An electrical device and electrical module

Abstract

The embodiment of the present application discloses an electrical device and an electrical module. The electrical device can be a charging device in the form of a charging pile, and can also be an inverter, etc. The electrical device comprises a shell. The electrical module comprises a heating device and a heat dissipation device. The heating device can be arranged on the inner side of the shell. The heat dissipation device is of an integrated structure. The heat dissipation device comprises a main body module and a first fin module. The main body module can also be arranged on the inner side of the shell. At least part of the first fin module can be arranged on the outer side of the shell. The heating device is mounted on the main body module. The cooling and heat dissipation effect of the heat dissipation device in the above-mentioned electrical module is relatively good.

Description

Technical Field

[0001] This application relates to the field of power electronics technology, specifically to an electrical device and an electrical module. Background Technology

[0002] Electrical equipment such as charging piles and inverters contain heat-generating components that emit significant heat during operation, affecting their own performance and that of the entire device. Current technologies primarily employ a cooling system combining internal and external heat sinks, but this method is relatively ineffective.

[0003] Therefore, how to provide a solution to overcome or alleviate the above-mentioned defects remains a technical problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0004] To address the aforementioned technical problems, this application provides an electrical device and an electrical module, which is applied in the electrical device, and the heat dissipation device of the electrical module can have a relatively better cooling effect.

[0005] In a first aspect, embodiments of this application provide an electrical module applicable to electrical equipment. The electrical equipment may be, for example, a charging device in the form of a charging pile, or an inverter, and includes a housing. The electrical module includes a heat-generating device and a heat-dissipating device. The heat-generating device can be disposed inside the housing. The heat-dissipating device is an integral structure. The heat-dissipating device includes a main body module and a first fin module. The main body module can also be disposed inside the housing. At least a portion of the first fin module can be disposed outside the housing. The heat-generating device is mounted on the main body module.

[0006] Using the above solution, the heat from the heating element can be transferred to the main module and then diffused from the main module to the first fin module. The first fin module can exchange heat with the heat dissipation airflow on the outside of the housing to remove the heat generated by the heating element, thereby achieving cooling and heat dissipation of the heating element. In this embodiment, the heat dissipation device is an integrated structure, which eliminates the need for the thermal interface material layer between the internal and external heat sinks in related technologies. This effectively improves the heat transfer efficiency and thus the heat dissipation effect, adapting to the current trend of high power density development. Simultaneously, the integrated heat dissipation device can be easily installed, simplifying the assembly process.

[0007] The aforementioned integrated heat dissipation device can take two forms: First, the heat dissipation device is a one-piece molded structure, meaning the aforementioned main module and first fin module can be integrally molded, such as through integral casting or integral extrusion molding; second, the main module and first fin module can be fabricated separately and then joined together using a welding process. In short, as long as the main module and first fin module can be an integral structure, there is no need to provide a thermal interface material layer between them.

[0008] In one possible implementation, the main module has a mounting surface, on which at least one heating element is disposed.

[0009] In one design, the main module can have at least two mounting surfaces. This configuration allows a single heat sink to cool multiple heat-generating components, reducing the number of heat sinks required and improving their utilization efficiency. Furthermore, when multiple heat-generating components are mounted on the same heat sink, multiple components can transfer heat to it, allowing the heat sink to reach a relatively high temperature. This also results in a larger temperature difference between the heat sink and the external environment, which is beneficial for improving the heat dissipation efficiency of the heat sink.

[0010] In another approach, the main module can also have only one mounting surface, which is also feasible.

[0011] In one possible implementation, the electrical module also includes a thermally conductive insulating device disposed between the heat-generating device and the main module to achieve insulation isolation between the heat-generating device and the main module.

[0012] In one possible implementation, the electrical module also includes a thermal interface material layer. A thermal interface material layer is provided between the thermally conductive insulating device and the main module, as well as between the thermally conductive insulating device and the heat-generating device, to fill the air gaps between the thermally conductive insulating device and the main module, and between the thermally conductive insulating device and the heat-generating device. This can effectively reduce the thermal resistance between the main module and the thermally conductive insulating device, thereby improving the heat transfer efficiency and ultimately improving the heat dissipation efficiency.

[0013] In one possible implementation, the heat dissipation device further includes a second fin module connected to the main body module. The second fin module can also be configured inside the housing to facilitate uniform heat distribution and conduction within the electrical equipment. This allows for a larger contact area between the heat dissipation device and the internal space of the housing, enabling more heat to be transferred from the housing to the heat dissipation device. This is beneficial for improving the heat dissipation effect of the electrical equipment.

[0014] Furthermore, the design of the second fin module allows the heat-generating device to have at least three heat dissipation methods: Method 1, the heat-generating device directly dissipates heat from the air inside the housing; Method 2, the heat emitted by the heat-generating device first enters the main module, then diffuses from the main module to the second fin module, where it is dissipated by the second fin module and the air inside the housing; Method 3, the heat emitted by the heat-generating device, after entering the main module, can diffuse from the main module to the first fin module, where it is dissipated by the first fin module and the cooling airflow outside the housing. It is evident that the second fin module increases the heat dissipation methods for the heat-generating device, enabling more efficient cooling.

[0015] The molding method of the second fin module and the main body module is consistent with the molding method of the first fin module and the main body module mentioned above, and will not be repeated here.

[0016] In one possible implementation, the second fin module and the heating element can be located on opposite sides of the main module. This arrangement reduces interference between the heating element and the second fin module, facilitating the installation and fixation of the heating element on the main module. Furthermore, positioning the second fin module and the heating element on opposite sides of the main module allows both the first and second methods mentioned above to utilize the air on either side of the main module for heat dissipation, thus making more efficient use of the air inside the casing.

[0017] In one possible implementation, the electrical module also includes connectors, through which the heating element is connected to the main module. These connectors can be, for example, screws. A heating element can be mounted and secured using one connector, or a heating element can be mounted and secured using at least two screws, as long as the requirements for use are met.

[0018] In addition to the above, in some other implementations of the embodiments of this application, the electrical module also includes a pressure plate and a connector. The pressure plate is connected to the main module via the connector, and the pressure plate is configured to press against at least two heating devices. In this implementation, the cooperation between the connector and the pressure plate allows for the simultaneous installation and fixing of multiple heating devices, reducing the number of connectors used and thus simplifying the installation process.

[0019] Secondly, embodiments of this application also provide an electrical device, which may be, for example, a charging device in the form of a charging pile, or an inverter. The electrical device includes a housing and an electrical module. The electrical module is the same as that described in the first aspect or any of its implementations. The heating element and the main module are both located inside the housing. At least a portion of the first fin module is located outside the housing.

[0020] In the aforementioned electrical equipment, the heat generated by the heating element can be transferred to the main module and then diffused from the main module to the first fin module. The first fin module can exchange heat with the cooling airflow on the outside of the housing to remove the heat generated by the heating element, thereby achieving cooling and heat dissipation. Furthermore, the heat dissipation device is an integrated structure, eliminating the need for the thermal interface material layer between the internal and external heat sinks in related technologies. This effectively improves heat transfer efficiency and thus enhances heat dissipation, adapting to the current trend of high power density development. Simultaneously, the integrated heat dissipation device facilitates installation, simplifying the assembly process.

[0021] In this embodiment, the number of heat dissipation devices can be at least two, and the heat dissipation devices can be arranged at intervals to accommodate the heat dissipation needs of heat-generating devices at different locations in the electrical equipment. Alternatively, only one heat dissipation device may be provided, depending on the specific characteristics of the heat-generating devices in the electrical equipment and their heat dissipation requirements.

[0022] In one possible implementation, the electrical equipment also includes a carrier device, such as a printed circuit board. The heating element and the carrier device are connected; specifically, the heating element may have connection pins, allowing it to connect to the carrier device. The main module has a connecting part, which is also connected to the carrier device. This fixed connection between the main module and the carrier device reduces the likelihood of relative movement between them, and consequently, minimizes the force exerted on the connection pins of the heating element and the connection point of the carrier device, thus ensuring a more reliable connection between them.

[0023] In one possible implementation, the housing includes a mounting wall with an opening. A first fin module extends out of the housing through the opening, and the main body module is connected to the mounting wall. After the main body module is connected to the mounting wall, it can seal the opening.

[0024] Furthermore, a sealing component is provided between the main module and the mounting shell wall. This sealing component can be a sealing ring, gasket, or sealant, etc., to achieve a seal between the main module and the mounting shell wall. This reduces the ingress of external moisture, dust, and other foreign matter into the shell, and prevents damage to heating and load-bearing components, thus helping to ensure the service life of the electrical equipment. In addition, sealing components such as sealing rings, gaskets, and sealants also have elastic deformation capabilities, which can effectively absorb installation tolerances. Attached Figure Description

[0025] Figure 1 This is a simplified structural diagram of an electrical device provided in an embodiment of this application;

[0026] Figure 2 for Figure 1 Connection structure diagram of heating and heat dissipation devices;

[0027] Figure 3 for Figure 2 A structural diagram from another perspective;

[0028] Figure 4 This is a simplified structural diagram of another electrical device provided in the embodiments of this application;

[0029] Figure 5 for Figure 4 Connection structure diagram of heating and heat dissipation devices;

[0030] Figure 6 for Figure 5 A structural diagram from another perspective.

[0031] Figure label:

[0032] 1000 - Electrical equipment; 1000A - Electrical module; 1100 - Housing; 1110 - Mounting housing wall; 1111 - Opening; 1200 - Heating element; 1210 - Connecting pin; 1300 - Heat dissipation element; 1310 - Main module; 1311 - Main body; 1311A - Mounting surface; 1311B - Connecting part; 1312 - Substrate part; 1312A - Connecting hole; 1320 - First fin module; 1330 - Second fin module; 1400 - Thermally conductive insulating element; 1500 - Thermal interface material layer; 1600 - Sealing component; 1700 - Connector; 1800 - Pressure plate; 1900 - Bearing device. Detailed Implementation

[0033] To enable those skilled in the art to better understand the technical solutions of this application, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0034] In the description of the embodiments of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first" and "second" may explicitly or implicitly include one or more of that feature.

[0035] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation", "connection" and "linking" should be interpreted broadly. For example, "linking" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0036] The directional terms mentioned in the embodiments of this application, such as "inner" and "outer", are only for reference to the direction of the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0037] In the description of embodiments of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0038] Please refer to Figures 1-3 , Figure 1 This is a simplified structural diagram of an electrical device provided in an embodiment of this application; Figure 2 for Figure 1 Connection structure diagram of heating and heat dissipation devices; Figure 3 for Figure 2 A structural diagram from another perspective.

[0039] like Figure 1 As shown, this application embodiment provides an electrical device 1000, which may be a charging device in the form of a charging pile, or an inverter, etc., without limitation. The electrical device 1000 includes a housing 1100 and an electrical module 1000A, which may include a heating element 1200 and a supporting element 1900.

[0040] The housing 1100 is the external structure of the electrical device 1000. Devices such as heating elements in the electrical device 1000 can be directly or indirectly mounted on the housing 1100 for integrated assembly. Specifically, the heating element 1200 can be located inside the housing 1100, which protects it from external moisture, dust, and other foreign objects. The housing 1100 also largely determines the external shape of the electrical device 1000. In this embodiment, the external shape of the housing 1100 is not explicitly limited. In practical applications, those skilled in the art can choose the shape according to specific needs, as long as it meets the requirements. For example, the housing 1100 can be a triangular prism, cuboid, cylinder, or other three-dimensional structure.

[0041] The heat-generating device 1200 specifically refers to an electronic device that generates heat during use, i.e., an electronic device with a heat dissipation requirement. The specific type, quantity, packaging form, and installation location of the heat-generating device 1200 are not limited here; in practical applications, those skilled in the art can determine these details based on the type of electrical equipment 1000 and other relevant requirements. In some implementations, the aforementioned heat-generating device 1200 can be an active power device in the form of a power transistor, chip, etc., such as an Insulated-Gate Bipolar Transistor (IGBT), an Integrated Gate-Commutated Thyristor (IGCT), or a Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET). Taking a power transistor as an example, the power transistor can be packaged using a Transistor Outline (TO) 247 or TO 220 package. In some other implementations, the aforementioned heating device 1200 can also be a reactive power device in the form of a capacitor, reactor, or other similar device.

[0042] The heating element 1200 may be mounted on the carrier device 1900 so that it can be accommodated and assembled inside the housing 1100 via the carrier device 1900. The carrier device 1900 may be, for example, a printed circuit board (PCB).

[0043] Here, the embodiments of this application do not limit the specific connection method between the heating device 1200 and the carrier device 1900. In practical applications, those skilled in the art can choose according to specific needs, as long as the requirements of use are met. For example, the heating device 1200 and the carrier device 1900 can be connected by welding, plugging, or other connection methods; see reference Figure 1 The heating device 1200 may have a connection pin 1210, and the heating device 1200 may be connected to the carrier device 1900 through the connection pin 1210.

[0044] To achieve effective heat dissipation for heat-generating devices, one related technology involves directly introducing a cooling airflow into the housing to directly cool the device. However, this technology also introduces dust, moisture, and other foreign matter carried by the airflow into the housing, potentially corroding the heat-generating and supporting components and affecting the lifespan of the electrical equipment. An improved solution involves encapsulating the heat-generating and supporting components with potting compound, which effectively prevents corrosion from dust and moisture. However, potting compounding is costly and introduces potting stress, which may affect the connection reliability between the heat-generating and supporting components.

[0045] In another related technology, electrical equipment can be equipped with separate internal and external heat sinks. The internal heat sink is located inside the housing, and the heat-generating components can be mounted on it. A thermal interface material layer is provided between the internal and external heat sinks. The external heat sink can be located outside the housing to utilize external airflow for cooling. In this technology, since the cooling airflow is not introduced into the housing, it can better avoid the problems of corrosion of heat-generating and supporting components, as well as the high cost and poor connection reliability caused by potting. However, the thermal interface material layer between the internal and external heat sinks can affect heat transfer, resulting in relatively poor heat dissipation and making it difficult to adapt to the current trend of high power density development.

[0046] To address this, in this embodiment, the electrical module 1000A further includes a heat dissipation device 1300. The heat dissipation device 1300 is an integrated structure and includes a main body module 1310 and a first fin module 1320 connected to each other. At least a portion of the main body module 1310 is located inside the housing 1100, and the heat-generating device 1200 is mounted on the main body module 1310. The first fin module 1320 includes at least two heat dissipation fins, and at least a portion of the first fin module 1320 is located outside the housing 1100.

[0047] With this configuration, the heat from the heating element 1200 can be transferred to the main module 1310, and then diffused from the main module 1310 to the first fin module 1320. The first fin module 1320 can exchange heat with the heat dissipation airflow outside the housing 1100 to remove the heat generated by the heating element 1200, thereby achieving cooling and heat dissipation of the heating element 1200. In this embodiment, the heat dissipation device 1300 is an integrated structure, which eliminates the need for the thermal interface material layer between the internal and external heat sinks in related technologies. This effectively improves the heat transfer efficiency and thus enhances the heat dissipation effect, adapting to the current trend of high power density development.

[0048] It should be noted that the aforementioned integrated heat dissipation device 1300 can include two forms: First, the heat dissipation device 1300 is an integrally formed structure, that is, the aforementioned main body module 1310 and the first fin module 1320 can be integrally formed, such as integral casting, integral extrusion molding, etc.; Second, the main body module 1310 and the first fin module 1320 can also be prepared separately and then connected into one piece by welding process; In short, as long as the main body module 1310 and the first fin module 1320 can be an integral structure, there is no need to set a thermal interface material layer between the main body module and the first fin module.

[0049] Here, the embodiments of this application do not limit the specific material of the heat dissipation device 1300. In practical applications, those skilled in the art can select according to specific needs, as long as it can meet the requirements of use. For example, the heat dissipation device 1300 can be made of metal, such as copper, aluminum, copper-aluminum alloy, etc., in order to ensure thermal conductivity.

[0050] Furthermore, the embodiments of this application do not limit the formation method of the above-mentioned heat dissipation airflow. The above-mentioned heat dissipation airflow can be natural wind, in which case the heat dissipation device 1300 can cool and dissipate heat from the heat-generating device 1200 by means of natural wind cooling. Alternatively, the above-mentioned heat dissipation airflow can also be forced wind, in which case the electrical equipment 1000 can also be equipped with a fan or other air supply component to provide forced wind to the heat dissipation device 1300 to cool and dissipate heat from the heat-generating device 1200.

[0051] In some implementations, housing 1100 may include mounting housing wall 1110, which is specifically a housing wall for mounting heat dissipation device 1300.

[0052] Combination Figure 1The mounting shell wall 1110 may have an opening 1111. The first fin module 1320 is configured to extend out of the shell 1100 through this opening 1111. The main body module 1310 can be connected to the mounting shell wall 1110. Specific connection methods include bolting, riveting, snap-fitting, etc., which are not limited here, as long as they ensure reliable installation between the heat dissipation device 1300 and the shell 1100. After installation, the main body module 1310 can seal the opening 1111.

[0053] Furthermore, a sealing component 1600 can be provided between the main module 1310 and the mounting shell wall 1110. This sealing component 1600 can be, for example, a sealing ring, a sealing gasket, or sealant, and can be used to seal the main module 1310 and the mounting shell wall 1110. This reduces the entry of external moisture, dust, and other foreign matter into the shell 1100, and the resulting damage to the heating element 1200 and the load-bearing device 1900, thus helping to ensure the service life of the electrical equipment 1000. In addition, the sealing component 1600, in the form of a sealing ring, sealing gasket, or sealant, also has elastic deformation capability, and can better absorb installation tolerances.

[0054] Here, the embodiments of this application do not limit the specific structural form of the main module 1310. In practical applications, those skilled in the art can choose according to specific needs, as long as it can meet the requirements of use. For example, it can be combined with Figures 1-3 The main body module 1310 may include a main body portion 1311 and a base plate portion 1312. The main body portion 1311 may be located on the side of the base plate portion 1312 away from the first fin module 1320. Each heat dissipation fin in the first fin module 1320 may be connected to the base plate portion 1312. The base plate portion 1312 is used to connect with the mounting shell wall 1110. For example, the base plate portion 1312 may be provided with a connection hole 1312A, through which external screws and the like can pass to achieve the fixed connection between the base plate portion 1312 and the mounting shell wall 1110.

[0055] In some implementations, the main module 1310 can also be connected to the carrier device 1900. Specific connection methods include welding, screw connection, snap-fit, riveting, etc., which are not limited here, as long as the reliability of the connection is guaranteed. Using the above scheme, the main module 1310 and the carrier device 1900 can be fixedly connected, making it less prone to relative shaking between them. Consequently, it is less likely to exert force on the connection point between the connecting pin 1210 and the carrier device 1900, which is more conducive to ensuring a reliable connection between the heating device 1200 and the carrier device 1900.

[0056] Specifically, such as Figure 1 As shown, the main module 1310 may have a connecting part 1311B, and the main module 1310 may be connected to the carrier device 1900 through the connecting part 1311B.

[0057] In some implementations, the main module 1310 may have at least two mounting surfaces 1311A, each of which may be equipped with at least one heating element 1200.

[0058] With this configuration, one heat sink 1300 can cool multiple heat-generating devices 1200, reducing the number of heat sinks 1300 required and improving their utilization efficiency. It is understood that when multiple heat-generating devices 1200 are installed on the same heat sink 1300, multiple heat-generating devices 1200 can transfer heat to the heat sink 1300, allowing the temperature of the heat sink 1300 to be relatively high. This means the temperature difference between the heat sink 1300 and the external environment can be relatively large, which is beneficial for improving the heat dissipation efficiency of the heat sink 1300.

[0059] In a specific example, such as Figures 1-3 As shown, a main module 1310 may have two mounting surfaces 1311A, each of which may be configured with two heating elements 1200. In some other embodiments of this application, a main module 1310 may also have three or more mounting surfaces 1311A, each of which may be configured with at least one heating element 1200.

[0060] It should be noted that, in this embodiment, the main module 1310 is provided with at least two mounting surfaces 1311A. However, in actual installation, it does not mean that every mounting surface 1311A needs to be equipped with a heating element 1200. This is related to the number and distribution of the heating elements 1200. In other words, by adopting the above solution, the main module 1310 in this embodiment can still have relatively high flexibility when installing the heating element 1200.

[0061] It can be seen that in practical applications, the main module 1310 does not necessarily need to have at least two mounting surfaces 1311A. It can also have only one mounting surface 1311A, as long as it can meet the requirements of use.

[0062] In some implementations, such as Figure 1 and Figure 2As shown, the electrical module 1000A may also include a thermally conductive insulating device 1400, which may be disposed between the heating device 1200 and the main module 1310 to achieve insulation isolation between the heating device 1200 and the main module 1310.

[0063] The aforementioned thermally conductive insulating device 1400 can be, for example, an aluminum nitride ceramic component, an alumina ceramic component, etc., and is not limited here.

[0064] In some implementations, such as Figure 1 and Figure 2 As shown, the electrical module 1000A may further include a thermal interface material layer 1500. The thermal interface material layer 1500 can be disposed between the thermally conductive insulating device 1400 and the main module 1310, and between the thermally conductive insulating device 1400 and the heat-generating device 1200. Taking the thermal interface material layer 1500 disposed between the thermally conductive insulating device 1400 and the main module 1310 as an example, the thermal interface material layer 1500 can fill the air gap between the thermally conductive insulating device 1400 and the main module 1310 (the air gap should be less than 0.1 mm), effectively reducing the thermal resistance between the main module 1310 and the thermally conductive insulating device 1400, thereby improving heat transfer efficiency and ultimately improving heat dissipation efficiency.

[0065] The thermal interface material layer 1500 can be specifically prepared using a thermal interface material (TIM), such as silicone grease, silicone, or thermally conductive adhesive. The thermal interface material layer 1500 can be prepared using a single thermal interface material; alternatively, it can be prepared using multiple thermal interface materials. For example, the thermal interface material layer 1500 can have thermally conductive adhesive on one side and silicone grease on the other.

[0066] In some implementations, such as Figure 1 and Figure 2 As shown, the electrical module 1000A may also include a connector 1700 and a pressure plate 1800.

[0067] The connector 1700 can be a screw or similar component, including a head and a rod. The rod can pass through the pressure plate 1800 and connect to the main module 1310. The head abuts against the pressure plate 1800, which is configured to press at least two heating elements 1200 together to secure them to the main module 1310. In this implementation, the cooperation between the connector 1700 and the pressure plate 1800 allows for the simultaneous installation and fixation of multiple heating elements 1200, reducing the number of connectors 1700 used and simplifying the installation process.

[0068] It is understood that the connection method between the heating element 1200 and the main module 1310 is not limited to the cooperation of the connector 1700 and the pressure plate 1800. In practical applications, those skilled in the art can also use other connection methods to install the heating element 1200, as long as they can meet the requirements of use. For example, the heating element 1200 can also be installed and fixed only by the connector 1700. For another example, the heating element 1200 can also be bonded and fixed to the main module 1310; for example, the heating element 1200 can be installed and fixed by thermally conductive insulating tape. In this case, since the thermally conductive insulating tape itself can perform the functions of connection, insulation and heat conduction, that is, the thermally conductive insulating tape itself can serve as the aforementioned thermally conductive insulating device 1400. In this case, the thermal interface material layer 1500 can also be determined whether it needs to be set according to the specific situation.

[0069] In addition, the aforementioned thermally conductive insulating device 1400 can also be made of flexible insulating material such as an insulating film. When the heating device 1200 and the main module 1310 are connected, the thermally conductive insulating device 1400 can be compressed, so that the gaps between the thermally conductive insulating device 1400 and the heating device 1200, as well as between the thermally conductive insulating device 1400 and the main module 1310, are relatively small or even non-existent. In this case, the aforementioned thermal interface material layer 1500 can also be determined whether it needs to be set according to the specific situation.

[0070] The specific structural form and related performance parameters of the aforementioned pressure plate 1800 are not limited here. In practical applications, those skilled in the art can select one according to specific needs, as long as it meets the requirements of use. For example, the aforementioned pressure plate 1800 can be a spring, etc. Another example is that the pressure of the aforementioned pressure plate 1800 must be able to meet the pressure requirement of 5 psi.

[0071] In some implementations, the number of the aforementioned heat dissipation devices 1300 can be at least two, and each heat dissipation device 1300 can be arranged at intervals to meet the heat dissipation requirements of heat-generating devices 1200 at different locations in the electrical equipment 1000.

[0072] Please refer to Figures 4-6 , Figure 4 This is a simplified structural diagram of another electrical device provided in the embodiments of this application; Figure 5 for Figure 4 Connection structure diagram of heating and heat dissipation devices; Figure 6 for Figure 5 A structural diagram from another perspective.

[0073] like Figures 4-6 As shown in the embodiments of this application, another electrical device 1000 is also provided, which is similar to the aforementioned one. Figures 1-3The overall structure and principle of the electrical equipment 1000 shown are the same. The following description focuses on the differences.

[0074] In this embodiment, the heat dissipation device 1300 may further include a second fin module 1330, which may also be connected to the main body module 1310. The forming methods of the second fin module 1330 and the main body module 1310 can be referred to the aforementioned description of the forming methods of the first fin module 1320 and the main body module 1310, and will not be repeated here. Specifically, the second fin module 1330 is located inside the housing 1100 to facilitate uniform heat distribution and heat conduction inside the electrical equipment 1000, allowing the heat dissipation device 1300 and the internal space of the housing 1100 to have a larger contact area. Correspondingly, more heat inside the housing 1100 can be transferred to the heat dissipation device 1300, which is of relatively positive significance for improving the heat dissipation effect of the electrical equipment 1000.

[0075] Furthermore, the arrangement of the second fin module 1330 allows the heat-generating device 1200 to have at least three heat dissipation methods: Method 1, the heat-generating device 1200 directly dissipates heat from the air inside the housing 1100; Method 2, the heat emitted by the heat-generating device 1200 can first enter the main module 1310, and then diffuse from the main module 1310 to the second fin module 1330, where it is dissipated by the second fin module 1330 and the air inside the housing 1100; Method 3, after entering the main module 1310, the heat emitted by the heat-generating device 1200 can diffuse from the main module 1310 to the first fin module 1320, where it is dissipated by the first fin module 1320 and the cooling airflow outside the housing 1100. It is evident that the second fin module 1330 increases the heat dissipation methods of the heat-generating device 1200, enabling it to achieve more efficient cooling.

[0076] In some implementations, the second fin module 1330 and the heating element 1200 can be located on opposite sides of the main module 1300. (Refer to...) Figure 4 The orientation and positional relationship of the second fin module 1330 and the heating device 1200 can be located on the left and right sides of the main module 1310, respectively.

[0077] This arrangement, on the one hand, reduces interference between the heating element 1200 and the second fin module 1330, facilitating the installation and fixation of the heating element 1200 on the main module 1310. On the other hand, by placing the second fin module 1330 and the heating element 1200 on opposite sides of the main module 1310, the aforementioned methods one and two can utilize the air on both sides of the main module 1310 for heat dissipation, thus more fully utilizing the air inside the housing 1100. Furthermore, for the implementation of an air supply component inside the housing 1100, placing the second fin module 1330 and the heating element 1200 on opposite sides of the main module 1310 facilitates the arrangement of the air supply component, allowing both the heating element 1200 and the second fin module 1330 to utilize the air in the same direction (e.g., ...). Figure 4 Cooling is achieved by a heat dissipation airflow (perpendicular to the plane of the paper).

[0078] As can be seen, the above description of the arrangement of the second fin module 1330 and the heating element 1200 is merely an exemplary illustration made in conjunction with the accompanying drawings of this application embodiment. It should not be construed as limiting the scope of implementation of the electrical equipment 1000 and electrical module 1000A provided in this application embodiment. Under the condition of satisfying the function, the second fin module 1330 and the heating element 1200 may also have other positional relationships. For example, the second fin module 1330 and the heating element 1200 may also be located on the same side of the main module 1310.

[0079] In this embodiment, the heating element 1200 may be connected to the main module 1310 only through the connector 1700. The number of connectors 1700 may be one, or the number of connectors 1700 may be at least two, as long as it can reliably install and fix the heating element 1200.

[0080] This document uses specific examples to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make several improvements and modifications to this application without departing from the principles of this application, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. An electrical module for use in electrical equipment, the electrical equipment comprising a housing, characterized in that, The electrical module includes a heating element and a heat dissipation element. The heating element can be disposed inside the housing. The heat dissipation element is an integral structure. The heat dissipation element includes a main body module and a first fin module. The main body module can be disposed inside the housing. At least a portion of the first fin module can be disposed outside the housing. The heating element is mounted on the main body module.

2. The electrical module according to claim 1, characterized in that, The main module has a mounting surface, and at least one of the heating devices is disposed on the mounting surface.

3. The electrical module according to claim 1, characterized in that, The electrical module also includes a thermally conductive insulating device, which is disposed between the heating element and the main module.

4. The electrical module according to claim 3, characterized in that, The electrical module also includes a thermal interface material layer, which is provided between the thermally conductive insulating device and the main module, as well as between the thermally conductive insulating device and the heat-generating device.

5. The electrical module according to any one of claims 1-4, characterized in that, The heat dissipation device further includes a second fin module, which is connected to the main body module and can be configured inside the housing.

6. The electrical module according to claim 5, characterized in that, The second fin module and the heating device are located on opposite sides of the main body module.

7. The electrical module according to any one of claims 1-4, characterized in that, The electrical module further includes a connector, through which the heating device is connected to the main module; or, The electrical module also includes a pressure plate and a connector. The pressure plate is connected to the main module via the connector and is configured to press at least two of the heating elements.

8. An electrical device, characterized in that, It includes a housing and an electrical module, wherein the electrical module is the electrical module according to any one of claims 1-7, the heating device and the main module are both located inside the housing, and at least a portion of the first fin module is located outside the housing.

9. The electrical equipment according to claim 8, characterized in that, The electrical equipment also includes a carrier device, the heating device has a connection pin, the connection pin is connected to the carrier device, and the main module has a connection part, the connection part is connected to the carrier device.

10. The electrical equipment according to claim 8 or 9, characterized in that, The housing includes a mounting shell wall with an opening through which the first fin module extends out of the housing. The main body module is connected to the mounting shell wall, and the main body module seals the opening. A sealing component is also provided between the main body module and the mounting shell wall.

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