A computing terminal top cover plate assembly

Abstract

The utility model discloses a kind of computing terminal top cover plate assemblies, one side of top cover plate is provided with processor module containing groove, the processor module containing groove has heat dissipation step, the position of the heat dissipation step corresponds with the processor position in processor module, a plurality of longitudinal heat dissipation grooves are provided on the top cover plate, and the rib is between adjacent heat dissipation groove, and the other side of top cover plate corresponding with the position of processor module containing groove edge has the rib.The processor module containing groove on top cover plate can accommodate control board on circuit board, wherein heat dissipation step can be attached with processor on control board, facilitate heat conduction to the back of top cover plate, a plurality of heat dissipation grooves are provided on top cover plate, increase the contact area with air, facilitate heat conduction, and the other side of top cover plate corresponding with the position of processor module containing groove edge has the rib, for improving the strength in the position of processor module containing groove.

Description

Technical Field

[0001] This disclosure relates to the field of computing terminal technology, and more specifically, to a computing terminal top cover assembly. Background Technology

[0002] Edge computing refers to an open platform that integrates core capabilities of networking, computing, storage, and applications at the network edge, close to the source of objects or data, to provide edge intelligence services to meet the key needs of industry digitalization in areas such as agile connectivity, real-time business, data optimization, application intelligence, security, and privacy protection.

[0003] Edge computing terminals need to be small in size and weight, have a suitable working environment, and have good heat dissipation performance. They require a heat dissipation system that works together with the chassis to dissipate heat. The top cover usually houses the circuit board and dissipates heat through the top cover. Summary of the Invention

[0004] This disclosure is for providing a computing terminal top cover assembly that is small in size, lightweight, and capable of effectively dissipating heat from electrical equipment.

[0005] To achieve the above objectives, the technical solution adopted in this disclosure is as follows:

[0006] A computing terminal top cover assembly includes a top cover, one side of which has a processor module receiving slot, the processor module receiving slot having a heat dissipation step, the position of the heat dissipation step corresponding to the position of the processor in the processor module, the top cover having a plurality of longitudinal heat dissipation slots, and ribs between adjacent heat dissipation slots, the other side of the top cover corresponding to the edge position of the processor module receiving slot also having the ribs.

[0007] Optionally, the other side of the top cover plate corresponding to the edge of the processor module receiving slot forms a rectangular rib. The rectangular rib has a first longitudinal heat dissipation groove inside, a second heat dissipation groove on the left side of the outer side of the rectangular rib, a third heat dissipation groove on the right side of the outer side of the rectangular rib, a fourth heat dissipation groove on the upper part of the rectangular rib, and a fifth heat dissipation groove on the lower part of the rectangular rib.

[0008] Optionally, the first heat sink, the second heat sink, the third heat sink, the fourth heat sink, and the fifth heat sink are arranged at equal intervals.

[0009] Optionally, the first heat dissipation slot, the second heat dissipation slot, the third heat dissipation slot, the fourth heat dissipation slot, and the fifth heat dissipation slot are all waist-shaped slots.

[0010] Optionally, a heat-conducting pad mounting groove is also provided in the middle of the heat dissipation step.

[0011] Optionally, a thermal pad is installed in the thermal pad mounting groove.

[0012] Optionally, the height of the heat dissipation step is flush with one side of the top cover plate.

[0013] Optionally, the top cover plate has screw mounting slots on its left and right sides, the screw mounting slots pass through the upper surface of the top cover plate, and the screw mounting slots have screw steps on the lower surface of the top cover plate, with mounting holes in the screw steps.

[0014] Optionally, the processor module receiving slot is a rectangular slot.

[0015] Optionally, the front panel is made of aluminum alloy.

[0016] This disclosure utilizes a processor module receiving slot on the top cover plate to accommodate a control board on a circuit board. The heat dissipation step can be attached to the processor on the control board to facilitate heat conduction to the back of the top cover plate. The top cover plate has multiple heat dissipation slots to increase the contact area with air and facilitate heat conduction. The other side of the top cover plate corresponding to the edge of the processor module receiving slot has the ribs to improve the strength at the processor module receiving slot location. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this disclosure or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a three-dimensional view of the edge computing terminal in this disclosure.

[0019] Figure 2 A three-dimensional view of the top cover plate in this disclosure Figure 1 .

[0020] Figure 3 A three-dimensional view of the top cover plate in this disclosure Figure 2 .

[0021] Figure 4 This is a three-dimensional view of the top cover plate in use in this disclosure. Detailed Implementation

[0022] The preferred embodiments of this disclosure will now be described in detail with reference to the accompanying drawings, so that the advantages and features of this disclosure can be more easily understood by those skilled in the art, thereby providing a clearer and more definite definition of the scope of protection of this disclosure.

[0023] See Figure 1 As shown, a computing terminal top cover assembly is provided. The edge computing terminal includes a front panel 1, a rear panel 2, a top cover 3, a bottom cover 4, a left side panel 5, and a right side panel 6. The front panel 1, rear panel 2, top cover 3, bottom cover 4, left side panel 5, and right side panel 6 together form a rectangular box structure. The front panel 1, rear panel 2, top cover 3, bottom cover 4, left side panel 5, and right side panel 6 can all be made of metal, preferably aluminum alloy which has high heat dissipation efficiency.

[0024] See Figure 2 , Figure 3 As shown, the circuit board, processor, etc. of the edge computing terminal are all fixed on the top cover plate 3, and the core processor dissipates heat through the top cover plate. In order to improve the heat dissipation efficiency, a processor module receiving slot 31 is provided on one side of the top cover plate 3. The processor module receiving slot 31 can be a rectangular slot, a square slot, or a circular slot, and its shape is adapted to the shape of the processor circuit board in the edge computing terminal, so as to facilitate the placement of the processor circuit board in the processor module receiving slot 31. For example, in this disclosure, the core processor circuit board can be an RK3588 core processing board, and the module receiving slot 31 can be set as a rectangular slot with a structure similar to that of the RK3588 core processing board.

[0025] The processor module housing 31 has a heat dissipation step 32, the position of which corresponds to the position of the processor in the processor module. Its size is adapted to the shape and structure of the RK3588 core processor. The heat dissipation step 32 can fit snugly against the processor on the control board, facilitating heat conduction to the back of the top cover 3. Multiple vertical heat dissipation slots 33 are formed on the top cover 3, increasing the contact area with air and facilitating heat conduction. Ribs 34 are provided between adjacent heat dissipation slots 33, and ribs 34 are also present on the other side of the top cover 3 corresponding to the edge of the processor module housing 31. The ribs 34 strengthen the area of ​​the processor module housing 31. The chassis shell is made of high-strength aluminum alloy, with a streamlined design and smooth rounded corners for a natural transition, which is both aesthetically pleasing and meets safety requirements. During the design process, CAD-assisted optimization of the three-dimensional design of the chassis shell was used, and the rigidity and strength of the shell were improved by uniformly adding reinforcing ribs 34 to the thin-walled shell. All fastening connections of components inside the chassis are fitted with threaded bushings to prevent unreliable connections and to meet maintainability requirements.

[0026] In one embodiment, a thermal pad mounting groove 35 is also provided in the middle of the heat dissipation step 32. A thermal pad can be installed in the thermal pad mounting groove 35 and then contact the processor through the thermal pad to increase the heat dissipation efficiency.

[0027] In another embodiment, the top cover plate 3, corresponding to the edge of the processor module receiving slot 31, forms a rectangular rib 341 on the other side. The rectangular rib 341 has a first longitudinal heat dissipation groove 331 inside, a second heat dissipation groove 332 on the left side of the outer side, a third heat dissipation groove 333 on the right side of the outer side, a fourth heat dissipation groove 334 at the upper part of the rectangular rib 341, and a fifth heat dissipation groove 335 at the lower part. Through the first heat dissipation groove 331, the second heat dissipation groove 332, the third heat dissipation groove 333, the fourth heat dissipation groove 334, and the fifth heat dissipation groove 335, heat dissipation can be conveniently achieved from all sides of the back of the processor module receiving slot 31. The large number of heat dissipation grooves improves heat dissipation efficiency.

[0028] Preferably, the height of the heat dissipation step 32 is flush with one side of the top cover plate 3, and it can be directly machined from an aluminum alloy steel plate; the first heat dissipation groove 331, the second heat dissipation groove 332, the third heat dissipation groove 333, the fourth heat dissipation groove 334, and the fifth heat dissipation groove 335 are equally spaced. The first heat dissipation groove 331, the second heat dissipation groove 332, the third heat dissipation groove 333, the fourth heat dissipation groove 334, and the fifth heat dissipation groove 335 are all oblong grooves, which facilitates direct metal processing of the side plate or facilitates mold processing.

[0029] See Figure 4 As shown, a thermal pad 36 is installed in the thermal pad mounting slot 31, and the heat of the RK3588 core processor can be quickly transferred to the top cover plate 3 for heat dissipation through the thermal pad 36.

[0030] Optionally, screw mounting slots 371 are provided on the left and right sides of the top cover plate 3. The screw mounting slots 371 pass through the upper surface of the top cover plate 3, and the screw mounting slots 371 have screw steps 372 on the lower surface of the top cover plate 3. The screw steps 372 have mounting holes. The multiple screw mounting slots 371 can easily fix the top cover plate to the left side plate 5 and the right side plate 6, and also facilitate the use of a screwdriver.

[0031] Although embodiments of the present disclosure have been described in conjunction with the accompanying drawings, the patent owner may make various modifications or alterations within the scope of the appended claims, as long as they do not exceed the scope of protection described in the claims of the present disclosure, they shall be within the scope of protection of the present disclosure.

Claims

1. A computing terminal top cover assembly, characterized in that, The device includes a top cover plate, one side of which has a processor module receiving slot. The processor module receiving slot has a heat dissipation step, the position of which corresponds to the position of the processor in the processor module. The top cover plate has multiple longitudinal heat dissipation slots, and there are ribs between adjacent heat dissipation slots. The other side of the top cover plate, corresponding to the edge position of the processor module receiving slot, also has the ribs.

2. The computing terminal top cover assembly according to claim 1, characterized in that: The top cover plate corresponding to the edge of the processor module receiving slot has a rectangular rib. The rectangular rib has a first longitudinal heat dissipation groove inside, a second heat dissipation groove on the left side of the outer side of the rectangular rib, a third heat dissipation groove on the right side of the outer side of the rectangular rib, a fourth heat dissipation groove on the upper part of the rectangular rib, and a fifth heat dissipation groove on the lower part of the rectangular rib.

3. The computing terminal top cover assembly according to claim 2, characterized in that: The first heat sink, the second heat sink, the third heat sink, the fourth heat sink, and the fifth heat sink are arranged at equal intervals.

4. The computing terminal top cover assembly according to claim 2, characterized in that: The first, second, third, fourth and fifth heat dissipation slots are all waist-shaped slots.

5. The computing terminal top cover assembly according to claim 1, characterized in that: A heat-conducting pad mounting groove is also provided in the middle of the heat dissipation step.

6. The computing terminal top cover assembly according to claim 5, characterized in that: A thermal pad is installed in the thermal pad mounting groove.

7. The computing terminal top cover assembly according to claim 1, characterized in that: The height of the heat dissipation step is flush with one side of the top cover plate.

8. The computing terminal top cover assembly according to claim 1, characterized in that: The top cover plate has screw mounting slots on its left and right sides, which pass through the upper surface of the top cover plate. The screw mounting slots have screw steps on the lower surface of the top cover plate, and mounting holes are formed in the screw steps.

9. The computing terminal top cover assembly according to claim 1, characterized in that: The processor module housing is a rectangular slot.

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