High-heat-dissipation micro backlight module for ar
Patent Information
- Application Number
- CN202521634004.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-01
- Publication Date
- 2026-10-27
- Estimated Expiration
- 2035-08-01
Smart Images
Figure CN224909913U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of backlight module technology, specifically to a high-heat-dissipation micro backlight module for AR. Background Technology
[0002] Augmented Reality (AR) devices, with their ability to blend virtual information with real-world scenes, have found widespread application in education, healthcare, and industrial design. High-heat-dissipation micro-backlight modules are key components of AR device display systems, primarily responsible for providing a uniform and stable light source to the display panel. Their performance directly impacts the image clarity, color reproduction, and overall user experience of the AR device. In practical applications, this module typically includes the following core structures:
[0003] Light source system: It consists of an array of high-brightness micro LEDs or OLED beads. By precisely controlling the luminous intensity and color of each individual bead, it achieves a high-contrast and wide-color-gamut display effect.
[0004] Light guide assembly: With the light guide plate as the core, and in conjunction with components such as diffuser plates and reflective sheets, it diffuses and homogenizes the light emitted by the light source system, ensuring that the light can be evenly projected onto the display panel;
[0005] Optical film assembly: encompasses various films such as brightness enhancement film and polarizing film, which improve the brightness and viewing angle of the display screen and reduce glare by adjusting the reflection, refraction and polarization of light;
[0006] Drive and control circuit: integrates driver chip and complex control circuit, used to precisely regulate the emission timing, brightness and color parameters of the light source system;
[0007] Module housing: It not only provides structural support and physical protection for internal components, but also undertakes a certain heat dissipation function and is an important medium for heat exchange between the module and the outside world.
[0008] Currently, the market offers several technical solutions for heat dissipation in miniature backlight modules used in AR applications: some products employ passive heat dissipation by increasing the surface area of the module casing, adding thermally conductive silicone or heat sinks to conduct internal heat to the outside; some products introduce active heat dissipation methods, such as integrating miniature fans or semiconductor cooling chips within the module to reduce module temperature through forced convection or cooling cycles; in addition, some high-end products are attempting to apply new materials such as vapor chambers and graphene heat dissipation films in hopes of improving heat dissipation efficiency.
[0009] However, the above-mentioned heat dissipation solutions have many problems in practical applications: Due to the limitations of AR devices' thinner and smaller design, passive heat dissipation, with its limited available surface area and space, is unable to dissipate the large amount of heat generated by the light source system, driver chip, and other components in the backlight module in a timely manner during long-term high-load operation, causing the module to heat up, accelerating the light decay of LED beads, reducing display quality, and affecting circuit stability; although active heat dissipation can reduce temperature, the noise of the miniature fan interferes with the user experience, the semiconductor cooling chip has high energy consumption and is prone to damage to the circuit due to condensation, and it also increases the size and weight of the module, which goes against the trend of AR devices becoming more portable; in addition, existing solutions mostly target some key components and lack a systematic design for the entire backlight module, resulting in large temperature differences inside the module, accelerated aging of components at heat accumulation points, and seriously affecting the overall performance and lifespan of the module.
[0010] To address the aforementioned issues, this device proposes a novel heat dissipation solution: by setting an X-shaped heat sink inside the miniature backlight module for AR, an efficient and balanced heat dissipation effect is achieved. The X-shaped heat sink is made of copper alloy with a high thermal conductivity, and its unique X-shaped structure extends from the center of the module to the four corners, covering the main heat-generating areas such as the light source system, drive and control circuits, ensuring that heat can be quickly and evenly conducted to the module shell. Utility Model Content
[0011] To address the shortcomings of existing technologies, this utility model provides a high-heat-dissipation miniature backlight module for AR. It solves the problems of current heat dissipation solutions being limited by the miniaturization and lightness requirements of AR devices. Passive heat dissipation, due to limited available surface area and space, struggles to dissipate the large amounts of heat generated by the light source system, driver chip, and other components within the backlight module during prolonged high-load operation, leading to module overheating, accelerated LED light decay, reduced display quality, and impacted circuit stability. While active heat dissipation can lower the temperature, the noise from the miniature fan interferes with the user experience, the semiconductor cooling chip has high energy consumption and is prone to condensation damage to the circuit, and it also increases the module's size and weight, contradicting the trend towards portability in AR devices. Furthermore, existing solutions often target only key components, lacking a systematic design for the entire backlight module, resulting in large internal temperature differences and accelerated aging of components at heat accumulation points, severely affecting the overall performance and lifespan of the module.
[0012] To achieve the above-mentioned objectives, this utility model provides the following technical solution: a high-heat-dissipation micro backlight module for AR, comprising a housing; a top cover disposed on the top of the housing; a light-shielding adhesive disposed inside the housing, located below the top cover; and a heat dissipation assembly disposed on the inner wall of the housing to dissipate heat generated inside the housing. The heat dissipation assembly includes a square groove, a side heat dissipation filter, a through groove, a heat sink, a mounting frame, a front heat dissipation filter, a heat-conducting plate, and a heat dissipation block. The square groove is located on both sides of the housing, and there are two square grooves symmetrically arranged on both sides of the housing. The side heat dissipation filter is fixedly installed on the square groove. The mounting frame is installed at the bottom of the housing. The front heat dissipation filter is installed on the mounting frame. The heat-conducting plate is located inside the lower part of the housing. The through groove is located on both sides of the housing, and there are several through grooves. One side of the heat sink is fixedly connected to the side wall of the heat-conducting plate, and the other side of the heat sink extends through the through groove to the outside of the housing. The heat dissipation block is located between the bottom of the heat-conducting plate and the inner wall of the front heat dissipation filter.
[0013] Preferably, the heat sink is provided in a plurality of linearly distributed forms, the heat sink is X-shaped, and the heat sink is made of copper alloy with high thermal conductivity; the outer wall of the housing is provided with a heat dissipation coating.
[0014] Preferably, the bottom of the light-shielding adhesive is provided with a composite film, the bottom of the composite film is provided with a beam-splitting film three, the bottom of the beam-splitting film three is provided with a beam-splitting film two, the bottom of the beam-splitting film two is provided with a beam-splitting film one, the bottom of the beam-splitting film one is provided with a QD film; the bottom of the QD film is provided with a BLT, the bottom of the BLT is provided with a MiniLed lamp board, and a glue iron is provided below the MiniLed lamp board, the bottom of the glue iron is in contact with the top of the heat-conducting plate.
[0015] Compared with the prior art, this utility model provides a high heat dissipation miniature backlight module for AR, which has the following beneficial effects:
[0016] 1. High-efficiency heat dissipation performance: The heat sink is made of copper alloy with high thermal conductivity and is X-shaped. Its unique structure can cover the main heat-generating areas such as the light source system, drive and control circuits, and MiniLED light boards, ensuring that heat is quickly and evenly conducted to the module shell. Compared with traditional heat dissipation methods, the heat dissipation efficiency is significantly improved. At the same time, it works in conjunction with the heat conduction plate, heat sink, front heat dissipation filter, and side heat dissipation filter to form a three-dimensional heat dissipation channel, which solves the problem of limited passive heat dissipation efficiency and effectively avoids the situation of LED light decay, display quality degradation, and circuit stability being affected by heat accumulation. The heat dissipation coating on the outer wall of the shell further enhances the heat exchange capacity between the module and the outside world, assists in overall heat dissipation, and reduces heat accumulation inside the module.
[0017] 2. Systematic and Balanced Heat Dissipation: Through the layout and design of components such as heat sinks, heat conduction plates, and heat sinks, systematic heat dissipation of the entire backlight module is achieved. This overcomes the shortcomings of existing solutions that only target heat dissipation for some key components, effectively reducing the temperature difference between different areas inside the module, slowing down the aging of components such as driver chips where heat accumulates, and improving the overall performance and lifespan of the module. The stable heat dissipation system ensures that the optical film group operates at a suitable temperature, enabling it to perform its light regulation function normally, thereby improving the brightness and viewing angle of the display and reducing glare, ensuring the clarity and color reproduction of the AR device's display. Attached Figure Description
[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model;
[0019] Figure 2 This is a schematic diagram of the bottom structure of this utility model;
[0020] Figure 3 This is a schematic diagram of the top structure of this utility model;
[0021] Figure 4 This is a schematic diagram of the internal structure of this utility model;
[0022] Figure 5 This is a schematic diagram of the internal side view structure of this utility model;
[0023] Figure 6 This is a side view of the heat sink structure of this utility model;
[0024] Figure 7 This is a schematic diagram of the front heat dissipation filter structure of this utility model.
[0025] In the diagram: 1. Housing; 2. Square groove; 3. Side heat dissipation filter; 4. Top cover; 5. Through groove; 6. Heat sink; 7. Mounting frame; 8. Front heat dissipation filter; 9. Heat conduction plate; 10. Heat sink block; 11. Glue iron; 12. Light-shielding adhesive; 13. Composite film; 14. Beam splitter film three; 15. Beam splitter film two; 16. Beam splitter film one; 17. QD film; 18. BLT; 19. Mini LED light panel. Detailed Implementation
[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0027] Example
[0028] like Figures 1 to 7 As shown, the technical solution in this application effectively addresses the limitations of current heat dissipation solutions due to the need for thinner and smaller AR devices. Passive heat dissipation, with its limited usable surface area and space, struggles to dissipate the large amounts of heat generated by the light source system, driver chip, and other components within the backlight module during prolonged high-load operation, leading to module overheating, accelerated LED light decay, reduced display quality, and impacted circuit stability. While active heat dissipation can lower the temperature, the noise from the miniature fan interferes with user experience, the semiconductor cooling chip is energy-intensive and prone to condensation damage, and it also increases the module's size and weight, contradicting the trend towards portability in AR devices. Furthermore, existing solutions often target only key components, lacking a systematic design for the entire backlight module, resulting in large internal temperature differences and accelerated aging of components at heat accumulation points, severely affecting the overall performance and lifespan of the module. The overall approach is as follows:
[0029] To address the problems existing in the prior art, this utility model provides a high heat dissipation micro backlight module for AR, including a housing 1; a top cover 4, which is disposed on the top of the housing 1; a light-shielding adhesive 12, which is disposed inside the housing 1 and located below the top cover 4; and a heat dissipation assembly, which is disposed on the inner wall of the housing 1 to dissipate the heat generated inside the housing 1; the heat dissipation assembly includes a square groove 2, a side heat dissipation filter 3, a through groove 5, a heat sink 6, a mounting frame 7, a front heat dissipation filter 8, a heat-conducting plate 9, and a heat sink block 10; the square groove 2 is opened on both sides of the housing 1, and there are two square grooves 2 symmetrically arranged on both sides of the housing 1; the side heat dissipation filter 3 is fixedly installed on the square groove 2; Mounting frame 7 is installed at the bottom of housing 1; front heat dissipation filter 8 is installed on mounting frame 7; heat conduction plate 9 is located inside the lower part of housing 1; through slots 5 are opened on both sides of housing 1, and several through slots 5 are provided; one side of heat sink 6 is fixedly connected to the side wall of heat conduction plate 9, and the other side of heat sink 6 extends through through slot 5 to the outside of housing 1; heat dissipation block 10 is located between the bottom of heat conduction plate 9 and the inner wall of front heat dissipation filter 8; several heat dissipation blocks 10 are provided and linearly distributed, heat dissipation blocks 10 are X-shaped, and heat dissipation blocks 10 are made of copper alloy with high thermal conductivity; when the high heat dissipation micro backlight module for AR is working, the internal light source system and other components, drive and control circuits and other components will generate heat. Heat is first transferred to the heat-conducting plate 9 through the adhesive iron 11 in contact with the MiniLed lamp panel 19. The adhesive iron 11 plays a role in initial heat conduction and fixed support. At the same time, the heat generated by the optical film group located below the light-shielding adhesive 12 and the BLT 18 during operation will also diffuse to the surroundings and be gradually conducted to the heat-conducting plate 9. As an important heat-conducting element inside the module, the heat-conducting plate 9 quickly absorbs heat from various components and gathers the heat due to its good thermal conductivity. After absorbing heat, the heat-conducting plate 9 transfers the heat absorbed from the side to the heat sink 6 fixedly connected to its side wall. The heat sink 6 extends to the outside of the housing 1 through the through slots 5 opened on both sides of the housing 1, and uses its large surface area to exchange heat with the air, dissipating the heat to the outside of the module. Meanwhile, the side heat dissipation filters 3, which are fixedly installed on the square grooves 2 symmetrically arranged on both sides of the housing 1, can assist the airflow at the heat sink 6 and accelerate the heat dissipation from the side heat dissipation filters 3. On the other hand, the heat from the bottom of the heat conduction plate 9 is transferred to the linearly distributed X-shaped heat sink 10. The heat sink 10 is made of copper alloy with a high thermal conductivity, which can absorb heat quickly and efficiently, and conduct heat evenly through its unique X-shaped structure. The bottom of the heat sink 10 contacts the front heat dissipation filter 8 installed on the mounting frame 7, and the heat is discharged to the outside of the module through the front heat dissipation filter 8. During this process, the heat dissipation coating on the outer wall of the housing 1 can help the housing 1 dissipate the small amount of heat it absorbs, further improving the overall heat dissipation effect.
[0030] The outer wall of the housing 1 is provided with a heat dissipation coating; the bottom of the light-shielding adhesive 12 is provided with a composite film 13, the bottom of the composite film 13 is provided with a beam splitting film 3 14, the bottom of the beam splitting film 3 14 is provided with a beam splitting film 2 15, the bottom of the beam splitting film 2 15 is provided with a beam splitting film 16, the bottom of the beam splitting film 16 is provided with a QD film 17; the bottom of the QD film 17 is provided with a BLT 18, the bottom of the BLT 18 is provided with a Mini LED lamp board 19, and the bottom of the Mini LED lamp board 19 is provided with a glue iron 11, the bottom of the glue iron 11 is in contact with the top of the heat-conducting plate 9; throughout the heat dissipation process, the light-shielding adhesive 12 plays a role in preventing light leakage and ensuring the quality of the displayed image. The optical film group below it, including composite film 13, beam splitting film three 14, beam splitting film two 15, beam splitting film one 16, QD film 17, BLT 18, etc., can normally perform the functions of light reflection, refraction, and polarization adjustment under a stable temperature environment, thereby improving the brightness and viewing angle of the display screen and reducing glare. The housing 1 and the top cover 4 together form the structural frame of the module, providing structural support and physical protection for the internal components, ensuring that each part maintains a stable working state during heat dissipation.
[0031] Structural Description: Housing 1: Serves as the basic frame for the high-heat-dissipation miniature backlight module used in AR, providing structural support and physical protection for all internal components. Its outer wall is coated with a heat-dissipating layer to enhance heat exchange with the external environment and aid in module heat dissipation. Square slots 2 and through slots 5 are symmetrically formed on both sides of housing 1, used for mounting side heat dissipation filters 3 and providing extension channels for heat sinks 6, respectively, optimizing the internal heat dissipation layout. Simultaneously, the top of housing 1 is used to mount the top cover 4, and the bottom is used to mount the mounting frame 7, together forming a closed module space to ensure stable operation of internal components.
[0032] Square slots 2: These are symmetrically distributed on both sides of the housing 1, providing installation positions for the side heat dissipation filters 3. Their design allows air to circulate more smoothly around the heat sink 6, assisting the heat sink 6 in dissipating heat outside the module and improving overall heat dissipation efficiency.
[0033] Side heat dissipation filter 3: Fixedly installed on the square slot 2, it serves to protect internal components and guide airflow. It allows air to pass through while blocking dust and foreign objects from entering the module, ensuring the heat dissipation effect of the heat sink 6 and the cleanliness of the module's interior, thus maintaining the normal operating environment for the components.
[0034] Top cover 4: Located on the top of housing 1, together with housing 1, it forms the closed outer shell of the module, further protecting the internal components from physical damage and external environmental interference, while providing mounting support for optical components such as light-shielding adhesive 12, ensuring the stability of the optical structure.
[0035] Through slots 5: Several through slots are provided on both sides of the housing 1, mainly for the heat sink 6 to pass through and extend to the outside of the housing 1. Through these through slots 5, the heat sink 6 can effectively contact the outside air and dissipate the heat conducted from the heat conduction plate 9, which is an important channel for the transfer of heat from the inside of the module to the outside.
[0036] Heat sink 6: One side is fixedly connected to the side wall of the heat-conducting plate 9, and the other side extends through the through groove 5 to the outside of the housing 1. With its large surface area, it fully exchanges heat with the outside air, dissipating the heat transferred from the heat-conducting plate 9 to the outside of the module. Its structural design increases the heat dissipation area and improves heat dissipation efficiency, making it a key component for lateral heat dissipation of the module.
[0037] Mounting frame 7: Installed at the bottom of housing 1, it is used to fix the front heat dissipation filter 8 and provide mounting support for heat sink 10. It ensures the stability of the front heat dissipation filter 8 and heat sink 10 in the module, ensures the normal operation of the heat dissipation channel, and maintains the integrity of the module structure.
[0038] Front heat dissipation filter 8: Installed on the mounting frame 7, located at the bottom of the heat sink 10. It allows airflow, enabling the heat conducted from the heat sink 10 to be smoothly discharged outside the module, while also serving a protective function to prevent foreign objects from entering the module and affecting heat dissipation and component operation.
[0039] Heat-conducting plate 9: Located inside the lower part of the housing 1, it is the core component for heat conduction within the module. It contacts the Mini LED light panel 19 via adhesive strip 11 and simultaneously receives heat from the optical film composite film 13, beam splitting film three 14, beam splitting film two 15, beam splitting film one 16, QD film 17, and BLT 18. Thanks to its excellent thermal conductivity, it rapidly gathers this heat and transfers it to the heat sink 6 and heat dissipation block 10, achieving both lateral and longitudinal heat conduction.
[0040] Heat sink 10: Made of copper alloy with high thermal conductivity, it is X-shaped and has several units arranged linearly, located between the bottom of the heat conduction plate 9 and the inner wall of the front heat dissipation filter 8. Its unique X-shaped structure can cover the main heat-generating areas of the light source system, such as the Mini LED light board 19, driving and control circuits, quickly and efficiently absorbing the heat transferred by the heat conduction plate 9, and evenly conducting the heat to the front heat dissipation filter 8 for discharge through structural design. It is a key component for achieving efficient and balanced heat dissipation of the module.
[0041] Plug 11: Located below the Mini LED light panel 19, in contact with the top of the heat-conducting plate 9. It not only plays a preliminary role in heat conduction, transferring the heat generated by the Mini LED light panel 19 to the heat-conducting plate 9, but also provides fixed support for the Mini LED light panel 19, ensuring the stability of the light source system in the module and guaranteeing its normal operation.
[0042] Light-shielding adhesive 12: Located inside the housing 1 and below the top cover 4, its main function is to prevent light leakage. By sealing the gap between the optical film assembly and the top cover 4, it ensures that light propagates along a predetermined path, avoids stray light affecting the display effect, and guarantees the quality of the AR device's display image.
[0043] Composite film 13: Located at the bottom of the light-shielding adhesive 12, it works in conjunction with beam-splitting film 14 to perform preliminary processing and adjustment of light. It can improve the distribution and characteristics of light, laying the foundation for further processing of light by the subsequent beam-splitting film, and is an important component of the optical film assembly to achieve light optimization function.
[0044] Spectrophotometer 3 14: Located below composite film 13, it distributes light according to a specific ratio and direction through operations such as reflection and refraction of light, further optimizing the propagation path and characteristics of light, and improving the brightness and color uniformity of the displayed image.
[0045] Beam splitter 2 15: At the bottom of beam splitter 3 14, the light is further refined by adjusting the angle, intensity and polarization state of the light to ensure that the light can better meet the display requirements and improve the quality and viewing angle of the display.
[0046] Beam splitter 16: Located at the bottom of beam splitter 2 15, it performs final optimization and calibration of the light, enabling the light to be accurately projected onto the display panel, reducing light loss and glare, and improving the clarity and contrast of the AR device's display.
[0047] QD Film 17: Located at the bottom of the beam-splitting film 16, it utilizes quantum dot technology to optimize the color of light. It can significantly improve the color gamut and color saturation of the displayed image, making the displayed colors more vivid and realistic, and enhancing the visual effects of AR devices.
[0048] BLT18: Located at the bottom of QD film 17, its main function is to homogenize light and provide stable backlight for the display panel. It ensures that light is projected evenly onto the display panel, guaranteeing the brightness uniformity of the displayed image, and is a crucial step in achieving high-quality display.
[0049] MiniLED light board 19: As the core component of the light source system, it consists of an array of high-brightness miniature LED beads. By precisely controlling the luminous intensity and color of each individual bead, it achieves a high-contrast, wide-color-gamut display effect, providing the light source required for virtual information display in AR devices. The heat generated is transferred to the heat-conducting plate 9 through the adhesive iron 11, and is one of the main sources of heat for the module.
[0050] Instructions for use
[0051] When the high-heat-dissipation miniature backlight module for AR is working, internal components such as the light source system, drive and control circuits generate heat. The heat is first transferred to the heat-conducting plate 9 through the adhesive iron 11 in contact with the MiniLed lamp board 19. The adhesive iron 11 plays a role in initial heat conduction and fixed support. At the same time, the heat generated by the optical film group and BLT18 located below the light-shielding adhesive 12 during operation will also diffuse to the surroundings and gradually conduct to the heat-conducting plate 9. As an important heat-conducting element inside the module, the heat-conducting plate 9 quickly absorbs the heat from various components and concentrates the heat due to its good thermal conductivity. After absorbing the heat, the heat-conducting plate 9 transfers the heat absorbed from the side to the heat sink 6 fixedly connected to its side wall. The heat sink 6 extends to the outside of the housing 1 through the through slots 5 opened on both sides of the housing 1, and uses its large surface area to exchange heat with the air, dissipating the heat to the outside of the module. Meanwhile, the side heat dissipation filters 3, which are fixedly installed on the square grooves 2 symmetrically arranged on both sides of the housing 1, can assist the airflow at the heat sink 6 and accelerate the heat dissipation from the side heat dissipation filters 3. On the other hand, the heat from the bottom of the heat conduction plate 9 is transferred to the linearly distributed X-shaped heat sink 10. The heat sink 10 is made of copper alloy with a high thermal conductivity, which can absorb heat quickly and efficiently, and conduct heat evenly through its unique X-shaped structure. The bottom of the heat sink 10 contacts the front heat dissipation filter 8 installed on the mounting frame 7, and the heat is discharged to the outside of the module through the front heat dissipation filter 8. During this process, the heat dissipation coating on the outer wall of the housing 1 can help the housing 1 dissipate the small amount of heat it absorbs, further improving the overall heat dissipation effect. During the entire heat dissipation process, the light-shielding adhesive 12 plays a role in preventing light leakage and ensuring the quality of the display image. The optical film group below it, including composite film 13, beam splitting film three 14, beam splitting film two 15, beam splitting film one 16, QD film 17, BLT 18, etc., can normally perform the functions of light reflection, refraction, and polarization adjustment under a stable temperature environment, thereby improving the brightness and viewing angle of the display screen and reducing glare. The housing 1 and the top cover 4 together form the structural frame of the module, providing structural support and physical protection for the internal components, ensuring that each part maintains a stable working state during heat dissipation.
[0052] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. High heat dissipation miniature backlight module for AR, including: Shell (1); Top cover (4), the top cover (4) is disposed on the top of the housing (1); Light-shielding adhesive (12) is disposed inside the housing (1) and located below the top cover (4); Its characteristic is that it also includes: A heat dissipation component is installed on the inner wall of the housing (1) to dissipate the heat generated inside the housing (1); The heat dissipation assembly includes a square groove (2), a side heat dissipation filter (3), a through groove (5), a heat sink (6), a mounting frame (7), a front heat dissipation filter (8), a heat conduction plate (9), and a heat dissipation block (10). The square groove (2) is provided on both sides of the shell (1), and there are two square grooves (2) symmetrically arranged on both sides of the shell (1); The side heat dissipation filter (3) is fixedly installed on the square groove (2); The mounting frame (7) is mounted on the bottom of the housing (1); The front heat dissipation filter (8) is mounted on the mounting frame (7); The heat-conducting plate (9) is located inside the lower part of the shell (1); The through slots (5) are provided on both sides of the housing (1), and there are several through slots (5); One side of the heat sink (6) is fixedly connected to the side wall of the heat-conducting plate (9), and the other side of the heat sink (6) extends through the through groove (5) to the outside of the housing (1); The heat sink (10) is located between the bottom of the heat-conducting plate (9) and the inner wall of the front heat dissipation filter (8).
2. The high heat dissipation micro backlight module for AR according to claim 1, characterized in that: The heat sink (10) is provided in a plurality of linearly distributed forms. The heat sink (10) is X-shaped and is made of copper alloy with high thermal conductivity.
3. The high heat dissipation micro backlight module for AR according to claim 1, characterized in that: The outer wall of the housing (1) is provided with a heat dissipation coating.
4. The high heat dissipation micro backlight module for AR according to claim 1, characterized in that: The light-shielding adhesive (12) has a composite film (13) at the bottom, a beam splitting film three (14) at the bottom of the composite film (13), a beam splitting film two (15) at the bottom of the beam splitting film three (14), a beam splitting film one (16) at the bottom of the beam splitting film two (15), and a QD film (17) at the bottom of the beam splitting film one (16).
5. The high heat dissipation micro backlight module for AR according to claim 4, characterized in that: The bottom of the QD film (17) is provided with a BLT (18), the bottom of the BLT (18) is provided with a Mini LED light panel (19), and a glue iron (11) is provided below the Mini LED light panel (19). The bottom of the glue iron (11) is in contact with the top of the heat-conducting plate (9).