Oil-cooled packaging structure and power module

Abstract

The application provides an oil-cooled packaging structure and a power module, comprising a cold plate and a power module; the cold plate has a first packaging surface and a second packaging surface on opposite sides in a first direction; a cooling cavity is formed in the cold plate, and the cooling cavity is open at the first packaging surface and the second packaging surface; the cold plate is sealingly connected with a packaging structure at the first packaging surface and sealingly connected with the power module at the second packaging surface, so that the packaging structure and the power module seal the opening; the cold plate is provided with a first flow channel and a second flow channel that are in communication with the cooling cavity, and the first flow channel and the second flow channel are arranged on opposite sides of the cooling cavity in a second direction; wherein the first direction is the thickness direction of the cold plate, and the second direction is the length direction of the cold plate. The application has a simple structure and is conducive to the miniaturization design of the oil-cooled packaging structure; by forming the cooling cavity in the cold plate to accommodate the oil-based cooling medium, the oil-based cooling medium can be directly in contact with the surface of the power module, which is conducive to improving the heat dissipation performance of the oil-cooled packaging structure.

Description

Technical Field

[0001] This application relates to the field of power device technology, and in particular to an oil-cooled packaging structure and a power module. Background Technology

[0002] Power modules are key components in electronic control systems and are widely used in automobiles, rail transportation, and new energy fields. Oil cooling is a preferred cooling solution for power modules due to its excellent insulation, high heat capacity, uniform heat dissipation, and adaptability to high power density and harsh environments.

[0003] In related technologies, oil cooling has high requirements for the layout of power modules in power modules and the packaging structure is relatively complex. If the layout is not reasonable, it can easily lead to problems such as increased power module size and reduced cooling efficiency. Utility Model Content

[0004] In view of this, the present application aims to provide an oil-cooled packaging structure to solve some or all of the above-mentioned technical problems.

[0005] For the purposes described above, the first aspect of this application provides an oil-cooled packaging structure, including a cold plate and a power module;

[0006] The cold plate has a first encapsulation surface and a second encapsulation surface on opposite sides in a first direction, and a cooling cavity is formed inside the cold plate. The cooling cavity forms an opening on the first encapsulation surface and the second encapsulation surface, respectively. The cold plate is sealed to an encapsulation structure on the first encapsulation surface and sealed to the power module on the second encapsulation surface, so that the encapsulation structure and the power module seal the opening.

[0007] The cold plate is provided with a first flow channel and a second flow channel that communicate with the cooling cavity. The first flow channel and the second flow channel are respectively arranged on opposite sides of the cooling cavity in a second direction; wherein, the first direction is the thickness direction of the cold plate, and the second direction is the length direction of the cold plate.

[0008] Based on the same inventive concept, a second aspect of this application also provides a power module, including the oil-cooled packaging structure as described in the first aspect.

[0009] As can be seen from the above, the oil-cooled packaging structure and power module provided in this application include a cold plate and a power module. The oil-cooled packaging structure has a simple structure and the thickness of the cold plate is easy to control, which is conducive to realizing the miniaturization and lightweight design of the oil-cooled packaging structure. By opening a cooling cavity in the cold plate to accommodate the oil-based cooling medium and directly sealing the opening of the cooling cavity with the side of the power module, the oil-based cooling medium can directly contact the surface of the power module, reducing the thermal resistance between the two and improving the heat absorption efficiency of the oil-based cooling medium on the power module, thereby improving the cooling efficiency of the oil-cooled packaging structure for the cooling module. Attached Figure Description

[0010] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0011] Figure 1 This is a schematic diagram of the cold plate and power module at a first angle in an embodiment of this application;

[0012] Figure 2 This is a schematic diagram of the cold plate and power module at a second angle in an embodiment of this application;

[0013] Figure 3 This is a schematic diagram of the cold plate and power module in an embodiment of this application from a third angle;

[0014] Figure 4 for Figure 3 Schematic diagram of the cross section of region AA;

[0015] Figure 5 This is a schematic diagram of the power module in an embodiment of this application.

[0016] Explanation of reference numerals in the attached figures:

[0017] 1. Cold plate; 101. First encapsulation surface; 102. Second encapsulation surface; 103. Cooling cavity; 1031. Separator; 104. First flow channel; 105. Second flow channel; 106. Diffuser groove; 107. Positioning post; 108. End plate receiving groove; 1081. Wiring end plate; 109. Wiring sleeve; 1091. Wiring hole;

[0018] 2. Packaging structure;

[0019] 3. Power module; 301. Chip area; 302. Heat sink structure;

[0020] 4. Connecting holes. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with specific embodiments and the accompanying drawings.

[0022] It should be noted that, unless otherwise defined, the technical or scientific terms used in the embodiments of this application should have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms "first," "second," and similar terms used in this application do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word covers the element or object listed following the word and its equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are only used to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0023] The power module is one of the core components of a power control system. Taking a power module used in an electronic control system as an example, the power module can be cooled by water, and the cooling medium can be a water-based cooling medium composed of water and ethylene glycol in a 1:1 ratio. Specifically, heat dissipation methods for power modules can include: indirect water cooling through TIM (Thermal Interface Material), direct water cooling based on a pin-fin structure metal water cooling plate, and DSC (Double Side Cooling) water cooling. As power semiconductor devices continue to develop rapidly towards higher power, higher power density, and miniaturization, DSC water cooling is currently the industry's best solution for heat dissipation performance. However, the cooling medium composed of water and ethylene glycol is conductive and cannot directly contact electrical components. To ensure the electrical safety of the power module and surrounding electrical components, an insulating layer needs to be added to the cooling path used to transport the medium. However, the addition of the insulating layer will further increase the thermal resistance of the cooling path, thereby limiting the continuous output power and peak power capability of the electronic control system.

[0024] To overcome the aforementioned technical challenges, oil cooling can be used instead of water cooling for power module cooling. Specifically, the oil-based cooling medium used in oil cooling can be mineral oil, modified silicone oil, ester oil, fluorinated liquid, or nanofluids, all possessing high specific heat capacity, good stability, and excellent insulation properties. Oil cooling offers several advantages: firstly, it provides excellent insulation performance, high specific heat capacity, uniform heat dissipation, and good adaptability to high power density applications and complex operating environments; secondly, heat loss within the electronic control system is primarily concentrated on the surface of the power module, making water cooling less efficient and less effective at suppressing its temperature. Therefore, oil cooling is superior to water cooling. Furthermore, due to the good insulation properties of oil-based cooling media, it can directly contact the power module to absorb generated heat, shortening the heat conduction path, improving heat dissipation efficiency, and preventing electrical interference to the power module and surrounding electronic components. However, due to the limitations of oil cooling, oil cooling places high demands on the layout of the power module within the module, and the packaging structure for oil-based cooling media is relatively complex. If the layout design of the power module within the power module is unreasonable, it can easily lead to problems such as increased power module size and increased flow resistance, which in turn reduces the cooling efficiency of oil cooling.

[0025] In view of this, this application provides an oil-cooled packaging structure 2, combined with Figures 1-5 The content shown provides a detailed description of the oil-cooled packaging structure 2.

[0026] An oil-cooled encapsulation structure 2 includes a cold plate 1 and a power module 3. The cold plate 1 has a first encapsulation surface 101 and a second encapsulation surface 102 on opposite sides in a first direction. A cooling cavity 103 is formed inside the cold plate 1, and the cooling cavity 103 forms openings on the first encapsulation surface 101 and the second encapsulation surface 102, respectively. The cold plate 1 is sealed to an encapsulation structure 2 on the first encapsulation surface 101 and sealed to the power module 3 on the second encapsulation surface 102, so that the encapsulation structure 2 and the power module 3 seal the openings. The cold plate 1 has a first flow channel 104 and a second flow channel 105 communicating with the cooling cavity 103. The first flow channel 104 and the second flow channel 105 are respectively arranged on opposite sides of the cooling cavity 103 in a second direction. The first direction is the thickness direction of the cold plate 1, and the second direction is the length direction of the cold plate 1.

[0027] like Figures 1-5 As shown, this application provides an oil-cooled packaging structure 2 that uses an oil-based cooling medium as the cooling medium and can directly cool the power module 3. The oil-cooled packaging structure 2 may include a stacked cold plate 1 and a power module 3. Specifically, as shown... Figure 1 , Figure 3 and Figure 4As shown, along the thickness direction of the cold plate 1, the cold plate 1 has a first encapsulation surface 101 and a second encapsulation surface 102 on opposite sides. Both encapsulation surfaces are provided with connecting posts and connecting holes 4 to provide installation positions for the power module 3 and the encapsulation structure 2. The cold plate 1 has a cooling cavity 103 inside for containing the oil-based cooling medium. The cooling cavity 103 penetrates the cold plate 1 along the thickness direction of the cold plate 1 to form openings on the first encapsulation surface 101 and the second encapsulation surface 102 respectively. The first encapsulation surface 101 of the cold plate 1 is sealed to the encapsulation structure 2, and the second encapsulation surface 102 is sealed to the power module 3. At this time, both the encapsulation structure 2 and the power module 3 can act as sealing components for the openings, which can prevent the outflow of the oil-based cooling medium. The encapsulation structure 2 can be used to seal the opening on the first encapsulation surface 101 that communicates with the cooling cavity 103, and the power module 3 can be used to seal the other opening on the second encapsulation surface 102 that communicates with the cooling cavity 103. This constitutes a simple and thin oil-cooled encapsulation structure 2, which is conducive to the miniaturization and lightweight design of the power module. When cooling the power module 3, the cooling chamber 103 is filled with an oil-based cooling medium. The oil-based cooling medium can directly contact the side of the packaging structure 2 near the cold plate 1 and the side of the power module 3 near the cold plate 1. This can reduce the thermal resistance between the power module 3 and the oil-based cooling medium and remove the heat generated by the power module 3, thereby achieving efficient and direct cooling of the power module 3.

[0028] For example, since the cold plate 1 needs to provide an installation position for the power module 3 and contain the oil-based cooling medium through the cooling cavity 103, the cold plate 1 can be configured as a plate-shaped frame structure and can be formed of a heat-resistant plastic material to ensure the reliability and stability of the oil-cooled encapsulation structure 2.

[0029] Furthermore, the packaging structure 2 can use a cover plate or cover body to seal the opening of the first packaging surface 101; in addition, the packaging structure 2 can also use an electrical module with electric drive function. Since the oil-based cooling medium in the cooling cavity 103 is in direct contact with one side of the packaging structure 2, the oil-based cooling medium can also synchronously cool the electrical module, thereby improving the cooling efficiency of the oil-based cooling medium.

[0030] Furthermore, such as Figures 1-3As shown, the cold plate 1 is provided with a first flow channel 104 and a second flow channel 105 connected to the cooling chamber 103. One of them can serve as the inlet flow channel for the oil-based cooling medium, and the other can serve as the outlet flow channel for the oil-based cooling medium. In this way, the oil-based cooling medium enters the cooling chamber 103 through the inlet flow channel, flows through the open area encapsulated by the power module 3, absorbs the heat accumulated on the surface of the power module 3, and then exits from the outlet flow channel, thereby carrying away the heat generated by the power module 3. At the same time, along the length direction of the cold plate 1, the first flow channel 104 and the second flow channel 105 are respectively arranged on opposite sides of the cooling chamber 103, so that the oil-based cooling medium forms a longer flow path in the chamber, which helps to improve the utilization efficiency of the oil-based cooling medium and achieve sufficient cooling of the power module 3.

[0031] Furthermore, the first flow channel 104 and the second flow channel 105 can be extended along the thickness direction of the cold plate 1, and the inlet end of the first flow channel 104 and the outlet end of the second flow channel 105 can be opened towards the side away from the packaging structure, so as to ensure that the oil-based cooling medium can fill the first flow channel 104, the cooling cavity 103 and the second flow channel 105, so as to ensure the cooling performance of the cold plate 1.

[0032] For example, the packaging structure 2 and the power module 3 can be connected to the cold plate 1 through the connection holes 4 so that the three can be aligned and connected by fasteners such as screws.

[0033] Furthermore, a sealing ring structure can be provided between the packaging structure 2 and the cold plate 1, and between the power module 3 and the cold plate 1, to enhance the sealing effect of the packaging structure 2 and the power module 3 on the cooling cavity 103 and prevent leakage of the oil-based cooling medium, which would affect the quality of the power module 3.

[0034] It should be noted that, in order to facilitate the description of the structural shape and positional relationship of each component in the oil-cooled packaging structure 2, the thickness direction of the cold plate 1 can be defined as the first direction, the length direction of the cold plate 1 as the second direction, and the width direction of the cold plate 1 as the third direction. These can be represented by x, y, and z respectively, and the three can be perpendicular to each other. This helps to more clearly show and understand the oil-cooled packaging structure 2 provided in this application in conjunction with the accompanying drawings, so as to accurately grasp the relative position and layout of each component.

[0035] In some embodiments, the first packaging surface 101 is provided with a diffusion groove 106, and the diffusion groove 106 and the packaging structure 2 together form a diffusion channel. The first channel 104 and the cooling cavity 103, as well as the second channel 105 and the cooling cavity 103, are connected through the corresponding diffusion channels.

[0036] To ensure the cooling effect of the oil-based coolant on the power module 3, the oil-based coolant can be supplied uniformly and stably to the cooling cavity 103 through the first flow channel 104, so that the oil-based coolant fully fills the cooling cavity 103 and makes close contact with the surface of the power module 3. To improve the delivery efficiency of the oil-based coolant, a diffusion groove 106 with a diffusion function can be formed on the first encapsulation surface 101 of the cold plate 1. In this way, when the encapsulation structure 2 is sealed and connected to the first encapsulation surface 101, the encapsulation structure 2 closes the diffusion groove 106 and forms a diffusion channel, and the first flow channel 104 and the cooling cavity 103, as well as the second flow channel 105 and the cooling cavity 103, are connected through the corresponding diffusion channels, ensuring that sufficient low-temperature oil-based coolant can be provided to the cooling cavity 103, and that the oil-based coolant after heat absorption can be discharged in time, so as to ensure the heat dissipation performance of the heat dissipation module.

[0037] In some embodiments, along a third direction, the diffusion groove 106 includes a plurality of side-by-side guide grooves, wherein the third direction is the width direction of the cold plate 1.

[0038] To improve the uniformity of the distribution of the oil-based cooling medium in the cooling chamber 103, the diffusion groove 106 can be divided into multiple parallel guide grooves along the width direction of the cold plate 1 (i.e., the third direction). In this way, the oil-based cooling medium entering the diffusion channel from the first flow channel 104 can be dispersed and guided into each guide groove, thereby being uniformly transported into the interior of the cooling chamber 103. At the same time, the oil-based cooling medium after heat absorption can be discharged in time through multiple guide grooves connected to the second flow channel 105, ensuring that the oil-based cooling medium after heat absorption in the cooling chamber 103 is fully replaced to maintain the cooling performance of the oil-based cooling medium.

[0039] In some embodiments, along the second direction, the cooling cavity 103 is provided with a plurality of spaced partitions 1031 to divide the cooling cavity 103 into a plurality of sub-cavities; the power module 3 is provided with a plurality of chip regions 301 on the side near the cold plate 1, and each chip region 301 is disposed opposite to a sub-cavity.

[0040] like Figure 1 and Figure 3As shown, the power module 3 may include a power board and various control chips arranged on the surface of the power board. The various control chips constitute the core functional area of ​​the control module. According to the distribution position of the chips on the power board, the surface of the power module 3 can be divided into multiple chip areas 301. During the operation of the electronic control system, each control chip will generate a large amount of heat in its corresponding chip area 301. In order to achieve effective heat dissipation of the corresponding chip area 301, multiple spaced partitions 1031 can be provided in the cooling cavity 103. Each partition 1031 can adopt a long strip structure extending along the width direction of the cold plate 1 to divide the cooling cavity 103 into multiple sub-chambers along the length direction of the cold plate 1. Each sub-chamber is arranged opposite to a chip area 301, so that the oil-based cooling medium can specifically cool the corresponding chip area 301, thereby improving the overall cooling efficiency of the power module 3.

[0041] In some embodiments, along the first direction, there is a gap between one side of the partition 1031 and the packaging structure 2, and the other side of the partition 1031 abuts against the power module 3; the orthographic projection of the partition 1031 in the first direction does not coincide with the orthographic projection of the chip area 301.

[0042] To achieve efficient cooling of the power module 3 by the oil-based cooling medium within the cooling chamber 103, the cooling chamber 103 occupies a large space on the cold plate 1. This results in insufficient effective support from the cold plate 1 for the power module 3 after it is sealed to the first encapsulation surface 101 of the cold plate 1, reducing the connection stability of the power module 3 and its compressive strength in the central area. Figures 1-3 As shown, to enhance the stability of the power module 3 on the surface of the cold plate 1 without affecting the smooth flow of the oil-based cooling medium within the cooling cavity 103, one side of the partition 1031 within the cooling cavity 103 can be made to abut against the surface of the power module 3 along the thickness direction of the cold plate 1, thereby forming effective support for the power module 3, improving the support effect of the cold plate 1 on the power module 3 and the flatness of the power module 3 itself. Simultaneously, a gap is left between the other side of the partition 1031 and the side of the encapsulation structure 2, ensuring interconnection between adjacent sub-cavities, allowing the oil-based cooling medium to flow smoothly within the cooling cavity 103, thus guaranteeing a uniform cooling effect of the oil-based cooling medium on the power module 3. This ensures both the secure installation of the power module 3 and the effective circulation of the oil-based cooling medium.

[0043] In some embodiments, the power module 3 is provided with a heat sink structure 302 on the side away from the cold plate 1; the heat sink structure 302 includes a plurality of heat sink pins arranged in an array, or a plurality of heat sink fins arranged at intervals.

[0044] During operation, the side of power module 3 furthest from cold plate 1 also generates heat; to further improve the heat dissipation efficiency of power module 3, such as... Figure 2 As shown, a heat sink structure 302 can be provided on the side of the power module 3 away from the cold plate 1. The heat sink structure 302 can increase the heat dissipation area and improve the heat dissipation efficiency. In this way, some of the heat generated by the power module 3 can be conducted to the heat sink structure 302 for dissipation, thereby increasing the heat dissipation rate. Specifically, the heat sink structure 302 can be designed as multiple arrayed heat dissipation pins or multiple spaced heat dissipation fins, which can achieve efficient heat dissipation of the power module 3.

[0045] Furthermore, to accelerate the heat dissipation rate of the radiator structure 302, auxiliary heat dissipation can be achieved by combining air cooling or water cooling devices; for example, a cooling fan can be added to the side of the radiator structure 302 to accelerate airflow and quickly remove heat from the radiator; or the radiator structure 302 can be immersed in coolant to absorb and release heat through the coolant, thereby enhancing the heat dissipation effect.

[0046] For example, the heat dissipation pins can be made of copper or its alloys, which can give the heat dissipation pins high thermal conductivity; the heat dissipation fins can be made of aluminum or its alloys, which takes into account both good thermal conductivity and low cooling cost.

[0047] In some embodiments, the second packaging surface 102 is provided with at least two positioning posts 107, and the power module 3 is provided with positioning holes adapted to the positioning posts 107; along the third direction, at least one positioning post 107 is provided on each of the opposite sides of the cooling cavity 103, wherein the third direction is the width direction of the cold plate 1.

[0048] To reduce the assembly difficulty between the power module 3 and the second packaging surface 102 of the cold plate 1, and to improve the alignment accuracy during assembly; such as Figure 1 and Figure 3 As shown, at least two positioning posts 107 can be provided on the second encapsulation surface 102 of the cold plate 1, and each positioning post 107 can extend along the thickness direction of the cold plate 1. Correspondingly, positioning holes matching the positioning posts 107 can be opened on the power module 3 to ensure that the positioning posts 107 can be accurately inserted into the positioning holes, thereby improving the reliability of positioning between the two. In addition, at least one positioning post 107 can be provided on each of the opposite sides of the cooling cavity 103 along the width direction of the cold plate 1 (i.e., the third direction), which can enhance the fixing strength and stability of the power module 3 on the first encapsulation surface 101 of the cold plate 1. In other words, the design of the positioning posts 107 helps to simplify the assembly process while ensuring a precise and stable connection between the power module 3 and the cold plate 1.

[0049] In some embodiments, the first encapsulation surface 101 is provided with a plurality of end plate receiving slots 108, and each end plate receiving slot 108 is provided with a wiring terminal plate 1081. The wiring terminal plate 1081 extends into the cooling cavity 103 and is electrically connected to the power module 3, while the remaining part is exposed to the outside relative to the cooling cavity 103.

[0050] To achieve effective cooling of the chip area 301 in the power module 3, the chip area 301 of the power module 3 needs to be in direct contact with and sealed to the oil-based cooling medium in the cooling cavity 103, i.e., the control chip of the power module 3 is encapsulated inside the cooling cavity 103. Therefore, to establish an electrical connection between the control chip in the chip area 301 and other electronic devices, multiple end plate receiving slots 108 can be provided on the first encapsulation surface 101 of the cold plate 1 for mounting the wiring terminal plate 1081; each end plate receiving slot 108 is located adjacent to the cooling cavity 103, which helps to shorten the wiring length between the wiring terminal plate 1081 and the chip area 301 of the power module 3.

[0051] After the terminal block 1081 is installed in the terminal block receiving groove 108, part of the terminal block 1081 can extend into the cooling cavity 103 and establish an electrical connection with the chip area 301 of the power module 3. Due to the presence of the oil-based cooling medium, the chip area 301 of the power module 3 can be provided with the necessary cooling function, and it can also provide insulation protection for different terminal blocks 1081 and each control chip to avoid short circuits. The remaining part of the terminal block 1081 is exposed outside the cooling cavity 103 and located in the terminal block receiving groove 108, which can provide corresponding electrical connection positions.

[0052] For example, the wiring terminal plate 1081 located in the terminal plate receiving groove 108 has through holes, and wiring operations of the wiring terminal plate 1081 can be realized by connecting screws, ensuring that the power module 3 can establish a stable electrical connection with other electronic devices.

[0053] In some embodiments, the second encapsulation surface 102 is provided with a plurality of wiring sleeves 109, each wiring sleeve 109 being connected to an end plate receiving groove 108 through a wiring hole 1091.

[0054] To reduce the wiring difficulty of power module 3, such as Figure 2 As shown, multiple terminal sleeves 109 can be provided on the second packaging surface 102 of the power module 3, with each terminal sleeve 109 arranged opposite to an end plate receiving groove 108. Each terminal sleeve 109 has a hollow wiring hole 1091 inside, which connects to the corresponding end plate receiving groove 108. When wiring structures such as terminals are inserted into the terminal sleeve 109, the terminal sleeve 109 acts as a shield and protector at the connection point between the terminal plate 1081 and the wiring structure, thereby improving the safety and reliability of the wiring section.

[0055] Based on the same inventive concept, this application also provides a power module, including the power module 3 described in any of the above embodiments. Specifically, since the power module includes the power module 3, it possesses all the advantages and beneficial effects of the power module 3.

[0056] Furthermore, the power module may also include a capacitor module, which is connected to the cold plate 1 via fasteners and electrically connected to the power module 3 to work together with the power module 3, which will not be described in detail here.

[0057] It should be noted that some embodiments of this application have been described above. Other embodiments are within the scope of the appended claims.

[0058] The various embodiments in this application are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0059] The description in this application is given for illustrative purposes and is not intended to be exhaustive or to limit the application to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described to better illustrate the principles and practical application of this application and to enable those skilled in the art to understand this application and design various embodiments with various modifications suitable for a particular purpose.

[0060] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of this application (including the claims) is limited to these examples; within the framework of this application, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of the embodiments of this application as described above, which are not provided in the details for the sake of brevity.

[0061] Although this application has been described in conjunction with specific embodiments thereof, many substitutions, modifications and variations of these embodiments will be apparent to those skilled in the art from the foregoing description.

[0062] The embodiments of this application are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the embodiments of this application should be included within the protection scope of this application.

Claims

1. An oil-cooled packaging structure, characterized in that, Including cold plates and power modules; The cold plate has a first encapsulation surface and a second encapsulation surface on opposite sides in a first direction, and a cooling cavity is formed inside the cold plate, with the cooling cavity forming an opening on the first encapsulation surface and the second encapsulation surface respectively; The cold plate is sealed to a packaging structure on the first packaging surface and sealed to the power module on the second packaging surface, so that the packaging structure and the power module seal the opening; The cold plate is provided with a first flow channel and a second flow channel that communicate with the cooling cavity. The first flow channel and the second flow channel are respectively arranged on opposite sides of the cooling cavity in a second direction; wherein, the first direction is the thickness direction of the cold plate, and the second direction is the length direction of the cold plate.

2. The oil-cooled packaging structure according to claim 1, characterized in that, The first packaging surface is provided with a diffusion groove, and the diffusion groove and the packaging structure together form a diffusion channel. The first channel and the cooling cavity, as well as the second channel and the cooling cavity, are connected through the corresponding diffusion channel.

3. The oil-cooled packaging structure according to claim 2, characterized in that, Along a third direction, the diffusion groove includes a plurality of guide grooves arranged side by side; wherein, the third direction is the width direction of the cold plate.

4. The oil-cooled packaging structure according to claim 1, characterized in that, Along the second direction, the cooling cavity is provided with a plurality of spaced partitions to divide the cooling cavity into a plurality of sub-cavities; The power module has multiple chip areas on the side near the cold plate, and each chip area is arranged opposite to a sub-cavity.

5. The oil-cooled packaging structure according to claim 4, characterized in that, Along the first direction, there is a gap between one side of the partition and the packaging structure, and the other side of the partition abuts against the power module; The orthographic projection of the partition in the first direction does not coincide with the orthographic projection of the chip area.

6. The oil-cooled packaging structure according to claim 1, characterized in that, The power module has a heat sink structure on the side away from the cold plate; The radiator structure includes multiple arrayed heat dissipation pins or multiple spaced heat dissipation fins.

7. The oil-cooled packaging structure according to claim 1, characterized in that, The second packaging surface is provided with at least two positioning posts, and the power module is provided with positioning holes that are adapted to the positioning posts; Along a third direction, at least one positioning column is provided on each of the opposite sides of the cooling cavity, wherein the third direction is the width direction of the cold plate.

8. The oil-cooled packaging structure according to claim 1, characterized in that, The first encapsulation surface is provided with multiple end plate receiving slots, and each end plate receiving slot is provided with a wiring terminal plate. The wiring terminal plate extends into the cooling cavity and is electrically connected to the power module, while the remaining part is exposed relative to the cooling cavity.

9. The oil-cooled packaging structure according to claim 8, characterized in that, The second encapsulation surface is provided with a plurality of wiring sleeves, each of which is connected to an end plate receiving groove.

10. A power module, characterized in that, Includes the power module as described in any one of claims 1-9.

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