A heat dissipation device

Abstract

The application discloses a heat dissipation device, comprising: a shell, an outer wall of the shell defining a mounting surface suitable for mounting a chip, and a plurality of heat dissipation openings penetrating to an inner wall of the shell are arranged at the mounting surface; a fan assembly, the fan assembly comprising a rotating part rotatably arranged in the shell, the rotating part being configured to generate airflow that is sucked in from the axial direction and discharged from the circumferential direction during rotation; a flow guide part, the flow guide part being arranged on the inner wall of the shell and spirally extending along the axial direction of the rotating part; an atomization assembly, the atomization assembly comprising an atomization nozzle arranged in the shell, the atomization nozzle being located between the rotating part and the flow guide part and being configured to inject cooling liquid to the airflow discharged by the rotating part. The application combines the double advantages of spray phase change heat absorption and air cooling forced convection, significantly enhances the disturbance and mixing degree of gas-liquid mixed fluid by utilizing vortex motion and centrifugal effect, can cope with higher heat flux, and has high overall heat dissipation efficiency and good heat dissipation effect.

Description

Technical Field

[0001] This application relates to the field of chip heat dissipation technology, and in particular to a heat dissipation device. Background Technology

[0002] As chip computing power continues to increase, its heat flux density is also increasing, and traditional single-phase air cooling and even water cooling technologies are gradually approaching their heat dissipation limits. Spray cooling technology has become an effective way to dissipate heat from electronic components due to its high efficiency in heat absorption by droplet phase change. However, both existing spray cooling and air cooling technologies have significant drawbacks. During spray cooling, the gas-liquid two-phase cooling fluid flows randomly on the chip surface at a slow velocity, easily forming stagnant liquid films in certain areas. These liquid films have high thermal resistance, which hinders heat transfer and reduces heat dissipation efficiency. Traditional air cooling devices, such as those using centrifugal fans, are limited by the specific heat capacity of air, resulting in poor heat dissipation when facing extremely high heat flux densities. If the airflow organization is not reasonable, it can easily create heat dissipation dead zones. Utility Model Content

[0003] This application aims to solve at least one of the technical problems existing in the prior art. To this end, this application proposes a heat dissipation device with good heat dissipation effect and high heat dissipation efficiency.

[0004] The heat dissipation device according to an embodiment of this application includes: The housing has an outer wall that defines a mounting surface suitable for mounting chips, and a plurality of heat dissipation vents extending through to the inner wall of the housing are provided on the mounting surface. A fan assembly, the fan assembly including a rotating part rotatably disposed within the housing, the rotating part being configured to generate an airflow that is drawn in axially and discharged circumferentially during rotation; A flow guide is disposed on the inner wall of the housing and extends spirally along the axial direction of the rotating part; An atomizing assembly, the atomizing assembly including an atomizing nozzle disposed within the housing, the atomizing nozzle being located between the rotating part and the guide part, and configured to spray coolant into the airflow discharged from the rotating part.

[0005] The heat dissipation device according to the embodiments of this application has at least the following beneficial effects: This application combines the advantages of spray phase change heat absorption and forced convection of air cooling. It utilizes vortex motion and centrifugal effect to significantly enhance the disturbance and mixing degree of the gas-liquid mixture, which can cope with high heat flux density. Furthermore, through the spiral guidance of the flow guide and the directional discharge of the heat dissipation port, the gas-liquid mixture can actively and continuously flush the chip surface, preventing the formation and thickening of the heat insulation liquid film, reducing the heat dissipation thermal resistance, and resulting in high overall heat dissipation efficiency and good heat dissipation effect.

[0006] According to some embodiments of this application, the outer wall of the housing defines a plurality of mounting surfaces, which are arranged circumferentially along the rotating portion.

[0007] According to some embodiments of this application, the flow guide includes at least one flow guide fin that surrounds the rotating portion at least once.

[0008] According to some embodiments of this application, the atomizing assembly includes at least one set of atomizing nozzles, and the set of atomizing nozzles includes a plurality of atomizing nozzles arranged circumferentially along the rotating portion.

[0009] According to some embodiments of this application, the atomizing component includes multiple sets of atomizing nozzles, which are arranged axially along the rotating part.

[0010] According to some embodiments of this application, the atomizing component further includes: At least one annular tube, the annular tubes being distributed circumferentially along the rotating portion; A coolant supply system connected to the annular pipe and configured to supply the coolant to the annular pipe; The atomizing nozzles in the same group are arranged on the same annular tube.

[0011] According to some embodiments of this application, the mounting surface is provided with a plurality of heat dissipation vents.

[0012] According to some embodiments of this application, the heat dissipation vent is configured as a hole or a slit.

[0013] According to some embodiments of this application, the rotating part is a centrifugal impeller.

[0014] According to some embodiments of this application, the atomizing nozzle is configured to spray the coolant toward the guide portion in the radial direction of the rotating portion.

[0015] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0016] The present application will be further described below with reference to the accompanying drawings and embodiments, wherein: Figure 1 This is a schematic diagram of the installation structure of the heat dissipation device according to an embodiment of this application; Figure 2 This is a schematic diagram of the internal structure of the housing according to an embodiment of this application; Figure 3 This is an exploded view of the installation structure of the housing and the guide fins according to an embodiment of this application; Figure 4 This is a schematic diagram of the structure of the atomizing component according to an embodiment of this application; Figure 5 This is a schematic diagram of the structure of the wind turbine assembly according to an embodiment of this application.

[0017] Icon labels: Housing 100, mounting surface 101, heat dissipation vent 102, side plate 110, hollow bracket 120; Fan assembly 200, rotating part 210, drive part 220; Flow guide 300, flow guide fin 301; Atomizing component 400, atomizing nozzle 410, annular tube 420, pump 430, coolant tank 440, inlet pipe 450, return pipe 460. Detailed Implementation

[0018] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0019] In the description of this application, it should be understood that the orientation descriptions, such as up, down, etc., are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0020] In the description of this application, "multiple" refers to two or more. The use of "first" and "second" is for the purpose of distinguishing technical features only and should not be construed as indicating or implying relative importance, or implicitly indicating the number of technical features indicated, or the order in which the technical features are indicated.

[0021] In the description of this application, unless otherwise expressly defined, terms such as "setup," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this application in conjunction with the specific content of the technical solution.

[0022] Reference Figures 1 to 5 As shown, a heat dissipation device according to an embodiment of this application includes: a housing 100, a fan assembly 200, a flow guide 300, and an atomizing assembly 400.

[0023] The housing 100 defines a cavity with an air inlet inside, and the outer wall of the housing 100 defines a mounting surface 101 suitable for mounting chips. Several heat dissipation vents 102 are provided on the mounting surface 101 and extend to the inner wall of the housing 100, that is, the heat dissipation vents 102 extend into the cavity inside the housing 100.

[0024] The fan assembly 200 includes a rotating part 210 and a driving part 220. The rotating part 210 is rotatably disposed within the housing 100 and located at the center of the cavity of the housing 100. The rotating part 210 is configured to generate airflow that is drawn in axially and discharged circumferentially during rotation. The driving part 220 is drively connected to the rotating part 210 and is used to drive the rotating part 210 to rotate.

[0025] The flow guide 300 is disposed on the inner wall of the housing 100 and extends spirally along the axial direction of the rotating part 210.

[0026] The atomizing assembly 400 includes an atomizing nozzle 410 disposed within the housing 100. The atomizing nozzle 410 is located between the rotating part 210 and the guide part 300. The atomizing nozzle 410 is configured to spray coolant into the airflow discharged from the rotating part 210. It should be noted that the atomizing nozzle 410 is capable of atomizing the coolant and spraying it out in the form of fine droplets.

[0027] When the heat dissipation device of this embodiment is working, the fan assembly 200 and the atomizing assembly 400 are started simultaneously. The rotating part 210 of the fan assembly 200 rotates at high speed, drawing in air from the axial direction and converting it into a high-speed circumferential airflow. At the same time, the atomizing nozzle 410 directly atomizes and sprays the coolant into this airflow. The coolant droplets are instantly captured, sheared and carried by the airflow to form a uniform gas-liquid mixture. This process effectively avoids the coolant adhering to the internal surface of the device and forming a liquid film, thereby reducing thermal resistance and improving heat dissipation efficiency. Subsequently, the gas-liquid mixture enters the space defined by the guide section 300 and the inner wall of the housing 100. Within this region, constrained by the guide section 300, the gas-liquid mixture transforms from initial radial flow to intense vortex motion, achieving uniform distribution and multiple centrifugal effects. This prolongs the flow path and residence time of the gas-liquid mixture within the housing 100, enhancing heat transfer. Simultaneously, the multiple centrifugal effects further refine the coolant droplets and ensure uniform distribution within the airflow, preventing localized aggregation and strengthening the contact between the gas-liquid mixture and the surface of the guide section 300, thus enhancing convective heat transfer and evaporative cooling processes. Finally, the gas-liquid mixture is guided to the inner wall of the housing 100 and discharged in a concentrated and directional manner through the heat dissipation port 102, directly and efficiently impacting and cooling the chip surface mounted on the mounting surface 101, achieving highly efficient heat dissipation.

[0028] The heat dissipation device of this application combines the dual advantages of spray phase change heat absorption and forced convection of air cooling. It also utilizes vortex motion and centrifugal effect to significantly enhance the disturbance and mixing degree of the gas-liquid mixture, which can cope with high heat flux density. Furthermore, through the spiral guidance of the flow guide 300 and the directional discharge of the heat dissipation port 102, the gas-liquid mixture can actively and continuously flush the chip surface, prevent the formation and thickening of the heat insulation liquid film, reduce the heat dissipation thermal resistance, and achieve high overall heat dissipation efficiency and good heat dissipation effect.

[0029] Reference Figure 2 and Figure 3 As shown, in some embodiments of this application, the outer wall of the housing 100 defines a plurality of mounting surfaces 101, which are arranged circumferentially along the rotating part 210. By providing a plurality of mounting surfaces 101, it is suitable for mounting a plurality of chips, thereby providing efficient heat dissipation for a plurality of chips at the same time. Each chip can share core components or components such as the fan assembly 200, the atomizing assembly 400, and the flow guide 300, which significantly reduces the system complexity, overall power consumption and manufacturing cost in multi-chip scenarios, and provides a compact, reliable and economical heat dissipation solution for high-density electronic devices.

[0030] Reference Figure 2 As shown, in some embodiments of this application, a plurality of heat dissipation vents 102 are uniformly provided on the mounting surface 101 to achieve uniform heat dissipation of the chip mounted on the mounting surface 101, wherein the heat dissipation vents 102 are configured as holes or slits.

[0031] Reference Figure 2 and Figure 3 As shown, in some embodiments of this application, the housing 100 includes a plurality of side plates 110 and a hollow bracket 120. The plurality of side plates 110 are sequentially and fixedly connected in a ring along the circumference of the rotating part 210. The hollow bracket 120 is fixed between the plurality of side plates 110 and along the axial direction of the rotating part 210. The hollow bracket 120 is located at one end of the side plate 110 away from the air inlet side of the rotating part 210. The plurality of side plates 110 and the hollow bracket 120 define the aforementioned cavity to accommodate the rotating part 210, the guide part 300, the atomizing nozzle 410 and other components. The side plates 110 are flat and a mounting surface 101 is formed on the outer wall of the side plates 110. The plurality of side plates 110 form a plurality of mounting surfaces 101 to accommodate the mounting of a plurality of chips. In addition, the heat dissipation port 102 is provided through the side plate 110.

[0032] In some embodiments of this application, the housing 100 may be configured as a regular polyhedral structure (e.g. Figure 2 The octagonal prism structure shown can have its centerline coincide with the rotation axis of the rotating part 210, so as to uniformly dissipate heat from the multiple chips mounted on the multiple mounting surfaces 101.

[0033] In some embodiments of this application, the side plate 110 may be made entirely or partially of a thermally conductive material. The thermally conductive material may be a material with high thermal conductivity, such as copper or aluminum alloy, so as to conduct the heat of the chip to the inside of the housing 100.

[0034] It should be noted that the chip can be connected to the side plate 110 through various connection methods such as fastener connection, thermal adhesive bonding, and snap-fit ​​connection. This embodiment does not make specific limitations on this.

[0035] Reference Figure 1 , Figure 2 and Figure 5 As shown, in some embodiments of this application, the rotating part 210 is a centrifugal impeller, and the driving part 220 is a motor. The motor can be mounted on the hollow bracket 120 of the housing 100, or a base can be provided separately to mount the motor.

[0036] Reference Figure 2 and Figure 3 As shown, in some embodiments of this application, the flow guiding part 300 includes at least one flow guiding fin 301. The flow guiding fin 301 is fixed to the inner wall of the housing 100 and surrounds the rotating part 210 at least once, thus forming a stable and continuous guiding structure, which makes the airflow and coolant droplets mix more fully and evenly. Since the flow guiding fin 301 surrounds the rotating part 210 at least once, the flow field it forms can evenly cover and act on each mounting surface 101, thereby ensuring that the chip installed in any position can obtain a good heat dissipation effect, effectively improving the heat dissipation uniformity in multi-chip heat dissipation scenarios.

[0037] In some embodiments of this application, in order to improve the flow guiding effect, all heat dissipation ports 102 are positioned between the two ends of the flow guiding fins 301 along the axial direction of the rotating part 210, so that all heat dissipation ports 102 are located within the effective flow guiding area formed by the flow guiding fins 301, so that the flow guiding part 300 can fully utilize the breaking and centrifugal strengthening effect of the gas-liquid mixture.

[0038] In some embodiments of this application, the flow guiding part 300 may be designed to include a plurality of flow guiding fins 301, which are arranged at intervals along the axial direction of the rotating part 210, and each flow guiding fin 301 surrounds the rotating part 210 at least once; in addition, the flow guiding part 300 may also be composed of a plurality of fins arranged in a spiral direction, and the coverage angle of a single fin in the circumferential direction of the rotating part 210 may be less than 360 degrees, while maintaining the overall spiral flow guiding function, the layout can be flexibly adjusted according to the position of the heat dissipation port 102.

[0039] Reference Figure 1 , Figure 2 and Figure 4As shown, in some embodiments of this application, the atomizing assembly 400 includes at least one set of atomizing nozzles 410. The set of atomizing nozzles 410 includes a plurality of atomizing nozzles 410 evenly arranged circumferentially along the rotating part 210. This arrangement can establish a uniform spray coverage field for the circumferential airflow formed by the rotating part 210, so that the airflow discharged from the rotating part 210 can be injected with coolant in real time at multiple circumferential angles, thereby realizing rapid and uniform mixing of gas-liquid two-phase flow, so as to provide uniform heat dissipation to the multiple mounting surfaces 101 arranged circumferentially.

[0040] Reference Figure 2 and Figure 4 As shown, in some embodiments of this application, the atomizing component 400 includes multiple sets of atomizing nozzles 410, which are arranged along the axial direction of the rotating part 210. By axially spacing multiple sets of atomizing nozzles 410, the spray range of the coolant can be expanded, further improving the heat dissipation effect.

[0041] Reference Figure 2 and Figure 4 As shown, in some embodiments of this application, the atomizing assembly 400 further includes a plurality of annular tubes 420 and a liquid supply system; the annular tubes 420 are distributed circumferentially along the rotating part 210, and each annular tube 420 corresponds to a group of atomizing nozzles 410, that is, the same group of atomizing nozzles 410 are disposed on the same annular tube 420; the liquid supply system is connected to the plurality of annular tubes 420 and is configured to provide coolant to the plurality of annular tubes 420, which is then atomized and sprayed out through the atomizing nozzles 410. By adopting the above-mentioned structural arrangement, coolant can be provided to each atomizing nozzle 410 at the same time, and the system integration is high.

[0042] Reference Figure 4 As shown, in some embodiments of this application, the liquid supply system includes a pump 430 and a coolant tank 440. An inlet pipe 450 and a return pipe 460 are provided between the coolant tank 440 and the annular pipe 420. The pump 430 is connected to the inlet pipe 450. The inlet pipe 450 and the return pipe 460 are located on opposite sides of the annular pipe 420. By providing the return pipe 460, the coolant that is not atomized and discharged in time in the annular pipe 420 can flow back to the coolant tank 440, which not only avoids the accumulation of coolant in the annular pipe 420 and affects the spray stability, but also realizes the recycling of coolant.

[0043] It should be noted that both the pump 430 and the coolant tank 440 mentioned above are miniature structures.

[0044] Reference Figure 2 and Figure 4As shown, in some embodiments of this application, the atomizing nozzle 410 is configured to spray coolant towards the guide section 300 along the radial direction of the rotating part 210, that is, the atomizing nozzle 410 sprays coolant with the wind. This configuration makes the initial spray direction of the coolant approximately the same as the airflow direction generated by the rotating part 210. The coolant droplets can be instantly captured by the airflow and efficiently sheared and broken up to form a uniformly distributed fine mist field. This not only improves the mixing efficiency and quality of the gas and liquid phases, but also avoids the situation where the coolant falls back onto the atomizing nozzle 410 when spraying against the wind.

[0045] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine different embodiments or examples described in this specification.

[0046] The embodiments of this application have been described in detail above with reference to the accompanying drawings. However, this application is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of this application.

Claims

1. A heat dissipation device, characterized in that, include: The housing has an outer wall that defines a mounting surface suitable for mounting chips, and a plurality of heat dissipation vents extending through to the inner wall of the housing are provided on the mounting surface. A fan assembly, the fan assembly including a rotating part rotatably disposed within the housing, the rotating part being configured to generate an airflow that is drawn in axially and discharged circumferentially during rotation; A flow guide is disposed on the inner wall of the housing and extends spirally along the axial direction of the rotating part; An atomizing assembly, the atomizing assembly including an atomizing nozzle disposed within the housing, the atomizing nozzle being located between the rotating part and the guide part, and configured to spray coolant into the airflow discharged from the rotating part.

2. The heat dissipation device according to claim 1, characterized in that, The outer wall of the housing defines a plurality of mounting surfaces, which are arranged circumferentially along the rotating part.

3. The heat dissipation device according to claim 2, characterized in that, The flow guide includes at least one flow guide fin, which surrounds the rotating part at least once.

4. The heat dissipation device according to claim 2, characterized in that, The atomizing assembly includes at least one set of atomizing nozzles, and the set of atomizing nozzles includes a plurality of atomizing nozzles arranged circumferentially along the rotating part.

5. The heat dissipation device according to claim 4, characterized in that, The atomizing component includes multiple sets of atomizing nozzles, which are arranged along the axial direction of the rotating part.

6. The heat dissipation device according to claim 4, characterized in that, The atomizing component also includes: At least one annular tube, the annular tubes being distributed circumferentially along the rotating portion; A coolant supply system connected to the annular pipe and configured to supply the coolant to the annular pipe; The atomizing nozzles in the same group are arranged on the same annular tube.

7. The heat dissipation device according to claim 1, characterized in that, The mounting surface is evenly provided with multiple heat dissipation vents.

8. The heat dissipation device according to claim 1, characterized in that, The heat dissipation vent is configured as a hole or a slit.

9. The heat dissipation device according to claim 1, characterized in that, The rotating part is a centrifugal impeller.

10. The heat dissipation device according to claim 1, characterized in that, The atomizing nozzle is configured to spray the coolant toward the guide portion in the radial direction of the rotating portion.

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