A heat sink for electronic components

Abstract

The utility model belongs to the technical field of electronic components, especially a radiator for electronic components. Including radiator structure and dismouting formula heat dissipation fan structure, dismouting formula heat dissipation fan structure includes splicing frame, and the inside movable insertion of splicing frame has dust screen and heat dissipation fan body. Through setting up dismouting formula heat dissipation fan structure, when the surface of heat dissipation fan body or dust screen accumulates more dust, only need to pull up dust screen and heat dissipation fan body from splicing frame, so that dust screen and heat dissipation fan body can conveniently and quickly install and dismount, thereby can clean dust screen and heat dissipation fan body, the whole process is simple and efficient and further relieves the work burden of maintenance personnel, and the dismouting formula design also effectively solves the dismounting difficult problem caused by the compact internal space of equipment, since the complex operation in the narrow space is not needed, the equipment damage risk caused by inconvenient operation is avoided.

Description

Technical Field

[0001] This utility model relates to the field of electronic components technology, specifically a heat sink for electronic components. Background Technology

[0002] Electronic components are the components of electronic parts and small machines and instruments. They are often composed of several parts and can be used interchangeably in similar products. They often refer to certain parts in industries such as electrical appliances, radio, and instruments, and are a general term for electronic devices such as capacitors, transistors, hairsprings, clock springs, and processor chips.

[0003] Because processor chips consume electrical energy and generate significant heat during operation, heatsinks are often installed to effectively dissipate heat and ensure they operate within a suitable temperature range, preventing overheating damage. Heatsinks conduct heat generated by the processor chip to their surface, and then dissipate the heat through airflow generated by cooling fans, thus maintaining the processor chip's temperature within a safe range.

[0004] When effective heat dissipation is required for the processor chip in a computer system, dust and impurities gradually accumulate on the surface of its cooling fan as the chip operates at high speed continuously. This dust buildup not only significantly reduces heat dissipation efficiency but can also cause the processor temperature to rise, thus affecting the stability and lifespan of the device. Therefore, to ensure effective heat dissipation and the normal operation of the processor chip, maintenance personnel must periodically remove the cooling fan from the heatsink assembly for thorough cleaning and maintenance. However, this process not only increases the workload of the staff but, in most cases, because the internal space of devices housing processor chips is typically very compact and limited, removing and installing the cooling fan becomes both time-consuming and laborious, further reducing maintenance efficiency and potentially introducing unnecessary operational risks.

[0005] Therefore, we propose a heat sink for electronic components to solve the above problems. Utility Model Content

[0006] (a) Technical problems to be solved

[0007] In view of the shortcomings of the prior art, this utility model provides a heat sink for electronic components, which solves the problems mentioned in the background art.

[0008] (II) Technical Solution

[0009] To achieve the above objectives, this utility model specifically adopts the following technical solution:

[0010] A heat sink for electronic components includes a heat sink structure and a detachable cooling fan structure. The detachable cooling fan structure includes a splicing frame, and a dustproof mesh and a cooling fan body are movably inserted into the splicing frame.

[0011] The splicing frame includes two base plates, and an overlapping vertical plate, a front splicing plate, and a rear splicing plate are fixedly installed on the top of the base plates. The dustproof net is located between the overlapping vertical plate and the front splicing plate, and the cooling fan body is located between the front splicing plate and the rear splicing plate.

[0012] Furthermore, the radiator structure includes a heat dissipation fin assembly, inside which a heat dissipation copper pipe is welded, and the top end of the heat dissipation copper pipe extends above the heat dissipation fin assembly and is fixedly installed with a connecting plug.

[0013] Furthermore, an aluminum contact seat is welded to the bottom end of the heat dissipation copper pipe, and a mounting bracket is provided on the outer edge of the aluminum contact seat. The aluminum contact seat is connected to the processor chip through the mounting bracket.

[0014] Furthermore, both the front and rear splicing panels have snap-fit ​​grooves inside. A first fitting frame is movably inserted between two oppositely arranged front splicing panels through the snap-fit ​​grooves, and a second fitting frame is movably inserted between two oppositely arranged rear splicing panels through the snap-fit ​​grooves.

[0015] Furthermore, shielding strips are fixedly installed at the opposite ends of the first and second bonding frames, and the shielding strips are located above the connection between the first and second bonding frames and the cooling fan body.

[0016] Furthermore, the front and back sides of the front and rear splicing plates are rotatably connected to sliding rollers, which overlap with the front and back sides of the first and second bonding frames.

[0017] Furthermore, a snap-fit ​​claw is fixedly installed on the back side of the base plate, and the snap-fit ​​claw is movably inserted into the lowest end of the back side of the heat dissipation fin assembly. A side wall overlap plate is fixedly installed on the back side of the rear splicing plate, and the side wall overlap plate overlaps with the side end of the heat dissipation fin assembly.

[0018] (III) Beneficial Effects

[0019] Compared with the prior art, the present invention provides a heat sink for electronic components, which has the following advantages:

[0020] This invention, through the design of a detachable cooling fan structure, allows for easy and quick installation and removal of the dust filter and cooling fan body when a large amount of dust accumulates on their surface or on the dustproof screen. This facilitates cleaning of the dust filter and cooling fan body. The entire process is simple and efficient, reducing the workload of maintenance personnel. Furthermore, the detachable design effectively solves the problem of difficult disassembly and assembly due to the compact internal space of the equipment. Since complex operations are not required in a confined space, the risk of equipment damage due to inconvenient operation is avoided, thus improving the safety and reliability of maintenance work. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of this utility model;

[0022] Figure 2 This is a schematic diagram of the radiator structure of this utility model;

[0023] Figure 3 This is a bottom view of the radiator structure of this utility model;

[0024] Figure 4 This is a schematic diagram of the detachable cooling fan structure of this utility model;

[0025] Figure 5 This is an exploded view of the detachable cooling fan structure of this utility model;

[0026] Figure 6 This is an exploded view of the splicing frame of this utility model.

[0027] In the diagram: 1. Radiator structure; 101. Heat dissipation fin assembly; 102. Copper heat dissipation pipe; 103. Connecting plug; 104. Aluminum contact seat; 105. Mounting bracket; 2. Detachable cooling fan structure; 201. Splicing frame; 202. Dustproof net; 203. Cooling fan body; 204. Base plate; 205. Overlapping vertical plate; 206. Front splicing plate; 207. Rear splicing plate; 208. Snap-fit ​​groove; 209. First fitting frame; 210. Second fitting frame; 211. Shielding strip; 212. Sliding roller; 213. Snap-fit ​​claw; 214. Side wall overlap plate. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0029] Example

[0030] like Figure 1-6 As shown, an embodiment of the present invention provides a heat sink for electronic components, including a heat sink structure 1 and a detachable cooling fan structure 2. The detachable cooling fan structure 2 includes a splicing frame 201, and a dustproof mesh 202 and a cooling fan body 203 are movably inserted into the splicing frame 201.

[0031] The splicing frame 201 includes two base plates 204. The top of the base plates 204 are fixedly installed with an overlapping vertical plate 205, a front splicing plate 206 and a rear splicing plate 207. The dustproof net 202 is located between the overlapping vertical plate 205 and the front splicing plate 206. The cooling fan body 203 is located between the front splicing plate 206 and the rear splicing plate 207.

[0032] like Figure 2 As shown, in some embodiments, the radiator structure 1 includes a heat dissipation fin assembly 101, with a heat dissipation copper pipe 102 welded inside the heat dissipation fin assembly 101. The top end of the heat dissipation copper pipe 102 extends above the heat dissipation fin assembly 101 and is fixedly installed with a connecting plug 103.

[0033] Specifically, by utilizing the excellent thermal conductivity of the heat dissipation copper pipe 102, the heat generated by the processor chip can be quickly transferred to the heat dissipation fin assembly 101. The heat dissipation fin assembly 101 increases the heat dissipation area, accelerating the dissipation of heat into the surrounding air. Meanwhile, the connecting plug 103 serves to seal and connect other components, ensuring the stable operation of the heat dissipation system.

[0034] like Figure 3 As shown, in some embodiments, an aluminum contact seat 104 is welded to the bottom end of the heat dissipation copper pipe 102, and a mounting bracket 105 is provided on the outer edge of the aluminum contact seat 104. The aluminum contact seat 104 is connected to the processor chip through the mounting bracket 105.

[0035] Specifically, due to the excellent thermal conductivity and light weight of aluminum, the contact base made of aluminum can not only efficiently conduct the heat generated by the processor chip during operation to the heat pipe 102, but its lightweight characteristics also help to reduce the weight of the overall heat dissipation module.

[0036] like Figure 6 As shown, in some embodiments, both the front splicing plate 206 and the rear splicing plate 207 have a snap-fit ​​groove 208 inside. The two front splicing plates 206 arranged opposite each other are movably connected to each other through the snap-fit ​​groove 208 with a first fitting frame 209, and the two rear splicing plates 207 arranged opposite each other are movably connected to each other through the snap-fit ​​groove 208 with a second fitting frame 210.

[0037] Specifically, the first bonding frame 209 and the second bonding frame 210 are interspersed between the dustproof net 202, the cooling fan body 203 and the radiator structure 1, so that the connection effect and ventilation effect of the dustproof net 202, the cooling fan body 203 and the radiator structure 1 are more ideal.

[0038] This interlocking connection structure not only enhances the stability between components, preventing them from loosening or shifting due to vibration during equipment operation, but also ensures smooth airflow within the heat dissipation system.

[0039] When the cooling fan 203 is running, air can pass through the dust filter 202 without obstruction and enter the area of ​​the heat sink fin assembly 101, effectively carrying away the heat from the heat sink fins and thus improving the overall heat dissipation efficiency of the radiator. Moreover, this design is also very convenient for maintenance and component replacement. The first mounting frame 209 and the second mounting frame 210 can be easily removed or installed using the operating card slot 208, facilitating the inspection, cleaning, or replacement of the dust filter 202 and the cooling fan 203, reducing maintenance costs and time.

[0040] like Figure 6 As shown, in some embodiments, shielding strips 211 are fixedly installed at the opposite ends of the first fitting frame 209 and the second fitting frame 210, and the shielding strips 211 are located above the connection between the first fitting frame 209 and the second fitting frame 210 and the cooling fan body 203.

[0041] Specifically, the shielding strip 211 forms an effective protective barrier, significantly reducing the chance of dust and other fine impurities entering the device through the connection gap between the first bonding frame 209, the second bonding frame 210, and the cooling fan body 203.

[0042] This design not only helps maintain the cleanliness of the internal environment of the cooling fan body 203, reducing the risk of performance degradation or failure due to the accumulation of contaminants, but also effectively ensures the continuous and stable operation of the cooling fan, thereby improving the overall working efficiency and reliability of the equipment, and significantly extending the service life of the cooling fan.

[0043] like Figure 6 As shown, in some embodiments, the front and back sides of the front splicing plate 206 and the rear splicing plate 207 are rotatably connected to sliding rollers 212, and the sliding rollers 212 overlap with the front and back sides of the first fitting frame 209 and the second fitting frame 210.

[0044] Specifically, the design of the sliding roller 212 optimizes the user experience during the assembly and disassembly of the first fitting frame 209 and the second fitting frame 210, effectively reducing the frictional resistance between components, making the entire operation process smoother and significantly improving user convenience and overall work efficiency.

[0045] like Figure 6 As shown, in some embodiments, a snap-fit ​​claw 213 is fixedly installed on the back side of the base plate 204, and the snap-fit ​​claw 213 is movably inserted into the lowest end of the back side of the heat dissipation fin assembly 101. A side wall overlapping plate 214 is fixedly installed on the back side of the rear splicing plate 207, and the side wall overlapping plate 214 overlaps with the side end of the heat dissipation fin assembly 101.

[0046] Specifically, the snap-fit ​​claw 213 and the side wall lap plate 214 are key connecting components of the detachable cooling fan structure 2. Through the tight fit between the snap-fit ​​claw 213 and the heat sink structure 1, and the multi-point support and fixation of the fan body by the side wall lap plate 214, the detachable cooling fan structure 2 can be firmly installed on the heat sink structure 1, effectively avoiding displacement or tilting caused by loose connection.

[0047] This not only ensures the integrity and consistency of the overall structure of the radiator, but also significantly suppresses vibration and shaking during the continuous operation of the cooling fan, thereby improving heat dissipation efficiency and system stability.

[0048] In use, the aluminum contact base 104 is first attached to the CPU chip, and then the aluminum contact base 104 is connected to the CPU chip through the mounting bracket 105.

[0049] Next, the two sets of base plates 204 are inserted into the side wall of the heat dissipation fin assembly 101, so that the locking claw 213 and the side wall overlapping plate 214 are precisely connected and securely installed with the lowest end and the side end of the back of the heat dissipation fin assembly 101, respectively, ensuring that the detachable cooling fan structure 2 and the heat sink structure 1 are tightly integrated into a whole.

[0050] Next, carefully place the dustproof net 202 within the specific space formed by the overlapping vertical plate 205 and the front splicing plate 206, ensuring its accurate positioning to achieve good dustproof performance. Then, place the cooling fan body 203 in the pre-designed position between the front splicing plate 206 and the rear splicing plate 207 to ensure stable operation of the cooling fan body 203.

[0051] Subsequently, the first bonding frame 209 is accurately inserted through the snap-fit ​​slot 208 on the front splicing plate 206, so that the first bonding frame 209 is tightly bonded to the dustproof mesh 202 and the cooling fan body 203.

[0052] Similarly, the second bonding frame 210 is inserted through the snap-fit ​​slot 208 on the rear splicing plate 207, so that the second bonding frame 210 is tightly connected to the cooling fan body 203 and the heat sink structure 1.

[0053] During this process, it is important to ensure that the shielding strips 211 on the first bonding frame 209 and the second bonding frame 210 are in the correct positions to effectively prevent dust from entering.

[0054] During the operation of the CPU, the heat pipe 102 quickly conducts the heat generated by the processor chip to the heat sink 101. The heat sink 101 increases the heat dissipation area and accelerates the dissipation of heat into the surrounding air.

[0055] At the same time, the cooling fan 203 operates, driving airflow. The air passes through the dust filter 202 and enters the heat sink fin assembly 101 area, effectively carrying away the heat from the heat sink fins, thereby ensuring that the processor chip operates stably within a suitable temperature range.

[0056] When it is necessary to clean and maintain the cooling fan body 203 or the dust filter 202, simply follow the reverse steps of installation, and lift the first fitting frame 209 and the second fitting frame 210 upwards to remove the dust filter 202 and the cooling fan body 203 from the splicing frame 201 for cleaning.

[0057] In summary, by setting up the detachable cooling fan structure 2, when a lot of dust accumulates on the surface of the cooling fan body 203 or the dust filter 202, simply pull the dust filter 202 and the cooling fan body 203 upwards from the splicing frame 201. This allows for convenient and quick installation and removal of the dust filter 202 and the cooling fan body 203, enabling cleaning of the dust filter 202 and the cooling fan body 203. The entire process is simple and efficient, reducing the workload of maintenance personnel. At the same time, the detachable design effectively solves the problem of difficult disassembly and assembly caused by the compact internal space of the equipment. Since complex operations are not required in a confined space, the risk of equipment damage due to inconvenient operation is avoided, improving the safety and reliability of maintenance work.

[0058] It should be noted that parts have a lifespan and can be replaced during regular maintenance when they no longer meet performance requirements. Deterioration in performance due to prolonged use of parts is not a design defect of this application.

[0059] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A heat sink for electronic components, comprising a heat sink structure (1) and a detachable cooling fan structure (2), characterized in that: The detachable cooling fan structure (2) includes a splicing frame (201), and a dustproof net (202) and a cooling fan body (203) are movably inserted into the splicing frame (201); The splicing frame (201) includes two base plates (204). The top of the base plate (204) is fixedly installed with an overlapping vertical plate (205), a front splicing plate (206) and a rear splicing plate (207). The dustproof net (202) is located between the overlapping vertical plate (205) and the front splicing plate (206). The cooling fan body (203) is located between the front splicing plate (206) and the rear splicing plate (207).

2. The heat sink for electronic components according to claim 1, characterized in that: The radiator structure (1) includes a heat dissipation fin assembly (101), and a heat dissipation copper pipe (102) is welded inside the heat dissipation fin assembly (101). The top end of the heat dissipation copper pipe (102) extends above the heat dissipation fin assembly (101) and is fixedly installed with a connecting plug (103).

3. A heat sink for electronic components according to claim 2, characterized in that: An aluminum contact seat (104) is welded to the bottom end of the heat dissipation copper pipe (102). A mounting bracket (105) is provided on the outer edge of the aluminum contact seat (104). The aluminum contact seat (104) is connected to the processor chip through the mounting bracket (105).

4. A heat sink for electronic components according to claim 1, characterized in that: Both the front splicing plate (206) and the rear splicing plate (207) have snap-fit ​​grooves (208) inside. The two front splicing plates (206) arranged opposite each other are movably connected to each other through the snap-fit ​​grooves (208) with a first fitting frame (209). The two rear splicing plates (207) arranged opposite each other are movably connected to each other through the snap-fit ​​grooves (208) with a second fitting frame (210).

5. A heat sink for electronic components according to claim 4, characterized in that: A shielding strip (211) is fixedly installed at the opposite ends of the first bonding frame (209) and the second bonding frame (210). The shielding strip (211) is located above the connection between the first bonding frame (209), the second bonding frame (210) and the cooling fan body (203).

6. A heat sink for electronic components according to claim 4, characterized in that: The front and back sides of the front splicing plate (206) and the rear splicing plate (207) are rotatably connected with sliding rollers (212), and the sliding rollers (212) overlap with the front and back sides of the first fitting frame (209) and the second fitting frame (210).

7. A heat sink for electronic components according to claim 1, characterized in that: A snap-fit ​​claw (213) is fixedly installed on the back side of the base plate (204), and the snap-fit ​​claw (213) is movably inserted into the lowest end of the back side of the heat dissipation fin assembly (101). A side wall overlap plate (214) is fixedly installed on the back side of the rear splicing plate (207), and the side wall overlap plate (214) overlaps with the side end of the heat dissipation fin assembly (101).

Images