A heat conduction device and electronic equipment

Abstract

The application discloses a heat conduction device, and relates to the technical field of electronic equipment. The heat conduction device comprises a heat conduction assembly and a functional assembly. The heat conduction assembly has a first connecting area and a second connecting area along a first direction. The first connecting area is used for connecting a heat dissipation assembly, and the second connecting area is used for connecting a heat generation assembly. The functional assembly is connected with the heat conduction assembly. The functional assembly can move along a second direction relative to the heat conduction assembly to change the connecting state of the heat conduction assembly. The first direction and the second direction have an included angle.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and in particular to a heat conduction device and electronic equipment. Background Technology

[0002] To improve heat conduction, heat conduction components usually need to maintain sufficient and good contact with heat-generating and heat-dissipating components. This makes it difficult to separate heat-dissipating, heat conduction, and heat-generating components, and may even damage the internal structure due to excessive force during separation. Utility Model Content

[0003] The heat-conducting device provided in this application facilitates disassembly and maintenance, and also reduces the risk of component damage during disassembly.

[0004] On one hand, the heat conduction device includes a heat conduction component and a functional component. The heat conduction component has a first connection area and a second connection area along a first direction. The first connection area is used to connect a heat dissipation component, and the second connection area is used to connect a heat generation component. The functional component is connected to the heat conduction component and can move relative to the heat conduction component along a second direction to change the connection state of the heat conduction component. The first direction and the second direction have an angle between them.

[0005] In one possible implementation of this application, the connection area of ​​the first connection region is smaller than the connection area of ​​the second connection region.

[0006] In one possible implementation of this application, the functional component is connected to the first connection area and / or the second connection area.

[0007] In one possible implementation of this application, the functional component includes a connecting part and a pulling part, which are arranged along a second direction. The connecting part is connected to a heat-conducting component, and the pulling part can drive the connecting part to move along the second direction.

[0008] In one possible implementation of this application, the connecting part is a ring structure, and the connecting part is arranged around the edge of the heat-conducting component; the heat-conducting component is provided with a first snap-fit ​​structure, and the functional component is provided with a second snap-fit ​​structure that is adapted to and connected to the first snap-fit ​​structure.

[0009] In one possible implementation of this application, the heat-conducting component has a mounting groove formed recessed along a first direction, the mounting groove being adapted to the shape of the connecting portion, and the connecting portion being disposed within the mounting groove.

[0010] On the other hand, the electronic device provided in this application includes a heat-generating component, a heat-dissipating component, a heat-conducting component, and a functional component. The heat-dissipating component is disposed corresponding to the heat-generating component; the heat-conducting component is disposed between the heat-generating component and the heat-dissipating component, and has a first connection area and a second connection area along a first direction, the first connection area connecting to the heat-dissipating component and the second connection area connecting to the heat-generating component; the functional component is connected to the heat-conducting component, and the functional component is movable relative to the heat-conducting component along a second direction to switch the heat-conducting component from a first connection state to a second connection state; the connection strength of the heat-conducting component in the first connection state is greater than the connection strength in the second connection state; the first direction and the second direction form an angle.

[0011] In one possible implementation of this application, the heat dissipation component and the heat generation component are connected in sequence through a heat conduction component. Switching from a first connection state to a second connection state, the functional component drives the heat conduction component to move, which can cause at least a partial failure of the first connection area and the second connection area of ​​the heat conduction component.

[0012] In one possible implementation of this application, the functional component includes a connecting part and a pulling part, which are arranged along a second direction. The connecting part is connected to the heat-conducting component, and the pulling part can drive the connecting part to move along the second direction. The heat dissipation component includes an opening that extends through the second direction, which is aligned with the heat-conducting component along the second direction. The pulling part extends through the opening to the outside of the heat dissipation component.

[0013] In one possible implementation of this application, the electronic device further includes a dust cover, which is detachably disposed on the heat dissipation assembly and covers the opening; the pull-out portion is accommodated in the cavity formed by the dust cover and the heat dissipation assembly. Attached Figure Description

[0014] Figure 1 This is one of the structural schematic diagrams of the electronic device provided in the embodiments of this application; Figure 2 This is a second schematic diagram of the structure of the electronic device provided in the embodiments of this application; Figure 3 This is one of the structural schematic diagrams of the heat-conducting device provided in the embodiments of this application; Figure 4 An exploded view of the heat-conducting device provided in the embodiments of this application; Figure 5 This is a second schematic diagram of the structure of the heat-conducting device provided in the embodiments of this application.

[0015] Figure label: 1-Heat-conducting device; 11-Heat-conducting component; 111-First connection area; 112-First snap-fit ​​structure; 113-Mounting groove; 114-Second connection area; 12-Functional component; 121-Connecting part; 122-Pull-up part; 123-Second snap-fit ​​structure; 2-Heat-generating component; 3-Heat-dissipating component; 31-Opening; 4-Dust cover; Z-First direction; X-Second direction; Y-Third direction. Detailed Implementation

[0016] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the specific technical solutions of this application will be further described in detail below with reference to the accompanying drawings of the embodiments of this application. The following embodiments are used to illustrate this application, but are not intended to limit the scope of this application.

[0017] In the embodiments of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of this application, unless otherwise stated, "multiple" means two or more.

[0018] Furthermore, in the embodiments of this application, directional terms such as "upper," "lower," "left," and "right" are defined relative to the positions in which the components are schematically placed in the accompanying drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and can change accordingly depending on the position of the components in the accompanying drawings.

[0019] In the embodiments of this application, unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium.

[0020] In embodiments of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0021] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design that is described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design. Specifically, the use of the terms "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0022] Some devices meet the IP5X dustproof rating (meaning they are dustproof up to level 5). To achieve this sealing standard, common air-cooling (i.e., fan) solutions are usually not used, as installing a fan through a hole would compromise the device's dustproof performance. Instead, a built-in thermally conductive component is used. This component transfers the heat generated by the heat-generating components to the heat dissipation component, thus achieving heat dissipation.

[0023] To improve thermal conductivity, thermally conductive components typically need to maintain sufficient and good contact with heat-generating and heat-dissipating components. Furthermore, to enhance sealing and structural compactness, the connection between the thermally conductive component and the heat-generating or heat-dissipating components can be difficult to separate. For example, to achieve better thermal conductivity and good contact, the thermally conductive component can be made of a soft and adhesive material, with its surface fully adhering to the heat-generating and heat-dissipating components, making separation of the heat-generating, heat-dissipating, and heat-dissipating components difficult.

[0024] The electronic equipment provided in this application can be used in devices that require good sealing, need to achieve an IP5X dustproof rating or fanless heat dissipation, such as servers, industrial PCs, laptops, mobile phones, tablets, outdoor cameras, sensors or controllers, etc.

[0025] This application provides an electronic device, with reference to... Figure 1 and Figure 2 The electronic device includes a heat-generating component 2, a heat-dissipating component 3, a heat-conducting component 11, and a functional component 12. The heat-dissipating component 3 is disposed corresponding to the heat-generating component 2; the heat-conducting component 11 is disposed between the heat-generating component 2 and the heat-dissipating component 3, and the heat-conducting component 11 has a first connection area 111 and a second connection area 114 along a first direction Z. The first connection area 111 is connected to the heat-dissipating component 3, and the second connection area 114 is connected to the heat-generating component 2; the functional component 12 is connected to the heat-conducting component 11, and the functional component 12 can move relative to the heat-conducting component 11 along a second direction X to switch the heat-conducting component 11 from a first connection state to a second connection state; the connection strength of the heat-conducting component 11 in the first connection state is greater than the connection strength in the second connection state; the first direction Z and the second direction X have an angle.

[0026] In this embodiment, the heating component 2 can generate heat during the use of the electronic device. The heating component 2 can be a central processing unit (CPU), a graphics processing unit (GPU), or an artificial intelligence acceleration chip, etc.

[0027] In this embodiment, the heat dissipation component 3 can transfer the heat transferred by the heat-conducting component 11 to the external environment. The heat dissipation component 3 can be a heat pipe, a heat spreader, a heat sink, etc. For example, the heat dissipation component 3 can be one or more heat pipes, and the first connection area 111 of the heat-conducting component 11 can be designed as a flat contact surface or a groove matching the shape of the heat pipe. The heat dissipation component 3 can be made of a material with high thermal conductivity, such as aluminum alloy, copper, or graphene.

[0028] For example, an electronic device includes a motherboard with a CPU. The area of ​​the motherboard where the CPU is located is connected to a second connection area of ​​a heat-conducting component, and the first connection area of ​​the heat-conducting component is connected to multiple heat pipes. During use, the heat generated by the CPU is transferred to the heat pipes through the heat-conducting component, where heat exchange occurs to dissipate heat. When the heat-conducting component switches from the first connection state to the second connection state, the connection strength between the heat-conducting component and the CPU weakens, and / or the connection strength between the heat-conducting component and the multiple heat pipes weakens. This facilitates separation and disassembly of the CPU and the heat pipes, thereby improving maintenance convenience.

[0029] In this embodiment, the heat-conducting component 11 has a first connecting region 111 and a second connecting region 114 along a first direction Z. The first direction Z can be understood as the thickness direction of the heat-conducting component 11, that is, the first connecting region 111 and the second connecting region 114 are located on both sides of the thickness direction of the heat-conducting component 11. Since the first connecting region 111 connects to the heat dissipation component 3 and the second connecting region 114 connects to the heat generation component 2, the heat dissipation component 3 and the heat generation component 2 are respectively connected to both sides of the thickness direction of the heat-conducting component 11 and are respectively connected to the heat-conducting component 11. Alternatively, the heat-conducting component 11 can be understood as being disposed between the heat dissipation component 3 and the heat generation component 2 to fill the air gap between them. The heat-conducting component 11 can be made of a material with good thermal conductivity and certain flexibility and compressibility, such as a thermally conductive silicone pad, a thermally conductive gel, or a flexible graphite pad.

[0030] In this embodiment, the first connection state can be understood as the structure in which the heat dissipation component 3, the heat conduction component 11 and the heat generation component 2 are connected can achieve stable heat conduction and realize heat dissipation function; the second connection state can be understood as the structure in which the heat dissipation component 3, the heat conduction component 11 and the heat generation component 2 are connected can reduce the ability to achieve heat conduction, and the heat dissipation component 3, the heat conduction component 11 and the heat generation component 2 are in a state that is easy to disassemble and separate.

[0031] In this embodiment, the functional component 12 is connected to the heat-conducting component 11. The functional component 12 can be a screw, a clip, a slider, a pull member, or a lever, etc. For example, the functional component 12 can be a slider disposed on the heat dissipation component 3. The slider is connected to the heat-conducting component 11 via a connecting rod. The heat dissipation component 3 is provided with a slide rail extending along the second direction X. The slide rail is disposed on and can move along the slide rail to drive the connecting rod to move in the second direction X. When the heat-conducting component 11 needs to switch from a first connection state to a second connection state, the slider moves along the slide rail in the second direction X, and the connecting rod pulls the heat-conducting component 11, applying a pulling force along the second direction X to the heat-conducting component 11. Under the action of the pulling force, the heat-conducting component 11 moves or deforms, thereby weakening the connection strength of the heat-conducting component 11.

[0032] In this embodiment, the first direction Z can be understood as the thickness direction of the heat-conducting component 11. When the heat-generating component 2 and the heat-dissipating component 3 are connected to the heat-conducting component 11, the first direction Z can be understood as the arrangement of the heat-generating component 2, the heat-conducting component 11 and the heat-dissipating component 3 being reversed, or perpendicular to the reverse arrangement of the heat-generating component 2 and / or the heat-dissipating component 3.

[0033] In this embodiment, the heat-conducting component 11 switches from a first connection state to a second connection state, thereby weakening the connection strength of the heat-conducting component 11. Specifically, the heat-conducting component 11 can be displaced relative to the heat-generating component 2 and / or the heat-dissipating component 3 by the functional component 12, or it can be deformed relative to the heat-generating component 2 and / or the heat-dissipating component 3.

[0034] In this embodiment, the second direction X and the first direction Z have an angle between them. The angle between the second direction X and the first direction Z can be 30 degrees, 45 degrees, or 60 degrees, etc., and can be adjusted according to the structural features between the heat-generating component 2, the heat-conducting component 11, and the heat-dissipating component 3. This application does not limit this. For example, the angle between the second direction X and the first direction Z can be 90 degrees, that is, the second direction X can be parallel to the extension direction of the heat-conducting component 11.

[0035] In some embodiments, the heat dissipation component 3 is a metal housing. The heat dissipation component 3 can be a one-piece housing or a separate housing. For example, the heat dissipation component 3 may include a first part and a second part. The heating device includes a first surface and a second surface facing away from each other. The first surface is connected to a first heat-conducting component 11, and the first heat-conducting component 11 is connected to a first part of the heat dissipation component 3. The second surface is connected to a second heat-conducting component 11, and the second heat-conducting component 11 is connected to a second part of the heat dissipation component 3. With this structure, the first part and the second part are fastened together to form a receiving space, and the heating component 2, the heat-conducting component 11 and the functional component 12 are housed in the receiving space.

[0036] In this embodiment, the connection strength of the heat-conducting component 11 can be weakened by the movement of the functional component 12 along the second direction X. The first connection area 111 of the heat-conducting component 11 is connected to the heat dissipation component 3, and the second connection area 114 of the heat-conducting component 11 is connected to the heat-generating component 2. The weakening of the connection strength of the heat-conducting component 11 can be a weakening of the connection strength between the heat dissipation component 3 and the first connection area 111; it can also be a weakening of the connection strength between the second connection area 114 and the heat-generating component 2; or it can be a weakening of the connection strength between both the heat dissipation component 3 and the heat-generating component 2 and the heat-conducting component 11.

[0037] For example, the functional component 12 can be connected to the first connection area 111. The functional component 12 moves along the second direction X, which can weaken the connection between the first connection area 111 and the heat dissipation component 3, making it easier to separate and disassemble the heat dissipation component 3 from the heat conduction component 11. The connection between the heat-generating component 2 and the heat conduction component 11 is not affected. Operators can clean or repair the inside of the electronic device, or replace or maintain the heat dissipation component 3, thus reducing damage to the heat-generating component 2 (such as CPU, GPU, etc.).

[0038] In another example, the functional component 12 can be connected to the second connection area 114. The functional component 12 moves along the second direction X, which can weaken the connection between the second connection area 114 and the heat-generating component 2, making it easier to separate and disassemble the heat-generating component 2 from the heat-conducting component 11. The connection between the heat dissipation component 3 and the heat-conducting component 11 is not affected. Operators can clean or repair the inside of the electronic device, or replace or maintain the heat-generating component 2. This can reduce damage to the heat-generating component 2 (such as CPU, GPU, etc.), simplify the disassembly process, and facilitate operation.

[0039] In another example, the functional component 12 can be connected to the first connection area 111 and the second connection area 114 respectively. If the heat conduction component 11 needs to be replaced, the functional component 12 can simultaneously weaken the connection strength between the heat conduction component 11, the heat dissipation component 3, and the heat generation component 2, making it easier to separate and disassemble the heat generation component 2, the heat conduction component 11, and the heat dissipation component 3. This allows for the maintenance and replacement of the heat generation component 2, the heat conduction component 11, and the heat dissipation component 3 respectively, simplifying the disassembly process and making the operation easier.

[0040] In the electronic device of this application embodiment, since the first connection area 111 of the heat conduction component 11 is connected to the heat dissipation component 3 and the second connection area 114 is connected to the heat generation component 2, and the heat conduction component 11 has a first connection area 111 and a second connection area 114 along the first direction Z, that is, the heat dissipation component 3 and the heat generation component 2 are connected to the heat conduction component 11 along the first direction Z, and the heat conduction component 11 can transfer the heat generated by the heat generation component 2 to the heat dissipation component 3 to achieve heat dissipation. Functional component 12 is connected to heat-conducting component 11. Since the connection strength of heat-conducting component 11 in the first connection state is greater than that in the second connection state, when heat-conducting component 11 switches from the first connection state to the second connection state, the connection strength of heat-conducting component 11 weakens. Therefore, heat-conducting component 11 is more easily separated from the connected heat-generating component 2 and / or heat-dissipating component 3 in the second connection state. Since functional component 12 is connected to heat-conducting component 11, and functional component 12 can move relative to heat-conducting component 11 along the second direction X to switch heat-conducting component 11 from the first connection state to the second connection state, that is, the movement of functional component 12 along the second direction X can weaken the connection strength of heat-conducting component 11. With this structure, the movement of functional component 12 along the second direction X can weaken the connection strength of heat-conducting component 11, which facilitates the separation of heat-conducting component 11 from heat-generating component 2 and / or heat-dissipating component 3, which facilitates the disassembly and maintenance of electronic equipment and reduces the possibility of component damage during disassembly.

[0041] In some possible embodiments of this application, the heat dissipation component 3 and the heat generation component 2 are connected in sequence through the heat conduction component 11. When switching from the first connection state to the second connection state, the functional component 12 drives the heat conduction component 11 to move, which can cause the first connection area 111 and the second connection area 114 of the heat conduction component 11 to fail at least partially.

[0042] In this embodiment, the heat-generating component 2 can be a main chip fixed on a printed circuit board; the heat-conducting component 11 can be a thermally conductive silicone pad covering the chip; and the heat dissipation component 3 can be an aluminum alloy heat sink or a metal casing. (Refer to...) Figure 1 and Figure 2 The heat dissipation component 3 and the heat generation component 2 are connected in sequence through the heat conduction component 11, forming a three-layer stacked and compressed structure.

[0043] In this embodiment, the functional component 12 drives the heat-conducting component 11 to move. The functional component 12 can move relative to the heat-conducting component 11, causing a change in the position or shape of the heat-conducting component 11. The functional component 12 can also drive the heat-conducting component 11 to move, causing a change in the position or shape of the heat-conducting component 11. This change in position or shape of the heat-conducting component 11 can cause at least partial failure of the first connection area 111 and the second connection area 114. The movement of the functional component 12 can be rotation or sliding, and the force applied by the functional component 12 to the heat-conducting component 11 can be tension, thrust, shear force, etc.

[0044] In this embodiment, the first connection area 111 and the second connection area 114 are at least partially ineffective, meaning that the connection is at least partially lost. For example, the first connection area 111 is connected to the heat dissipation component 3. At least partial failure of the first connection area 111 means that the connection between the first connection area 111 and the heat dissipation component 3 is at least partially lost, reducing the connection strength between them. When the first connection area 111 and the heat dissipation component 3 are bonded, the bonded area in the first connection state is larger than the bonded area in the second connection state.

[0045] In this embodiment of the application, the area of ​​the first connection area 111 and the area of ​​the second connection failure part may be related to the degree of movement of the heat conduction component 11 driven by the functional component 12. The greater the degree of movement of the heat conduction component 11, the larger the area of ​​the failure part.

[0046] In the electronic device of this application embodiment, the heat dissipation component 3 and the heat generation component 2 are sequentially connected via the heat conduction component 11. When switching from the first connection state to the second connection state, the functional component 12 drives the heat conduction component 11 to move. Therefore, when switching to the second connection state is required, the functional component 12 can be controlled to drive the heat conduction component 11 to move, thus enabling controllable switching of connection states. Since in the second connection state, the first connection area 111 and the second connection area 114 are at least partially ineffective—that is, the connection between the first connection area 111 and the heat generation component 2 is at least partially ineffective, and the connection between the second connection area 114 and the heat dissipation component 3 is at least partially ineffective—the connection strength is reduced, the force required for separation is reduced, facilitating separation during maintenance and reducing damage caused by excessive force during separation.

[0047] In some embodiments, at least a portion of the functional component 12 is movable along a second direction X to apply a force along the second direction X to the heat-conducting component 11, causing the heat-conducting component 11 to switch from a first connection state to a second connection state.

[0048] For example, the functional component 12 can be a composite structure, which may include a rotary drive and a push rod. The rotary drive drives the push rod to extend and retract along the second direction X to apply a thrust along the second direction X to the heat conduction component 11. Under the action of the thrust, part of the structure of the heat conduction component 11 deforms, thereby causing part of the structure of the first connection area 111 and the second connection area 114 to fail, thereby reducing the connection strength of the first connection area 111 and the second connection area 114.

[0049] In some possible embodiments of this application, reference is made to Figure 2 and Figure 3The functional component 12 includes a connecting part 121 and a pulling part 122, which are arranged along the second direction X. The connecting part 121 is connected to the heat-conducting component 11, and the pulling part 122 can drive the connecting part 121 to move along the second direction X. The heat dissipation component 3 includes an opening 31 that extends through the heat-conducting component 11 along the second direction X. The opening 31 is aligned with the heat-conducting component 11 along the second direction X, and the pulling part 122 extends through the opening 31 to the outside of the heat dissipation component 3.

[0050] In this embodiment, the connection between the connecting part 121 and the heat-conducting component 11 can be achieved through bonding, snap-fit ​​connection, threaded connection, etc. This can be adjusted according to the structure of the functional component 12. When the user pulls the pulling part 122 along the second direction X, it can cause the heat-conducting component 11 to move or deform, causing at least a portion of the heat-conducting component 11 to separate from the heat dissipation component 3 and the heat-generating component 2.

[0051] In this embodiment, the portion of the pull part 122 that passes through the opening 31 and is located outside the heat dissipation assembly 3 may have a pull ring, a handle, or a raised button, making it convenient for the user to pinch or press.

[0052] For example, functional component 12 can be a long rod-shaped part. One end of it is machined with a threaded hole or a buckle, so that it can be fixed to the heat-conducting component 11 as a connecting part 121; the other end of the rod can be used as a pulling part 122 for pulling.

[0053] In another example, the functional component 12 can also be a T-shaped or L-shaped pull rod, with the horizontal part of the pull rod serving as the connecting part 121 and connecting to both sides of the heat-conducting component 11; the vertical part serving as the pulling part 122 is used to perform the pulling action.

[0054] In this embodiment, the opening 31 extends through the heat dissipation component 3. The opening 31 can be a round hole, a square hole, or a D-shaped hole. The shape of the opening 31 can match the cross-sectional shape of the pulling part 122.

[0055] In the electronic device of this application embodiment, since the connecting part 121 and the pulling part 122 are arranged along the second direction X, the force of the pulling part 122 can be transmitted to the connecting part 121 along the second direction X. Therefore, the pulling part 122 can drive the connecting part 121 to move along the second direction X. Since the connecting part 121 is connected to the heat-conducting component 11, the connecting part 121 can transmit the force of the pulling part 122 to the heat-conducting component 11, so that the heat-conducting component 11 can move along the second direction X, thereby switching the heat-conducting component 11 from the first connection state to the second connection state.

[0056] Since the heat dissipation assembly 3 includes an opening 31 extending along the second direction X, the pulling part 122 can pass through the opening 31 along the second direction X to extend out of the heat dissipation assembly 3. The opening 31 and the heat conduction assembly 11 are aligned along the second direction X, so that the pulling part 122 will not interfere with the outer casing during its movement along the second direction X, reducing the possibility of jamming during the movement of the pulling part 122. The pulling part 122 extends out of the heat dissipation assembly 3 through the opening 31, allowing the user to operate the pulling part 122 from the outside of the heat dissipation assembly 3, thereby switching the state of the heat conduction assembly 11, which is convenient for use.

[0057] In some possible embodiments of this application, reference is made to Figure 2 The electronic device also includes a dust cover 4, which is detachably mounted on the heat dissipation assembly 3 and covers the opening 31; the pulling part 122 is housed in the cavity formed by the dust cover 4 and the heat dissipation assembly 3.

[0058] In this embodiment, the dust cover 4 is detachably mounted on the heat dissipation assembly 3. The dust cover 4 can be installed on the heat dissipation assembly 3 by means of clips, screws, magnets, etc., so as to facilitate disassembly and installation. For example, the edge of the dust cover 4 may have elastic clips, and the outer surface of the heat dissipation assembly 3 is provided with a groove corresponding to the elastic clips. The elastic clips are snapped into the grooves to realize the detachable connection of the dust cover 4 to the heat dissipation assembly 3.

[0059] In this embodiment, when the dust cover 4 is installed on the heat dissipation assembly 3, the position of the dust cover 4 can cover all parts of the opening 31 on the heat dissipation device to form an isolation layer on the outside of the opening 31. The shape and size of the dust cover 4 are designed to be sufficient to cover all parts of the opening 31. A sealing ring or sealing gasket can be provided in the area where the dust cover 4 and the heat dissipation assembly 3 are connected to improve the dustproof sealing effect.

[0060] In this embodiment, when the dust cover 4 is installed on the heat dissipation assembly 3, a cavity can be formed between the dust cover 4 and the heat dissipation assembly 3, and the pulling part 122 is housed and protected inside the cavity. The interior of the dust cover 4 may have a recessed structure, which can form a space for accommodating the pulling part 122 when the dust cover 4 is connected to the surface of the heat dissipation assembly 3.

[0061] In the electronic device of this application embodiment, the dust cover 4 is disposed on the heat dissipation assembly 3 and can cover the opening 31 to prevent external dust and debris from entering the heat dissipation assembly 3 through the opening 31, thereby improving the sealing effect. At the same time, the pulling part 122 of the functional component 12 is housed in the cavity formed by the dust cover 4 and the heat dissipation assembly 3, which can reduce the damage or misoperation of the pulling part 122 due to accidental collision.

[0062] When it is necessary to switch the state of the heat conduction component 11, the operator can first remove the dust cover 4. After removing the dust cover 4, the operator can pull the pull part 122 to perform the operation of switching the state of the heat conduction component 11.

[0063] This application provides a heat-conducting device 1, referring to... Figure 3 , Figure 4 and Figure 5 The heat-conducting device 1 includes a heat-conducting component 11 and a functional component 12. The heat-conducting component 11 has a first connection area 111 and a second connection area 114 along a first direction Z. The first connection area 111 is used to connect to the heat dissipation component 3, and the second connection area 114 is used to connect to the heat-generating component 2. The functional component 12 is connected to the heat-conducting component 11 and can move relative to the heat-conducting component 11 along a second direction X to change the connection state of the heat-conducting component 11. The first direction Z and the second direction X have an angle.

[0064] In this embodiment, the heat-conducting component 11 can be a heat-conducting pad adapted to the shape of the heat-generating component 2. One side of the heat-conducting component 11 has a first connecting area 111, and the other side has a second connecting area 114. That is, the first connecting area 111 and the second connecting area 114 are located on opposite sides of the heat-conducting component 11. The areas of the first connecting area 111 and the second connecting area 114 can be the same or different. For example, the first connecting area 111 is used to connect the heat dissipation component 3, and the first connecting area 111 can be the area where the heat-conducting component 11 contacts the heat dissipation component 3; the second connecting area 114 is used to connect the heat-generating component 2, and the second connecting area 114 can also be the area where the heat-conducting component 11 contacts the heat-generating component 2.

[0065] In this embodiment, the first connection area 111 is used to connect the heat dissipation component 3, and the second connection area 114 is used to connect the heat generation component 2. The connection can be made by external pressure to make the connection area fit tightly with the corresponding component; or by using thermally conductive adhesive or pressure-sensitive adhesive for fixing; or by using a structure such as a buckle or a groove for physical connection.

[0066] In this embodiment, the connection state can refer to the connection state formed by different connection methods. For example, a change in the connection state can be from a compressed state to a released state; or from an adhesive state to a separated state; or from a locked state to an unlocked state. For example, a change in the connection state of the heat-conducting component 11 can be a reduction in the area of ​​the connection.

[0067] It should be added that, through experimental testing, the presence of the functional component 12 in the heat-conducting component 11 provided in this application embodiment does not affect the heat conduction efficiency of the heat-conducting component 11. That is, the heat conduction efficiency of the heat-conducting component 11 with the functional component 12 is consistent with that of the heat-conducting component 11 without the functional component 12.

[0068] In the heat conduction device 1 of this application embodiment, since the first connection area 111 of the heat conduction component 11 is connected to the heat dissipation component 3 and the second connection area 114 is connected to the heat generation component 2, and the heat conduction component 11 has a first connection area 111 and a second connection area 114 along the first direction Z, that is, the heat dissipation component 3 and the heat generation component 2 are connected to the heat conduction component 11 along the first direction Z, the heat conduction component 11 can transfer the heat generated by the heat generation component 2 to the heat dissipation component 3 to achieve heat dissipation. Functional component 12 is connected to heat-conducting component 11. Functional component 12 can move relative to heat-conducting component 11 along the second direction X to change the connection state of heat-conducting component 11. Since heat dissipation component 3 and heat generation component 2 are connected to heat-conducting component 11 along the first direction Z, and there is an angle between the second direction X and the first direction Z, the movement of functional component 12 along the second direction X can provide heat-conducting component 11 with a force at an angle to the first direction Z, thereby changing the connection state of heat-conducting component 11. Therefore, by controlling the movement of functional component 12, the connection state of heat-conducting component 11 can be controlled, reducing the possibility of damage to the internal structure due to excessive force during separation, facilitating the control of changes in the connection state of heat-conducting component 11, and reducing damage to the structure of heat-conducting device 1.

[0069] In some possible embodiments of this application, the connection area of ​​the first connection region 111 is smaller than the connection area of ​​the second connection region 114.

[0070] In this embodiment, the second connection area 114 is used to connect the heat-generating component 2. The heat-generating component 2 (such as a CPU or GPU chip) is typically a planar heat source, and the heat it generates is dissipated relatively evenly across the entire surface. Sufficient contact between the second connection area 114 and the heat-generating component 2 can improve the heat transfer effect and reduce the occurrence of localized hot spots and heat dissipation dead zones.

[0071] Based on this, the second connection area 114 of the heat conduction component 11 connecting to the heat generation component 2 can be a continuous plane and in full contact with the heat generation component 2; while the first connection area 111 can be a discontinuous surface, adapted to the structural shape of the heat dissipation component 3.

[0072] In the heat conduction device 1 of this application embodiment, the first connection area 111 is used to connect the heat dissipation component 3, and the second connection area 114 is used to connect the heat generation component 2. The direction of heat transfer on the heat conduction component 11 is from the second connection area 114 to the first connection area 111. Since the connection area of ​​the first connection area 111 is smaller than the connection area of ​​the second connection area 114, heat will naturally converge when flowing from a large cross section to a small cross section, thereby helping to improve the flow of heat to the heat dissipation component 3 and improve the heat transfer and heat dissipation effect.

[0073] In some possible embodiments of this application, functional component 12 is connected to the first connection area 111 and / or the second connection area 114.

[0074] In this embodiment of the application, based on the structural features of the functional component 12 and the heat-conducting component 11, there can be multiple functional components 12. Multiple functional components 12 can all be disposed in the first connection area 111, or multiple functional components 12 can all be disposed in the second connection area, or multiple functional components 12 can be disposed in the first connection area 111 and the second connection area 114 respectively.

[0075] For example, there may be two functional components 12, which are respectively connected to the first connection area 111 and the second connection area 114; or there may be one functional component 12, which can be connected to either the first connection area 111 or the second connection area 114.

[0076] When the functional component 12 is disposed in the first connection area 111, the functional component 12 acts on the first connection area 111, and the movement of the functional component 12 along the second direction X can change the connection state of the first connection area 111, thereby facilitating the separation of the first connection area 111 and the heat dissipation component 3; when the functional component 12 is disposed in the second connection area 114, the functional component 12 acts on the second connection area 114, and the movement of the functional component 12 along the second direction X can change the connection state of the second connection area 114, thereby facilitating the separation of the second connection area 114 and the heat generation component 2; when the functional component 12 is disposed in both the first connection area 111 and the second connection area 114, the functional component 12 acts on both the first connection area 111 and the second connection area 114, and the movement of the functional component 12 along the second direction X can change the connection state of both the first connection area 111 and the second connection area 114, thereby facilitating the separation of the heat conduction component 11, the heat dissipation component 3 and the heat generation component 2.

[0077] The heat conduction device 1 of this application embodiment has a first connection area 111 for connecting the heat dissipation component 3 and a second connection area 114 for connecting the heat generation component 2. By connecting the functional component 12 to the first connection area 111 and / or the second connection area 114, the connection state of the heat conduction component 11 to the heat dissipation component 3 and the heat generation component 2 can be controlled, thereby improving the flexibility of control.

[0078] In some possible embodiments of this application, reference is made to Figure 3 , Figure 4 and Figure 5 The functional component 12 includes a connecting part 121 and a pulling part 122. The connecting part 121 and the pulling part 122 are arranged along the second direction X. The connecting part 121 is connected to the heat-conducting component 11. The pulling part 122 can drive the connecting part 121 to move along the second direction X.

[0079] In this embodiment, the connecting portion 121 and the pulling portion 122 can be either an integral structure or separate structures. When the connecting portion 121 and the pulling portion 122 are an integral structure, the connecting portion 121 is connected to the heat-conducting component 11, and the connecting portion 121 and the pulling portion 122 extend relative to the heat-conducting component 11 along the second direction X. When the connecting portion 121 and the pulling portion 122 are separate structures, the connecting portion 121 and the pulling portion 122 are connected end-to-end along the second direction X, so that force is transmitted along the second direction X.

[0080] In the heat conduction device 1 of this application embodiment, since the connecting part 121 is connected to the heat conduction component 11, and the connecting part 121 and the pulling part 122 are arranged along the first direction Z, pulling the pulling part 122 along the second direction X can drive the pulling part 122 to have a movement tendency along the second direction X, so that the connecting part 121 applies a force in the second direction X to the heat conduction component 11, and the heat conduction component 11 changes its connection state under the action of the force.

[0081] In some possible embodiments of this application, reference is made to Figure 3 , Figure 4 and Figure 5 The connecting part 121 has a ring structure and is arranged around the edge of the heat-conducting component 11; the heat-conducting component 11 is provided with a first snap-fit ​​structure 112, and the functional component 12 is provided with a second snap-fit ​​structure 123 that is adapted to and connected to the first snap-fit ​​structure 112.

[0082] In one example, the connecting portion 121 can be an annular wall structure, resembling a frame, fitted onto the peripheral outer wall of the heat-conducting component 11. In another example, the connecting portion 121 can be located on the side of the heat-conducting component 11 used to connect the heat-generating component 2 or the heat-dissipating component 3, that is, the connecting portion 121 is connected to the edge of the heat-conducting component 11 having a first connecting area 111, or the connecting portion 121 is connected to the edge of the heat-conducting component 11 having a second connecting area 114.

[0083] For example, the functional component 12 can be made of plastic, and the connecting part 121 and the pulling part 122 are an integral structure. The first end of the functional component 12 is a ring structure, which is the connecting part 121. When the first end is connected to the heat-conducting component 11, the second end of the functional component 12 is a sheet-like structure extending along the second direction X, which is the pulling part 122. In order to facilitate the operator to pull, the end of the second end can be set as an arc-shaped structure.

[0084] In this embodiment, the heat-conducting component 11 is connected to the heat-generating component 2 and the heat-dissipating component 3 by bonding. The connecting part 121 has a ring structure and is arranged around the edge of the heat-conducting component 11. By pulling the pulling part 122, the connecting part 121 can apply shear force to the heat-conducting component 11 around the edge of the heat-conducting component 11 to weaken the bonding strength between the heat-conducting component 11 and the heat-generating component 2 and the heat-dissipating component 3.

[0085] In this embodiment, the first snap-fit ​​structure 112 and the second snap-fit ​​structure 123 are adapted to each other to form a snap-fit ​​area, thereby increasing the contact area between the connecting part 121 and the heat-conducting component 11 and improving the effect of the connecting part 121 in transmitting force to the heat-conducting component 11. This application does not limit the shape of the first snap-fit ​​structure 112 and the second snap-fit ​​structure 123.

[0086] In the embodiments of this application, reference is made to Figure 3 , Figure 4 and Figure 5 The first snap-fit ​​structure 112 extends along the third direction Y, which is perpendicular to the second direction X and is parallel to the extension direction of the first connection area 111 and / or the second connection area 114.

[0087] In this embodiment, since there is an angle between the first direction Z and the second direction X, this application does not limit the angle between the first direction Z and the second direction X. The angle between the first direction Z and the second direction X can be 90 degrees. In one embodiment, the first direction Z, the second direction X, and the third direction Y are perpendicular to each other. This can be understood as the first direction Z being the thickness direction of the heat-conducting component 11, the second direction X being the width direction of the heat-conducting component 11, and the third direction Y being the length direction of the heat-conducting component 11.

[0088] In the embodiments of this application, reference is made to Figure 4 There are multiple first snap-fit ​​structures 112, and the multiple first snap-fit ​​structures 112 are arranged along the second direction X, which can form a sawtooth-like structure on the connecting part 121 along the second direction X.

[0089] In this embodiment of the heat-conducting device 1, the connecting part 121 is an annular structure, which surrounds the edge of the heat-conducting component 11. The annular connecting structure can uniformly apply and receive force from all sides of the heat-conducting component 11, making the heat-conducting component 11 uniformly stressed, thereby improving the stability and effectiveness of the heat-conducting component 11 in changing its state. Since the heat-conducting component is provided with a first snap-fit ​​structure 112, and the functional component 12 is provided with a second snap-fit ​​structure 123 adapted to and connected to the first snap-fit ​​structure 112, the cooperation of the first snap-fit ​​structure 112 and the second snap-fit ​​structure 123 can improve the force transmission effect and reduce the amount of force required when pulling the pulling part 122.

[0090] In some possible embodiments of this application, reference is made to Figure 4 The heat-conducting component 11 has a mounting groove 113 formed by recessing along the first direction Z. The mounting groove 113 is adapted to the shape of the connecting part 121, and the connecting part 121 is disposed in the mounting groove 113.

[0091] In this embodiment, the mounting groove 113 is not a through hole, but a blind groove, such as a square or circular recessed groove on one side surface of the heat-conducting component 11. The depth of the mounting groove 113 can be adjusted according to the thickness of the connecting part 121, and the depth of the mounting groove 113 can be less than the thickness of the heat-conducting component 11 itself.

[0092] For example, refer to Figure 4 The heat-conducting component 11 can be a square heat-conducting pad. The edge of the side surface of the heat-conducting pad connected to the heat dissipation component 3 is recessed along the first direction Z to form a mounting groove 113. The connecting part 121 of the functional component 12 is a rectangular ring structure that matches the shape of the mounting groove 113. The mounting part has multiple first snap-fit ​​structures 112 on two sides extending along the second direction X. The multiple first snap-fit ​​structures 112 are evenly distributed. The heat-conducting pad has multiple second snap-fit ​​structures 123 at the positions corresponding to the multiple snap-fit ​​structures. The multiple first snap-fit ​​structures 112 and the multiple second snap-fit ​​structures 123 snap-fit ​​each other.

[0093] Based on this, the pulling part 122 can extend from the opening 31 of the heat dissipation component 3. If the operator needs to separate the heat conduction component 11 from the heat dissipation component 3 or the heat generation component 2, the dust cover 4 can be opened and the pulling part 122 can be pulled to move the pulling part 122 along the second direction X. The pulling part 122 drives the connecting part 121 to move. The connecting part 121 applies shear force to the heat conduction component 11, so that the connection strength between the heat conduction component 11 and the heat dissipation component 3 or the heat generation component 2 gradually decreases, thereby facilitating disassembly and reducing damage caused by excessive force during separation.

[0094] In the heat conduction device 1 of this application embodiment, since the connecting part 121 is disposed in the mounting groove 113, the connecting part 121 forms a tight fit with the side wall and bottom wall of the groove, which increases the connection area between the connecting part 121 and the heat conduction component 11. Therefore, it can enhance the rigidity and stability of the connection between the functional component 12 and the heat conduction component 11, reduce the situation where the connecting part 121 is subjected to force in the second direction X and the heat conduction component 11 may separate or loosen, and improve the stability of the force transmission process.

[0095] The sequence numbers of the embodiments in this application are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments. The above are merely preferred embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made based on the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A heat-conducting device, characterized in that, include: A heat-conducting component, wherein the heat-conducting component has a first connection area and a second connection area along a first direction, the first connection area being used to connect a heat dissipation component, and the second connection area being used to connect a heat-generating component; A functional component, which is connected to the heat-conducting component, and the functional component is movable relative to the heat-conducting component in a second direction to change the connection state of the heat-conducting component; The first direction and the second direction form an angle.

2. The heat-conducting device according to claim 1, characterized in that, The connection area of ​​the first connection region is smaller than the connection area of ​​the second connection region.

3. The heat-conducting device according to claim 1, characterized in that, The functional component is connected to the first connection area and / or the second connection area.

4. The heat-conducting device according to claim 1, characterized in that, The functional component includes a connecting part and a pulling part, which are arranged along the second direction. The connecting part is connected to the heat-conducting component, and the pulling part can drive the connecting part to move along the second direction.

5. The heat-conducting device according to claim 4, characterized in that, The connecting part is a ring structure, and the connecting part is arranged around the edge of the heat-conducting component; the heat-conducting component is provided with a first snap-fit ​​structure, and the functional component is provided with a second snap-fit ​​structure that is adapted to and connected to the first snap-fit ​​structure.

6. The heat-conducting device according to claim 5, characterized in that, The heat-conducting component has a mounting groove formed recessed along the first direction, the mounting groove being adapted to the shape of the connecting portion, and the connecting portion being disposed within the mounting groove.

7. An electronic device, characterized in that, include: Heating components; A heat dissipation component is provided correspondingly to the heat generation component; A heat-conducting component is disposed between the heat-generating component and the heat-dissipating component. The heat-conducting component has a first connection area and a second connection area along a first direction. The first connection area is connected to the heat-dissipating component, and the second connection area is connected to the heat-generating component. A functional component is connected to the heat-conducting component, and the functional component is movable relative to the heat-conducting component along a second direction to switch the heat-conducting component from a first connection state to a second connection state; the connection strength of the heat-conducting component in the first connection state is greater than the connection strength in the second connection state; the first direction and the second direction have an angle.

8. The electronic device according to claim 7, characterized in that, The heat dissipation component and the heat generation component are connected in sequence through the heat conduction component. When switching from the first connection state to the second connection state, the functional component drives the heat conduction component to move, which can cause at least a partial failure of the first connection area and the second connection area of ​​the heat conduction component.

9. The electronic device according to claim 7, characterized in that, The functional component includes a connecting part and a pulling part, which are arranged along the second direction. The connecting part is connected to the heat-conducting component, and the pulling part can drive the connecting part to move along the second direction. The heat dissipation component includes an opening that extends through the second direction. The opening is aligned with the heat-conducting component along the second direction, and the pulling part extends through the opening to the outside of the heat dissipation component.

10. The electronic device according to claim 9, characterized in that, It also includes a dust cover, which is detachably mounted on the heat dissipation assembly and covers the opening; the pulling part is housed in the cavity formed by the dust cover and the heat dissipation assembly.

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