Improved chisel radiator

CN224909962UActive Publication Date: 2026-10-27SHEN ZHEN HAOYANG HUIFENG TECHNOLONGY CO LTD
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Patent Information

Application Number
CN202522498603.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-11-25
Publication Date
2026-10-27
Estimated Expiration
2035-11-25

AI Technical Summary

Technical Problem

[0003]然而,在高温焊接过程中,焊料容易沿齿间缝隙流动,导致齿间堵塞,影响液体流通,进而降低散热效率

Benefits of technology

[0014]本实用新型提供了一种改进型铲齿散热器。具备以下有益效果:

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Abstract

The application discloses an improved toothed heat sink, relates to the technical field of electronic heat dissipation, and improves the phenomenon that solder easily flows along tooth gap, causes tooth blockage, and influences liquid circulation in a high-temperature welding process, and comprises a base plate, a group of fins are arranged on the upper surface of the base plate, a solder plate is arranged above the fins, a group of fin insertion holes corresponding to the size of the fins are arranged on the solder plate, the positions of the fin insertion holes correspond to the laying positions of the group of fins on the base plate, the solder plate is in abutment with the fins on the base plate through the fin insertion holes, reinforcing frames are arranged on the outer sides of the fins, fin insertion grooves are formed in the upper surface of the base plate, the fins are arranged in the fin insertion grooves, and ventilation holes are formed between two fins. The application can be designed in a way that the upper end of the fins is bent by 90 degrees at the top end of the tooth, and effectively solves the performance degradation problem of the traditional toothed heat sink caused by the inflow of solder into the tooth gap.
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Description

Technical Field

[0001] This utility model relates to the field of electronic heat dissipation technology, and in particular to an improved spade-tooth heat sink. Background Technology

[0002] As a highly efficient passive heat dissipation component, the serrated heat sink is formed by directly shaving heat dissipation teeth onto a metal substrate. It boasts core advantages such as integrated heat dissipation teeth and substrate, no contact thermal resistance, and high heat transfer efficiency. It is widely used in electronic devices (such as CPUs and power modules), industrial controllers, automotive electronics, and new energy equipment. Due to its compact structure and large heat dissipation area, the serrated heat sink is widely applied in electronic devices. In traditional designs, the 0.15 mm thick serrated tips are typically welded directly to the top.

[0003] However, during high-temperature welding, solder can easily flow along the gaps between the teeth, causing blockages, affecting fluid flow, and thus reducing heat dissipation efficiency. Furthermore, improper solder flow can also lead to increased local thermal resistance and even structural failure. Therefore, a new connection method is urgently needed to solve the problem of solder flowing into the gaps between the teeth, while maintaining the feasibility of the manufacturing process and cost control. Utility Model Content

[0004] (a) Technical problems to be solved

[0005] To address the problems existing in the prior art, this utility model provides an improved shovel-tooth radiator.

[0006] (II) Technical Solution

[0007] To achieve the above objectives, this utility model is implemented through the following technical solution: an improved spade-shaped heat sink, comprising a base plate, a set of fins disposed on the upper surface of the base plate, a solder plate disposed above the fins, a set of fin insertion holes corresponding to the size of the fins disposed on the solder plate, the position of the fin insertion holes corresponding to the laying position of the set of fins on the base plate, the solder plate abutting against the fins on the base plate through the fin insertion holes, and a reinforcing frame disposed on the outer side of the fins.

[0008] As a preferred embodiment of the improved spade-shaped heat sink of this utility model, the upper surface of the substrate is provided with fin slots, the fins are disposed inside the fin slots, ventilation holes are formed between two fins, and the ventilation holes are spaced apart from the fin insertion holes.

[0009] In a preferred embodiment of the improved toothed radiator described in this utility model, the lower surface of the solder plate is bonded to the upper surface of the fins.

[0010] In a preferred embodiment of the improved spade-shaped heat sink of this utility model, the area of ​​the solder plate is larger than the area of ​​the fins, and a downwardly extending guide plate is provided on the lower surface of the solder plate near the side wall.

[0011] As a preferred embodiment of the improved shovel-tooth radiator of this utility model, the shovel teeth at the upper end of the fins are provided with a 90° curved portion, and the curved portion is integrally formed with the fins.

[0012] In a preferred embodiment of the improved spade-shaped radiator of this utility model, the area of ​​the reinforcing frame is the same as the area of ​​the substrate, a rubber pad is provided on the outer surface of the reinforcing frame, and ventilation holes are provided on the outer surface of the reinforcing frame.

[0013] (III) Beneficial Effects

[0014] This utility model provides an improved spade-shaped radiator. It has the following beneficial effects:

[0015] 1. By designing the 0.15 mm portion at the tip of the spade teeth as a 90-degree right-angle bend, a surface contact connection is formed with the top during welding. This design creates a distinct right-angle turn at the connection, effectively blocking the path of solder flow along the tooth side and significantly reducing the risk of solder seeping into the inter-tooth space. The 90-degree bend at the tip of the spade teeth fits flush with the top plane of the heat sink during assembly and is fixed by welding. The presence of the bend creates a natural flow-blocking structure for the solder at the connection, preventing the solder plate from melting into liquid at high temperatures and flowing into the gap between the spade teeth, thus preventing its diffusion into the inter-tooth space.

[0016] 2. By adding a solder plate and using a plug-in method, the solder plate is quickly fixed to the fins on the substrate to form a whole, which improves the overall strength of the fins and effectively avoids the phenomenon of individual fins bending under external force. It has the advantages of simple structure, convenient installation and obvious effect. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0019] Figure 2 This is a schematic diagram of the internal structure of this utility model.

[0020] Figure 3 This is a schematic diagram of the substrate and fin structure of this utility model.

[0021] Figure 4 This is a partial structural schematic diagram of the present invention.

[0022] Figure 5 This is a schematic diagram of the structure at point A of this utility model.

[0023] In the figure, 1 is the substrate; 2 is the fin; 201 is the fin slot; 202 is the ventilation hole; 3 is the solder plate; 4 is the reinforcement frame; and 401 is the vent hole. Detailed Implementation

[0024] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0025] Example 1

[0026] Reference Figure 1 , Figure 2 , Figure 3 and Figure 4 This is the first embodiment of the present invention. This embodiment provides an improved spade-tooth heat sink, including a base plate 1. A set of fins 2 are provided on the upper surface of the base plate 1. A solder plate 3 is provided above the fins 2. The solder plate 3 is provided with a set of fin insertion holes corresponding to the size of the fins 2. The position of the fin insertion holes corresponds to the laying position of the set of fins 2 on the base plate 1. The solder plate 3 abuts against the fins 2 on the base plate 1 through the fin insertion holes. A reinforcing frame 4 is provided on the outer side of the fins 2.

[0027] Specifically, a fin slot 201 is provided on the upper surface of the substrate 1, and the fin 2 is disposed inside the fin slot 201. A ventilation hole 202 is formed between the two fins 2, and the ventilation hole 202 is spaced apart from the fin insertion hole. The lower surface of the solder plate 3 is bonded to the upper surface of the fin 2.

[0028] Furthermore, by designing the 0.15 mm portion at the tip of the spade on fin 2 as a 90-degree right-angle bend, a surface contact connection is formed with the top during welding. This design creates a distinct right-angle turn at the connection point, effectively blocking the path of solder flow along the tooth side and significantly reducing the risk of solder seeping into the tooth gaps. The tip of the spade on fin 2 has a 90-degree bend, which fits against the top plane of the heat sink during assembly and is fixed by welding. The presence of the bend creates a natural flow-blocking structure for the solder at the connection point, preventing the solder plate 3 from melting into liquid at high temperatures and flowing into the gap between the spade teeth, thus preventing it from spreading into the tooth gaps.

[0029] Example 2

[0030] Reference Figure 1 , Figure 2 , Figure 4 and Figure 5 This is the second embodiment of the present invention, which is based on the previous embodiment.

[0031] The area of ​​solder plate 3 is larger than that of fin 2. A downwardly extending guide plate is provided on the lower surface of solder plate 3 near the side wall. The shovel teeth at the upper end of fin 2 are provided with a 90° curved part, and the curved part is integrated with fin 2.

[0032] Specifically, the area of ​​the reinforcing frame 4 is the same as that of the substrate 1, the outer surface of the reinforcing frame 4 is provided with a rubber pad, and the outer surface of the reinforcing frame 4 is provided with a vent hole 401.

[0033] Furthermore, by adding a solder plate 3, the solder plate 3 is quickly fixed to the fins 2 on the substrate 1 through a plug-in method, forming a whole, which improves the overall strength of the fins 2 and effectively avoids the phenomenon of bending of individual fins 2 under external force. It has the advantages of simple structure, convenient installation and obvious effect.

[0034] Working Principle: During use, the 0.15 mm portion at the tip of the spade on fin 2 is designed with a 90-degree right-angle bend, forming a surface contact connection with the top during welding. This design creates a distinct right-angle turn at the connection, effectively blocking the path of solder flow along the tooth side and significantly reducing the risk of solder seeping into the inter-tooth space. The 90-degree bend at the tip of the spade on fin 2 fits against the top plane of the heatsink during assembly and is fixed by welding. The presence of the bend creates a natural flow barrier for the solder at the connection, preventing it from diffusing into the inter-tooth space. This structure can be achieved through stamping or precision bending processes, requiring no additional materials or complex procedures. Mass production can be achieved simply by adding a bending step to the existing spade processing flow. It is not only suitable for traditional spade heatsinks but can also be integrated with heat pipes, vapor chambers, and other heat dissipation modules, expanding its applications in high-performance computing, LED lighting, power modules, and other fields. The 90° bend structure forms a physical barrier, cutting off the solder flow path while keeping the inter-tooth space open, ensuring unobstructed liquid flow and preventing solder from seeping into the inter-tooth space. By blocking the gaps between the teeth, the designed heat dissipation area is maintained, the thermal resistance is reduced, the overall heat dissipation performance is improved, the local stress concentration caused by solder flow is reduced, and the reliability of the structure under high temperature cycling is enhanced. Moreover, only the tooth forming mold needs to be adjusted, without the need for additional materials or complex processes, which is suitable for rapid switching of existing production lines. By adding a solder plate 3, the solder plate 3 is quickly fixed to the fins 2 on the substrate 1 through a plug-in method to form a whole, which improves the overall strength of the fins 2 and effectively avoids the phenomenon of bending of individual fins 2 under external force. It has the advantages of simple structure, convenient installation and obvious effect.

[0035] It should be noted that in this paper, relational terms such as first and second are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations.

Claims

1. An improved spade-shaped heat sink, comprising a substrate (1), characterized in that: A set of fins (2) is provided on the upper surface of the substrate (1). A solder plate (3) is provided above the fins (2). A set of fin insertion holes corresponding to the size of the fins (2) are provided on the solder plate (3). The position of the fin insertion holes corresponds to the laying position of the set of fins (2) on the substrate (1). The solder plate (3) abuts against the fins (2) on the substrate (1) through the fin insertion holes. A reinforcing frame (4) is provided on the outer side of the fins (2).

2. The improved spade-shaped radiator according to claim 1, characterized in that: The upper surface of the substrate (1) is provided with a fin slot (201), the fin (2) is disposed inside the fin slot (201), a ventilation hole (202) is formed between the two fins (2), and the ventilation hole (202) is spaced apart from the fin insertion hole.

3. The improved spade-tooth radiator according to claim 1, characterized in that: The lower surface of the solder plate (3) is bonded to the upper surface of the fin (2).

4. The improved spade-tooth radiator according to claim 1, characterized in that: The area of ​​the solder plate (3) is larger than the area of ​​the fin (2), and a downwardly extending guide plate is provided on the lower surface of the solder plate (3) near the side wall.

5. An improved spade-shaped radiator according to claim 1, characterized in that: The upper end of the fin (2) has a 90° curved portion, and the curved portion is integrally formed with the fin (2).

6. An improved spade-shaped radiator according to claim 1, characterized in that: The area of ​​the reinforcing frame (4) is the same as that of the substrate (1). The outer surface of the reinforcing frame (4) is provided with a rubber pad and a vent hole (401) is opened on the outer surface of the reinforcing frame (4).