A heat dissipation device and apparatus

Abstract

The application relates to a heat dissipation device and equipment, and relates to the technical field of heat dissipation of electronic equipment. The heat dissipation device comprises a substrate, a first heat dissipation module and a second heat dissipation module arranged on the substrate. The first heat dissipation module comprises a shell and a plurality of first heat dissipation air ducts arranged in the shell, and the plurality of first heat dissipation air ducts are isolated from each other. The second heat dissipation module comprises a plurality of heat dissipation fins arranged on the substrate, and a second heat dissipation air duct is formed between adjacent heat dissipation fins. The first heat dissipation module with closed first heat dissipation air ducts and the second heat dissipation module with heat dissipation fins are arranged, stable upward airflow is formed in the air duct by using the chimney effect, and the natural convection heat dissipation efficiency is significantly improved. The two modules work cooperatively, the heat dissipation capacity is improved, the manufacturing cost and the maintenance convenience are considered, and the heat dissipation demand of high-power electronic equipment is especially suitable.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology for electronic devices, and in particular to a heat dissipation device and apparatus. Background Technology

[0002] In various power electronic devices, power devices generate a large amount of heat during operation, directly affecting the operational stability and lifespan of the equipment. Therefore, it is usually necessary to add heat dissipation structures to the equipment casing to enhance heat dissipation. Currently, the industry commonly uses finned heat sinks, which increase the contact area with air by placing fins on the surface of the equipment casing, thereby improving heat dissipation efficiency.

[0003] However, this traditional finned heat sink has significant technical limitations in practical applications. First, within a limited space, the heat dissipation area is strictly constrained by the fin height and spacing, making it difficult to effectively expand the heat dissipation area and meet the ever-increasing heat dissipation demands of high-power equipment. Second, the open finned structure lacks effective organization and guidance of airflow, resulting in unstable airflow paths and a tendency for turbulence and backflow. This causes hot air to stagnate in the fin gaps, preventing the formation of a continuous and stable thermal convection channel. This disordered flow significantly reduces the heat exchange efficiency of the heat dissipation system, making traditional heat dissipation structures perform poorly when facing high heat flux density heat dissipation requirements. Utility Model Content

[0004] In order to solve the problems of limited heat dissipation area and low heat dissipation efficiency caused by disordered airflow in existing heat dissipation structures, this application provides a heat dissipation device and equipment.

[0005] The heat dissipation device provided in this application adopts the following technical solution: A heat dissipation device includes a substrate and a first heat dissipation module and a second heat dissipation module disposed on the substrate; the first heat dissipation module includes a housing and a plurality of partitions, the partitions dividing the interior of the housing into a plurality of first heat dissipation channels, the plurality of first heat dissipation channels being isolated from each other; the second heat dissipation module includes a plurality of heat dissipation fins disposed on the substrate, a second heat dissipation channel being formed between adjacent heat dissipation fins.

[0006] By adopting the above technical solution, the first heat dissipation module is based on the chimney effect principle. It guides hot air to form a stable laminar flow from bottom to top through a closed first heat dissipation duct, thereby improving the efficiency of natural convection heat dissipation. The second heat dissipation module expands the heat dissipation area and enhances thermal conductivity through heat dissipation fins and the second heat dissipation duct formed between the heat dissipation fins. The two modules work together to solve the problems of high porosity and limited heat dissipation area in traditional die-casting heat dissipation devices, thereby enhancing the heat dissipation effect.

[0007] In one specific implementation, the first heat dissipation duct runs vertically through the entire space, the heat dissipation fins are inclined, and the inclination direction of the heat dissipation fins intersects with the extension direction of the first heat dissipation duct.

[0008] By adopting the above technical solution, the inclined heat dissipation fins can effectively guide the external airflow along their surface, forming a crossflow with the vertically rising airflow based on the chimney effect in the first heat dissipation module, which enhances the air disturbance and turbulence effect, thereby significantly improving the heat exchange efficiency.

[0009] In one specific implementation, the first heat dissipation module is integrally formed by aluminum extrusion; the second heat dissipation module is integrally formed by die casting.

[0010] By adopting the above technical solution, a first heat dissipation module with a first heat dissipation air duct structure is manufactured by aluminum extrusion process, which enhances natural convection heat dissipation by utilizing the chimney effect. At the same time, a second heat dissipation module manufactured by die casting process provides additional heat dissipation area. The first and second heat dissipation modules work together through reasonable layout to achieve the best balance between heat dissipation performance and manufacturing cost.

[0011] In one specific implementation, the first heat dissipation module is detachably connected to the substrate.

[0012] By adopting the above technical solution, modular maintenance can be achieved through detachable connection, and the first heat dissipation module can be replaced separately when it is damaged, which greatly reduces equipment costs. In one specific implementation, the first heat dissipation module and the second heat dissipation module are disposed at intervals on the substrate, with a heat dissipation gap formed between them.

[0013] By adopting the above technical solution, the heat dissipation gap ensures that air can flow freely in the second heat dissipation channel between the heat dissipation fins, thereby enhancing the convective heat dissipation effect; in addition, it also plays a role in thermal isolation, preventing the two modules from thermally interfering with each other.

[0014] In one specific implementation, the inner wall of the housing and the surface of the partition are provided with heat dissipation teeth protruding into the first heat dissipation duct.

[0015] By adopting the above technical solution, the heat exchange area is greatly increased by utilizing the heat dissipation tooth structure. At the same time, the airflow is guided to flow in an orderly manner in the closed channel, forming a stable laminar flow state, enhancing the chimney effect and improving heat dissipation efficiency.

[0016] In one specific implementation, the first heat dissipation duct is a duct with a continuously serrated cross-section.

[0017] By adopting the above technical solution, the first heat dissipation air duct with a continuous sawtooth cross-section provides a uniform and smooth upward path for the airflow, ensuring that the hot air can flow upward continuously and stably; and it can increase the heat dissipation surface area while maintaining low airflow resistance, so that the natural convection effect can be optimized.

[0018] In one specific implementation, the first heat dissipation duct includes a central duct formed by the inner flange of the heat dissipation tooth structure, and a plurality of toothed sub-ducts formed circumferentially around the central duct.

[0019] By adopting the above technical solution, the central air duct, acting as the main chimney, generates a strong suction force, which drives the airflow in the circumferential toothed sub-air duct to accelerate. The two work together to form an efficient heat dissipation system, ensuring both sufficient suction force and providing ample heat exchange area.

[0020] In one specific implementation, the cross-sectional shape of the central air duct is circular, elliptical, or polygonal.

[0021] By adopting the above technical solutions, central air ducts with different cross-sectional shapes can adapt to various heat dissipation needs. Circular cross-sections have the lowest flow resistance and the best ventilation effect; elliptical cross-sections balance flow resistance and structural strength in a limited space; polygonal cross-sections are easy to manufacture and can provide more heat dissipation edges.

[0022] In one specific implementation, a heat-conducting structure is provided on the contact surface between the housing and the substrate, and / or the inner wall of the first heat dissipation duct is provided with a coating that enhances heat radiation.

[0023] By adopting the above technical solution, the thermally conductive structure on the contact surface fills the gaps, significantly reducing the contact thermal resistance and ensuring that heat is efficiently conducted from the substrate to the first heat dissipation module; the high emissivity coating enhances the surface thermal radiation capability, further improving the heat dissipation effect through radiative heat transfer.

[0024] An apparatus includes a housing, the housing being provided with a heat dissipation device as described above.

[0025] By adopting the above technical solutions, this efficient combined heat dissipation device provides reliable temperature management for the power devices inside the equipment. The heat dissipation design based on the chimney effect ensures stable operation of the equipment in high-temperature environments. The modular design facilitates installation and maintenance, the aluminum extrusion process reduces production costs, and the detachable structure reduces maintenance expenses, thus comprehensively improving the reliability, service life, and market competitiveness of the equipment.

[0026] In summary, the beneficial technical effects of this application are as follows: This heat dissipation device improves heat dissipation performance through a combined structural design; the first heat dissipation module, based on the chimney effect principle, guides hot air to form a stable bottom-up laminar flow through a closed first heat dissipation duct, improving the efficiency of natural convection heat dissipation; the second heat dissipation module expands the heat dissipation area and enhances thermal conductivity through heat dissipation fins and the second heat dissipation duct formed between the fins; the two modules work together to solve the problems of high porosity and limited heat dissipation area in traditional die-cast heat dissipation devices, thereby enhancing the heat dissipation effect; this comprehensive advantage of integrating high-efficiency heat dissipation, low-cost manufacturing, and convenient maintenance enables it to provide reliable temperature management for various equipment while improving the reliability, service life, and market competitiveness of the equipment. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the heat dissipation device in Embodiment 1 of this application.

[0028] Figure 2 This is a structural diagram used to illustrate the first heat dissipation module.

[0029] Figure 3 yes Figure 2 Enlarged view of section A.

[0030] Figure 4 This is a schematic diagram illustrating a heat dissipation tooth structure with equal width design.

[0031] Figure 5 This is a schematic diagram illustrating the structure of a heat dissipation tooth with a variable width design.

[0032] Figure 6 It is a schematic diagram used to show the structure of the heat dissipation device installed on the equipment.

[0033] Figure 7 It is a structural diagram of multiple boxes used to demonstrate a stacked design.

[0034] Figure 8 This is a schematic diagram illustrating the structure of the first heat dissipation duct in Embodiment 2.

[0035] Explanation of reference numerals in the attached drawings: 1. Heat dissipation device; 2. First heat dissipation module; 21. Housing; 211. Mounting hole; 22. First heat dissipation air duct; 221. Central air duct; 222. Toothed sub-air duct; 23. Outer wall fins; 24. Partition plate; 3. Second heat dissipation module; 31. Heat dissipation fins; 32. Second heat dissipation air duct; 4. Base plate; 5. Heat dissipation tooth structure; 51. Continuous toothed protrusion; 52. Discrete toothed protrusion; 6. Heat dissipation gap; 7. Box body. Detailed Implementation

[0036] The following is in conjunction with the appendix Figure 1-8This application will be described in further detail.

[0037] Example 1 Reference Figure 1 This application discloses a heat dissipation device, which mainly includes a substrate 4, a first heat dissipation module 2, and a second heat dissipation module 3.

[0038] In this embodiment, the substrate 4 serves as the mounting base and is preferably made of a metal material with good thermal conductivity (such as aluminum alloy). The size and shape of the substrate 4 can be adjusted according to actual installation requirements. In this embodiment, the substrate 4 is provided with through holes for easy subsequent installation on the equipment.

[0039] Reference Figure 1 and Figure 2 The first heat dissipation module 2 is disposed on the substrate 4 and includes a housing 21 and a plurality of first heat dissipation air channels 22 formed in the housing 21. In this embodiment, the housing 21 is a structure that is open from top to bottom and closed on all sides. This closed design can isolate the hot gas passing through the interior from the external environment, ensuring that the airflow can only flow through the designed first heat dissipation air channels 22 and will not escape to the bypass or short circuit, thus maintaining the stability of the flow channel.

[0040] Reference Figure 2 and Figure 3 The housing 21 is provided with multiple partitions 24, which are vertically arranged. The partitions 24 divide the interior of the housing 21 into multiple first heat dissipation channels 22. The first heat dissipation channels 22 are isolated from each other and connected vertically within the housing 21, forming multiple independent vertical channels. The first heat dissipation channels 22 work based on the chimney effect principle: when heat is conducted from the substrate 4 to the housing 21 and the internal structure, it heats the air in the first heat dissipation channels 22. The hot air rises due to the decrease in density and is discharged from the top. At the same time, cold air is drawn in from the bottom, forming a continuous and stable laminar flow from bottom to top, achieving efficient natural convection heat dissipation.

[0041] Furthermore, the inner wall of the housing 21 and the surface of the partition 24 are provided with heat dissipation tooth structure 5 protruding into the first heat dissipation air duct 22, and the heat dissipation tooth structure 5 extends along its height direction; in this embodiment, multiple partitions 24 are arranged parallel to each other along the length or width direction of the housing 21, dividing the interior of the housing 21 to form multiple parallel first heat dissipation air ducts 22.

[0042] In this embodiment, the heat dissipation tooth structure 5 consists of continuous toothed protrusions 51, which are formed on the two surfaces of the partition 24 and the two opposing inner walls of the housing 21, respectively. Through this design, the first heat dissipation air duct 22 is a duct with a continuous sawtooth cross-section. Multiple continuous sawtooth first heat dissipation air ducts 22 provide a uniform and smooth upward path for airflow, ensuring that hot air can flow upward continuously and stably, avoiding airflow turbulence. It can also increase the heat dissipation surface area while maintaining low airflow resistance, so that the natural convection effect can be optimized.

[0043] Reference Figure 3 and Figure 4 The spacing between the heat dissipation tooth structures 5 is designed such that the spacing between two opposite heat dissipation tooth structures 5 is set as d, which is 0.5-20mm. That is, in this embodiment, in each first heat dissipation air duct 22, the spacing d between two opposite continuous tooth-shaped protrusions 51 is 0.5-20mm. Based on the chimney effect principle, the natural convection effect is best when the spacing d is 4-5mm, and the forced air cooling application is suitable when the spacing d is 3-4mm. When the spacing is 1.2 times the height of the heat dissipation tooth structure 5, the chimney effect is most significant, and the heat exchange can be increased by 30%. The range of 0.5-20mm covers various application scenarios from natural convection to forced air cooling, ensuring that the optimal heat dissipation effect can be achieved under different operating conditions.

[0044] In this embodiment, the width of the continuous toothed protrusions 51 (heat dissipation tooth structure 5) on different partitions 24 can be set to be the same or different as needed (e.g., Figure 3 The equal width design shown, or Figure 4 (as shown in the variable width design). This flexible design allows each first heat dissipation air duct 22 to have an equal heat dissipation surface area while meeting the spacing d requirement between the two toothed protrusions. This ensures the consistency of heat dissipation performance of each air duct and achieves optimal heat distribution and heat dissipation effect.

[0045] A thermally conductive structure (not shown in the figure), such as thermal grease or thermal putty, is provided on the contact surface between the housing 21 and the substrate 4 to fill the microscopic gaps, reduce the contact thermal resistance, and ensure that heat is efficiently conducted from the substrate 4 to the first heat dissipation module 2.

[0046] Reference Figure 1 and Figure 2 The first heat dissipation module 2 and the substrate 4 are detachably connected. In this embodiment, the housing 21 of the first heat dissipation module 2 is provided with mounting holes 211. The mounting holes 211 are holes that pass through the front and back of the housing 21, ensuring that fasteners such as mounting screws can pass smoothly, making it easy to install the first heat dissipation module 2 onto the substrate 4, improving the ease of installation and subsequent maintenance.

[0047] When installing the first heat dissipation module 2, the first heat dissipation module 2 and the second heat dissipation module 3 are spaced apart on the substrate 4 to form a heat dissipation gap 6. The heat dissipation gap 6 provides an independent airflow channel for the heat dissipation fins 31 of the second heat dissipation module 3, allowing air to circulate freely between the heat dissipation fins 31, while preventing the first heat dissipation module 2 and the second heat dissipation module 3 from thermally interfering with each other, ensuring that each performs its best heat dissipation performance.

[0048] Reference Figure 1 and Figure 5 The second heat dissipation module 3 is disposed on the substrate 4, and the first heat dissipation module 2 and the second heat dissipation module 3 are arranged side by side. The second heat dissipation module 3 includes a plurality of heat dissipation fins 31 extending upward from the substrate 4. In this embodiment, the heat dissipation fins 31 are integrally formed with the substrate 4, and a second heat dissipation air channel 32 is formed between two adjacent heat dissipation fins 31. In this embodiment, the heat dissipation fins 31 (i.e., the second heat dissipation duct 32) are inclined, and the inclined direction of the heat dissipation fins 31 (i.e., the extension direction of the second heat dissipation duct 32) intersects with the extension direction of the first heat dissipation duct 22. In this embodiment, the extension direction of the first heat dissipation duct 22 is vertical. One end (bottom end) of the heat dissipation fins 31 is inclined toward the first heat dissipation module 2, and the inclined angle is preferably 5-60°, that is, the heat dissipation fins 31 are set at an angle of 5-60° with the vertical direction. This inclined design can effectively guide the external airflow to flow directionally along the second heat dissipation duct 32 formed between the heat dissipation fins 31, and generate beneficial cross disturbance with the vertical rising airflow in the first heat dissipation module 2 based on the chimney effect, enhance the turbulence effect, and thus significantly improve the heat exchange efficiency. At the same time, the inclined setting increases the effective projected area of ​​the heat dissipation fins 31 in the airflow direction, further expands the heat dissipation surface area, and optimizes the heat dissipation performance.

[0049] Furthermore, a heat dissipation gap 6 is left between the heat dissipation fins 31 and the housing 21 of the first heat dissipation module 2, which ensures smooth airflow and avoids direct contact between the two modules, thus preventing thermal interference.

[0050] The first heat dissipation module 2 is integrally formed by aluminum extrusion, and the second heat dissipation module 3 is integrally formed by die casting. The first heat dissipation module 2, which has a first heat dissipation air duct 22 structure, is manufactured by aluminum extrusion, which enhances natural convection heat dissipation by utilizing the chimney effect. At the same time, the second heat dissipation module 3, which is manufactured by die casting, provides additional heat dissipation area. The first heat dissipation module 2 and the second heat dissipation module 3 work together through a reasonable layout, which can improve the thermal conductivity of the entire heat dissipation device 1 by at least 1 time and the heat dissipation efficiency by 3-5 times. The best balance between heat dissipation performance, manufacturing cost and maintenance convenience is achieved.

[0051] In this embodiment, the outer wall of the housing 21 is also provided with outer wall fins 23. The outer wall fins 23 are integrally formed with the housing 21 by aluminum extrusion process and are arranged to extend in the vertical direction. The outer wall fins 23 further increase the heat dissipation surface area of ​​the first heat dissipation module 2 and work together with the first heat dissipation air duct 22 inside the housing 21 to improve the overall heat dissipation performance.

[0052] Reference Figure 6 This embodiment also discloses a device, including but not limited to high-power electronic devices such as energy storage devices, photovoltaic inverters, and transformers; such devices generate a lot of heat when working and have high requirements for heat dissipation; this embodiment takes an energy storage device as an example.

[0053] In this embodiment, the energy storage device (equipment) includes a housing 7 and heat-generating elements (including battery modules and power modules, etc.) disposed therein, and also includes a heat dissipation device 1 as described above disposed on the housing 7 (for the specific structure of the heat dissipation device 1, please refer to...). Figure 1-5 ).

[0054] The heat dissipation device 1 is mounted on the outside of the equipment housing 7 via the substrate 4 and is positioned corresponding to the position of the heating element inside the housing 7. During operation, the heat generated by the heating element is conducted to the first heat dissipation module 2 and the second heat dissipation module 3 via the substrate 4.

[0055] The first heat dissipation module 2 is based on the chimney effect and achieves efficient natural convection heat dissipation through its internal optimized top-to-bottom and side-closed first heat dissipation air duct 22 structure; the second heat dissipation module 3 increases the heat dissipation area through its heat dissipation fins 31 and the second heat dissipation air duct 32 formed between the heat dissipation fins 31, and further enhances the heat dissipation effect in conjunction with the independent airflow channel provided by the heat dissipation gap 6.

[0056] In practical applications, the heat dissipation device 1 can effectively cope with the instantaneous large amount of heat generated by the equipment during operation. Through the synergistic effect of the dual heat dissipation mechanisms, it ensures that the internal temperature of the equipment is always maintained within a safe range. Especially when the ambient temperature is high, the heat dissipation device 1 can still maintain good heat dissipation performance, avoiding equipment performance degradation or safety hazards caused by overheating.

[0057] Reference Figure 7 In this embodiment, the energy storage device can be a stacked design, including multiple boxes 7, which are stacked vertically, and each box 7 is equipped with a heat dissipation device 1. This stacked layout makes full use of vertical space and improves the space utilization of the device. The heat dissipation device 1 on each box 7 works independently to form a distributed heat dissipation system, which not only ensures the heat dissipation needs of each box 7, but also avoids the mutual conduction and accumulation of heat between the boxes 7. In particular, when multiple boxes 7 are stacked, the hot air generated by the upper box 7 rises and further enhances the chimney effect of the heat dissipation device 1 of the lower box 7, forming a synergistic heat dissipation effect and improving the overall system heat dissipation efficiency. This modular stacking design makes the energy storage device have good scalability and maintainability, and the number of boxes 7 can be flexibly adjusted according to the actual power demand, while facilitating the maintenance and replacement of individual boxes 7.

[0058] The implementation principle of this application embodiment is as follows: through a unique combined heat dissipation device 1, the closed first heat dissipation air duct 22 based on the chimney effect is combined with the heat dissipation fins 31 to form a synergistic heat dissipation effect; specifically, the first heat dissipation module 2 is integrally formed by aluminum extrusion process, and the advantages of this process are used to manufacture the first heat dissipation module 2 with a complex first heat dissipation air duct 22 structure, which has high material density, low porosity and excellent thermal conductivity; the second heat dissipation module 3 is integrally formed by die casting process, which gives full play to the advantages of die casting process in manufacturing complex shape structures and provides sufficient heat dissipation area; When the device is working, the heat generated by the heating element is quickly conducted to the two heat dissipation modules through the substrate 4. The first heat dissipation module 2 utilizes its internal closed first heat dissipation air duct 22 structure to form a continuous and stable airflow circulation based on the physical property of hot air rising, thereby achieving efficient natural convection heat dissipation. At the same time, the second heat dissipation module 3 expands the heat dissipation area through the heat dissipation fins 31 and the second heat dissipation air duct 32 formed between the heat dissipation fins 31, further enhancing the heat dissipation effect. Combined with the reasonable heat dissipation gap 6 design, it ensures unobstructed airflow. This dual heat dissipation mechanism, based on the advantages of different manufacturing processes, works synergistically to overcome the shortcomings of traditional die-cast heat dissipation devices 1, such as high porosity and limited heat dissipation area. It also ensures the precision and thermal conductivity of the first heat dissipation duct 22 through aluminum extrusion. This significantly improves the thermal conductivity and heat dissipation efficiency of the entire heat dissipation device 1. At the same time, the modular design concept not only ensures optimized heat dissipation but also enables convenient maintenance through a detachable connection structure. This effectively controls costs while ensuring long-term reliable operation of the equipment, providing a heat dissipation solution that achieves the best balance between heat dissipation performance, production cost, and maintenance convenience for various high-power electronic devices.

[0059] Example 2 Reference Figure 8 The difference between this embodiment and the first embodiment is that the first heat dissipation air duct 22 is a composite air duct, including a central air duct 221 formed by the inner flange of the heat dissipation tooth structure 5, and a plurality of tooth-shaped sub-air ducts 222 formed circumferentially around the central air duct 221; and in this embodiment, the heat dissipation tooth structure 5 includes a plurality of discrete tooth-shaped protrusions 52 provided on the two side plates of the partition plate 24 and the inner wall of the periphery of the shell 21.

[0060] In this embodiment, multiple partitions 24 are arranged intersecting in the horizontal and vertical directions to form multiple grid areas. The first heat dissipation duct 22 is formed in the grid area. In this embodiment, the discrete toothed protrusions 52 on the partitions 24 and the housing 21 are respectively arranged in correspondence with the multiple grid areas. In each grid region (i.e. each first heat dissipation duct 22), there are four discrete toothed protrusions 52 arranged circumferentially. Each discrete toothed protrusion 52 has an inner flange. The ends of the four inner flanges together form a central air duct 221. The central air duct 221 and the circumferential toothed sub-air ducts 222 formed by the discrete toothed protrusions 52 together form the first heat dissipation duct 22.

[0061] In this embodiment, the distance d between two discrete toothed protrusions 52 (heat dissipation tooth structure 5) arranged opposite each other in each first heat dissipation air duct 22 (grid area) is 0.5-20mm; this distance range can balance the relationship between heat dissipation area and airflow resistance, and ensure that the best heat dissipation effect can be achieved under different working conditions.

[0062] The cross-sectional shape of the central air duct 221 is circular, elliptical, or polygonal. In this embodiment, the cross-sectional shape of the central air duct 221 is preferably circular, that is, each discrete toothed protrusion 52 has an arc-shaped inner flange, and the ends of the four arc-shaped inner flanges together form a circular central air duct 221. The circular cross-section has the lowest flow resistance and the best ventilation effect. The elliptical shape can better balance flow resistance and structural strength in a limited space. The polygonal shape is easy to manufacture and can provide more heat dissipation edges. According to the needs of different application scenarios, a suitable cross-sectional shape can be selected to optimize the heat dissipation performance.

[0063] The implementation principle of this application embodiment is as follows: the first heat dissipation air duct 22 achieves functional zoning and synergistic effect through the composite air duct structure; its central air duct 221 forms a low flow resistance channel with its optimized cross-sectional shape (circular), effectively enhancing the chimney effect. As an airflow accelerator in the system, it effectively enhances the chimney effect, generates stable suction force, and provides continuous airflow power for the entire heat dissipation process; at the same time, multiple toothed sub-air ducts 222 distributed circumferentially around the central air duct 221 serve as heat exchange enhancement areas. Through the dense arrangement of discrete toothed protrusions 52 (heat dissipation tooth structure 5), the effective heat dissipation area is increased, providing sufficient surface area for heat exchange. The combined design of the central air duct 221 and the toothed sub-air duct 222 ensures efficient transmission of airflow power and makes full use of the heat dissipation area. While maintaining structural compactness, it improves overall heat dissipation efficiency and provides a more effective solution for heat dissipation of high-power electronic devices.

[0064] Example 3 This embodiment further optimizes the heat dissipation surface based on any of the aforementioned embodiments. Specifically, the inner wall of the first heat dissipation duct 22 is provided with a coating that enhances heat radiation (not shown in the figure; please refer to the specific structure of the heat dissipation device). Figure 1-5 This coating can increase the surface's thermal emissivity, further enhancing heat dissipation through radiative heat transfer.

[0065] In this embodiment, the coating that enhances thermal radiation is preferably a blackening treatment, that is, a black aluminum oxide coating is formed on the surface of the aluminum material through anodizing process; this treatment can not only improve the surface thermal emissivity and further improve the heat dissipation effect through radiative heat transfer, but also provide anti-corrosion protection and extend service life.

[0066] In other embodiments, nano-coating technology can also be used to enhance the heat dissipation effect; for example, by preparing a nanoscale metal oxide coating (such as Ad2O3, TiO2, etc.) on the surface, the high specific surface area and quantum effect of nanomaterials can be used to enhance the thermal radiation performance; in practical applications, appropriate surface treatment processes and coating materials can be selected according to the specific working environment, usage requirements and cost budget of the heat dissipation device 1 to achieve the best heat dissipation effect and service life.

[0067] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A heat dissipation device, characterized in that: The device includes a substrate and a first heat dissipation module and a second heat dissipation module disposed on the substrate. The first heat dissipation module includes a housing and a plurality of partitions, the partitions dividing the interior of the housing into a plurality of first heat dissipation channels, the plurality of first heat dissipation channels being isolated from each other. The second heat dissipation module includes a plurality of heat dissipation fins disposed on the substrate, and a second heat dissipation channel is formed between adjacent heat dissipation fins.

2. The heat dissipation device according to claim 1, characterized in that: The first heat dissipation duct runs vertically through the entire space. The heat dissipation fins are inclined, and the inclination direction of the heat dissipation fins intersects with the extension direction of the first heat dissipation duct.

3. The heat dissipation device according to claim 1, characterized in that: The first heat dissipation module is integrally formed using an aluminum extrusion process; The second heat dissipation module is integrally formed using a die-casting process.

4. The heat dissipation device according to claim 1, characterized in that: The first heat dissipation module is detachably connected to the substrate.

5. The heat dissipation device according to claim 1, characterized in that: The first heat dissipation module and the second heat dissipation module are disposed at intervals on the substrate, and a heat dissipation gap is formed between them.

6. The heat dissipation device according to claim 1, characterized in that: The inner wall of the housing and the surface of the partition are provided with heat dissipation teeth that protrude into the first heat dissipation duct.

7. The heat dissipation device according to claim 6, characterized in that: The first heat dissipation duct is a duct with a continuously sawtooth cross-section.

8. The heat dissipation device according to claim 6, characterized in that: The first heat dissipation duct includes a central duct formed by the inner flange of the heat dissipation tooth structure, and a plurality of tooth-shaped sub-ducts formed around the central duct in the circumferential direction; the cross-sectional shape of the central duct is circular, elliptical or polygonal.

9. The heat dissipation device according to claim 1, characterized in that: The contact surface between the housing and the substrate is provided with a heat-conducting structure, and / or the inner wall of the first heat dissipation duct is provided with a coating that enhances heat radiation.

10. A device, characterized in that: Includes a housing, the housing being provided with a heat dissipation device as described in any one of claims 1-9.

Images