Electronic device

Abstract

The application discloses an electronic device, and relates to the technical field of electronic devices. The electronic device comprises a heat generating component, a fan and a target component; at least part of the target component, the heat generating component and the fan jointly enclose a closed flow channel; the fan introduces airflow from the outside of the electronic device, and the airflow is used for heat dissipation of the heat generating component through the flow channel; the target component at least comprises a first part and a second part; the first part is used for guiding the airflow; and the first part and the second part are used for isolating the airflow inside the electronic device.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and more particularly to an electronic device. Background Technology

[0002] Currently, heat-generating components produce a significant amount of heat during operation, which is typically dissipated through fans or natural convection. However, in practical applications, the hot air exhausted by these components may experience backflow due to obstructions from surrounding structures or equipment. This means the high-temperature airflow fails to escape smoothly and instead returns to the intake area of ​​the heat-generating component. This hot air backflow causes the ambient temperature at the intake to rise, increasing the temperature of the cooling air entering the component and thus reducing heat dissipation efficiency. Utility Model Content

[0003] To address the aforementioned technical problems, the embodiments of this application provide the following technical solutions: This application provides an electronic device, including: Heat-generating components, fans, and target components; The target component, the heat-generating component, and at least a portion of the fan together form a closed flow channel; The fan draws airflow from outside the electronic device and cools the heat-generating components through the flow channel; The target component includes at least a first part and a second part, the first part being used to guide airflow, and the first and second parts being used to isolate airflow inside the electronic device.

[0004] In some modified embodiments of this application, the fan is disposed at the first end of the flow channel, and the target component, the heat-generating component, and the first area of ​​the fan together form the flow channel; The first part has a guide plate, which is located near the first end of the flow channel. The airflow introduced into the first area of ​​the fan can be guided by the guide plate to the heat-generating component.

[0005] In some modified embodiments of this application, the guide vane is movably connected to the second part, and the guide vane is movable between a first position and a second position to adjust the area of ​​the first region of the fan; When the guide plate moves to the first position, it is located relatively far away from the heat-generating component, and the area of ​​the first region is relatively larger; when the guide plate moves to the second position, the area of ​​the first region is relatively smaller.

[0006] In some modified embodiments of this application, it also includes: The heat-generating element is located on the side of the air guide plate away from the heat-generating component; the second area of ​​the fan faces the heat-generating element, and the fan can introduce airflow from outside the electronic device to dissipate heat from the heat-generating element; The second region differs from the first region. When the guide plate moves to the first position, it is relatively close to the heat-generating component, and the area of ​​the second region is relatively smaller. When the guide plate moves to the second position, it is relatively far away from the heat-generating component, and the area of ​​the first region is relatively larger.

[0007] In some modified embodiments of this application, the first part further includes a telescopic structure, which is connected to the side of the guide plate near the fan to seal the gap between the guide plate and the fan. When the guide vane is positioned relatively close to the fan, the telescopic structure is in a relatively contracted state; when the guide vane is positioned relatively far from the fan, the telescopic structure is in a relatively extended state.

[0008] In some modified embodiments of this application, the second part includes: The air guide bracket has a rotatable baffle connected to it. The air guide bracket has a rotation space, and the baffle can rotate within the rotation space. A sealing plate is provided on the side of the air guide bracket away from the heat-generating component. When the air guide plate is in the first position, the air guide plate contacts the sealing plate to form a closed hollow trapezoidal structure with the air guide bracket.

[0009] In some modified embodiments of this application, the heating element is disposed on the first side of the flow channel; The second part also includes an air guide duct, which is located on the side of the air guide bracket away from the fan. The air guide duct, air guide bracket and air guide plate cover the projection of the heat-generating component on the first side along the projection of the first side.

[0010] In some modified embodiments of this application, a driving member is linked to the guide plate, and the driving member can drive the guide plate to move between a first position and a second position.

[0011] In some modified embodiments of this application, the driving component includes a telescopic rod disposed within the flow channel, and the telescopic rod is capable of extending and retracting in a first direction; The first part also includes a connecting part, which is fixedly connected to the guide plate and rotatably connected to the second part via a rotating shaft; The guide plate is located on the first side of the rotating shaft, the drive end of the connecting part is located on the second side of the rotating shaft, the telescopic rod is connected to the drive end, and the telescopic rod extends and retracts in the first direction to drive the connecting part to rotate, so that the guide plate rotates between the first position and the second position.

[0012] In some modified embodiments of this application, an elastic element is also included. The elastic element is disposed between the connecting portion and the second portion. When the guide plate moves to the first position, the elastic element undergoes non-elastic deformation; when the guide plate moves to the second position, the elastic element undergoes elastic deformation. Attached Figure Description

[0013] The above and other objects, features, and advantages of exemplary embodiments of this application will become readily understood by reading the following detailed description with reference to the accompanying drawings. In the drawings, several embodiments of this application are illustrated by way of example and not limitation, with the same or corresponding reference numerals denoteing the same or corresponding parts, wherein: Figure 1 A schematic diagram of the structure of an electronic device is shown. Figure 2 A schematic diagram of a partial structure of an electronic device is shown. Figure 3 A partial structural diagram of another embodiment of an electronic device is shown schematically; Figure 4 A schematic diagram of the structure of an electronic device is shown. Figure 5 A schematic diagram of the first part of an electronic device is shown. Figure 6 A schematic diagram of the first part of the structure of another embodiment of an electronic device is shown.

[0014] Explanation of icon numbers: 1. Heating component; 2. Fan; 3. Target component; 31. Second part; 311. Air guide duct; 312. Air guide bracket; 32. Deflector plate; 4. Heating element; 5. First area; 6. Second area; 7. Driving element; 8. Elastic element; 9. Telescopic structure; 10. Sealing plate; 11. Telescopic rod; 12. Rotating shaft; 13. Connecting part; 14. First part. Detailed Implementation

[0015] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0016] It should be noted that, unless otherwise stated, the technical or scientific terms used in this application shall have the ordinary meaning as understood by one of ordinary skill in the art to which this application pertains.

[0017] Currently, heat-generating components produce a significant amount of heat during operation, which is typically dissipated through fans or natural convection. However, in practical applications, the hot air exhausted by these components may experience backflow due to obstructions from surrounding structures or equipment. This means the high-temperature airflow fails to escape smoothly and instead returns to the intake area of ​​the heat-generating component. This hot air backflow causes the ambient temperature at the intake to rise, increasing the temperature of the cooling air entering the component and thus reducing heat dissipation efficiency.

[0018] Decreased heat dissipation efficiency not only affects the performance of heat-generating components but may also cause their temperature to rise continuously, triggering overheat protection, reducing equipment frequency, or even causing damage. Furthermore, with the continuous increase in power density, the problem of hot air recirculation is particularly prominent in highly integrated electronic devices (such as servers, high-performance computers, and industrial control equipment), and has become an important factor that cannot be ignored in thermal management design.

[0019] To address the aforementioned technical problems, this disclosure proposes an electronic device that can prevent hot air from flowing back into the air intake area of ​​the heat-generating component 1, thereby improving the heat dissipation efficiency of the heat-generating component 1. Example

[0020] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 As shown, an electronic device includes a heat-generating component 1, a fan 2, and a target component 3; at least a portion of the target component 3, the heat-generating component 1, and the fan 2 together form a sealed flow channel; the fan 2 introduces airflow from the outside of the electronic device and dissipates heat from the heat-generating component 1 through the flow channel; the target component 3 includes at least a first part 14 and a second part, the first part 14 being used to guide the airflow, and the first part 14 and the second part being used to isolate the airflow inside the electronic device.

[0021] Heat-generating component 1 refers to components that generate heat during operation due to current flow or signal processing. These components release energy as heat due to energy loss; poor heat dissipation can lead to overheating, affecting device performance, lifespan, and even safety. Heat-generating component 1 can be a processor, such as a central processing unit (CPU) and a graphics processing unit (GPU). CPUs and GPUs are among the most critical heat-generating components in a computer system, responsible for performing various computational tasks. With increased integration and operating frequency, their power consumption and heat generation also increase significantly. GPUs can be equipped with cooling fans to direct air drawn in by the fans to the GPU chip and its heat sink, thereby increasing heat dissipation efficiency. Heat-generating component 1 can also be a power module, including DC-DC converters and AC-DC converters, used to provide stable voltage to other electronic components. Energy loss is inevitable during power conversion, and this energy is usually dissipated as heat. Heat-generating component 1 can also be a power amplifier, used in wireless communication devices such as mobile phones and base stations. Power amplifiers amplify input signals for long-distance transmission, but this process generates a significant amount of heat. The heat-generating component 1 can also be a resistor. When current flows through a resistor, heat is generated according to Joule's law. Resistors used in high-power circuits require special attention to heat dissipation design. The heat-generating component 1 can also be a transformer or inductor. In power electronic equipment, transformers and inductors generate heat because current flows through their coils and the iron core experiences hysteresis and eddy current losses.

[0022] Fan 2 is a device used to promote airflow and aid in heat dissipation or ventilation. Fan 2 lowers the operating temperature of the heat-generating component 1 by introducing cool external air and expelling hot internal air, thereby ensuring stable operation and extending the lifespan of the equipment. Fan 2 can be an axial fan, characterized by blades rotating around a central axis. The rotation of the impeller causes air to flow axially, offering advantages such as simple structure, small size, and low noise, and is widely used for heat dissipation in electronic devices such as computers and servers. Fan 2 can also be a mixed-flow fan, with airflow direction between circumferential and radial, maintaining both a certain air pressure and a high airflow, suitable for environments with high heat dissipation requirements. Fan 2 can be a single large fan or a module composed of multiple small fans. These small fans can be flexibly arranged as needed to achieve optimal airflow distribution.

[0023] The target component 3 is part of the electronic device. It, along with at least a portion of the target component 3, the heat-generating component 1, and the fan 2, can form a sealed flow channel. This allows the fan 2 to draw airflow from outside the electronic device, which then passes through the flow channel to dissipate heat from the heat-generating component 1, preventing hot air from flowing back into the air intake area of ​​the heat-generating component 1 and improving heat dissipation efficiency. The target component 3 can be an air guide slot 311, connected to both the fan 2 and the heat-generating component 1. This allows the fan 2 to draw airflow from outside the electronic device, which then passes through the internal space of the air guide slot 311 to dissipate heat from the heat-generating component 1. If the heat-generating component 1 is large, it can be positioned on the side wall of the air guide slot 311, for example, along its length or extension, to easily shield it and prevent hot air from flowing back into its air intake area. The target component 3 can also be an air duct. An air duct is suitable for cases where the heat-generating component 1 is small. The heat-generating component 1 and the fan 2 can be positioned at opposite ends of the air duct to improve the airflow guiding effect. Alternatively, the target component 3 can be positioned on the side wall of the air duct to reduce the airflow guiding distance.

[0024] The first part 14 is part of the target component 3, and this part is mainly responsible for introducing external airflow (such as cold air from fan 2 or air conditioning system) into a designated path. The first part 14 can be designed as an air guide channel, air duct inlet, guide vane, etc. For example, it can be an air guide plate, air duct interface, and extended air nozzle. The second part cooperates with the first part 14 to isolate the internal airflow of electronic equipment. This part acts as a seal or partition to prevent disorderly mixing or leakage of internal airflow. It ensures the separation of hot and cold airflow and improves heat dissipation efficiency. For example, the second part can be the main body of the air guide slot 311 or air guide duct, or it can be a sealing baffle or airflow isolation cover, suitable for larger heat-generating components 1. For example, in a server chassis cooling system, the first part 14 can be an air guide box inlet to introduce cold air into the CPU or GPU module, and the second part can be a sealed structure to prevent hot air from flowing back into the cold air area. Figure 5 and Figure 6 As shown, the first part and the second part can be an integral structure to ensure the airtightness of the flow channel; the first part and the second part can also be fixedly connected and a sealing structure can be set at the connection to facilitate separate manufacturing and transportation.

[0025] The flow channel is a closed or relatively closed airflow passage formed by at least a portion of the target component 3, the heat-generating component 1, and the fan 2. The flow channel can be an absolutely closed airflow passage, thereby preventing hot air from entering the flow channel and affecting the intake air temperature of the heat-generating component 1 to a greater extent; or it can be a relatively closed airflow passage, as long as the first part 14 and the second part block the airflow inside the electronic device, preventing the airflow inside the electronic device from entering the flow channel.

[0026] This disclosure, by setting the target component 3, enables the target component 3 to jointly enclose at least a portion of the heat-generating component 1 and the fan 2 into a sealed flow channel, and enables the first part 14 of the target component 3 to guide airflow. The fan 2 introduces airflow from the outside of the electronic device and dissipates heat from the heat-generating component 1 through the flow channel. Furthermore, the first part 14 and the second part jointly isolate the airflow inside the electronic device, thereby preventing the heat-generating component 1 and the hot air inside the electronic device from entering the air intake area and flow channel of the heat-generating component 1, and preventing the cooling air entering the heat-generating component 1 from mixing with the hot air, which would cause the temperature to rise, thereby improving the heat dissipation efficiency of the heat-generating component 1.

[0027] like Figure 1 As shown, in some modified embodiments of this application, the fan 2 is disposed at the first end of the flow channel, and the target component 3, the heating component 1 and the first region 5 of the fan 2 together form the flow channel; the first part 14 has a guide plate 32, which is disposed near the first end of the flow channel, and the airflow introduced by the first region 5 of the fan 2 can be guided by the guide plate 32 to flow to the heating component 1.

[0028] Fan 2 is installed at the first end of the flow channel (i.e., where the airflow enters), which can effectively increase the airflow through the system and provide a stronger cooling effect. The first part 14 can be set at or near the first end of the flow channel to ensure that the airflow moves in a predetermined direction, starting from fan 2, passing through the first part 14 (airflow guiding part) and the second part (airflow isolation part), and finally reaching the target area that needs to be cooled. By actively pushing the air, fan 2 can help overcome the resistance in the system, such as pipe bends, filters and other obstructions, thereby improving the overall heat dissipation efficiency.

[0029] The first region 5 of fan 2 refers to the portion of fan 2 that is enclosed by the target component 3 and the heat-generating component 1 to form an airflow channel. The first region 5 of fan 2 can output airflow to provide cooling air to the heat-generating component 1. For example, fan 2 can be composed of multiple small fans, and the first region 5 can be the airflow output area corresponding to one or two small fans; fan 2 can be the entire large fan 2, and the first region 5 can be a part of the airflow output area of ​​the large fan 2. The first region 5 can be a fixed region or a dynamically changing region, for example, the first region 5 can dynamically change with the movement of the first part 14.

[0030] A flow deflector 32 is a physical structure designed to change the flow direction or distribution of a fluid (gas or liquid). While guiding the flow, it can also shield the airflow inside electronic devices. It is installed near the first end of the flow channel to ensure the fluid flows in the desired direction and speed, and can also reduce turbulence and improve fluid transport efficiency. The flow deflector 32 can be a fixed type, using a fixed geometry to achieve basic control of the fluid flow direction, commonly found in applications requiring stable and continuous airflow or water flow. The flow deflector 32 can also be an adjustable type, allowing adjustment of its angle or position to flexibly control fluid flow according to actual needs.

[0031] like Figure 1 As shown, in some modified embodiments of this application, the guide plate 32 is movably connected to the second part, and the guide plate 32 can move between a first position and a second position to adjust the area of ​​the first region 5 of the fan 2; wherein, when the guide plate 32 moves to the first position, the guide plate 32 is in a position relatively far away from the heat-generating component 1, and the area of ​​the first region 5 is relatively larger; when the guide plate 32 moves to the second position, the area of ​​the first region 5 is relatively smaller.

[0032] The deflector 32 is movably connected to the second part, meaning that the deflector 32 can be connected to the second part of the device (such as a fan system) through some adjustable mechanical means and can move between the first and second positions. This structural design allows for dynamic adjustment of the airflow direction or flow rate. The deflector 32 and the second part can also be rotatably connected, for example, by a hinge or a rotating shaft 12. The deflector 32, connected to the second part via one or more hinges or rotating shafts 12, can rotate within a certain angle range, suitable for applications requiring oscillating adjustment, and features a simple structure and high reliability. The deflector 32 and the second part can also be slidably connected; for example, the deflector 32 can slide along a track, changing its position relative to the fan 2. The track can extend into the flow channel, providing a wider range of adjustment, which can be used for linear adjustment of the area of ​​the fan 2's inlet or outlet, and can achieve translational adjustment, suitable for complex air duct designs. The deflector 32 can also be connected to the second part via an elastic element, allowing it to shift position under external force and return to its original position after the external force is removed.

[0033] The heating element 1 can be positioned on one side of the air duct. When the guide plate 32 is in the first position, it is far from the heating element 1, and the area of ​​the first region 5 is larger, meaning a larger air intake or exhaust channel, allowing more air to pass through and enhancing the cooling effect. When the guide plate 32 is in the first position, being far from the heating element 1 prevents the exhaust hot air from being re-inhaled, increasing the intake of fresh cold air, suitable for equipment with high operating power and requiring stronger heat dissipation. When the guide plate 32 is in the second position, the area of ​​the first region 5 is smaller. The air duct narrows, limiting the airflow, which can concentrate the airflow, increase local wind speed, or provide directional airflow. When the guide plate 32 is in the second position, it can be positioned relatively close to the heating element 1, saving energy and reducing noise in low-power mode, suitable for equipment operating smoothly at low temperatures, reducing noise or achieving energy-saving operation.

[0034] By movably connecting the air deflector 32 to the second part, the air deflector 32 can move between the first position and the second position to adjust the area of ​​the first region 5 of the fan 2, thereby achieving dynamic airflow management. It can automatically adjust the airflow path and flow rate according to the system temperature or operating status, and balance heat dissipation efficiency with energy consumption / noise control.

[0035] like Figure 1 As shown, in some modified embodiments of this application, the electronic device further includes a heat-generating element 4, which is disposed on the side of the air guide plate 32 away from the heat-generating component 1; the second region 6 of the fan 2 faces the heat-generating element 4, and the fan 2 can introduce airflow from outside the electronic device to dissipate heat from the heat-generating element 4; wherein, the second region 6 is different from the first region 5. When the air guide plate 32 moves to the first position, the air guide plate 32 is in a position relatively close to the heat-generating component 4, and the area of ​​the second region 6 is relatively smaller; when the air guide plate 32 moves to the second position, the air guide plate 32 is in a position relatively far away from the heat-generating component 4, and the area of ​​the first region 5 is relatively larger.

[0036] The heat-generating component 4 refers to a structural component that generates heat during operation. For example, the heat-generating component 4 could be a CPU module, GPU module, power supply module, power amplifier, etc. The second region 6 is another air outlet area of ​​the fan 2, directly facing the heat-generating component 4. The position of the guide plate 32 changes the effective airflow area of ​​this region. For example, the second region 6 could be the entire air outlet area of ​​the fan 2 except for the first region 5, thus allowing the area of ​​the second region 6 to decrease as the first region 5 increases, and increase as the first region 5 decreases. The second region 6 could also be a portion of the air outlet area of ​​the fan 2 other than the first region 5. For example, the second region 6 could be an area adjacent to the first region 5, and the fan 2 could have other areas besides the first region 5 and the second region 6 to dissipate heat from other components. The first region 5 and the second region 6 could consist of fixed areas and movable areas, with two movable areas overlapping and two fixed areas located at both ends of the movable areas. The movable areas are the adjustment areas of the guide plate 32.

[0037] The heating element 4 is positioned on the side of the guide plate 32 away from the heating component 1, i.e., the guide plate 32 is positioned between the heating component 1 and the heating element 4. When the guide plate 32 is in the first position, it is away from the heating component 1 and close to the heating component 4, resulting in a larger area in the first region 5 and a smaller area in the second region 6. This is suitable for situations where the heating component 1 operates at high power and requires stronger heat dissipation. When the guide plate 32 is in the second position, it is close to the heating component 1 and away from the heating component 4, resulting in a smaller area in the first region 5 and a larger area in the second region 6. This is suitable for situations where the heating component 4 operates at high power and requires stronger heat dissipation. For example, heat-generating component 1 can be a graphics card (GPU module), and heat-generating component 4 can be a CPU or CPU module. The EC (embedded controller) detects the system's operating status and the status of the CPU and graphics card (temperature, utilization, power consumption) to determine the user's specific application scenario (graphics processing, scientific computing, heterogeneous computing, etc.) and automatically adjusts the opening angle. For example, when the power consumption of the graphics card rises to a certain threshold, it is determined to be graphics processing, and the EC drives the motor to adjust to the angle corresponding to the power consumption of the graphics card. If the power consumption continues to increase, the angle is further increased to increase the air intake of the graphics card. Other application scenarios are controlled in the same way.

[0038] like Figure 2 As shown, in some modified embodiments of this application, the first part 14 further includes a telescopic structure 9, which is connected to the side of the guide plate 32 near the fan 2 to seal the gap between the guide plate 32 and the fan 2; wherein, when the guide plate 32 is in a position relatively close to the fan 2, the telescopic structure 9 is in a relatively contracted state, and when the guide plate 32 is in a position relatively far away from the fan 2, the telescopic structure 9 is in a relatively extended state.

[0039] The telescopic structure 9 refers to a mechanical structure that can change its length (extend or shorten) in a certain direction according to external conditions or control commands. The telescopic structure 9 is connected to the side of the guide plate 32 near the fan 2. Its main function is to seal the gap between the guide plate 32 and the fan 2. When the guide plate 32 moves between the first position and the second position, the structure extends and retracts accordingly, maintaining good airflow sealing and shielding effect, thereby preventing hot air from flowing into the closed flow channel during the movement of the guide plate 32, thus reducing the heat dissipation efficiency.

[0040] The elastic structure can be made of elastic materials, such as elastic rubber or silicone strips, which can automatically adjust its shape to fill gaps as the deflector 32 moves. Alternatively, the elastic structure can be a mechanical telescopic component, employing mechanical structures such as slide rails, springs, or folding metal sheets, which expands and contracts with the position of the deflector 32, offering good durability and suitability for long-term use. Small magnets or self-locking mechanisms can also be installed on the edge of the deflector 32, automatically attracting or locking to seal gaps when the deflector 32 moves to a specific position, providing simple operation and a good sealing effect.

[0041] like Figure 1 and Figure 6 As shown, in some modified embodiments of this application, the second part includes an air guide bracket 312, a guide plate 32 is rotatably connected to the air guide bracket 312, and a rotation space is provided inside the air guide bracket 312, so that the guide plate 32 can rotate within the rotation space; a sealing plate 10 is provided on the side of the air guide bracket 312 away from the heat-generating component 1, and when the guide plate 32 is in the first position, the guide plate 32 contacts the sealing plate 10 to form a closed hollow trapezoidal structure with the air guide bracket 312.

[0042] The air guide bracket 312 is a component used to support and guide the direction of airflow. It not only provides physical support but also optimizes the airflow path through specific shapes and angles, ensuring that air flows efficiently to the desired location. Components such as deflectors 32 can be mounted on the air guide bracket 312, and these components can be adjusted in position as needed to change the direction and intensity of the airflow.

[0043] The air guide bracket 312 can be a fixed type, with a simple structure, mainly used to provide a fixed airflow channel. The air guide bracket 312 can have a built-in deflector plate 32 or other adjustment devices, allowing for manual or electric adjustment of the airflow direction. It is suitable for air conditioner indoor units, laptop cooling systems, etc., allowing users to adjust the airflow direction as needed. It can also be equipped with sensors and actuators (such as motors) to automatically adjust the position of the deflector plate 32 according to environmental conditions (such as temperature and humidity). The air guide bracket 312 can be made of flexible materials, capable of bending and deforming within a certain range to adapt to different spatial requirements, making it suitable for compact electronic devices with limited internal space.

[0044] In some embodiments, the guide vane 32 and the air guide bracket 312 can be rotatably connected by hinges, pivots 12, or ball joints, allowing the guide vane 32 to rotate freely within a certain angle range, thereby facilitating the adjustment of the area of ​​the first region 5 and the second region 6. The rotation space refers to a portion of the space inside the air guide bracket 312. To ensure smooth rotation of the guide vane 32, sufficient rotation space is reserved inside the air guide bracket 312, allowing the guide vane 32 to rotate within a large range of motion and avoiding collisions or friction with surrounding structures.

[0045] The sealing plate 10 is a component used to close or partially close the flow channel. The sealing plate 10 can be part of the air guide bracket 312 or can be set independently of the air guide bracket 312. When the guide plate 32 moves to the first position, the distance between the guide plate 32 and the fan 2 is at its maximum. At this time, the sealing plate 10 blocks the space between the guide plate 32 and the fan 2, thus forming a hollow trapezoidal or hollow triangular prism structure with the air guide bracket 312 and the guide plate 32, thereby preventing airflow from inside the electronic equipment from entering the flow channel. The sealing plate 10 can be horizontally set to form a hollow trapezoidal structure with the air guide bracket 312 and the guide plate 32; the sealing plate 10 can be tilted along the tilt direction of the guide plate 32, thus forming a hollow triangular prism structure with the air guide bracket 312 and the guide plate 32. During the movement of the guide plate 32, the gap between the guide plate 32 and the fan 2 gradually decreases, always remaining within the sealing range of the sealing plate 10, thereby ensuring the blocking effect.

[0046] like Figure 1 As shown, in some modified embodiments of this application, the heating element 1 is disposed on the first side of the flow channel; the second part also includes an air guide slot 311, which is disposed on the side of the air guide bracket 312 away from the fan 2, and the air guide slot 311, the air guide bracket 312 and the guide plate 32 cover the projection of the heating element 1 on the first side along the projection of the first side.

[0047] The air guide slot 311 is a structure specifically designed to guide airflow. Its specific shape optimizes the direction and velocity distribution of airflow, ensuring efficient airflow to areas requiring cooling or ventilation. The air guide slot 311 can be used in conjunction with other components such as the deflector plate 32 and the sealing plate 10 to achieve optimal airflow management. For example, the air guide slot 311 can be a straight structure with a linear channel, primarily used to directly guide airflow from one point to another, suitable for simple and direct airflow path requirements, such as small fans 2 or exhaust fans 2 in household appliances. The air guide slot 311 can also be flared, with a wider inlet that gradually narrows to the outlet, resembling a flare, used to concentrate airflow and accelerate its speed, suitable for applications requiring enhanced local wind speed, such as the cooling system of a laptop computer. The air guide slot 311 can be multi-layered, composed of multiple parallel or staggered small air guide slots 311, with a certain spacing between each layer, to achieve more complex airflow control. For example, multiple layers of air guide slots 311 can be placed between the heat-generating component 1 and the heat-generating element 4 to improve heat insulation and further enhance heat dissipation efficiency. The air guide slot 311 can also be designed in a spiral shape, which can make the airflow rotate, which helps to further mix and evenly distribute the airflow, and is suitable for occasions that require a highly uniform airflow distribution.

[0048] The air guide slot 311, the air guide bracket and the air guide plate 32 cover the projection of the heat-generating component 1 on the first side, so that the first part 14 and the second part can completely block the heat-generating component 1, thereby preventing hot air from the electronic device from entering the heat-generating component 1, and thus improving the heat dissipation effect.

[0049] like Figure 1 , Figure 5 and Figure 6 As shown, in some modified embodiments of this application, a driving component 7 is also included. The driving component 7 is linked to the guide plate 32 and can drive the guide plate 32 to move between a first position and a second position.

[0050] The driving component 7 refers to a device capable of generating mechanical motion or force to drive other components (such as the guide vane 32) to move, rotate, or perform other forms of action. The motion of the driving component 7 can be transmitted to the guide vane 32 through mechanical structures such as linkages and gears to ensure synchronized action; alternatively, it can directly contact the guide vane 32 to drive its movement. For example, the driving component 7 can be an electric driving component 7, using a motor as a power source to convert rotary motion into linear or rotary motion through gears, belts, or other transmission mechanisms; for example, it can be a stepper motor, DC motor, or servo motor. The driving component 7 can also be a pneumatic driving component 7, using compressed air as a power source to achieve linear or rotary motion through cylinders or pneumatic motors. This is suitable for applications requiring rapid response and high environmental requirements, such as ventilation systems in clean rooms and pneumatic valve control on certain industrial automated production lines. The driving component 7 can also be a hydraulic driving component 7, using liquid pressure as a power source to achieve linear or rotary motion through hydraulic cylinders or hydraulic motors. This is suitable for applications requiring large thrust or torque, such as damper control in heavy machinery and large industrial fans. For example, the guide plate 32 can be rotated by connecting the motor shaft 12, or the guide plate 32 can be pushed by a cylinder or hydraulic cylinder to make the guide plate 32 rotate.

[0051] like Figure 3 As shown, in some modified embodiments of this application, the driving component 7 includes a telescopic rod 11, which is disposed in the flow channel and is capable of telescopic extension and retraction in a first direction; the first part 14 also includes a connecting part 13, which is fixedly connected to the guide plate 32 and rotatably connected to the second part via a rotating shaft 12; wherein, the guide plate 32 is disposed on the first side of the rotating shaft 12, the driving end of the connecting part 13 is disposed on the second side of the rotating shaft 12, the telescopic rod 11 is connected to the driving end, and the telescopic rod 11 extends and retracts in the first direction to drive the connecting part to rotate, so that the guide plate 32 rotates between a first position and a second position.

[0052] The telescopic rod 11 is a mechanical structural component capable of length variation (extension or reduction) along a specific direction (usually axial). It can consist of multiple nested or slidingly connected tubular or rod-shaped units, enabling linear movement under external power or internal elastic elements. For example, the telescopic rod 11 can be an electric telescopic rod 11, using a motor to drive a screw-nut mechanism to extend or retract the rod, allowing precise control of stroke and speed; it can also be a pneumatic telescopic rod 11 (cylinder), using compressed air to push a piston, causing the rod to move linearly, offering fast response and high force; or it can be a hydraulic telescopic rod 11 (hydraulic cylinder), using liquid pressure to push a piston rod, providing powerful thrust, suitable for heavy-duty applications.

[0053] The telescopic rod 11 can directly push the guide plate 32 to rotate, such as Figure 1 , Figure 4 and Figure 5 As shown, for example, the telescopic rod 11 can push a part of the guide plate 32, thereby causing the guide plate 32 to rotate, and then the guide plate 32 can be reset by the elastic element 8 and gravity. The telescopic rod 11 can also indirectly push the guide plate 32 to rotate. As described above, the telescopic rod 11 can be set in the flow channel, and the connecting part 13 is rotatably connected to the second part through the rotating shaft 12. The driving ends of the guide plate 32 and the connecting part 13 are respectively set on the first side and the second side of the rotating shaft 12, forming a lever. By telescopically extending and retracting the telescopic rod 11 in the first direction, the driving end of the connecting part is displaced, thereby causing the connecting part and the guide plate 32 to rotate, so that the guide plate 32 rotates between the first position and the second position. The guide plate 32 can be linked to the telescopic rod 11. For example, the telescopic rod 11 can contact one side of the guide plate 32 but not be fixed, so as to avoid the guide plate 32 from obstructing the movement of the telescopic rod 11; the telescopic rod 11 can also be rotatably connected to the guide plate 32 to improve the stability of the transmission.

[0054] In some modified embodiments of this application, an elastic element 8 is also included. The elastic element 8 is disposed between the connecting portion 13 and the second portion 31. When the guide plate 32 moves to the first position, the elastic element 8 undergoes non-elastic deformation; when the guide plate 32 moves to the second position, the elastic element 8 undergoes elastic deformation.

[0055] Elastic element 8 refers to a mechanical component with elastic deformation capability, capable of undergoing recoverable deformation (i.e., elastic deformation) when subjected to external force, and returning to its original shape after the external force is removed. For example... Figure 1 As shown, the elastic element 8 can be disposed between the first part 14 and the second part 31, or between the connecting part 13 and the second part 31. When the driving member 7 drives the guide plate 32 to move from the first position to the second position, the elastic element 8 can provide an opposing force, thereby limiting the guide plate 32 and ensuring that the guide plate 32 is stably in the set position. The elastic element 8 can also help the guide plate 32 move from the second position to the first position. The elastic element 8 can be a compression spring, installed between the connecting part 13 and the second part 31 of the guide plate 32. When the guide plate 32 moves to the second position, the spring is compressed and stores potential energy. When the driving member 7 removes the external force, the spring releases the energy, causing the guide plate 32 to automatically spring back to the first position. The elastic element 8 can also be a torsion spring, installed near the rotation axis 12 of the guide plate 32. When the guide plate 32 rotates to the second position, the torsion spring is torsion-forced, providing a rotational torque, causing the guide plate 32 to automatically reset within the set angle range.

[0056] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An electronic device, characterized in that, include: Heat-generating components, fans, and target components; The target component, the heating component, and at least a portion of the fan together form a closed flow channel; The fan draws airflow from outside the electronic device and dissipates heat from the heat-generating components through the flow channel; The target component includes at least a first part and a second part, wherein the first part is used to guide the airflow, and the first and second parts are used to isolate the airflow inside the electronic device.

2. The electronic device according to claim 1, characterized in that, The fan is disposed at the first end of the flow channel, and the target component, the heat-generating component, and the first area of ​​the fan together form the flow channel; The first part has a guide plate, which is located near the first end of the flow channel, and the airflow introduced by the first area of ​​the fan can be guided by the guide plate to the heating component.

3. The electronic device according to claim 2, characterized in that, The air guide plate is movably connected to the second part, and the air guide plate can move between a first position and a second position to adjust the area of ​​the first region of the fan; When the guide plate moves to the first position, it is located relatively far away from the heating element, and the area of ​​the first region is relatively larger; when the guide plate moves to the second position, the area of ​​the first region is relatively smaller.

4. The electronic device according to claim 3, characterized in that, Also includes: A heating element is disposed on the side of the air guide plate away from the heating component; a second region of the fan faces the heating element, and the fan is capable of introducing airflow from outside the electronic device to dissipate heat from the heating element; The second region differs from the first region. When the guide plate moves to the first position, it is relatively close to the heating element, and the area of ​​the second region is relatively smaller. When the guide plate moves to the second position, it is relatively far away from the heating element, and the area of ​​the first region is relatively larger.

5. The electronic device according to claim 3, characterized in that, The first part also includes a telescopic structure, which is connected to the side of the guide plate near the fan to seal the gap between the guide plate and the fan; When the guide plate is positioned relatively close to the fan, the telescopic structure is in a relatively contracted state; when the guide plate is positioned relatively far from the fan, the telescopic structure is in a relatively extended state.

6. The electronic device according to claim 3, characterized in that, The second part includes: An air guide bracket, wherein the air guide plate is rotatably connected to the air guide bracket, and the air guide bracket is provided with a rotation space, within which the air guide plate can rotate; A sealing plate is provided on the side of the air guide bracket away from the heating component. When the air guide plate is in the first position, the air guide plate contacts the sealing plate to form a closed hollow trapezoidal structure with the air guide bracket.

7. The electronic device according to claim 6, characterized in that, The heating element is disposed on the first side of the flow channel; The second part also includes an air guide slot, which is disposed on the side of the air guide bracket away from the fan. The air guide slot, the air guide bracket and the air guide plate cover the projection of the heating component on the first side along the projection of the first side.

8. The electronic device according to claim 3, characterized in that, A driving component is linked to the guide plate, and the driving component can drive the guide plate to move between the first position and the second position.

9. The electronic device according to claim 8, characterized in that, The driving component includes a telescopic rod disposed within the flow channel, and the telescopic rod is capable of extending and retracting in a first direction. The first part further includes a connecting part, which is fixedly connected to the guide plate, and the connecting part is rotatably connected to the second part via a rotating shaft; The guide plate is disposed on the first side of the rotating shaft, the driving end of the connecting part is disposed on the second side of the rotating shaft, the telescopic rod is connected to the driving end, and the telescopic rod extends and retracts in a first direction to drive the connecting part to rotate, so that the guide plate rotates between the first position and the second position.

10. The electronic device according to claim 9, characterized in that, Also includes: An elastic element is disposed between the connecting portion and the second portion, and when the guide plate moves to the first position, the elastic element undergoes inelastic deformation. When the guide plate moves to the second position, the elastic element undergoes elastic deformation.

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