Aluminum extruded columnar heat sink device

CN224909928UActive Publication Date: 2026-10-27ZHENJIANG SAMSUNG ELECTRONICS RADIATOR CO LTD
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Patent Information

Application Number
CN202522106495.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-09-29
Publication Date
2026-10-27
Estimated Expiration
2035-09-29

AI Technical Summary

Technical Problem

[0003]本实用新型针对上述问题,公开了一种铝型柱式散热器装置,解决了传统针柱式散热器散热效果较差的问题

Benefits of technology

[0011](1)本实用新型采用两端凸起的针翅组配合液冷腔结构,能够引导冷却液形成定向流动,减少低速死区,使流量分布更均匀,提高散热效率。

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Abstract

The utility model relates to an aluminum type column radiator device, including liquid cooling base, heat conduction board and needle fin group, liquid cooling base surface is equipped with the installation groove for installing heat conduction board, and heat conduction board and installation groove form liquid cooling cavity between, and the both ends of liquid cooling base are provided with liquid inlet and liquid outlet respectively, and the both ends inner wall of liquid cooling cavity are set up in two sides and contract, heat conduction board is located one side surface of liquid cooling cavity and sets up needle fin group, and both ends of needle fin group are all in convex structure, needle fin group is composed of several needle columns perpendicular to heat conduction board, and three grooves are evenly distributed and are equipped with on needle column upper end along needle column center, and one end of three grooves is connected in communication in needle column center, so that three grooves form Y shape flow channel for cooling medium circulation, make cooling medium from inside through needle column, improve the radiating area, strengthen the turbulence intensity, improve the heat exchange efficiency.
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Description

Technical Field

[0001] This utility model relates to the field of electronic heat sink technology, and in particular to an aluminum column heat sink device. Background Technology

[0002] Pin-type radiators utilize cylindrical, rhomboid, and elliptical fin structures to increase the heat dissipation surface area. In liquid cooling systems, traditional cylindrical pin-type fins have drawbacks: when coolant flows over the pin surface or channel wall, fluid viscosity creates a velocity boundary layer. The innermost layer of this boundary layer has a near-zero fluid velocity, forming a nearly static liquid film. Since heat must be transferred through this static liquid film via pure conduction, this layer constitutes significant thermal resistance, severely limiting heat dissipation efficiency. Therefore, high-intensity turbulent vortex disturbances are needed to dynamically thin or even locally disrupt the laminar sublayer. This allows the coolant main fluid, at a lower temperature, to directly flow over the hot surface, enabling faster heat transfer from the pin surface to the coolant, thus improving heat dissipation. Utility Model Content

[0003] To address the aforementioned problems, this utility model discloses an aluminum column radiator device, which solves the problem of poor heat dissipation performance of traditional pin column radiators.

[0004] The specific technical solution is as follows:

[0005] An aluminum columnar radiator device includes a liquid-cooled base, a heat-conducting plate, and a pin fin assembly. The surface of the liquid-cooled base is provided with a mounting groove for mounting the heat-conducting plate, forming a liquid-cooled cavity between the heat-conducting plate and the mounting groove. An inlet and an outlet connected to the liquid-cooled cavity are respectively provided at both ends of the liquid-cooled base, and the inner wall of the liquid-cooled cavity near the outlet is tapered on both sides. The pin fin assembly is located on one side surface of the heat-conducting plate within the liquid-cooled cavity. Both ends of the pin fin assembly have a convex structure adapted to the shape of the liquid-cooled cavity. The pin fin assembly consists of several pin columns perpendicular to the heat-conducting plate. Three slots are evenly distributed along the center of each pin column, with one end of each slot connected to the center of the pin column, forming a Y-shaped flow channel for the cooling medium.

[0006] Furthermore, the mounting groove has steps on both the left and right sides for supporting and mounting the heat-conducting plate.

[0007] Furthermore, the sidewalls of the steps all have a wavy structure.

[0008] Furthermore, the three slots on each needle post are distributed in the same direction.

[0009] Furthermore, the connection between the needle column and the heat-conducting plate is reinforced with a conical surface.

[0010] The beneficial effects of this utility model are reflected in:

[0011] (1) This utility model adopts a needle fin assembly with protruding ends and a liquid cooling cavity structure, which can guide the coolant to form a directional flow, reduce the low-speed dead zone, make the flow distribution more uniform, and improve the heat dissipation efficiency.

[0012] (2) In this utility model, each needle column is provided with a Y-shaped flow channel at the upper end, so that the cooling medium can pass through the needle column from the inside. This not only increases the heat dissipation area, but also induces strong vortices at the bifurcation and confluence points, effectively destroying the thermal boundary layer, enhancing the turbulence intensity, and improving the heat exchange efficiency. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the structure of the radiator device of this utility model.

[0014] Figure 2 This is a schematic diagram of the liquid-cooled base in this utility model.

[0015] Figure 3 This is a schematic diagram of the structure of the heat-conducting plate of this utility model.

[0016] Figure 4 This is a three-dimensional view of the needle column of this utility model.

[0017] Explanation of reference numerals in the attached drawings: liquid cooling base 1, mounting groove 101, step 102, liquid cooling cavity 103, heat conduction plate 2, groove 21, needle fin assembly 3, needle column 31, slot 311. Detailed Implementation

[0018] To make the technical solution of this utility model clearer and more explicit, the utility model will be further described below with reference to the accompanying drawings. Any solution derived by equivalent substitution and conventional reasoning of the technical features of this utility model falls within the protection scope of this utility model. The fixed connections and fixed settings mentioned in this utility model are all common connection methods in the mechanical field, including welding, bolt and nut connections, and screw connections.

[0019] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0020] Please see the appendix Figure 1-4This embodiment provides an aluminum column-type radiator device, including a liquid-cooled base 1, a heat-conducting plate 2, and a pin fin assembly 3. The surface of the liquid-cooled base 1 is provided with a mounting groove 101 for mounting the heat-conducting plate 2, so that a liquid-cooled cavity 103 is formed between the heat-conducting plate 2 and the mounting groove 101. The two ends of the liquid-cooled base 1 are respectively provided with a liquid inlet and a liquid outlet connected to the liquid-cooled cavity 103, and the inner walls at both ends of the liquid-cooled cavity 103 are both tapered. One side of the surface of the heat-conducting plate 2 is provided with a groove 21 for mounting electronic components to be cooled, and the other side of the heat-conducting plate 2 is provided on the surface of the liquid-cooled cavity 103. The two ends of the pin fin assembly 3 are convex structures adapted to the shape of the liquid-cooled cavity 103. The protruding pin fin assembly 3, in conjunction with the structure of the liquid-cooled cavity 103, can guide the coolant to form a directional flow, reduce the low-speed dead zone, and make the flow distribution more uniform.

[0021] The needle-fin assembly 3 consists of several needle columns 31 perpendicular to the heat-conducting plate 2. In this embodiment, the needle columns 31 are formed by extruding aluminum material using a mold and a cold precision forging process. Three slots 311 are evenly distributed along the center of the upper end of each needle column 31. The slots 311 are longitudinally penetrating, and the distribution direction of the three slots 311 on each needle column 31 is the same. One end of each slot 311 is connected to the center of the needle column 31, forming a Y-shaped flow channel for the cooling medium. This allows the cooling medium to pass through the needle column 31 from the inside, increasing the heat dissipation area and inducing strong vortices at the branching and converging points, effectively disrupting the thermal boundary layer, enhancing turbulence intensity, and improving heat transfer efficiency.

[0022] In this embodiment, the mounting groove 101 has steps 102 on the left and right sides for supporting the heat-conducting plate 2. The steps 102 are provided with screw holes so that the edge of the heat-conducting plate 2 is fixed by fasteners in conjunction with the screw holes.

[0023] In this embodiment, the sidewalls of the steps 102 are all wavy. When the coolant flows through the wavy wall, it will periodically experience acceleration and deceleration, resulting in flow separation and generating controllable vortices to improve heat dissipation performance.

[0024] In this embodiment, the connection between the needle post 31 and the heat-conducting plate 2 is reinforced with a conical surface to improve the structure of the needle post 31.

[0025] The above description is merely a preferred embodiment of this utility model, but the scope of protection of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the scope of protection of this utility model. Therefore, the scope of protection of this utility model should be determined by the scope of the claims.

Claims

1. An aluminum column-type radiator device, comprising a liquid-cooled base (1), a heat-conducting plate (2), and a pin fin assembly (3), wherein the surface of the liquid-cooled base (1) is provided with a mounting groove (101) for mounting the heat-conducting plate (2), such that a liquid-cooled cavity (103) is formed between the heat-conducting plate (2) and the mounting groove (101), and an inlet and an outlet connected to the liquid-cooled cavity (103) are respectively provided at both ends of the liquid-cooled base (1), and the inner walls at both ends of the liquid-cooled cavity (103) are both tapered on both sides; the pin fin assembly (3) is provided on one side surface of the heat-conducting plate (2) located in the liquid-cooled cavity (103), characterized in that, The needle fin assembly (3) has a convex structure at both ends and is adapted to the shape of the liquid cooling cavity (103); the needle fin assembly (3) is composed of several needle columns (31) perpendicular to the heat conduction plate (2). Three slots (311) are evenly distributed along the center of the needle column (31) at the upper end of the needle column (31). One end of the three slots (311) is connected to the center of the needle column (31), so that the three slots (311) form a Y-shaped flow channel for the flow of cooling medium.

2. The aluminum column radiator device as described in claim 1, characterized in that, The mounting groove (101) has steps (102) on the left and right sides for supporting and mounting the heat-conducting plate (2).

3. The aluminum column radiator device as described in claim 2, characterized in that, The sidewalls of the steps (102) are all wavy.

4. The aluminum column radiator device as described in claim 1, characterized in that, The three slots (311) on each needle column (31) are distributed in the same direction.

5. The aluminum column radiator device as described in claim 4, characterized in that, The connection between the needle column (31) and the heat-conducting plate (2) is reinforced with a conical surface.