A heat dissipation structure of a transcranial magnetic stimulation instrument cabinet and a transcranial magnetic stimulation instrument

CN224909934UActive Publication Date: 2026-10-27JIANGXI PUZOO MEDICAL DEVICE CO LTD
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Patent Information

Application Number
CN202522230517.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-10-22
Publication Date
2026-10-27
Estimated Expiration
2035-10-22

AI Technical Summary

Technical Problem

在经颅磁刺激仪的长时间的工作的条件下,会出现热量在机柜内部累积的情况,同样无法保证仪器的稳定性和安全性

Benefits of technology

[0023]本实用新型将冷却单元设置在集热壳体中,让冷却单元输出的热量被拦在集热壳体中,再通过散热管道的散热风机抽风,直接将冷却单元输出的热量沿着散热管道排到机柜外,杜绝冷却单元排出的热量进入机柜柜内,直接避免了冷却单元处产生的热量在机柜内残留累积。

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the field of transcranial magnetic stimulator, concretely provides a kind of heat dissipation structure and transcranial magnetic stimulator of transcranial magnetic stimulator cabinet, including cabinet, heat collection shell is arranged in the cabinet, cooling unit is placed in the heat collection shell, heat dissipation pipeline is arranged between the heat collection shell and cabinet inner wall, the heat dissipation pipeline is communicated cabinet outside, and heat dissipation fan is arranged in the heat dissipation pipeline;The utility model sets up cooling unit in heat collection shell, let cooling unit output heat be blocked in heat collection shell, then pass through the heat dissipation fan of heat dissipation pipeline and extract air, directly cooling unit output heat is along heat dissipation pipeline and is arranged to cabinet outside, prevents cooling unit output heat from entering cabinet cabinet, directly avoids the heat generated at cooling unit to be left in cabinet and accumulated, can guarantee the continuity and security of equipment use.
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Description

Technical Field

[0001] This utility model relates to the field of transcranial magnetic stimulation (TMS) devices, specifically providing a heat dissipation structure for a TMS device cabinet and a TMS device. Background Technology

[0002] Transcranial magnetic stimulation (TMS), a non-invasive neuromodulation technique, has been widely used in the treatment of various neurological disorders, including depression, anxiety, and neuropathic pain. The core working principle of a TMS treatment device is to release high-intensity pulsed currents to the stimulation coil through a pulsed power unit, thereby generating an induced electromagnetic field around the coil. A typical TMS device cabinet needs to integrate the pulsed power unit, cooling system, main control and power supply system, etc.

[0003] Current transcranial magnetic stimulation (TMS) devices all utilize a large-capacity capacitor bank in the pulse power unit to release a huge current into the treatment coil of the instrument within a very short time, forming a current pulse. However, this process generates a large amount of heat. To ensure the continuity and safety of the equipment, cooling equipment must be configured to cool the coil. However, the cooling equipment is generally located inside the cabinet, and it also needs to dissipate heat after cooling the coil. Existing TMS devices typically use a cooling fan outside the hot end of the cooling equipment to dissipate heat, but the output hot air can only be discharged to the outside through the ventilation holes of the cabinet, leaving some heat inside the cabinet. Under the conditions of prolonged operation of the TMS device, heat can accumulate inside the cabinet, which also compromises the stability and safety of the instrument. Utility Model Content

[0004] To address the aforementioned issues, this invention provides a heat dissipation structure for a transcranial magnetic stimulation (TMS) device, preventing heat accumulation in the cooling unit inside the cabinet and ensuring the long-term stable and safe operation of the instrument.

[0005] The technical solution of this utility model is as follows:

[0006] A heat dissipation structure for a transcranial magnetic stimulation (TMS) device cabinet includes a cabinet, a heat collection shell disposed in the cabinet, a cooling unit disposed in the heat collection shell, a heat dissipation pipe disposed between the heat collection shell and the inner wall of the cabinet, the heat dissipation pipe connecting to the outside of the cabinet, and a heat dissipation fan disposed in the heat dissipation pipe.

[0007] In this solution, the cooling unit is placed inside the heat collection housing, so that the heat output by the cooling unit is trapped in the heat collection housing. Then, the heat output by the cooling unit is directly exhausted to the outside of the cabinet by the cooling fan of the heat dissipation pipe, preventing the heat discharged by the cooling unit from entering the cabinet and directly avoiding the accumulation of heat generated at the cooling unit inside the cabinet.

[0008] Preferably, the surface of the heat collector housing is provided with air suction holes. By providing air suction holes on the surface of the heat collector housing, airflow inside the heat collector housing is facilitated, and the heat generated by the cooling unit can be better carried away.

[0009] Preferably, the cabinet is divided into multiple layers vertically by partitions, with each component in the cabinet placed on a different layer.

[0010] In this design, the cabinet is vertically divided into multiple layers, with different devices installed on each layer. This effectively reduces the floor space occupied by the entire transcranial magnetic stimulation (TMS) cabinet, making the TMS device smaller and easier to move.

[0011] Since a cooling unit is installed in the heat collection housing, when the cooling unit is a device such as a chiller that uses liquid as the heat transfer medium, in order to avoid liquid leakage in the cooling unit or condensate dripping causing damage to other devices, the heat collection housing is preferably located at the bottom layer of the cabinet, and the air intake holes are located on both sides of the heat collection housing.

[0012] In this design, the cooling unit and the heat collection housing are located at the bottom of the cabinet, so even if the cooling unit leaks or condensation occurs, it will not affect the normal operation of other devices.

[0013] Preferably, a first ventilation hole is provided on the cabinet wall opposite to the air intake hole, and a second ventilation hole is provided on the uppermost cabinet wall of the cabinet.

[0014] In this solution, since the surface of the heat collection shell is equipped with air intake holes, and with the cooling fan for exhaust, it can act as a negative pressure exhaust mechanism to exhaust air from the inside of the cabinet. A slight negative pressure is formed at the bottom of the cabinet, allowing the first and second ventilation holes to automatically draw in air to form an air duct. One of the air ducts runs from top to bottom, which can also carry away the heat generated by other components above, such as power supplies and capacitors, without the need for additional cooling fans. This ensures heat dissipation of the cooling unit while also achieving heat dissipation of the inside of the cabinet.

[0015] Another preferred placement of the heat collection housing is that the heat collection housing is located on the top layer of the cabinet, the heat collection housing is sealed to the top partition, and the air intake is located on the top of the heat collection housing.

[0016] In this design, the sealed connection between the heat collector housing and the partition prevents liquid dripping from the cooling unit and potentially affecting the components below, should leaks or condensation occur. Furthermore, placing the heat collector housing and cooling unit at the top of the cabinet allows for better airflow as hot air, being less dense, rises. Heat generated by other components, such as power supplies and capacitors, will concentrate upwards within the cabinet. This hot air can then be drawn out directly by the cooling fan through the air intake holes on the heat collector housing surface, thus dissipating heat both within the cooling unit and the interior of the cabinet.

[0017] Preferably, a first ventilation hole is provided on the wall of the topmost cabinet, and a second ventilation hole is provided on the bottommost cabinet. Because the surface of the heat collector housing has air intake holes, combined with the cooling fan, it acts as a negative pressure exhaust mechanism to draw air from the inside of the cabinet. A slight negative pressure is formed at the top of the cabinet, allowing the first and second ventilation holes to automatically draw in air and form an air duct, thus better dissipating heat from inside the cabinet.

[0018] Preferably, the bottom of the heat collection housing is provided with an emergency pipe that connects to the outside of the cabinet. By providing an emergency pipe, even if there is a liquid leak or condensate dripping from the cooling unit, the liquid can be directly discharged to the outside of the cabinet through the emergency pipe, further ensuring the normal operation of other devices.

[0019] A transcranial magnetic stimulation (TMS) device includes a heat dissipation structure for a TMS device cabinet as described above. The cabinet contains a capacitor unit, a power supply unit, and a cooling unit. Outside the cabinet are casters, a display, and a pulse stimulation unit. The cooling unit is located within the heat collection housing.

[0020] This transcranial magnetic stimulation device has good internal heat dissipation and can work stably for a long time.

[0021] Preferably, the cooling unit is a chiller, and the front end of the heat collection shell is provided with an opening. The operating end of the chiller extends out of the opening, exposing the operating panel of the chiller, which facilitates the adjustment of the chiller parameters.

[0022] The beneficial effects of this utility model are:

[0023] This invention places the cooling unit inside the heat collection shell, trapping the heat output by the cooling unit within the shell. The heat is then drawn out by the cooling fan through the heat dissipation pipe, directly exhausting the heat output by the cooling unit to the outside of the cabinet. This prevents the heat discharged by the cooling unit from entering the cabinet and directly avoids the accumulation of heat generated at the cooling unit inside the cabinet. Attached Figure Description

[0024] To more clearly illustrate the technical solution of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 A perspective view of this utility model without the cabinet door;

[0026] Figure 2 This is a front view of the present invention;

[0027] Figure 3 This is a side sectional view of the cabinet of this utility model;

[0028] Figure 4 This utility model Figure 3 Sectional view of AA;

[0029] Figure 5 This is a side sectional view of another mechanism of this utility model.

[0030] In the above figures, the corresponding reference numerals are as follows:

[0031] 1-Rack, 101-First ventilation hole, 102-Second ventilation hole, 103-Third ventilation hole, 2-Heat collector shell, 201-Air intake hole, 3-Cooling unit, 4-Heat dissipation pipe, 5-Heat dissipation fan, 6-Baffle, 7-Emergency pipe, 8-Moving wheels, 9-Display, 10-Pulse stimulation unit. Detailed Implementation

[0032] The technical solution of the present invention will be clearly and completely described in conjunction with the accompanying drawings and through specific implementation methods of the embodiments of the present invention.

[0033] Example 1:

[0034] A heat dissipation structure for a transcranial magnetic stimulation (TMS) device cabinet 1, such as... Figure 1 , Figure 3 and Figure 4 As shown, the system includes a cabinet 1, a heat collection shell 2 is provided in the cabinet 1, a cooling unit 3 is placed in the heat collection shell 2, a heat dissipation pipe 4 is provided between the heat collection shell 2 and the inner wall of the cabinet 1, the heat dissipation pipe 4 is connected to the outside of the cabinet 1, and a heat dissipation fan 5 is provided in the heat dissipation pipe 4.

[0035] The heat collection shell 2 is provided with air suction holes 201 on its surface. By providing air suction holes 201 on the surface of the heat collection shell 2, the air flow inside the heat collection shell 2 is facilitated, and the heat generated by the cooling unit 3 can be better carried out.

[0036] In this embodiment, the cooling unit 3 is placed in the heat collection shell 2, so that the heat output by the cooling unit 3 is blocked in the heat collection shell 2. Then, the heat output by the cooling fan 5 of the heat dissipation pipe 4 is directly blown out of the cabinet 1 along the heat dissipation pipe 4, preventing the heat discharged by the cooling unit 3 from entering the cabinet 1 and directly avoiding the heat generated at the cooling unit 3 from remaining and accumulating in the cabinet 1.

[0037] Example 2:

[0038] Based on Example 1, such as Figure 3 As shown, the cabinet 1 is vertically divided into multiple layers by partitions 6, with each device in the cabinet 1 placed on a different layer. The layers are interconnected via partitions 6 and the inner wall of the cabinet 1. In this embodiment, the cabinet 1 is vertically divided into multiple layers, with each layer housing different devices, effectively reducing the footprint of the entire transcranial magnetic stimulation (TMS) cabinet 1, making the TMS device smaller and easier to move.

[0039] Specifically, when the cooling unit 3 is a device that uses liquid as the heat transfer medium, such as a chiller, in order to prevent liquid leakage in the cooling unit 3 or condensate dripping that could damage other devices, the heat collection shell 2 is located at the bottom of the cabinet 1, and the air intake vents 201 are located on both sides of the heat collection shell 2.

[0040] In this embodiment, the cooling unit 3 and the heat collection housing 2 are located on the bottom layer of the cabinet 1. Even if the cooling unit 3 leaks or condensation occurs, it will not affect the normal operation of other devices.

[0041] Furthermore, a first ventilation hole 101 is provided on the cabinet wall opposite to the air intake 201, and a second ventilation hole 102 is provided on the uppermost cabinet wall of the cabinet 1. Since the surface of the heat collection housing 2 is provided with the air intake 201, in conjunction with the cooling fan, it can act as a negative pressure exhaust mechanism to draw air from the inside of the cabinet 1. A slight negative pressure is formed at the bottom of the cabinet 1, allowing the first ventilation hole 101 and the second ventilation hole 102 to automatically draw in air and form an air duct. One of the air ducts runs from top to bottom, carrying away the heat generated by other components above, such as power supplies and capacitors, without the need for an additional cooling fan. This ensures heat dissipation of the cooling unit 3 while also achieving heat dissipation of the inside of the cabinet 1.

[0042] Of course, such as Figure 4 As shown, a third ventilation hole 103 can also be provided at the bottom of the cabinet 1. The third ventilation hole 103 is located on both sides of the heat dissipation shell and close to the air intake hole 201 to ensure that the temperature of the gas entering the heat collection shell 2 to exchange heat with the cooling unit 3 is not too high, and to ensure the heat dissipation effect of the heat dissipation fan 5 on the cooling unit 3.

[0043] Example 3:

[0044] Based on Example 2, in order to further improve the heat dissipation within cabinet 1, such as... Figure 5 As shown, another position of the heat collection housing 2 is provided. The heat collection housing 2 is located on the top layer of the cabinet 1. The heat collection housing 2 is sealed to the top partition 6. The air intake 201 is located on the top of the heat collection housing 2.

[0045] Specifically, the sealed connection between the heat collector housing 2 and the partition 6 prevents liquid from dripping and affecting the components below in case of leakage or condensation in the cooling unit 3. Furthermore, by placing the heat collector housing 2 and the cooling unit 3 on the top layer of the cabinet 1, the lower density of hot air causes it to rise, concentrating the heat generated by other components such as power supplies and capacitors upwards within the cabinet. This hot air is then directly drawn out by the cooling fan through the air intake holes 201 on the surface of the heat collector housing 2, thus achieving heat dissipation for the interior of the cabinet 1 while the cooling unit 3 dissipates heat.

[0046] Furthermore, a first ventilation hole 101 is provided on the wall of the topmost cabinet 1, and a second ventilation hole 102 is provided on the bottommost cabinet 1. Since the surface of the heat collection shell 2 is provided with air intake holes 201, together with the cooling fan, it can act as a negative pressure exhaust mechanism to exhaust air from the inside of the cabinet 1. A slight negative pressure is formed at the top of the cabinet 1, allowing the first ventilation hole 101 and the second ventilation hole 102 to automatically draw in air and form an air duct, thereby better dissipating the heat inside the cabinet 1.

[0047] Furthermore, the bottom of the heat collection housing 2 is provided with an emergency pipe 7 that connects to the outside of the cabinet 1. By providing the emergency pipe 7, even if the cooling unit 3 leaks liquid or drips condensate, the liquid can be discharged directly to the outside of the cabinet through the emergency pipe 7, further ensuring the normal operation of other devices.

[0048] The emergency pipe 7 can be equipped with a sensor to detect whether there is liquid flow in the emergency pipe 7, thereby determining whether the cooling unit 3 is leaking or whether condensate is accumulating. Of course, this sensor can be an optical liquid level sensor.

[0049] Example 4:

[0050] A transcranial magnetic stimulation device, such as Figure 1 and Figure 2As shown, the heat dissipation structure of the transcranial magnetic stimulation (TMS) device cabinet 1 disclosed in the above embodiments is included. The cabinet 1 contains a capacitor unit, a power supply unit, and a cooling unit 3. Outside the cabinet 1 are casters 8, a display 9, and a pulse stimulation unit 10. The cooling unit 3 is located within the heat collection housing 2. The TMS device disclosed in this embodiment has good internal heat dissipation and can achieve stable operation for extended periods.

[0051] When the cooling unit 3 is a chiller, the front end of the heat collection shell 2 is provided with an opening, and the operating end of the chiller extends out of the opening, exposing the operating panel of the chiller, which facilitates the adjustment of the chiller parameters.

[0052] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.

Claims

1. A heat dissipation structure for a transcranial magnetic stimulation (TMS) device cabinet, comprising a cabinet, characterized in that, The cabinet is equipped with a heat collection shell, in which a cooling unit is placed. A heat dissipation pipe is provided between the heat collection shell and the inner wall of the cabinet, and the heat dissipation pipe connects to the outside of the cabinet. A cooling fan is installed in the heat dissipation pipe.

2. The heat dissipation structure of a transcranial magnetic stimulation (TMS) device cabinet according to claim 1, characterized in that, The surface of the heat collection shell is provided with air suction holes.

3. The heat dissipation structure of a transcranial magnetic stimulation (TMS) instrument cabinet according to claim 2, characterized in that, The cabinet is divided into multiple layers vertically by partitions, with each component placed on a different layer.

4. The heat dissipation structure of a transcranial magnetic stimulation (TMS) instrument cabinet according to claim 3, characterized in that, The heat collection housing is located on the bottom layer of the cabinet, and the air intake holes are located on both sides of the heat collection housing.

5. The heat dissipation structure of a transcranial magnetic stimulation (TMS) instrument cabinet according to claim 4, characterized in that, A first ventilation hole is provided on the cabinet wall opposite to the air intake hole, and a second ventilation hole is provided on the uppermost cabinet wall of the cabinet.

6. The heat dissipation structure of a transcranial magnetic stimulation (TMS) instrument cabinet according to claim 3, characterized in that, The heat collection housing is located on the top layer of the cabinet, and the heat collection housing is sealed to the uppermost partition. The air intake is located on the top of the heat collection housing.

7. The heat dissipation structure of a transcranial magnetic stimulation (TMS) instrument cabinet according to claim 6, characterized in that, The top cabinet has a first ventilation hole on its wall, and the bottom cabinet has a second ventilation hole.

8. The heat dissipation structure of a transcranial magnetic stimulation (TMS) device cabinet according to claim 6, characterized in that, An emergency pipe connecting the bottom of the heat collector shell to the outside of the cabinet is provided.

9. A transcranial magnetic stimulation device, characterized in that, The heat dissipation structure of a transcranial magnetic stimulation device cabinet as described in any one of claims 1-8 includes a capacitor unit, a power supply unit and a cooling unit inside the cabinet, and a moving wheel, a display and a pulse stimulation unit outside the cabinet, wherein the cooling unit is disposed in the heat collection shell.

10. A transcranial magnetic stimulation device according to claim 9, characterized in that, The cooling unit is a chiller, and the front end of the heat collection shell is provided with an opening, through which the operating end of the chiller extends.