Integrated structure of high-density patch high-voltage power supply

Abstract

The utility model discloses an integrated structure of high density patch high voltage power supply relates to high voltage power supply technical field, including integrated circuit board still includes cooling assembly, the cooling assembly includes first phase change cooling spare and second phase change cooling spare of intercommunication, first phase change cooling spare is located integrated circuit board's side, second phase change cooling spare is close integrated circuit board's lower end surface setting, wherein, second phase change cooling spare includes cooling liquid pipe and annular phase change spare, phase change spare is located cooling liquid pipe's outside, the utility model discloses first, second phase change cooling spare cooperation, through phase change material absorbs a large number of latent heat, can quickly restrain the temperature sudden rise under instantaneous high -power impact, cooperation cooling liquid pipe's active heat exchange, form passive buffering and active heat dissipation double temperature control, avoid core component and spare damage because of high temperature, guarantee power supply long -term stable operation.

Description

Technical Field

[0001] This utility model belongs to the field of high voltage power supply technology, and in particular relates to an integrated structure of a high-density patch high voltage power supply. Background Technology

[0002] In the field of high-voltage power supply technology, as electronic devices develop towards miniaturization and high power density, high-density surface mount technology is widely used in the circuit board integration of high-voltage power supplies. By arranging high-voltage capacitors, surface mount inductors, precision resistors and other components in a high density, the size of the power supply can be effectively reduced to meet the requirements of equipment miniaturization. However, this also leads to a significant increase in the heat density per unit area of ​​the circuit board. Especially under instantaneous high load or peak current loading, the core power chip is prone to generating a large amount of concentrated heat. If heat dissipation is not timely, it will directly affect the operational stability and service life of the components.

[0003] Current traditional high-voltage power supply heat dissipation structures mostly adopt single heat sink fins or simple coolant pipe designs, which are difficult to cope with the complex heat dissipation requirements brought about by high-density integration. On the one hand, a single heat dissipation method either has insufficient heat dissipation efficiency and cannot quickly absorb instantaneous heat, resulting in a sudden rise in local temperature; on the other hand, some heat dissipation structures require a large installation space, which conflicts with the compact layout requirements of high-density surface mount technology and affects the overall assembly and use of the power supply. Based on this, an integrated structure for a high-density surface mount high-voltage power supply is proposed. Utility Model Content

[0004] The purpose of this invention is to provide an integrated structure for a high-density surface-mount high-voltage power supply, which solves the existing problems.

[0005] To solve the above-mentioned technical problems, this utility model is achieved through the following technical solution: This utility model relates to an integrated structure for a high-density surface-mount high-voltage power supply, comprising an integrated circuit board and a cooling assembly. The cooling assembly includes a first phase-change cooling element and a second phase-change cooling element that are connected to each other. The first phase-change cooling element is disposed on the side of the integrated circuit board, and the second phase-change cooling element is disposed against the lower end face of the integrated circuit board. The second phase-change cooling element includes a coolant pipe and an annular phase-change element, with the phase-change element disposed outside the coolant pipe.

[0006] Preferably, the first phase change cooling element includes: Two strip-shaped heat-conducting shells are symmetrically fixed on both sides of the lower end face of the integrated circuit board, and the interior of the strip-shaped heat-conducting shells is divided into a coolant cavity and a phase change material cavity by a partition, and the coolant cavity is filled with coolant; The first phase change block is disposed inside the cavity of the phase change material; Multiple connecting ports are equidistantly located on the outer shell of the coolant cavity.

[0007] Preferably, the phase change element includes an annular heat-conducting shell, the interior of which is hollow, and the coolant pipe is connected to two opposite connecting ports. A second phase change block is provided inside the annular heat-conducting shell.

[0008] Preferably, it also includes a heat-conducting element, which is disposed on the upper and lower surfaces of the strip-shaped heat-conducting shell and is used to conduct and dissipate the heat of the strip-shaped heat-conducting shell.

[0009] Preferably, the heat-conducting component includes a first heat-dissipating plate fixed to the upper end face of the strip-shaped heat-conducting shell, and a plurality of first heat dissipation fins are equidistantly inserted into the first heat-dissipating plate.

[0010] Preferably, the heat-conducting component further includes a second heat-dissipating plate fixed to the lower end face of the strip-shaped heat-conducting shell, and a plurality of second heat-dissipating fins are equidistantly inserted on the second heat-dissipating plate, with the second heat-dissipating fins and the first heat-dissipating fins being distributed alternately.

[0011] This utility model has the following beneficial effects: 1. This utility model adopts the first and second phase change cooling components working together. By absorbing a large amount of latent heat through the phase change material, it can quickly suppress the temperature rise under instantaneous high power impact. Combined with the active heat exchange of the coolant pipe, it forms a dual temperature control of passive buffering and active heat dissipation, avoiding damage to core components due to high temperature and ensuring long-term stable operation of the power supply.

[0012] 2. The second phase change cooling component of this utility model is set against the lower end face of the circuit board, and the first phase change cooling component is symmetrically distributed on both sides of the circuit board. The fins of the heat conduction component are staggered, which maximizes the heat dissipation area in a limited space without occupying too much extra space. It perfectly adapts to the integration requirements of high-density surface mount components and effectively reduces the overall size of the power supply.

[0013] 3. The heat-conducting components achieve bidirectional heat dissipation through upper and lower heat spreaders and fins. Combined with the phase change components, the shape can be adjusted according to the chip layout. It can control the temperature of the concentrated heat-generating areas of multiple chips, avoid local heat accumulation, and is suitable for high-voltage power supply scenarios with different component layouts.

[0014] Of course, any product implementing this utility model does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram of the cooling component and heat-conducting element of this utility model; Figure 3 This is a cross-sectional structural schematic diagram of the second phase change cooling component of this utility model; Figure 4 This is a schematic diagram of the structure of the first phase change cooling component of this utility model; Figure 5 This utility model Figure 4 A schematic diagram of the cross-sectional structure; Figure 6 This is an external view of the high-voltage power supply unit.

[0017] The attached diagram lists the components represented by each number as follows: 1. Integrated circuit board; 2. Cooling assembly; 21. First phase change cooling component; 211. Strip-shaped heat-conducting shell; 212. Connecting port; 213. Coolant cavity; 214. Phase change material cavity; 215. First phase change block; 22. Second phase change cooling component; 221. Annular heat-conducting shell; 222. Coolant pipe; 223. Second phase change block; 3. Heat-conducting component; 31. First heat spreader; 32. First heat dissipation fin; 33. Second heat spreader; 34. Second heat dissipation fin; 4. High-voltage power supply body. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] Please see Figures 1-5 As shown, this utility model provides an integrated structure for a high-density surface-mount high-voltage power supply, including an integrated circuit board 1, on which high-density surface-mount components (such as high-voltage capacitors, surface-mount inductors, precision resistors, etc.) are integrated. By optimizing the component layout and wiring design, the circuit integration per unit area is improved, effectively reducing the overall structural volume. Figure 6As shown, it is a high-voltage power supply body 4. An integrated circuit board 1 is installed inside the high-voltage power supply body 4. It also includes a cooling assembly 2. The cooling assembly 2 includes a first phase change cooling element 21 and a second phase change cooling element 22 that are connected to each other. The first phase change cooling element 21 is located on the side of the integrated circuit board 1. The second phase change cooling element 22 is located against the lower end face of the integrated circuit board 1. The second phase change cooling element 22 includes a coolant pipe 222 and a phase change element. The phase change element is located outside the coolant pipe 222. The fixed position of the phase change element can be adjusted according to the actual situation to avoid blocking the pins on the integrated circuit board 1.

[0020] Among them, see Figure 2 as well as Figures 4-5 As shown, the first phase change cooling component 21 includes two strip-shaped heat-conducting shells 211. The two strip-shaped heat-conducting shells 211 are symmetrically fixed on both sides of the lower end face of the integrated circuit board 1. The strip-shaped heat-conducting shells 211 are made of high thermal conductivity composite materials (such as thermally conductive plastics and metal matrix composites). The interior of the strip-shaped heat-conducting shells 211 is divided into a coolant cavity 213 and a phase change material cavity 214 by a partition. The coolant cavity 213 contains coolant, and the phase change material cavity 214 contains a first phase change block 215, which realizes the dual heat dissipation function of active heat dissipation and passive heat buffering. The first phase change block 215 can be made of paraffin alloy. When the circuit board encounters a sudden high-power impact (such as peak current loading) or a sudden thermal shock, the paraffin alloy will quickly absorb a large amount of latent heat of fusion, avoiding a rapid rise in the temperature of the circuit board in a short period of time. This provides a thermal buffer time for the thermal management and control of the system (such as increasing the speed of the cooling fan and strengthening the circulation of coolant), effectively protecting the core components such as power chips from high-temperature damage.

[0021] See Figures 2-3As shown, the phase change component includes an annular heat-conducting shell 221, which is hollow inside. Multiple connecting ports 212 are equidistantly provided on the outer shell of the coolant cavity 213. Coolant pipes 222 are connected to corresponding two connecting ports 212. The coolant pipes 222 are located below the power chip and contain coolant. A high thermal conductivity layer is provided on the outside of the coolant pipes 222, except where the annular heat-conducting shell 221 is fitted, so that the outer end of the high thermal conductivity layer and the annular heat-conducting shell 221 can fit against the lower end face of the integrated circuit board 1. A second phase change block is provided inside the annular heat-conducting shell 221. 223. The second phase change block 223 can also be made of paraffin alloy. When the power chip generates a lot of heat due to instantaneous high load, part of the heat is transferred to the coolant pipe 222 through the high thermal conductivity layer and is quickly carried away by the coolant; the other part of the heat is transferred to the annular heat-conducting shell 221 and is absorbed and melted by the second phase change block 223 to further suppress local temperature peaks and ensure that the power chip is always in a safe operating temperature range. This design is suitable for circuit board scenarios with multi-chip integration and can effectively solve the problem caused by concentrated heat generation of power chips, and improve the heat dissipation uniformity and stability of the entire high-voltage power supply system.

[0022] Secondly, the shape design of the phase changer can be adapted and adjusted according to the layout of the power chip (such as circular, square, or ring-shaped).

[0023] As described above, in practical use, the integrated circuit board 1 integrates a large number of precision components. During operation, the components will continuously release heat, causing the temperature of itself and the surrounding area to rise rapidly. If the heat cannot be dissipated in time, it will not only affect the operational stability of the components, but may also shorten their service life, or even cause the overall failure of the high-voltage power supply.

[0024] At this time, the coolant-filled pipe 222 directly exchanges heat with the integrated circuit board 1, quickly removing the heat from the surface of the board.

[0025] Secondly, the second phase change block 223, encased in the annular heat-conducting shell 221, is in close contact with the coolant pipe 222. When the coolant temperature rises sharply due to absorbing a large amount of heat, the second phase change block 223 will rapidly undergo a solid-liquid phase change. By utilizing the characteristic of absorbing a large amount of latent heat during the phase change process, it can quickly suppress the upward trend of the coolant temperature. In addition, the first phase change block 215 inside the strip-shaped heat-conducting shell 211 will also simultaneously initiate a solid-liquid phase change and actively absorb heat. The two work together to form a dual temperature control barrier, effectively avoiding the adverse effects of excessively rapid temperature rise on the normal operation of the high-voltage power supply, and providing a reliable guarantee for the long-term stable operation of the equipment.

[0026] In addition, see Figures 1-2 as well as Figures 4-5As shown, it also includes a heat-conducting element 3, which is disposed on the upper and lower surfaces of the strip-shaped heat-conducting shell 211 and is used to conduct and dissipate the heat of the strip-shaped heat-conducting shell 211.

[0027] The heat-conducting component 3 includes a first heat-dissipating plate 31 fixed to the upper end face of the strip-shaped heat-conducting shell 211. Multiple first heat dissipation fins 32 are equidistantly inserted on the first heat-dissipating plate 31. The heat-conducting component 3 also includes a second heat-dissipating plate 33 fixed to the lower end face of the strip-shaped heat-conducting shell 211. Multiple second heat dissipation fins 34 are equidistantly inserted on the second heat-dissipating plate 33. The second heat dissipation fins 34 and the first heat dissipation fins 32 are staggered. Heat can be conducted away from above through the first heat dissipation fins 32 on the first heat-dissipating plate 31, and heat can be conducted away from below through the second heat-dissipating plate 33 on the second heat-dissipating plate 33. In terms of structural layout, the second heat dissipation fins 34 and the first heat dissipation fins 32 are arranged in a staggered manner, which not only helps to optimize space utilization, but also enhances the stability of the overall heat dissipation structure.

[0028] When the strip-shaped heat-conducting shell 211 heats up due to working heat, the heat is simultaneously conducted to the heat dissipation plates at the top and bottom. The first heat dissipation plate 31 quickly conducts heat from above and diffuses it to the surrounding environment through the first heat dissipation fins 32 on it. At the same time, the second heat dissipation plate 33 dissipates heat from below simultaneously with the second heat dissipation fins 34 on its lower surface. The bidirectional heat dissipation design increases the effective heat dissipation area and improves heat dissipation efficiency. The staggered arrangement of the heat dissipation fins further optimizes the airflow path, enhances the uniformity of heat exchange, and avoids local heat accumulation, thereby achieving more efficient and balanced temperature control in a limited space.

[0029] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0030] The preferred embodiments of this utility model disclosed above are merely illustrative of the present utility model. These preferred embodiments do not exhaustively describe all details, nor do they limit the utility model to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of this utility model, thereby enabling those skilled in the art to better understand and utilize it. This utility model is limited only by the claims and their full scope and equivalents.

Claims

1. An integrated structure for a high-density surface-mount high-voltage power supply, comprising an integrated circuit board (1), characterized in that, It also includes a cooling assembly (2), which includes a first phase change cooling element (21) and a second phase change cooling element (22) connected in communication. The first phase change cooling element (21) is located on the side of the integrated circuit board (1), and the second phase change cooling element (22) is located against the lower end face of the integrated circuit board (1). The second phase change cooling element (22) includes a coolant pipe (222) and an annular phase change element, which is located outside the coolant pipe (222).

2. The integrated structure of the high-density surface-mount high-voltage power supply according to claim 1, characterized in that, The first phase change cooling element (21) includes: Two strip-shaped heat-conducting shells (211) are symmetrically fixed on both sides of the lower end face of the integrated circuit board (1), and the interior of the strip-shaped heat-conducting shells (211) is divided into a coolant cavity (213) and a phase change material cavity (214) by a partition. The coolant cavity (213) is filled with coolant. The first phase change block (215) is disposed inside the phase change material cavity (214); Multiple connecting ports (212) are equidistantly provided on the outer shell of the coolant cavity (213).

3. The integrated structure of the high-density surface-mount high-voltage power supply according to claim 2, characterized in that, The phase change component includes an annular heat-conducting shell (221), which is hollow inside. The coolant pipe (222) is connected to two corresponding connecting ports (212). A second phase change block (223) is provided inside the annular heat-conducting shell (221).

4. The integrated structure of the high-density surface-mount high-voltage power supply according to claim 1, characterized in that, It also includes a heat-conducting component (3), which is disposed on the upper and lower surfaces of the strip-shaped heat-conducting shell (211) to conduct heat out of the strip-shaped heat-conducting shell (211).

5. The integrated structure of the high-density surface-mount high-voltage power supply according to claim 4, characterized in that, The heat-conducting component (3) includes a first heat-dissipating plate (31) fixed on the upper surface of the strip heat-conducting shell (211), and a plurality of first heat dissipation fins (32) are inserted at equal intervals on the first heat-dissipating plate (31).

6. The integrated structure of the high-density surface-mount high-voltage power supply according to claim 5, characterized in that, The heat-conducting component (3) also includes a second heat-dissipating plate (33) fixed on the lower end face of the strip heat-conducting shell (211). Multiple second heat-dissipating fins (34) are equidistantly inserted on the second heat-dissipating plate (33). The second heat-dissipating fins (34) and the first heat-dissipating fins (32) are staggered.

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