Backplane heat dissipation structure and mobile device

Abstract

The application provides a backboard heat dissipation structure and a mobile device. The backboard heat dissipation structure comprises a graphene heat dissipation sheet and a backboard, the graphene heat dissipation sheet is located at one side of the backboard, the backboard heat dissipation structure further comprises an adhesive layer, the adhesive layer is provided with a plurality of first rows of pores, the plurality of first rows of pores are distributed on the adhesive layer at intervals, and the extension direction of each first row of pores is the same as the thickness direction of the adhesive layer. The graphene heat dissipation sheet is provided with a plurality of second rows of pores, the extension direction of each second row of pores is the same as the thickness direction of the graphene heat dissipation sheet, the plurality of first rows of pores and the plurality of second rows of pores are in one-to-one correspondence and are communicated, and the graphene heat dissipation sheet is attached to the backboard through the adhesive layer. The backboard heat dissipation structure can further improve the heat dissipation effect.

Description

Technical Field

[0001] This utility model relates to the technical field of heat dissipation structure, and in particular to a backplate heat dissipation structure and a mobile device. Background Technology

[0002] Currently, many mobile devices employ a combination of graphene layers, double-sided adhesive layers, and backplates for heat dissipation. This primarily involves using graphene layers to bond circuit boards and batteries. Graphene layers serve both thermal conductivity and buffering functions. For example, the utility model patent application with application number CN202020820471.8 describes a heat dissipation structure consisting of graphene heat sinks and metal heat dissipation backplates. The graphene heat sinks are attached to the metal heat dissipation backplates. While the combination of graphene heat sinks and metal heat dissipation backplates provides good thermal conductivity, the adhesive layer between them actually increases thermal resistance, significantly impacting the overall heat dissipation effect. Furthermore, the tightness of the bond between the graphene heat sinks and the metal heat dissipation backplate also significantly affects the overall heat dissipation effect, as air bubbles can easily form between them, hindering heat dissipation. Utility Model Content

[0003] The purpose of this invention is to overcome the shortcomings of the prior art and provide a backplate heat dissipation structure and mobile device that can further improve heat dissipation effect.

[0004] The objective of this utility model is achieved through the following technical solution: A backplate heat dissipation structure includes a graphene heat sink and a backplate. The graphene heat sink is located on one side of the backplate. The backplate heat dissipation structure also includes an adhesive layer. The adhesive layer is provided with a plurality of first bubble-removing holes. The plurality of first bubble-removing holes are spaced apart on the adhesive layer. The extending direction of each first bubble-removing hole is the same as the thickness direction of the adhesive layer. The graphene heat sink has multiple second bubble holes, and the extension direction of each second bubble hole is the same as the thickness direction of the graphene heat sink. The multiple first bubble holes and the multiple second bubble holes are connected in a one-to-one correspondence. The graphene heat sink is attached to the back plate through the adhesive layer.

[0005] In one embodiment, the graphene heat sink includes a graphene foam layer and a graphene layer, the graphene foam layer being connected to the adhesive layer, and the graphene layer being attached to the side of the graphene foam layer away from the adhesive layer. Each of the second row of bubbles penetrates both the graphene foam layer and the graphene layer.

[0006] In one embodiment, the graphene layer is a graphene coating or a graphene patch.

[0007] In one embodiment, the graphene foam layer is a polyurethane rubber type graphene foam or a EPDM rubber type graphene foam.

[0008] In one embodiment, the adhesive layer is a thermally conductive double-sided adhesive layer.

[0009] In one embodiment, the backplate includes a metal sheet and an injection-molded body, wherein the metal sheet and the injection-molded body are integrally injection-molded structures, and the metal sheet is located on the side of the injection-molded body near the adhesive layer and is at least partially bonded to the adhesive layer.

[0010] In one embodiment, the porosity of the graphene heat sink is less than 20%.

[0011] In one embodiment, the diameter of each of the first bubble-removing holes and each of the second bubble-removing holes is independently selected from 0.2 mm to 3 mm.

[0012] In one embodiment, the distance between any two adjacent second bubble holes is 0.7cm to 2cm.

[0013] In one embodiment, the projection of each second bubble-removing hole onto the adhesive layer is located within the corresponding second bubble-removing hole.

[0014] In one embodiment, the graphene heat sink includes a peripheral portion and a central portion, the peripheral portion being fitted onto the central portion, and a plurality of second bubble holes being evenly distributed in the central portion. Further, both the peripheral portion and the central portion are laid flat on one side of the back plate; The adhesive layer is partially disposed around the periphery of the peripheral portion.

[0015] In one embodiment, the back panel includes a laminated aramid fiber layer and a protective varnish layer, the aramid fiber layer being laminated with the adhesive layer.

[0016] A mobile device includes a heat source and a backplate heat dissipation structure as described in any of the above embodiments, wherein the graphene heat sink is attached to the heat source on one side away from the adhesive layer.

[0017] Compared with the prior art, the present invention has at least the following advantages: The backplate heat dissipation structure of this utility model has a first row of bubble holes formed on the adhesive layer and a second row of bubble holes formed on the graphene heat sink, which corresponds one-to-one with the first row of bubble holes. This reduces the air bubbles and cavities between the backplate and the graphene heat sink after the graphene heat sink is bonded to the backplate by the adhesive layer, effectively improving the tightness of the fit between the graphene heat sink and the backplate, and initially improving the heat dissipation effect of the backplate heat dissipation structure. Furthermore, the setting of the first row of bubble holes at the adhesive layer reduces the thermal resistance between the backplate and the graphene heat sink, and allows some of the graphene heat sink to directly contact the backplate, further improving the heat dissipation effect of the backplate heat dissipation structure. In addition, each first row of bubble holes and each second row of bubble holes forms a heat dissipation channel, enhancing heat convection and radiation heat dissipation, further improving the heat dissipation effect of the backplate heat dissipation structure. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the backplate heat dissipation structure according to one embodiment of the present invention. Figure 2 for Figure 1 A partial view of the backplate heat dissipation structure shown. Figure 3 for Figure 1 Another partial view of the backplate heat dissipation structure shown; Figure 4 for Figure 1 A partial cross-sectional view of the backplate heat dissipation structure shown. Figure 5 This is a schematic diagram of the hierarchical structure of the back plate according to one embodiment of the present invention. Detailed Implementation

[0020] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. The drawings illustrate preferred embodiments of this utility model. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this utility model.

[0021] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0023] This application provides a backplate heat dissipation structure. The backplate heat dissipation structure includes a graphene heat sink and a backplate. The graphene heat sink is located on one side of the backplate. The backplate heat dissipation structure also includes an adhesive layer. The adhesive layer has a plurality of first bubble holes, which are spaced apart on the adhesive layer. The extension direction of each first bubble hole is the same as the thickness direction of the adhesive layer. The graphene heat sink has a plurality of second bubble holes, which extend in the same direction as the thickness direction of the graphene heat sink. The plurality of first and second bubble holes are connected in a one-to-one correspondence. The graphene heat sink is attached to the backplate through the adhesive layer.

[0024] The aforementioned backplate heat dissipation structure forms a first row of air bubbles on the adhesive layer and a second row of air bubbles on the graphene heat sink, each corresponding to one of the first row of air bubbles. This reduces the air bubble cavities between the backplate and the graphene heat sink after the graphene heat sink is bonded to the backplate via the adhesive layer, effectively improving the tightness of the fit between the graphene heat sink and the backplate. This initially improves the heat dissipation effect of the backplate heat dissipation structure. Furthermore, the first row of air bubbles in the adhesive layer reduces the thermal resistance between the backplate and the graphene heat sink and allows some of the graphene heat sink to directly contact the backplate, further improving the heat dissipation effect of the backplate heat dissipation structure. In addition, each first row of air bubbles and each second row of air bubbles forms a heat dissipation channel, enhancing heat convection and radiation heat dissipation, further improving the heat dissipation effect of the backplate heat dissipation structure.

[0025] To better understand the backplate heat dissipation structure of this application, the following further explanation is provided: Please refer to the following: Figures 1 to 4One embodiment of the backplate heat dissipation structure 10 includes a graphene heat sink 100 and a backplate 200. The graphene heat sink 100 is located on one side of the backplate 200. The backplate heat dissipation structure 10 also includes an adhesive layer 300. The adhesive layer 300 has a plurality of first bubble holes 301, which are spaced apart on the adhesive layer 300. The extension direction of each first bubble hole 301 is the same as the thickness direction of the adhesive layer 300. The graphene heat sink 100 has a plurality of second bubble holes 101, which extend in the same direction as the thickness direction of the graphene heat sink 100. The plurality of first bubble holes 301 and the plurality of second bubble holes 101 are connected in a one-to-one correspondence. The graphene heat sink 100 is attached to the backplate 200 through the adhesive layer 300.

[0026] The aforementioned backplate heat dissipation structure 10 forms a first row of air bubble holes 301 on the adhesive layer 300 and a second row of air bubble holes 101 on the graphene heat sink 100, which correspond one-to-one with the first row of air bubble holes 301. This reduces the air bubble cavities between the backplate 200 and the graphene heat sink 100 after the graphene heat sink 100 is bonded to the backplate 200 by the adhesive layer 300, effectively improving the tight fit between the graphene heat sink 100 and the backplate 200, and initially achieving the desired backplate heat dissipation structure. The heat dissipation effect of the backplate heat dissipation structure 10 is further improved by the setting of the first row of bubble holes 301 at the adhesive layer 300, which reduces the thermal resistance between the backplate 200 and the graphene heat sink 100 and allows some of the graphene heat sink 100 to directly contact the backplate 200, thereby further improving the heat dissipation effect of the backplate heat dissipation structure 10. In addition, each first row of bubble holes 301 and each second row of bubble holes 101 form a heat dissipation channel, which enhances heat convection and radiation heat dissipation, thereby further improving the heat dissipation effect of the backplate heat dissipation structure 10.

[0027] Please refer to the following: Figures 1 to 4 In one embodiment, the graphene heat sink 100 includes a graphene foam layer 110 and a graphene layer 120. The graphene foam layer 110 is connected to the adhesive layer 300, and the graphene layer 120 is attached to the side of the graphene foam layer 110 away from the adhesive layer 300. Further, each second row of bubbles 101 penetrates both the graphene foam layer 110 and the graphene layer 120. Further, the graphene layer 120 is a graphene coating or a graphene patch. Further, the graphene foam layer 110 is a polyurethane rubber-type graphene foam or an EPDM rubber-type graphene foam. It is understandable that the graphene foam layer 110 has better buffering and heat conduction effects, which allows the graphene foam layer 110 to be more tightly and directly contact the back plate 200, and allows the graphene layer 120 to be more tightly and directly contact the heat source, effectively further improving the heat dissipation effect of the back plate heat dissipation structure 10.

[0028] Please refer to the following: Figures 1 to 4 In one embodiment, the adhesive layer 300 is a thermally conductive double-sided adhesive layer, which better ensures the stable adhesion of the graphene heat sink 100 to the back plate 200.

[0029] In one embodiment, the backplate includes a metal sheet and an injection-molded body, wherein the metal sheet and the injection-molded body are integrally injection-molded structures, and the metal sheet is located on the side of the injection-molded body near the adhesive layer and is at least partially bonded to the adhesive layer, thereby improving the heat dissipation effect of the backplate and further improving the heat dissipation effect of the backplate heat dissipation structure.

[0030] Please refer to the following: Figures 1 to 4 In one embodiment, the porosity of the graphene heat sink 100 is less than 20%. Furthermore, the pore size of each first row of bubbles 301 and each second row of bubbles 101 is independently selected from 0.2mm to 3mm. Furthermore, the spacing between any two adjacent second rows of bubbles 101 is 0.7cm to 2cm, which effectively ensures improved heat dissipation performance of the backplate heat dissipation structure 10.

[0031] Please refer to the following: Figures 1 to 4 In one embodiment, the projection of each second row of bubble holes 101 onto the adhesive layer 300 is located within the corresponding second row of bubble holes 101, so that there is no exposed adhesive layer 300 at the second row of bubble holes 101.

[0032] Please refer to the following: Figures 1 to 4 In one embodiment, the graphene heat sink 100 includes a peripheral portion 100a and a central portion 100b, with the peripheral portion 100a fitted onto the central portion 100b. A plurality of second-row pores 101 are evenly distributed in the central portion 100b. Furthermore, both the peripheral portion 100a and the central portion 100b are laid flat on one side of the backplate 200. Furthermore, the adhesive layer 300 partially surrounds the periphery of the peripheral portion 100a, ensuring that the adhesive layer 300 at least partially surrounds the periphery of the graphene heat sink 100, thereby reducing edge warping of the graphene heat sink 100 and ensuring the heat dissipation effect of the backplate heat dissipation structure 10.

[0033] Please see Figure 5 In one embodiment, the backsheet includes a laminated aramid fiber layer and a protective varnish layer, wherein the aramid fiber layer is laminated with the adhesive layer, improving the mechanical properties of the backsheet. Further, the protective varnish layer comprises a laminated primer layer and a matte varnish layer, with the primer layer laminated onto the aramid fiber layer. Further, the specific manufacturing process of the backsheet is as follows: aramid fiber prepreg *3 → hot pressing → primer spraying → matte varnish spraying → laser shaping.

[0034] This application also provides a mobile device. One embodiment of the mobile device includes a heat source and a backplate heat dissipation structure as described in any of the above embodiments, with a graphene heat sink attached to the side of the heat source away from the adhesive layer. Further, please refer to... Figures 1 to 4 In this embodiment, the backplate heat dissipation structure 10 includes a graphene heat sink 100 and a backplate 200. The graphene heat sink 100 is located on one side of the backplate 200. The backplate heat dissipation structure 10 also includes an adhesive layer 300. The adhesive layer 300 has a plurality of first bubble-diffusing holes 301, which are spaced apart on the adhesive layer 300. The extension direction of each first bubble-diffusing hole 301 is the same as the thickness direction of the adhesive layer 300. The graphene heat sink 100 has a plurality of second bubble-diffusing holes 101, which extend in the same direction as the thickness direction of the graphene heat sink 100. The plurality of first bubble-diffusing holes 301 and the plurality of second bubble-diffusing holes 101 are connected in a one-to-one correspondence. The graphene heat sink 100 is attached to the backplate 200 through the adhesive layer 300. Further, the heat source includes, but is not limited to, at least one of a battery, a circuit board, and electronic components.

[0035] The aforementioned mobile devices employ a backplate heat dissipation structure, which further enhances the heat dissipation effect of the mobile devices.

[0036] Compared with the prior art, the present invention has at least the following advantages: The backplate heat dissipation structure 10 of this utility model has a first row of air bubble cavities 301 formed on the adhesive layer 300, and a second row of air bubble cavities 101 corresponding to the first row of air bubble cavities 301 formed on the graphene heat sink 100. This reduces the air bubble cavities between the backplate 200 and the graphene heat sink 100 after the graphene heat sink 100 is bonded to the backplate 200 by the adhesive layer 300, effectively improving the tightness of the fit between the graphene heat sink 100 and the backplate 200, and initially achieving backplate heat dissipation. The improved heat dissipation effect of structure 10 is further enhanced by the setting of the first row of bubbles 301 at the adhesive layer 300, which reduces the thermal resistance between the back plate 200 and the graphene heat sink 100 and allows some of the graphene heat sink 100 to directly contact the back plate 200, thereby further improving the heat dissipation effect of the back plate heat dissipation structure 10. In addition, each first row of bubbles 301 and each second row of bubbles 101 forms a heat dissipation channel, which enhances heat convection and radiation heat dissipation, thereby further improving the heat dissipation effect of the back plate heat dissipation structure 10.

[0037] The above embodiments only illustrate several implementation methods of this utility model, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A backplate heat dissipation structure, comprising a graphene heat sink and a backplate, wherein the graphene heat sink is located on one side of the backplate, characterized in that, The backplate heat dissipation structure also includes an adhesive layer, which has a plurality of first bubble drainage holes. The plurality of first bubble drainage holes are distributed at intervals on the adhesive layer, and the extension direction of each first bubble drainage hole is the same as the thickness direction of the adhesive layer. The graphene heat sink has multiple second bubble holes, and the extension direction of each second bubble hole is the same as the thickness direction of the graphene heat sink. The multiple first bubble holes and the multiple second bubble holes are connected in a one-to-one correspondence. The graphene heat sink is attached to the back plate through the adhesive layer.

2. The backplate heat dissipation structure according to claim 1, characterized in that, The graphene heat sink includes a graphene foam layer and a graphene layer. The graphene foam layer is connected to the adhesive layer, and the graphene layer is attached to the side of the graphene foam layer away from the adhesive layer. Each of the second row of bubbles penetrates both the graphene foam layer and the graphene layer.

3. The backplate heat dissipation structure according to claim 2, characterized in that, The graphene layer is a graphene coating or a graphene patch.

4. The backplate heat dissipation structure according to claim 2, characterized in that, The graphene foam layer is either polyurethane rubber type graphene foam or EPDM rubber type graphene foam.

5. The backplate heat dissipation structure according to claim 1, characterized in that, The adhesive layer is a thermally conductive double-sided adhesive layer.

6. The backplate heat dissipation structure according to claim 1, characterized in that, The back plate includes a metal sheet and an injection-molded body. The metal sheet and the injection-molded body are integrally injection-molded structures. The metal sheet is located on the side of the injection-molded body near the adhesive layer and is at least partially bonded to the adhesive layer.

7. The backplate heat dissipation structure according to claim 1, characterized in that, The porosity of the graphene heat sink is less than 20%; and / or, The diameter of each of the first and second bubble-removing holes is independently selected from 0.2 mm to 3 mm; and / or, The spacing between any two adjacent second row of bubbles is 0.7cm to 2cm; and / or, The projection of each second bubble-removing pore onto the adhesive layer is located within the corresponding second bubble-removing pore.

8. The backplate heat dissipation structure according to claim 1, characterized in that, The graphene heat sink includes a peripheral portion and a central portion, with the peripheral portion fitted onto the central portion, and a plurality of second bubble holes evenly distributed in the central portion; The adhesive layer is partially disposed around the periphery of the peripheral portion.

9. The backplate heat dissipation structure according to claim 1, characterized in that, The back panel includes a laminated aramid fiber layer and a protective varnish layer, wherein the aramid fiber layer is laminated and connected to the adhesive layer.

10. A mobile device, characterized in that, The device includes a heat source and a backplate heat dissipation structure according to any one of claims 1 to 9, wherein the graphene heat sink is attached to the heat source on the side away from the adhesive layer.

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