Housing for a controller and controller

Abstract

The utility model discloses a kind of shells for controller, it includes: first shell portion (100) and the second shell portion (200) being connected with first shell portion, wherein the inside of first shell portion and the second shell portion form the first cavity (P1) of shell, and the printed circuit board assembly of controller is used to accommodate first cavity;The outside cover of first shell portion is provided with cover plate (400), to form the second cavity (P2) in outside, the air-cooled element accommodating station (P3) is in the second cavity, and the heat dissipation fin (500) around air-cooled element accommodating station is arranged, to form cooling air duct;First shell portion outlet hole (601) is equipped on the side wall of first shell portion, and first shell portion is also provided with the vent (602) of being communicated with first cavity and second cavity;Second shell portion outlet hole (603) is equipped on the second shell portion on the opposite side of vent;Cover plate is provided with air inlet (604) on the position corresponding to air-cooled element accommodating station.

Description

Technical Field

[0001] This utility model relates to a heat dissipation structure, and more particularly to a heat dissipation structure for a controller. Background Technology

[0002] The controller is the core computing unit of many smart devices. As the computing power requirements of various smart devices continue to increase, the power of the controller is also increasing, and therefore its heat dissipation requirements are also increasing.

[0003] Especially for printed circuit board assemblies that integrate multiple electronic components, if the printed circuit board assembly cannot be cooled quickly and comprehensively, heat will accumulate inside the controller housing, causing the internal temperature of the controller to rise, which will seriously affect the overall performance of the controller.

[0004] Current controllers often only cool the electronic components on one side of the printed circuit board. Utility Model Content

[0005] One of the objectives of this invention is to provide a housing for a controller that can effectively cool and dissipate heat from electronic components on both sides of a printed circuit board assembly within a limited space, thereby improving the heat dissipation effect of the controller.

[0006] To achieve the above objectives, this utility model proposes a housing for a controller, comprising: a first housing portion and a second housing portion connected to the first housing portion, the first housing portion having an inner side facing the second housing portion and an outer side opposite to the inner side, wherein the inner side of the first housing portion and the second housing portion form a first cavity of the housing, the first cavity being used to accommodate a printed circuit board assembly of the controller; wherein:

[0007] The outer side of the first housing portion is covered with a cover plate to form a second cavity on the outside. The second cavity has a space for accommodating air-cooled components and heat dissipation fins disposed around the space for accommodating air-cooled components. The heat dissipation fins form a cooling air duct.

[0008] The first housing part has an air outlet on its side wall and a ventilation opening that connects the first cavity and the second cavity.

[0009] The second housing portion is provided with an air outlet located on the opposite side of the vent.

[0010] The cover plate is provided with an air inlet hole at the position corresponding to the housing of the air-cooled component.

[0011] Furthermore, in the housing described in this utility model, the air outlet of the first housing portion includes a first air outlet relatively far away from the vent and a second air outlet relatively close to the vent, and the total flow cross-sectional area of ​​the first air outlet is much larger than the total flow cross-sectional area of ​​the second air outlet.

[0012] Furthermore, in the housing described in this utility model, the extending direction of the heat dissipation fins is from the air-cooling element receiving position to the air outlet of the first housing portion, and the heat dissipation fins are radially distributed.

[0013] Furthermore, in the outer casing of this utility model, the air inlet holes are arranged in a honeycomb pattern.

[0014] Furthermore, in the housing described in this utility model, the cover plate is provided with reinforcing ribs extending radially outward from the air inlet; and / or the inner surface of the cover plate is provided with pressing ribs for interference fit with the air-cooling element.

[0015] Furthermore, in the housing described in this utility model, the air-cooling element receiving station is provided with a supporting rib protruding from the outer surface of the first housing portion.

[0016] Furthermore, in the housing described in this utility model, an electromagnetic compatibility shielding element is provided between the first housing portion and the second housing portion.

[0017] Furthermore, in the housing described in this utility model, the electromagnetic compatibility shielding element includes an electromagnetic compatibility shielding adhesive layer.

[0018] Furthermore, in the housing described in this utility model, the inner surface of the first housing portion is provided with a first heat dissipation boss protruding from the inner surface.

[0019] Furthermore, in the housing described in this utility model, the surface of the first heat dissipation boss used for corresponding contact and connection with the electronic components of the printed circuit board assembly is provided with a first thermally conductive material layer.

[0020] Furthermore, in the housing described in this utility model, the inner surface of the second housing portion is provided with a second heat dissipation boss protruding from the inner surface.

[0021] Furthermore, in the housing described in this utility model, the surface of the second heat dissipation boss used for corresponding contact and connection with the electronic components of the printed circuit board assembly is provided with a second thermally conductive material layer.

[0022] Another objective of this invention is to provide a controller that can quickly dissipate heat to ensure the stable performance of the domain controller.

[0023] To achieve the above objectives, the present invention also provides a controller, which includes:

[0024] The outer casing as described above;

[0025] The air-cooled element is located at the air-cooled element housing.

[0026] A printed circuit board assembly disposed within the first cavity of the housing.

[0027] Furthermore, in the controller described in this utility model, the air-cooling element includes a fan.

[0028] Furthermore, in the controller described in this utility model, the axial direction of the fan is consistent with the height direction of the housing.

[0029] The housing structure described in this utility model is simple, and in particular, it can cool and dissipate heat from the electronic components on both sides of the printed circuit board assembly inside the controller, thereby further improving the heat dissipation effect of the controller and helping to ensure the stable performance of the controller. Attached Figure Description

[0030] Figure 1 The diagram shows a split structure of the outer shell of this utility model in one embodiment.

[0031] Figure 2 A schematic diagram of the structure of the first housing portion in one embodiment of the housing described in this utility model is shown from one perspective.

[0032] Figure 3 This invention provides a schematic diagram of the structure of the first housing portion in one embodiment of the housing, shown from another perspective.

[0033] Figure 4 The diagram shows a top-down view of the cover plate in one embodiment of the housing described in this utility model.

[0034] Figure 5 Showing Figure 4 Sectional view at point AA.

[0035] Figure 6 Showing Figure 5 A magnified view of a section at point B in the middle.

[0036] Figure 7 Showing Figure 5 A magnified view of a section at point C.

[0037] Figure 8 The diagram shows a split structure of the controller according to one embodiment of the present invention. Detailed Implementation

[0038] The housing and controller of this utility model will be further explained and described below with reference to the accompanying drawings and specific embodiments. However, such explanation and description do not constitute an undue limitation on the technical solution of this utility model.

[0039] The controller is the core computing unit of many smart devices. As the computing power requirements of various smart devices continue to increase, the power of controllers is also increasing, thus requiring more efficient heat dissipation. Especially for printed circuit board assemblies that integrate multiple electronic components, if the PCB assembly cannot be cooled rapidly and comprehensively, heat will accumulate inside the controller housing, causing the internal temperature to rise and severely affecting the overall performance of the controller.

[0040] Current controllers often only cool the electronic components on one side of the printed circuit board, resulting in poor overall cooling performance.

[0041] To address the aforementioned problems, this invention provides a housing for a controller in one embodiment.

[0042] Figure 1 The diagram shows a split structure of the outer shell of this utility model in one embodiment.

[0043] like Figure 1 As shown, in some embodiments, the housing for the controller may include a first housing portion 100 and a second housing portion 200 connected to the first housing portion 100.

[0044] like Figure 1 As shown, in some more specific embodiments, the first housing portion 100 can be connected to the second housing portion 200 by a first connecting bolt 301. Of course, in other more specific embodiments, the first housing portion can also be connected to the second housing portion by other means, such as by a snap-fit.

[0045] Figure 2 A schematic diagram of the structure of the first housing portion in one embodiment of the housing described in this utility model is shown from one perspective.

[0046] Figure 3 This invention provides a schematic diagram of the structure of the first housing portion in one embodiment of the housing, shown from another perspective.

[0047] like Figure 1 , Figure 2 and Figure 3As shown, in some embodiments, the first housing portion 100 has an inner side 101 facing the second housing portion and an outer side 102 opposite to the inner side, wherein the inner side 101 of the first housing portion and the second housing portion 200 form a first cavity P1 of the housing, the first cavity being used to house the printed circuit board assembly of the controller.

[0048] like Figure 1 and Figure 4 As shown, the outer side of the first housing portion 100 is covered with a cover plate 400 to form a second cavity P2 on the outer side.

[0049] In some more specific embodiments, the cover plate 400 can be threaded to the screw post 103 of the first housing portion via the second connecting bolt 302 to be disposed on the first housing portion.

[0050] like Figure 2 As shown, the second cavity has a cooling element housing P3 and several heat dissipation fins 500 arranged around the cooling element housing, and the adjacent heat dissipation fins 500 form a cooling air duct.

[0051] In addition, the first housing portion 100 is provided with an air outlet 601 on its side wall, and a vent 602 for connecting the first cavity P1 and the second cavity P2 is also provided on the first housing portion. The second housing portion 200 is provided with an air outlet 603 located on the opposite side of the vent 602. An air inlet 604 is provided on the cover plate 400 corresponding to the position of the air-cooled component receiving station P3.

[0052] The heat dissipated by the electronic components on the printed circuit board assembly 900 is partially accumulated in the first cavity P1, and partially transferred to the heat sink 500 through the first housing portion. Based on the arrangement of the above embodiment, as... Figure 5 As shown, the cover plate 400 covers the outside of the first housing portion 100, thereby forming a relatively sealed cooling air duct in the second cavity P2 in conjunction with the heat dissipation fins 500. Figure 5The arrows indicate the flow direction of the cooling gas F. When the air-cooled component 300 is working, a large amount of cooling gas F is drawn into the second cavity P2 through the air inlet 604 on the cover plate 400. Subsequently, the cooling gas exchanges heat with the heat sink fins 500 and flows outwards along the cooling air duct. Since the first housing part 100 is provided with a large number of first housing part air outlets 601, most of the air that has undergone heat exchange will flow out to the external environment through the first housing part air outlets 601. In addition, a portion of the cooling gas will enter the first cavity P1 through the vent 602 on the first housing part 100. Since the second housing part air outlet 603 on the second housing part 200 is located on the opposite side of the vent 602, the cooling gas can flow directly over the electronic devices on the lower surface of the printed circuit board assembly to remove the heat generated by the electronic devices on the lower surface of the printed circuit board assembly. On the other hand, the heat conducted to the second housing part can also be carried out to the outside of the housing through the second housing part air outlet 603 by forced convection. Therefore, in this embodiment, the cooling gas F flows through the upper and lower cavities, the second cavity P2 and the first cavity P1, respectively, which not only cools and dissipates heat from the electronic devices on the upper surface of the printed circuit board, but also effectively cools and dissipates heat from the electronic devices on the lower surface of the printed circuit board.

[0053] Therefore, in the above embodiments, both the first housing portion and the second housing portion of the outer casing can play a role in heat dissipation, thereby improving the heat dissipation efficiency of the controller and enabling the controller temperature to be maintained at a low level, thereby ensuring the stable operation of the controller.

[0054] Furthermore, since the above-described embodiments can effectively cool and dissipate heat from electronic devices on both sides of the printed circuit board at the same time, this improves the flexibility of the electronic device placement on the printed circuit board. For example, some electronic devices that generate a lot of heat can be placed not only on the upper surface of the printed circuit board, but also on the lower surface.

[0055] In some more specific embodiments, the vent 602 can be configured as a large square hole. However, it should be noted that the present invention does not limit the shape of the vent 602. It is understood that, in addition to a square hole, the vent can also be configured as other shapes to realize the communication function between the first cavity P1 and the second cavity P2, such as a round hole, an elliptical hole, or other shapes.

[0056] In some specific implementation methods, such as Figure 2As shown, the air outlet 601 of the first housing portion includes a first air outlet 6011 relatively far from the vent 602 and a second air outlet 6012 relatively close to the vent 602. The total flow cross-sectional area of ​​the first air outlet 6011 is much larger than the total flow cross-sectional area of ​​the second air outlet 6012. For example, in some specific instances, the number of first air outlets 6011 is much greater than the number of second air outlets 6012. This arrangement ensures that a portion of the cooling gas enters the first cavity through the vents while further increasing the total flow cross-sectional area of ​​the air outlets in the first housing portion, thus achieving a better balance between the cooling gas convection effect of the first and second cavities.

[0057] In some more specific implementations, such as Figure 2 As shown, the heat dissipation fins 500 extend from the air-cooled component housing P3 to the air outlet 601 of the first housing portion, and the heat dissipation fins 500 are radially distributed.

[0058] Since the air-cooled component housing P3 is located in the middle of the first housing, the heat dissipation fins surrounding the air-cooled component housing P3 are distributed radially, which is conducive to the flow of cooling gas and can further improve the heat dissipation effect.

[0059] In some more specific implementations, such as Figure 4 As shown, the air inlets 604 on the cover plate 400 are arranged in a honeycomb pattern.

[0060] This densely arrayed honeycomb air inlet can effectively reduce noise while ensuring sufficient airflow, and also ensures that the controller's electromagnetic compatibility (EMC) is not affected.

[0061] In some more specific embodiments, the cover plate 400 is also provided with a reinforcing rib 401 extending radially outward from the air inlet 604. This reinforcing rib is beneficial to further increase the structural strength and structural stability of the cover plate, especially for thinner cover plates, which is more conducive to ensuring its structural stability.

[0062] In some more specific implementations, such as Figure 6 As shown, the inner surface of the cover plate 400 is also provided with a pressing rib 402 for interference fit with the air-cooling element. In this embodiment, by providing the pressing rib 402 for interference fit with the air-cooling element 300, the air-cooling element 300 can be pressed tightly onto the air-cooling element receiving position, thereby helping to reduce the vibration of the air-cooling element and the resulting noise.

[0063] In some specific embodiments, the cover plate 400 may be provided with both reinforcing ribs 401 and pressing ribs 402.

[0064] In some more specific embodiments, before the cover plate 400 presses onto the air-cooled element 300, such as Figure 2 As shown, the air-cooled component 300 can be pre-positioned in the air-cooled component receiving station P3 by the positioning post 104. With this setting, the air-cooled component can be stably placed in the air-cooled component receiving station P3 without the use of connecting bolts, thus simplifying the installation process.

[0065] In some more specific implementations, such as Figure 2 As shown, a support rib 105 protruding from the outer surface of the first housing portion is provided within the air-cooled component housing P3, which is used to support the air-cooled component. With this arrangement, as... Figure 5 As shown, when the air-cooled element 300 is placed on the support rib 105, it is still a distance away from the outer surface of the first housing part, which is conducive to the flow of cooling gas.

[0066] In some specific implementations, to further improve the electromagnetic compatibility of the controller, such as... Figure 1 and Figure 6 As shown, an electromagnetic compatibility shielding element 700 may also be provided between the first housing portion 100 and the second housing portion 200.

[0067] In some more specific embodiments, the electromagnetic compatibility shielding element 700 may include an electromagnetic compatibility shielding adhesive layer. This shielding adhesive layer not only provides electromagnetic protection for the controller, but also, being an elastic material, acts as a seal between the first and second housing portions. This allows the first cavity to be relatively sealed, ensuring that most of the cooling gas inside the first cavity can only be discharged through the air outlet 603 in the second housing portion, thereby further guaranteeing the flow path of the cooling gas.

[0068] like Figure 1 and Figure 3 As shown, in order to further improve the heat dissipation effect and to enable targeted and synchronous heat dissipation of various electronic devices on one side of the printed circuit board (e.g., the upper surface), in some specific embodiments, the inner surface of the first housing portion is provided with a first heat dissipation protrusion 801 protruding from the inner surface.

[0069] It should be noted that this utility model does not limit the number of first heat dissipation protrusions; there can be one or more. Those skilled in the art can set the number of first heat dissipation protrusions according to needs, such as the number of electronic devices requiring targeted heat dissipation. The first heat dissipation protrusion 801 is used to respectively attach and connect with at least one electronic device of the printed circuit board assembly to exchange heat with it, thereby playing a role in dissipating heat from the electronic device. In this way, the first housing portion 100 can simultaneously perform targeted heat dissipation and cooling on one or more heat-generating electronic devices on one side (e.g., the upper surface) of the printed circuit board through one or more first heat dissipation protrusions 801, effectively avoiding the problem of uneven heat dissipation and further improving heat dissipation efficiency.

[0070] In some more specific implementations, such as Figure 1 As shown, the surface of the first heat dissipation protrusion 801, which is used to connect with the electronic components of the printed circuit board assembly, may also be provided with a first thermally conductive material layer 802. That is, the first thermally conductive material layer 802 is disposed between the electronic components on one side of the printed circuit board assembly and the first heat dissipation protrusion 801. The first thermally conductive material layer can reduce thermal resistance, thereby further improving the heat conduction effect.

[0071] In some more specific embodiments, the first thermally conductive material layer may include a thermally conductive silicone grease layer. Those skilled in the art can select the thermal conductivity of the thermally conductive silicone grease according to actual needs; generally, the higher the thermal conductivity of the thermally conductive silicone grease, the more beneficial it is for heat dissipation.

[0072] Of course, in other more specific embodiments, the first thermally conductive material layer may also be thermally conductive putty, thermally conductive gel, thermally conductive double-sided adhesive, thermally conductive graphite sheet or similar thermally conductive element.

[0073] Similarly, as Figure 1 As shown, in order to further improve the heat dissipation effect and to provide targeted heat dissipation for each electronic device located on the other side (e.g., the lower surface) of the printed circuit board, in some specific embodiments, the inner surface of the second housing portion 200 (i.e., the side surface facing the first cavity) is provided with a second heat dissipation protrusion 803 protruding from the inner surface.

[0074] This invention does not limit the number of second heat dissipation protrusions; there can be one or more. Those skilled in the art can determine the number of second heat dissipation protrusions according to needs, such as the number of electronic devices requiring targeted heat dissipation. The second heat dissipation protrusion 803 is used to respectively abut and connect with at least one electronic device on the other side of the printed circuit board for heat exchange, thereby dissipating heat from the electronic device. In this way, the second housing portion 200 can simultaneously and specifically dissipate and cool one or more heat-generating electronic devices on the other side (e.g., the lower surface) of the printed circuit board through one or more second heat dissipation protrusions 803, effectively avoiding uneven heat dissipation and further improving heat dissipation efficiency.

[0075] In some more specific implementations, such as Figure 1 As shown, the surface of the second heat dissipation protrusion used for corresponding contact and connection with the electronic components of the printed circuit board assembly may also be provided with a second thermally conductive material layer 804. That is, the second thermally conductive material layer 804 is disposed between the electronic components on the other side of the printed circuit board assembly and the second heat dissipation protrusion 803. The second thermally conductive material layer can also reduce thermal resistance, thereby further improving the heat conduction effect.

[0076] In some more specific embodiments, the second thermally conductive material layer may include a thermally conductive silicone grease layer. Those skilled in the art can select the thermal conductivity of the thermally conductive silicone grease according to actual needs; generally, the higher the thermal conductivity of the thermally conductive silicone grease, the more beneficial it is for heat dissipation.

[0077] Of course, in other more specific embodiments, the second thermally conductive material layer can also be thermally conductive putty, thermally conductive gel, thermally conductive double-sided adhesive, thermally conductive graphite sheet or similar thermally conductive element.

[0078] In some specific embodiments, the first housing part and the second housing part can be made of aluminum or aluminum alloy or other materials that take into account both lightweight and heat dissipation.

[0079] In some other embodiments, this invention also provides a controller in which the electronic components on both sides of the printed circuit board are able to dissipate heat quickly, thereby ensuring the stable performance of the controller.

[0080] Figure 8 The diagram shows a split structure of the controller according to one embodiment of the present invention.

[0081] like Figure 8As shown, in some embodiments, the controller may include a housing as described in the above embodiments, with a cooling element 300 provided at the cooling element accommodating station P3 of the housing. Furthermore, a printed circuit board assembly 900 is also provided within the housing. The printed circuit board assembly includes a printed circuit board and electronic devices disposed on the printed circuit board. Electronic devices are disposed on both sides of the printed circuit board, for example, the upper surface 901 and the lower surface 902.

[0082] It should be noted that this utility model does not limit the number of printed circuit board assemblies. In some more specific embodiments, such as Figure 8 As shown, a printed circuit board assembly is housed within the housing. In some other, more specific embodiments, two, three, four, or other numbers of printed circuit board assemblies may also be housed within the housing.

[0083] A printed circuit board (PCB) can be a printed circuit board that integrates various electronic components. The electronic components on the PCB can be a system on a chip (SOC), or other electronic components that generate heat and consume power, such as resistors, capacitors, inductors, diodes, and transistors.

[0084] In some more specific embodiments, the air-cooling element 300 may include a fan. In other more specific embodiments, the air-cooling element may also include a suction device, such as a suction pump.

[0085] In some more specific implementations, such as Figure 8 As shown, the axial direction of the fan is consistent with the height direction of the housing, or the thickness direction of the housing. That is, the fan is mounted horizontally on the housing. Compared with the vertical mounting method, this configuration can further reduce the size of the controller in the height direction to meet the requirements of limited installation space in the height direction of the controller.

[0086] With the above-described configuration, the controller of this invention can achieve efficient heat dissipation with a simple structure, and in particular, it can effectively dissipate heat from electronic components on both sides of the printed circuit board.

[0087] Since this utility model does not involve improvements to other components of the controller, the other components of the controller and their working process will not be described in detail.

[0088] It should be noted that the controller described in this utility model can include various types, such as vehicle controllers or other types of controllers, like smart home controllers or robot controllers. Furthermore, the vehicle controller can be a domain controller, an MCU (Microcontroller Unit), an ECU (Electronic Control Unit), or an IDC (Intelligent Drive Control), etc.

[0089] It should be noted that the prior art within the scope of protection of this utility model is not limited to the embodiments given in this utility model document. All prior art that does not contradict the solution of this utility model, including but not limited to prior patent documents, prior publications, prior public uses, etc., can be included in the scope of protection of this utility model.

[0090] Furthermore, the combination of the technical features in this case is not limited to the combination methods described in the claims of this case or the combination methods described in the specific embodiments. All technical features described in this case can be freely combined or combined in any way, unless they contradict each other.

[0091] It should also be noted that the embodiments listed above are merely specific embodiments of this utility model. Obviously, this utility model is not limited to the above embodiments, and any similar changes or modifications made thereto that can be directly derived or easily conceived by those skilled in the art from the content disclosed in this utility model should fall within the protection scope of this utility model.

Claims

1. A housing for a controller, comprising: A first housing portion (100) and a second housing portion (200) connected to the first housing portion, the first housing portion having an inner side (101) facing the second housing portion and an outer side (102) opposite to the inner side, wherein the inner side of the first housing portion and the second housing portion form a first cavity (P1) of the housing, the first cavity being used to house a printed circuit board assembly of the controller; characterized in that: The outer side of the first housing portion is covered with a cover plate (400) to form a second cavity (P2) on the outer side. The second cavity has a wind-cooling component receiving station (P3) and heat dissipation fins (500) arranged around the wind-cooling component receiving station. The heat dissipation fins form a cooling air duct. The first housing part has an air outlet (601) on its side wall, and the first housing part also has a vent (602) that connects the first cavity and the second cavity. The second housing portion is provided with a second housing portion air outlet (603) located on the opposite side of the vent; The cover plate is provided with an air inlet (604) at the position corresponding to the air-cooled component housing.

2. The outer casing as claimed in claim 1, characterized in that, The first housing portion of the air outlet includes a first air outlet (6011) which is relatively far away from the vent and a second air outlet (6012) which is relatively close to the vent. The total flow cross-sectional area of ​​the first air outlet is much larger than the total flow cross-sectional area of ​​the second air outlet.

3. The outer casing as described in claim 1, characterized in that, The heat dissipation fins (500) extend from the air-cooling element housing position to the air outlet of the first housing portion, and the heat dissipation fins are radially distributed.

4. The outer casing as claimed in claim 1, characterized in that, The air inlet holes (604) are arranged in an array in a honeycomb pattern.

5. The outer casing as claimed in claim 1, characterized in that, The cover plate is provided with reinforcing ribs (401) extending radially outward from the air inlet; and / or the inner surface of the cover plate is provided with pressing ribs (402) for interference fit with the air-cooling element.

6. The outer casing as claimed in claim 1, characterized in that, The air-cooled component receiving station is provided with a support rib (105) protruding from the outer surface of the first housing portion.

7. The outer casing as claimed in claim 1, characterized in that, An electromagnetic compatibility shielding element (700) is provided between the first housing portion and the second housing portion.

8. The outer casing as claimed in claim 7, characterized in that, The electromagnetic compatibility shielding element includes an electromagnetic compatibility shielding adhesive layer.

9. The outer casing as claimed in claim 1, characterized in that, The inner surface of the first housing portion is provided with a first heat dissipation boss (801) protruding from the inner surface.

10. The outer casing as claimed in claim 9, characterized in that, The surface of the first heat dissipation boss, which is used to attach and connect with the electronic components of the printed circuit board assembly, is provided with a first thermally conductive material layer (802).

11. The outer casing as claimed in claim 1, characterized in that, The inner surface of the second housing portion is provided with a second heat dissipation boss (803) protruding from the inner surface.

12. The outer casing as claimed in claim 11, characterized in that, The second heat dissipation boss has a second thermally conductive material layer (804) on its surface for corresponding contact with the electronic components of the printed circuit board assembly.

13. A controller, characterized in that, It includes: The housing as described in any one of claims 1-12; An air-cooled element (300) is disposed at the air-cooled element receiving station; A printed circuit board assembly (900) is disposed in the first cavity of the housing.

14. The controller as claimed in claim 13, characterized in that, The air-cooling component includes a fan.

15. The controller as claimed in claim 14, characterized in that, The axial direction of the fan is consistent with the height direction of the housing.

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