodating space can be filled by the sealing protrusion 23. It is also understood that the inner layer 21 and the outer layer 22 can be coaxial or non-coaxial. The sealing protrusion 23 can be a rigid structure integrally formed with the outer layer 22 or made of an elastic material, such as an additional sealing ring structure, to achieve a contact seal against the outer wall of the inlet 11 or outlet 12. The number of sealing protrusions 23 can be designed and adjusted according to actual needs, for example, one or more can be spaced apart along the axial direction of the adapter 2; the sealing protrusions 23 can be arranged around the axial direction of the adapter 2 in a circle, or when there are multiple sealing protrusions 23, they can be arranged intermittently around the axial direction of the adapter 2, and adjacent sealing protrusions 23 can form a continuous circle around the axial direction of the adapter 2. In this embodiment, the inner layer 21 and the outer layer 22 can be integrally formed rigid metal structures, and the arrangement of the sealing protrusions 23 in this configuration can be referred to the above description. In this embodiment, the inner layer 21 can be configured as a rigid structure, and the outer layer 22 can be configured as an elastic material, which may be, but is not limited to, silicone. In this configuration, the sealing protrusion 23 can be a silicone protrusion integrally formed with the outer layer 22. In this embodiment, with the inner layer 21 configured as a rigid structure, the outer layer 22 can be configured as a heat-shrinkable material. After the adapter 2 is fitted with the inlet 11 or outlet 12, it is heated and shrunk, so that the outer layer 22 fits tightly against the outer wall of the inlet 11 or outlet 12, thereby enhancing the sealing performance. Furthermore, in this embodiment, the cooperation between the inner layer 21 and the outer layer 22 can effectively extend the leakage path of the heat dissipation fluid. The heat dissipation fluid needs to bypass the inner layer 21, then bypass the inlet 11 (outlet 12), and then pass the sealing protrusion 23 before leakage can occur. Thus, the above design greatly reduces the possibility of leakage and improves the sealing effect.

[0061] Furthermore, in the specific implementation of the heat dissipation device provided in this embodiment, the heat absorption part 1 is provided with a flow channel (not shown in the figure), and the inlet 11 and the outlet 12 are both connected to the flow channel; wherein, a plurality of inlets 11 form parallel heat dissipation paths after connecting to the flow channel; or a plurality of inlets 11 form interconnected heat dissipation paths after connecting to the flow channel.

[0062] It is understandable that, in order to improve the heat dissipation efficiency of the heat dissipation device, a heat dissipation channel can be provided in the heat absorption section 1 in this embodiment to guide the heat dissipation fluid in the heat absorption section 1. The heat dissipation fluid enters the heat dissipation channel through the inlet 11 and flows in the heat dissipation channel to absorb heat and flows out of the heat absorption section 1 through the outlet 12 to flow into the heat dissipation section 3 for heat transfer and heat dissipation. The heat dissipation channel can be integrally formed with the heat absorption section 1. The heat dissipation channel can be a pipe structure or a channel structure formed by baffles inside the heat absorption section 1, etc. The heat dissipation channel can be a single winding channel or multiple independent channels. Its internal direction can be designed and adjusted according to actual needs. For example, each inlet 11 corresponds to a heat dissipation channel, forming multiple parallel heat dissipation paths, which standardizes the flow path of the heat dissipation fluid and allows for targeted heat absorption at certain locations. For example, the heat dissipation channels are interconnected, and each inlet 11 can connect to different locations of the heat dissipation channel. However, the heat dissipation fluid entering through each inlet 11 can flow freely within the heat dissipation channel, which can reduce targeting and improve the overall heat absorption efficiency of the heat absorption section 1.

[0063] Furthermore, in the specific implementation of the heat dissipation device provided in this embodiment, the outer wall of the second end 25 of the adapter 2 is provided with threads (not shown in the figure); or the outer wall of the second end 25 of the adapter 2 is provided with an adhesive area (not shown in the figure).

[0064] It is understandable that, in order to achieve the connection between the adapter 2 and the guide tube 4, a threaded or adhesive area can be provided on the outer wall of the second end 25 of the adapter 2 in this embodiment, so as to achieve a sealed connection with the guide tube 4 by threading or bonding; of course, the above-mentioned features can also be provided on the inner wall of the second end 25 of the adapter 2 according to actual needs.

[0065] Example 2

[0066] This embodiment provides an electronic device, which includes an electronic device body (not shown in the figure) and a heat dissipation device. The electronic device body contains at least one heat-generating element. The heat dissipation device includes a heat-absorbing part 1, an adapter 2, and a heat dissipation part 3. The first surface 13 of the heat-absorbing part 1 is attached to the heat-generating element. The heat-absorbing part 1 has a receiving space for receiving heat dissipation fluid. The heat-absorbing part 1 has at least one inlet 11 and at least one outlet 12 communicating with the receiving space. The dimension of the inlet 11 along a first direction a is smaller than its dimension along a second direction b, and the dimension of the outlet 12 along the first direction a is smaller than its dimension along the second direction b. The first end 24 of the adapter 2 is adapted to the inlet 11 or the outlet 12. The inlet 11 or the outlet 12 is detachably connected. The second end 25 of the adapter 2 is different from its first end 24. The second end 25 of the adapter 2 is used to detachably connect to the guide pipe 4. The heat dissipation part 3 is spaced apart from the heat-generating element. The heat dissipation part 3 is arranged in a one-to-one correspondence with the outlet 12. The heat dissipation part 3 is used to connect between the inlet 11 and the outlet 12 of the heat absorption part 1 through the guide pipe 4 and the adapter 2, so that the heat dissipation fluid can transfer the absorbed heat to the heat dissipation part 3 through the guide pipe 4 and return to the heat absorption part 1 through the inlet 11. The first direction a is perpendicular to the first surface 13, and the second direction b is perpendicular to the first direction a.

[0067] It is understood that the electronic device provided in this embodiment can be used, but is not limited to, in electronic devices such as mobile phones, computers, laptops, and tablets; it is also easy to understand that the heat-generating component can be, but is not limited to, devices such as CPUs and GPUs that generate heat during operation. The heat dissipation device provided in this embodiment is the heat dissipation device described in Embodiment 1, and its structure and working principle are described in detail in Embodiment 1, and will not be repeated here.

[0068] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A heat dissipation device, characterized in that, It includes: The heat-absorbing part has a receiving space for receiving heat dissipation fluid; the heat-absorbing part is provided with at least one inlet and at least one outlet communicating with the receiving space, the dimension of the inlet along a first direction is smaller than its dimension along a second direction, and the dimension of the outlet along the first direction is smaller than its dimension along the second direction; the first surface of the heat-absorbing part is used to adhere to the heating element. An adapter, wherein a first end of the adapter is adapted to the inlet or the outlet for detachable connection to the inlet or the outlet, and a second end of the adapter is different from its first end, and the second end of the adapter is used for detachable connection to a guide tube; A heat dissipation section is used to connect the inlet and outlet of the heat absorption section through the guide pipe and the adapter, so that the heat dissipation fluid can transfer the absorbed heat to the heat dissipation section through the guide pipe and return to the heat absorption section through the inlet; Wherein, the first direction is perpendicular to the first surface, and the second direction is perpendicular to the first direction.

2. The heat dissipation device according to claim 1, characterized in that: The radial cross-section of the second end of the adapter is circular, and the dimension of the second end of the adapter along the first direction is greater than the dimension of its first end along the first direction.

3. The heat dissipation device according to claim 1, characterized in that: The first end of the adapter includes an inner layer and an outer layer that are stacked together; An accommodating space is formed between the inner layer and the outer layer, and the accommodating space is used to accommodate the inlet or the outlet; The outer layer has at least one sealing protrusion on one side surface facing the inner layer, the sealing protrusion being used to abut against the outer wall of the inlet or the outlet.

4. The heat dissipation device according to claim 3, characterized in that: The sealing protrusion is elastic; or The sealing protrusion is integrally formed with the outer layer.

5. The heat dissipation device according to claim 1, characterized in that: The number of inlets on the heat absorption section is different from the number of outlets; or The number of inlets on the heat-absorbing section is equal to the number of outlets.

6. The heat dissipation device according to claim 1, characterized in that: The heat absorption section is provided with a flow channel, and both the inlet and the outlet are connected to the flow channel; In this configuration, several of the inlets connect to the flow channel to form parallel heat dissipation paths; or several of the inlets connect to the flow channel to form interconnected heat dissipation paths.

7. The heat dissipation device according to claim 1, characterized in that: The inlet and the outlet are arranged opposite to the heat absorption section; The dimensions of the inlet and the outlet in the first direction are smaller than the dimensions of the heat-absorbing part in the first direction.

8. The heat dissipation device according to claim 1, characterized in that: The second end of the adapter is threaded; or The second end of the adapter has an adhesive area on its outer wall.

9. The heat dissipation device according to claim 1, characterized in that: It also includes the power unit; The power unit is disposed between the heat absorption section and the heat dissipation section to provide the driving force for the heat dissipation fluid to enter the heat dissipation section through the outlet.

10. An electronic device, characterized in that, It includes: An electronic device body, wherein at least one heating element is provided within the electronic device body; A heat dissipation device, comprising: A heat-absorbing part, the first surface of which is attached to the heat-generating element; the heat-absorbing part has a receiving space for receiving heat dissipation fluid; the heat-absorbing part is provided with at least one inlet and at least one outlet communicating with the receiving space, the dimension of the inlet along a first direction is smaller than its dimension along a second direction, and the dimension of the outlet along the first direction is smaller than its dimension along the second direction; An adapter, wherein a first end of the adapter is adapted to the inlet or the outlet for detachable connection to the inlet or the outlet, and a second end of the adapter is different from its first end, and the second end of the adapter is used for detachable connection to a guide tube; The heat dissipation section is spaced apart from the heat-generating element; the heat dissipation section is arranged one-to-one with the outlet; the heat dissipation section is used to connect the inlet and outlet of the heat absorption section through the guide pipe and the adapter, so that the heat dissipation fluid can transfer the absorbed heat to the heat dissipation section through the guide pipe and return to the heat absorption section through the inlet; Wherein, the first direction is perpendicular to the first surface, and the second direction is perpendicular to the first direction.

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