A heat dissipation assembly and electronic device

Abstract

The present disclosure provides a heat dissipation assembly and an electronic device, which can include: an air outlet piece, a first heat conduction piece and a second heat conduction piece, the air outlet piece has an air outlet; the first heat conduction piece is distributed along a first direction with the air outlet piece and opposite to the air outlet, at least for guiding the air flow of the air outlet; the second heat conduction piece is distributed along a second direction with the first heat conduction piece, the second direction and the first direction satisfy the angle condition, part of the second heat conduction piece is stacked with the first heat conduction piece, for guiding the heat of the target device to the first heat conduction piece, the orthographic projection of the second heat conduction piece along the second direction and the orthographic projection of the air outlet piece along the second direction do not satisfy the overlap condition.

Description

Technical Field

[0001] This disclosure relates to the field of electronic equipment technology, and in particular to a heat dissipation component and electronic equipment. Background Technology

[0002] Electronic devices are equipped with fans to accelerate the flow of gas within them.

[0003] In related technologies, the fan is partially covered by heat pipes, which means that the heat pipes need to be removed first when disassembling the fan, making the fan disassembly process complicated and time-consuming. Utility Model Content

[0004] This disclosure provides a heat dissipation component and an electronic device, the technical solution of which is as follows:

[0005] In a first aspect, this disclosure provides a heat dissipation component, which may include: an air outlet, a first heat-conducting component, and a second heat-conducting component. The air outlet has an air outlet. The first heat-conducting component and the air outlet are distributed along a first direction and are opposite to the air outlet to guide the airflow at least through the air outlet. The second heat-conducting component and the first heat-conducting component are distributed along a second direction, the second direction and the first direction satisfying an angle condition. A portion of the second heat-conducting component is stacked with the first heat-conducting component to guide the heat of the target device to the first heat-conducting component. The orthographic projection of the second heat-conducting component along the second direction and the orthographic projection of the air outlet component along the second direction do not satisfy an overlap condition.

[0006] In some embodiments, the air outlet includes: a first housing and a second housing, the first housing and the second housing being connected along a third direction opposite to the second direction to form an air cavity, and an air outlet communicating with the air cavity being formed between the first housing and the second housing, the first housing having a first thickness surface extending along the third direction at a position corresponding to the air outlet, the second housing having a second thickness surface extending along the third direction at a position corresponding to the air outlet, the second thickness surface being opposite to the first thickness surface, and at least one of them being provided with a concave-convex structure; the first heat-conducting member abutting the first thickness surface; the second heat-conducting member abutting the second thickness surface.

[0007] In some embodiments, the first thickness surface is provided with the concave-convex structure to form a stepped surface; the second thickness surface is an arcuate surface protruding from the stepped surface; wherein, when the second thickness surface of the second housing abuts against the second heat-conducting element, the second housing abuts against the surface of the first heat-conducting element near the second heat-conducting element.

[0008] In some embodiments, the air outlet component is provided with a connection hole, the connection direction of which is consistent with the second direction. The connection hole is used to allow a fastener to pass through the connection hole along the connection direction and connect with the target component.

[0009] In some embodiments, the first heat-conducting element includes: a first portion and a second portion, the first portion and the second portion being respectively opposite to the air outlet, and the first portion matching the contour of the first thickness surface and abutting against the first thickness surface, the second portion being away from the first thickness surface and the second thickness surface; the first portion being provided with a first flow channel, the first flow port of the first flow channel being opposite to the air outlet; the second portion being provided with a second flow channel, the second flow port of the second flow channel being opposite to the air outlet.

[0010] In some embodiments, the size of the first flow channel is larger than the size of the second flow channel.

[0011] In some embodiments, the first portion is provided with a plurality of first flow channels, which are distributed along a fourth direction that forms an angle with both the first direction and the second direction; the second portion is provided with a plurality of second flow channels, which are distributed along the fourth direction; the cross-sectional dimensions of the plurality of first flow channels are consistent and the cross-sectional dimensions of the plurality of second flow channels are consistent, or the cross-sectional dimensions of the plurality of first flow channels and the cross-sectional dimensions of the plurality of second flow channels gradually decrease along the fourth direction.

[0012] In some embodiments, the height of the first guide channel along the second direction is the same as the height of the second guide channel along the second direction.

[0013] Secondly, this disclosure provides an electronic device, which may include: a housing and a heat dissipation assembly, wherein the heat dissipation assembly is disposed within the housing, and the heat dissipation assembly includes: an air outlet, a first heat-conducting component, and a second heat-conducting component, wherein the air outlet has an air outlet; the first heat-conducting component and the air outlet are distributed along a first direction and are opposite to the air outlet, so as to at least guide the airflow at the air outlet; the second heat-conducting component and the first heat-conducting component are distributed along a second direction, wherein the second direction and the first direction satisfy an angle condition, a portion of the second heat-conducting component is stacked with the first heat-conducting component, and is used to guide the heat of the target device to the first heat-conducting component; wherein the orthographic projection of the second heat-conducting component along the second direction and the orthographic projection of the air outlet component along the second direction do not satisfy an overlap condition.

[0014] In some embodiments, the electronic device may further include: a fastener that passes through the air outlet in the second direction and is detachably connected to the housing.

[0015] The above description is only an overview of the technical solution of this disclosure. In order to better understand the technical means of this disclosure and to implement it in accordance with the contents of the specification, the preferred embodiments of this disclosure are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in this disclosure or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is an exploded structural diagram of the heat dissipation component provided in this disclosure;

[0018] Figure 2 This is a schematic diagram of the air outlet component of the heat dissipation assembly provided in this disclosure;

[0019] Figure 3 A schematic diagram of the structure of the first and second heat-conducting components of the heat dissipation assembly provided in this disclosure;

[0020] Figure 4 This is a schematic diagram of the structure of the first heat-conducting element of the heat dissipation assembly provided in this disclosure.

[0021] Explanation of reference numerals in the attached figures:

[0022] 10. Heat dissipation component; 11. Air outlet; 111. Air outlet; 112. First housing; 1121. First thickness surface; 113. Second housing; 1131. Second thickness surface; 114. Connecting hole; 12. First heat conduction component; 121. First end; 122. Second end; 123. First part; 1231. First airflow channel; 1232. First airflow port; 124. Second part; 1241. Second airflow channel; 1242. Second airflow port; 13. Second heat conduction component; 20. Fastener. Detailed Implementation

[0023] The embodiments of this disclosure will be further described in detail below with reference to the accompanying drawings and examples. The detailed description of the embodiments and the accompanying drawings are used to illustrate the principles of this disclosure by way of example, but should not be used to limit the scope of this disclosure. This disclosure can be implemented in many different forms and is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

[0024] These embodiments are provided to make the disclosure thorough and complete, and to fully express the scope of the disclosure to those skilled in the art. It should be noted that, unless otherwise specifically stated, the relative arrangement of components and steps, material composition, numerical expressions, and values ​​set forth in these embodiments should be interpreted as exemplary only and not as limiting.

[0025] It should be noted that, in the description of this disclosure, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicating orientation or positional relationship, are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0026] Furthermore, the terms "first," "second," and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different parts. "Vertical" is not strictly vertical, but within the permissible margin of error. "Parallel" is not strictly parallel, but within the permissible margin of error. Terms such as "including" or "contains" mean that the element preceding the word encompasses the element listed after the word, and do not exclude the possibility of encompassing other elements as well.

[0027] It should also be noted that, in the description of this disclosure, unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this disclosure depending on the specific circumstances. When a particular device is described as being located between a first device and a second device, an intermediary device may or may not be present between the particular device and the first or second device.

[0028] All terms used in this disclosure have the same meaning as understood by one of ordinary skill in the art to which this disclosure pertains, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant art, and not as idealized or highly formalized, unless expressly defined herein.

[0029] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, they should be considered part of the specification.

[0030] Electronic devices are equipped with fans to accelerate the flow of gas within them.

[0031] In related technologies, the fan is partially covered by heat pipes, which means that the heat pipes need to be removed first when disassembling the fan, making the fan disassembly process complicated and time-consuming.

[0032] The inventors of this disclosure have discovered that a heat dissipation component and an electronic device can be provided. The heat dissipation component can be disposed inside the casing of the electronic device. The heat dissipation component may include an air outlet, a first heat-conducting component (such as fins), and a second heat-conducting component (such as a heat pipe). The first heat-conducting component and the air outlet are distributed along a first direction, and the second heat-conducting component and the first heat-conducting component are stacked along a second direction at an angle to the first direction. The orthographic projection of the second heat-conducting component in the second direction does not overlap with the orthographic projection of the air outlet in the same direction. The second heat-conducting component is used to transfer the heat of the target device (such as the motherboard, memory card, etc.) inside the casing to the first heat-conducting component. The first heat-conducting component is used to guide the airflow from the air outlet of the air outlet to flow along a preset path (for example, from the air outlet toward the casing), so that the heat received by itself is diffused with the airflow along the preset path, thereby achieving effective heat dissipation of the electronic device and reducing the internal temperature of the electronic device. In terms of structural layout, the orthographic projection of the second heat-conducting component in the second direction does not overlap with the orthographic projection of the air outlet component in the same direction. Therefore, without disassembling the second heat-conducting component, the air outlet component can be independently disassembled in a third direction opposite to the second direction, enabling convenient and quick maintenance and replacement, and the operation time is short.

[0033] First aspect

[0034] This disclosure provides a heat dissipation component 10, see [link to relevant documentation] Figures 1 to 4 As shown, the heat dissipation assembly 10 may include: an air outlet 11, a first heat conductor 12, and a second heat conductor 13. The air outlet 11 has an air outlet 111. The first heat conductor 12 and the air outlet 11 are distributed along a first direction and are opposite to the air outlet 111, so as to guide the airflow of the air outlet 111 at least. The second heat conductor 13 and the first heat conductor 12 are distributed along a second direction, and the second direction and the first direction satisfy an angle condition. A portion of the second heat conductor 13 is stacked with the first heat conductor 12 to guide the heat of the target device to the first heat conductor 12. The orthographic projection of the second heat conductor 13 along the second direction and the orthographic projection of the air outlet 11 along the second direction do not satisfy an overlap condition.

[0035] The air outlet 11 can be a fan with blades that move under the rotation of the motor shaft to generate airflow, and the airflow can be sent out through the air outlet 111 of the air outlet 11; the air outlet 11 can also be configured in other ways.

[0036] The first heat-conducting element 12 can be along the first direction (e.g., the air outlet element 11) with the first heat-conducting element 11. Figure 1 As shown in the X direction, the air outlet 111 is located at one end of the air outlet 11 along the first direction and is opposite to the first heat-conducting element 12. Thus, the airflow from the air outlet 11 through its outlet 111 can flow to a designated location (such as the casing of an electronic device) under the guidance of the first heat-conducting element 12, so that the heat around the first heat-conducting element 12 and itself can be dissipated along with the guided airflow to the designated location; for example, see... Figure 1 As shown, the first heat-conducting element 12 extends along a first direction with two ends, namely a first end 121 and a second end 122. The second end 122 is opposite to the air outlet 111, and the first heat-conducting element 12 can guide the airflow from the air outlet 111 from the second end 122 to the first end 121 in a direction opposite to the first direction, and send the heat to the outer shell adjacent to the first end 121 for dissipation. The first heat-conducting element 12 can be a structure made of a heat-conducting material (such as metal) with a flow channel (such as the first flow channel 1231 and the second flow channel 1241 mentioned below), and the airflow from the air outlet 111 can be guided through the flow channel.

[0037] The second heat-conducting element 13, a portion of which can be aligned with the first heat-conducting element 12 along a second direction (e.g., Figure 1 The second heat-conducting element 12 (as shown in the Y direction) is stacked and at least partially adjacent to the target device (such as the motherboard or storage device inside the casing of an electronic device) to conduct heat from the target device to itself and ultimately to the first heat-conducting element 12, which is stacked with the second heat-conducting element 13, and then dissipated through the first heat-conducting element 12. The second direction has an angle with the first direction; for example, see [reference needed]. Figure 1 As shown, the second direction and the first direction are perpendicular to each other, forming an angle of 90 degrees. The second heat-conducting element 13 can be a heat pipe structure made of a heat-conducting material (such as metal), with one end of the heat pipe positioned close to the target device and the other end stacked with the first heat-conducting element 12 along the second direction. The orthographic projection of the second heat-conducting element 13 along the second direction does not overlap with the orthographic projection of the air outlet element 11 along the second direction, so that the air outlet element 11 is positioned in a third direction opposite to the second direction (such as...). Figure 2 As shown in the Z direction, there is no obstruction from the second heat-conducting element 13, so it can move along the third direction to achieve the purpose of being disassembled.

[0038] In some examples, an electronic device is a laptop computer, which includes a display end with a screen and a system end with input keys. The system end may include a housing and a heat dissipation assembly 10. The housing is a hollow cuboid structure, and the heat dissipation assembly 10 is disposed inside the housing. See also Figures 1 to 4As shown, the heat dissipation assembly 10 may include: an air outlet 11, a first heat-conducting element 12, and a second heat-conducting element 13. Both the first heat-conducting element 12 and the air outlet 11 are connected to the inner bottom wall of the housing and distributed along the width direction of the housing. The end of the first heat-conducting element 12 away from the air outlet 11 is opposite to the inner wall of the housing at its height (or thickness). The air outlet 11 has an air outlet 111, which corresponds between the first heat-conducting element 12 and the air outlet 11 and corresponds to the inner wall of the housing at its height (or thickness). One end of the second heat-conducting element 13 is stacked and connected to the side of the first heat-conducting element 12 facing away from the inner bottom wall, and the other end is disposed near the motherboard (i.e., the target device) inside the system. The orthographic projection of the second heat-conducting element 13 along the height direction of the housing and the orthographic projection of the air outlet 11 along the height direction of the housing do not overlap, allowing the air outlet 11 to move relative to the second heat-conducting element 13 away from the inner bottom wall along the height direction of the housing, thus enabling the air outlet 11 to be disassembled without removing the second heat-conducting element 13. The second heat-conducting element 13 can guide the heat from the motherboard to the first heat-conducting element 12. Then, when the airflow from the air outlet 111 is guided by the first heat-conducting element 12, the heat conducted to the first heat-conducting element 12 can be transported to the inner wall of the housing by the guided airflow for dissipation, thereby reducing the heat inside the electronic device.

[0039] In this embodiment, the heat dissipation component 10 can be disposed inside the casing of the electronic device. The heat dissipation component 10 may include an air outlet 11, a first heat conductor 12, and a second heat conductor 13. The second heat conductor 13 is used to guide the heat of the target device inside the casing to the first heat conductor 12. The first heat conductor 12 is used to guide the airflow sent out from the air outlet 111 of the air outlet 11 along a preset path (such as from the air outlet 111 to the casing), and to allow the heat conducted to the first heat conductor 12 itself to be dissipated along the preset path of the airflow of the first heat conductor 12, so as to reduce the internal temperature of the electronic device. Wherein, the orthographic projection of the second heat conductor 13 along the second direction and the orthographic projection of the air outlet 11 along the second direction do not meet the overlap condition. Thus, the air outlet 11 can be disassembled along a third direction opposite to the second direction without disassembling the second heat conductor 13 (such as a heat pipe), thereby realizing convenient disassembly of the air outlet 11 and saving time.

[0040] In some embodiments, see Figures 1 to 4As shown, the air outlet 11 may include: a first housing 112 and a second housing 113, the first housing 112 and the second housing 113 are connected along a third direction to form an air cavity, and an air outlet 111 connecting the air cavity is formed between the first housing 112 and the second housing 113. The first housing 112 has a first thickness surface 1121 extending along a third direction at the position corresponding to the air outlet 111, and the second housing 113 has a second thickness surface 1131 extending along a third direction at the position corresponding to the air outlet 111. The second thickness surface 1131 is opposite to the first thickness surface 1121, and at least one of them is provided with a concave-convex structure; a first heat-conducting element 12 abuts against the first thickness surface 1121; and a second heat-conducting element 13 abuts against the second thickness surface 1131.

[0041] The concave-convex structure can be a step-like structure with right angles, a serrated structure with acute angles, or other forms of concave-convex structure.

[0042] The first thickness surface 1121 and the second thickness surface 1131 are distributed along a third direction and are opposite to each other. The first heat-conducting element 12 abuts against the first thickness surface 1121; the second heat-conducting element 13 abuts against the second thickness surface 1131, so that the first heat-conducting element 12 and the air outlet element 11 abut against each other in the first direction for a more stable connection.

[0043] At least one of the first thickness surface 1121 and the second thickness surface 1131 is provided with a concave-convex structure so that after it abuts against the corresponding heat-conducting element (such as the first heat-conducting element 12, the second heat-conducting element 13, etc.), the first heat-conducting element 12 and the air outlet element 11 are in concave-convex cooperation abutting against each other in the first direction, so as to make it more stable.

[0044] In some embodiments, see Figures 1 to 4 As shown, the first thickness surface 1121 has a concave-convex structure, such as a convex part between two adjacent concave parts and a concave part between two adjacent convex parts to form a stepped surface; the second thickness surface 1131 is an arc-shaped surface protruding from the stepped surface; wherein, when the second thickness surface 1131 of the second housing 113 abuts against the second heat-conducting element 13, the second housing 113 abuts against the surface of the first heat-conducting element 12 near the second heat-conducting element 13.

[0045] In other words, compared to the stepped surface, the curved surface protrudes, such as... Figure 1 As shown, although the curved surface is below, it is partially exposed due to its protruding design.

[0046] In this embodiment, when the second thickness surface 1131 (i.e., the convex arc surface) of the second housing 113 abuts against the second heat-conducting element 13 (i.e., the concave arc surface), the surface of the second housing 113 near the first housing 112 also abuts against the surface of the first heat-conducting element 12 near the second heat-conducting element 13. In this way, the second housing 113 abuts against the first heat-conducting element 12 and the second heat-conducting element 13 at the same time, so that the positions of the air outlet 11, the first heat-conducting element 12, and the second heat-conducting element 13 are compact and relatively stable.

[0047] In some other embodiments, the first thickness surface 1121 is an arc-shaped surface, and the second thickness surface 1131 is provided with a concave-convex structure to form a stepped surface; wherein, when the second thickness surface 1131 of the second housing 113 abuts against the second heat-conducting element 13, the second housing 113 abuts against the surface of the first heat-conducting element 12 near the second heat-conducting element 13.

[0048] Here, the stepped surface protrudes from the curved surface, so that when the second thickness surface 1131 of the second housing 113 abuts against the second heat conductor 13, the surface of the first heat conductor 12 near the second heat conductor 13 abuts against the second heat conductor 13.

[0049] In this embodiment, when the second thickness surface 1131 (the part with the stepped surface) of the second housing 113 abuts against the second heat-conducting element 13 (i.e., the part with the stepped surface design), the surface of the second housing 113 near the first housing 112 also abuts against the surface of the first heat-conducting element 12 near the second heat-conducting element 13. In this way, the second housing 113 abuts against the first heat-conducting element 12 and the second heat-conducting element 13 at the same time, so that the positions of the air outlet 11, the first heat-conducting element 12, and the second heat-conducting element 13 are compact and relatively stable.

[0050] In some embodiments, see Figure 1 and Figure 2 As shown, the air outlet 11 is provided with a connection hole 114. The connection direction of the connection hole 114 is consistent with the second direction. The connection hole 114 is used to allow the fastener 20 to pass through the connection hole 114 along the connection direction and connect with the target part.

[0051] Fastener 20 can be a screw, pin, or other structure; target part can be a reinforcement, rib, or other structural component inside an electronic device, or it can be the outer shell of an electronic device.

[0052] When the fastener 20 is a screw, it can be inserted through the connecting hole 114 in the second direction and connected to the target part by thread engagement; when the fastener 20 is a pin, it can be inserted through the connecting hole 114 in the second direction and connected to the hole on the target part by interference fit.

[0053] In this embodiment, the connection direction of the connecting hole 114 is consistent with the second direction, so that the fastener 20 can pass through the connecting hole 114 along the second direction and connect with the target part. In this way, through the cooperation of the connecting hole 114 and the fastener 20, the air outlet 11 is more firmly fixed to the target part. At the same time, when disassembling the air outlet 11, after disassembling the fastener 20, the air outlet 11 can be moved along the third direction, so that the fastener 20 and the air outlet 11 can be easily disassembled on the same side of the target part.

[0054] In some embodiments, see Figure 1 , Figure 3 and Figure 4 As shown, the first heat-conducting element 12 may include: a first part 123 and a second part 124, the first part 123 and the second part 124 being opposite to the air outlet 111 respectively, and the first part 123 matching the contour of the first thickness surface 1121 and abutting the first thickness surface 1121, the second part 124 being away from the first thickness surface 1121 and the second thickness surface 1131; the first part 123 is provided with a first flow channel 1231, the first flow port 1232 of the first flow channel 1231 being opposite to the air outlet 111; the second part 124 is provided with a second flow channel 1241, the second flow port 1242 of the second flow channel 1241 being opposite to the air outlet 111.

[0055] The first part 123 and the second part 124 are distributed along the length of the air outlet 111. The first part 123 is opposite to a portion of the air outlet 111 and abuts against the first thickness surface 1121. The second part 124 is opposite to a portion of the air outlet 111 and can abut against the air outlet component 11. The first guide channel 1231 and the second guide channel 1241 can be the same or different in terms of height, width and other dimensions.

[0056] In this embodiment, the first heat-conducting element 12 may include a first part 123 and a second part 124. Both the first part 123 and the second part 124 are opposite to the air outlet 111 of the air outlet 11. The first part 123 and the second part 124 are respectively provided with a first flow channel 1231 and a second flow channel 1241 opposite to the air outlet 111, so that the airflow sent from the air outlet 111 can be directed to different positions through the first flow channel 1231 and the second flow channel 1241, so as to further improve the heat dissipation efficiency inside the casing of the electronic device. In addition, the first part 123 matches the contour of the first thickness surface 1121 and abuts against the first thickness surface 1121. At the same time, the first part 123 can abut against the surface of the second housing 113 near the first housing 112, so that the relative position between the first heat-conducting element 12 and the air outlet 11 is more stable, thereby reducing the probability of relative friction between the first heat-conducting element 12 and the air outlet 11, which would shorten the life.

[0057] In some embodiments, see Figure 1 , Figure 3 and Figure 4 As shown, the size of the first flow channel 1231 is larger than the size of the second flow channel 1241. Thus, the first flow channel 1231 can allow for lower flow velocities and pressures, while the second flow channel 1241 can allow for higher flow velocities and pressures than the first flow channel 1231, allowing them to work together to control the airflow velocity and pressure. Furthermore, the flow velocity in the first flow channel 1231 is lower than that in the second flow channel 1241, resulting in less noise generated by the first flow channel 1231 than by the second flow channel 1241. Therefore, the first flow channel 1231 can be positioned further away from the user, while the second flow channel 1241 can be positioned relatively closer to the user, reducing noise interference to the user.

[0058] The first flow channel 1231 can be larger in its length direction than the second flow channel 1241 in its length direction, so that the area of ​​the first part 123 is larger, thus having a larger heat dissipation area and promoting heat dissipation. For example, if the length of the first flow channel 1231 in its length direction is twice the length of the second flow channel 1241 in its length direction, it can not only make the area of ​​the first part 123 larger, thus having a larger heat dissipation area and promoting heat dissipation, but also achieve a balance between the increased flow resistance and the increased heat dissipation area.

[0059] In some embodiments, see Figure 1 , Figure 3 and Figure 4 As shown, the first part 123 is provided with a plurality of first flow guiding channels 1231, which are distributed along a fourth direction that forms an angle with both the first and second directions; the second part 124 is provided with a plurality of second flow guiding channels 1241, which are distributed along the fourth direction; the cross-sectional dimensions of the plurality of first flow guiding channels 1231 are the same and the cross-sectional dimensions of the plurality of second flow guiding channels 1241 are the same, or the cross-sectional dimensions of the plurality of first flow guiding channels 1231 and the cross-sectional dimensions of the plurality of second flow guiding channels 1241 gradually decrease along the fourth direction.

[0060] The fourth direction can be, for example, Figure 1 , Figure 3 and Figure 4 The W direction is shown.

[0061] like Figure 1 , Figure 3 and Figure 4As shown, the cross-sectional dimensions of the multiple first flow channels 1231 are the same and the cross-sectional dimensions of the multiple second flow channels 1241 are the same. At the same time, the interface dimension of the first flow channel 1231 is larger than the cross-sectional dimension of the second flow channel 1241.

[0062] In this embodiment, the plurality of first flow channels 1231 and the plurality of second flow channels 1241 can be configured in at least two ways: one is that the cross-sectional dimensions of the plurality of first flow channels 1231 and the cross-sectional dimensions of the plurality of second flow channels 1241 are the same; the other is that the cross-sectional dimensions of the plurality of first flow channels 1231 and the cross-sectional dimensions of the plurality of second flow channels 1241 gradually decrease along the fourth direction, allowing for flexible selection of the configuration. Furthermore, when the cross-sectional dimensions of the plurality of first flow channels 1231 and the cross-sectional dimensions of the plurality of second flow channels 1241 are the same, the manufacturing parameters of the plurality of first flow channels 1231 and the plurality of second flow channels 1241 are the same, facilitating manufacturing; when the cross-sectional dimensions of the plurality of first flow channels 1231 and the plurality of second flow channels 1241 gradually decrease along the fourth direction, the plurality of first flow channels 1231 and the plurality of second flow channels 1241 have a gradually decreasing visual effect along the fourth direction, thus meeting market design requirements for appearance.

[0063] In some embodiments, see Figure 1 , Figure 3 and Figure 4 As shown, the height of the first flow channel 1231 along the second direction is the same as the height of the second flow channel 1241 along the second direction. That is to say, the height (or thickness) of the first heat-conducting element 12 at different positions along the second direction is consistent, and the outer contour is more regular, so as to facilitate the setting of surrounding structural components.

[0064] Second aspect

[0065] This disclosure provides an electronic device, which may include a housing and a heat dissipation assembly 10. The heat dissipation assembly 10 is disposed inside the housing and may further include an air outlet 11, a first heat conductor 12, and a second heat conductor 13. The air outlet 11 has an air outlet 111. The first heat conductor 12 is distributed along a first direction with the air outlet 11 and is opposite to the air outlet 111 to guide the airflow at least through the air outlet 111. The second heat conductor 13 is distributed along a second direction with the first heat conductor 12. The second direction and the first direction satisfy an angle condition. A portion of the second heat conductor 13 is stacked with the first heat conductor 12 to guide the heat of the target device to the first heat conductor 12. The orthographic projection of the second heat conductor 13 along the second direction and the orthographic projection of the air outlet 11 along the second direction do not satisfy an overlap condition.

[0066] Electronic devices, such as laptops, servers, and speakers.

[0067] In this embodiment, a heat dissipation assembly 10 is provided inside the casing of the electronic device. The heat dissipation assembly 10 may include an air outlet 11, a first heat conductor 12, and a second heat conductor 13. The second heat conductor 13 is used to guide the heat of the target device inside the casing (heat generated during the operation of the target device, such as the motherboard) to the first heat conductor 12. The first heat conductor 12 is used to guide the airflow sent out from the air outlet 111 of the air outlet 11 along a preset path (such as from the air outlet 111 to the casing), and to allow the heat conducted to the first heat conductor 12 itself to be dissipated along the preset path of the airflow of the first heat conductor 12, so as to reduce the internal temperature of the electronic device. Wherein, the orthographic projection of the second heat conductor 13 along the second direction and the orthographic projection of the air outlet 11 along the second direction do not meet the overlap condition. Thus, the air outlet 11 can be disassembled along a third direction opposite to the second direction without disassembling the second heat conductor 13 (such as a heat pipe), thereby realizing convenient disassembly of the air outlet 11 and saving time.

[0068] In some embodiments, see Figure 1 and Figure 2 As shown, the electronic device may also include: a fastener 20 that passes through the air outlet 11 in a second direction and is detachably connected to the housing.

[0069] The fastener 20 can be a screw, pin, or other structure. If the fastener 20 is a screw, it can be inserted through the connecting hole 114 in the second direction and connected to the outer shell by threaded engagement, and can also be separated from the outer shell. If the fastener 20 is a pin, it can be inserted through the connecting hole 114 in the second direction and connected to the hole on the outer shell by interference fit, and can also be separated from the outer shell.

[0070] In this embodiment, the fastener 20 can be inserted through the connection hole 114 along the second direction and connected to the target component. In this way, the connection hole 114 and the fastener 20 are properly matched, so that the air outlet component 11 is more firmly fixed to the outer casing. At the same time, when disassembling the air outlet component 11, after disassembling the fastener 20, the air outlet component 11 can be moved along the third direction, so that the fastener 20 and the air outlet component 11 can be easily disassembled on the same side of the outer casing.

[0071] It should be noted that the heat dissipation components in the electronic devices provided in this disclosure are similar to those described in the above-described heat dissipation component embodiments, and have similar beneficial effects. For technical details not disclosed in the embodiments of the electronic devices in this disclosure, please refer to the description of the heat dissipation component embodiments in this disclosure for understanding; further details will not be repeated here.

[0072] The embodiments of this disclosure have now been described in detail. To avoid obscuring the concept of this disclosure, some details known in the art have not been described. Those skilled in the art can fully understand how to implement the technical solutions disclosed herein based on the above description.

[0073] While specific embodiments of this disclosure have been described in detail by way of examples, those skilled in the art should understand that the examples are for illustrative purposes only and not intended to limit the scope of this disclosure. Those skilled in the art should understand that modifications can be made to the above embodiments or equivalent substitutions can be made to some technical features without departing from the scope and spirit of this disclosure. In particular, as long as there is no structural conflict, the technical features mentioned in the various embodiments can be combined in any manner.

Claims

1. A heat dissipation component, characterized in that, include: Air outlet component, with an air outlet; A first heat-conducting element is distributed along a first direction with the air outlet element and is opposite to the air outlet, so as to at least guide the airflow of the air outlet; The second heat-conducting element is distributed along the second direction with the first heat-conducting element. The second direction and the first direction satisfy the angle condition. A portion of the second heat-conducting element is stacked with the first heat-conducting element to guide the heat of the target device to the first heat-conducting element. The orthographic projection of the second heat-conducting element along the second direction and the orthographic projection of the air outlet element along the second direction do not satisfy the overlap condition.

2. The heat dissipation assembly according to claim 1, characterized in that, The air outlet component includes: a first housing and a second housing, the first housing and the second housing are connected along a third direction opposite to the second direction to form an air cavity, and an air outlet communicating with the air cavity is formed between the first housing and the second housing. The first housing has a first thickness surface extending along the third direction at the position corresponding to the air outlet, and the second housing has a second thickness surface extending along the third direction at the position corresponding to the air outlet. The second thickness surface is opposite to the first thickness surface, and at least one of them is provided with a concave-convex structure. The first heat-conducting component abuts against the surface of the first thickness; The second heat-conducting element abuts against the second thickness surface.

3. The heat dissipation assembly according to claim 2, characterized in that, The first thickness surface is provided with the aforementioned uneven structure to form a stepped surface; The second thickness surface is an arc-shaped surface that protrudes from the stepped surface; In the case where the second thickness surface of the second housing abuts against the second heat-conducting element, the second housing abuts against the surface of the first heat-conducting element near the second heat-conducting element.

4. The heat dissipation assembly according to claim 3, characterized in that, The air outlet component is provided with a connection hole, the connection direction of which is consistent with the second direction. The connection hole is used to allow a fastener to pass through the connection hole along the connection direction and connect with the target component.

5. The heat dissipation assembly according to claim 3 or 4, characterized in that, The first heat-conducting component includes: a first part and a second part, the first part and the second part being respectively opposite to the air outlet, and the first part matching the contour of the first thickness surface and abutting the first thickness surface, and the second part being away from the first thickness surface and the second thickness surface; The first part is provided with a first flow guide channel, and the first flow guide port of the first flow guide channel is opposite to the air outlet; The second part is provided with a second flow guide channel, and the second flow guide port of the second flow guide channel is opposite to the air outlet.

6. The heat dissipation assembly according to claim 5, characterized in that, The size of the first flow channel is larger than the size of the second flow channel.

7. The heat dissipation assembly according to claim 6, characterized in that, The first part is provided with a plurality of first flow channels, and the plurality of first flow channels are distributed along a fourth direction that forms an angle with both the first direction and the second direction; The second part is provided with a plurality of second flow channels, which are distributed along the fourth direction; The cross-sectional dimensions of the plurality of first flow channels are the same and the cross-sectional dimensions of the plurality of second flow channels are the same, or the cross-sectional dimensions of the plurality of first flow channels and the cross-sectional dimensions of the plurality of second flow channels gradually decrease along the fourth direction.

8. The heat dissipation assembly according to claim 7, characterized in that, The height of the first flow guide channel along the second direction is the same as the height of the second flow guide channel along the second direction.

9. An electronic device, characterized in that, include: shell; A heat dissipation assembly, disposed within the housing, includes: Air outlet component, with an air outlet; A first heat-conducting element is distributed along a first direction with the air outlet element and is opposite to the air outlet, so as to at least guide the airflow of the air outlet; The second heat-conducting element is distributed along the second direction with the first heat-conducting element. The second direction and the first direction satisfy the angle condition. A portion of the second heat-conducting element is stacked with the first heat-conducting element to guide the heat of the target device to the first heat-conducting element. The orthographic projection of the second heat-conducting element along the second direction and the orthographic projection of the air outlet element along the second direction do not satisfy the overlap condition.

10. The electronic device according to claim 9, characterized in that, Also includes: Fasteners pass through the air outlet in the second direction and are detachably connected to the housing.

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