High heat conduction efficiency profile heat sink

Abstract

The utility model relates to a high heat conduction efficiency section bar radiator in the field of heat dissipation, including the heat dissipation base plate, the heat dissipation base plate upper surface installs the heat conduction fin group by the wave -shaped fin, and the wave -shaped fin bottom is provided with inverted trapezoidal flared end; The lower surface installs the contact convex of wave -shaped design, and the heat dissipation base plate inner chamber lower part evenly distributes the honeycomb microchannel; The upper part of inner chamber evenly is provided with the thread -shaped flow guide groove, and the inner chamber installs V -shaped disturbance convex, and the surface cladding nanometer ceramic heat insulating layer, and the inclined type through -hole is set up between the flow guide groove and the honeycomb microchannel, and the radiator can prolong air residence time, enlarge the contact area, solve the traditional linear fin heat accumulation problem; Accelerate heat diffusion, improve transmission efficiency, realize heat exchange through enhancing turbulent heat exchange, reduce heat reflux, solve the problem that the traditional radiator heat diffusion is slow, and the heat exchange effect is poor.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation, specifically to a high thermal conductivity profile heat sink. Background Technology

[0002] High thermal conductivity profile radiators for automobiles are mainly used for heat dissipation of core heat-generating components such as automobile engines and electronic control units. They are key components that prevent performance degradation, shortened lifespan, or failure due to overheating during long-term operation of automobile-related components. Their heat dissipation efficiency directly affects the overall stability and safety of automobile operation.

[0003] Existing automotive profile radiators have significant shortcomings in their structural design. Most adopt a straight fin structure, which results in a fixed and singular airflow path when passing through the radiator. Furthermore, the effective contact area between the fins and the airflow is limited by the straight shape and cannot be further improved. When the car is under high load and the heat generated by the heat-generating components increases, the airflow cannot fully interact with the fins to remove heat, leading to the continuous accumulation of heat inside the radiator and affecting the heat dissipation effect. Traditional radiator base plates lack directional thermal conductivity optimization and airflow guidance design. Heat can only rely on natural convection to slowly diffuse within the base plate. Moreover, the airflow tends to form a stable boundary layer during the flow within the base plate, which cannot be broken to enhance the heat transfer effect. Ultimately, this results in low overall thermal conductivity and heat dissipation efficiency of the radiator, making it difficult to meet the heat dissipation requirements of the car under high load. Utility Model Content

[0004] The purpose of this invention is to solve the above-mentioned defects and provide a high thermal conductivity profile heat sink with wavy fins and inverted trapezoidal flares, which can fully remove the heat from the fins. This solves the technical problem in the prior art that the airflow cannot fully interact with the fins to remove heat, thus causing heat to continuously accumulate inside the heat sink.

[0005] The objective of this utility model is achieved through the following means:

[0006] A high thermal conductivity profile heat sink includes a heat sink substrate. A heat-conducting fin assembly is mounted on the upper surface of the heat sink substrate. The heat-conducting fin assembly consists of wavy fins that are interlaced, forming a spiral upward airflow channel between adjacent wavy fins. An inverted trapezoidal flare is formed at the bottom of the wavy fins. Contact protrusions with a wavy design are mounted on the lower surface of the heat sink substrate. Honeycomb microchannels are uniformly distributed in the lower part of the inner cavity of the heat sink substrate, forming a honeycomb microchannel array. The inner wall of the honeycomb microchannels is coated with a graphene coating. A flow guide groove is uniformly formed in the upper part of the inner cavity of the heat sink substrate. The flow guide groove has a threaded design, with its inlet and outlet extending outwards through the inner wall of the heat sink substrate. Turbulence protrusions with a V-shaped design are uniformly mounted in the inner cavity of the flow guide groove. The surface of the flow guide groove is covered with a nano-ceramic heat insulation layer. A through-hole with an inclined design is formed between the flow guide groove and the honeycomb microchannels.

[0007] The heat generated by the heating element is transferred to the contact protrusion, which in turn transfers the heat to the heat dissipation substrate. The heat is then transferred to the honeycomb microchannels via the heat dissipation substrate, and the graphene coating on the inner wall of the honeycomb microchannels facilitates the rapid diffusion of heat within the heat dissipation substrate.

[0008] The heat dissipation substrate transfers some heat to the heat-conducting fin assembly. The wavy fins of the heat-conducting fin assembly transfer heat outward. At the same time, external airflow enters the spiral upward airflow channel between adjacent wavy fins. The airflow dissipates heat from the fins outward. The inverted trapezoidal flare at the bottom of the wavy fins facilitates smoother airflow into the spiral upward airflow channel.

[0009] The heat dissipation substrate carries another portion of the heat through the inclined through holes to the guide channel. The guide channel then carries the heat along the spiral channel towards the air inlet and outlet. At the same time, the V-shaped turbulence protrusions in the inner cavity of the guide channel cause the airflow to generate turbulence, which breaks the airflow boundary layer and enhances the heat exchange efficiency between the airflow and the guide channel. The nano-ceramic heat insulation layer on the surface of the guide channel prevents heat from flowing back to the heat dissipation substrate, reducing heat loss.

[0010] Furthermore, the upper outer side of the heat dissipation substrate is uniformly provided with connecting grooves, which are designed as a ring. The air inlet and air outlet of the guide groove are located at the center of the corresponding connecting groove.

[0011] The ring-shaped connecting grooves ensure the precise positioning of the air inlet and outlet of the air guide channel, preventing the airflow from being affected by installation misalignment. At the same time, the evenly spaced connecting grooves allow for more balanced stress on the upper outer part of the heat sink substrate, improving the overall structural stability.

[0012] Furthermore, the air inlet and outlet of the air guide channel are equipped with filters, which are connected to the corresponding connecting channels.

[0013] The filter element can block external dust and impurities from entering the guide channel, preventing the guide channel from becoming clogged due to the accumulation of impurities, ensuring that the heat dissipation airflow channel of the guide channel is always unobstructed and maintaining heat dissipation efficiency.

[0014] Furthermore, the filter element consists of a main frame, a dust filter screen, and a connecting plate, with the main frame having an overall circular design.

[0015] The circular main frame design better fits the circular air inlet and outlet of the air guide channel, reducing airflow resistance. At the same time, the circular main frame itself has high strength, which can ensure that the filter element is not easily deformed during use and extend the service life of the filter element.

[0016] Furthermore, the dust filter is located at the center of the main frame, and the dust filter is connected to the air inlet and outlet of the guide channel. The connecting plate is designed as a ring.

[0017] The dust filter is located in the center of the main frame and is connected to the air outlet of the guide channel, which ensures that all airflow passing through the guide channel can be filtered by the dust filter, thus improving the filtration effect. The ring-shaped connecting plate can be precisely matched with the ring-shaped connecting groove, ensuring the fit between the filter and the connecting groove and preventing airflow from leaking from the gaps.

[0018] Furthermore, the connecting plate is disposed on the back of the main frame, the outer surface of the connecting plate is provided with external threads, the inner wall of the connecting groove is provided with internal threads, and the connecting plate and the connecting groove are threadedly connected.

[0019] The threaded connection method is easy to operate, and the filter element can be disassembled and assembled without the need for complicated tools, which facilitates the subsequent cleaning or replacement of the filter element; at the same time, the threaded connection method ensures that the connecting plate and the connecting groove are firmly connected, preventing the filter element from loosening or falling off due to vibration or other factors during equipment operation.

[0020] The beneficial effects of this utility model are: the interlaced wave-shaped fins on the heat dissipation substrate form a spiral upward airflow channel, which, together with the inverted trapezoidal flare at the root of the fins, can guide the airflow smoothly into the channel and prolong the residence time of the air in the channel, greatly expanding the effective contact area between the airflow and the fins, and can fully remove the heat on the fins, effectively solving the problem of heat accumulation caused by the single airflow path and limited heat dissipation area of ​​traditional straight fins.

[0021] The honeycomb microchannel array in the lower part of the heat dissipation substrate has a graphene coating on its inner wall, which can significantly accelerate the diffusion rate of heat inside the substrate. The wavy contact protrusions on the lower surface of the substrate increase the contact area with the heat source and improve the efficiency of heat transfer from the heat source to the substrate. The V-shaped turbulence protrusions in the flow channel can disrupt the stable boundary layer during airflow and enhance the turbulent heat transfer effect. The oblique through holes realize the heat exchange between the honeycomb microchannel and the spiral flow channel. The nano-ceramic heat insulation layer on the surface of the flow channel can effectively reduce the backflow of heat from the flow channel to other areas of the substrate, further optimizing the heat transfer path and solving the problems of slow heat diffusion and poor heat exchange effect of traditional heat sink substrates. Attached Figure Description

[0022] Figure 1 This is a three-dimensional structural diagram of a high thermal conductivity profile heat sink according to the present invention;

[0023] Figure 2 This is a schematic diagram of the overall lower surface structure of a high thermal conductivity profile radiator according to the present invention;

[0024] Figure 3 This is a cross-sectional view of the flow channel portion of a high thermal conductivity profile radiator according to this utility model;

[0025] Figure 4 This is a schematic diagram of the through-hole structure of a high thermal conductivity profile heat sink according to this utility model;

[0026] Figure 5 This is a schematic diagram of a honeycomb microchannel array structure for a high thermal conductivity profile heat sink according to this utility model;

[0027] Figure 6 This is a schematic diagram of the filter component structure of a high thermal conductivity profile radiator according to this utility model;

[0028] In the figure, 1. Heat dissipation substrate; 2. Heat-conducting fin assembly; 3. Contact protrusion; 4. Guide channel; 5. Through hole; 6. Honeycomb microchannel; 7. Connecting groove; 8. Filter element; 9. Main frame; 10. Dust filter screen; 11. Connecting plate. Detailed Implementation

[0029] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0030] In this embodiment, refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6The specific implementation of a high thermal conductivity profile heat sink includes a heat dissipation base plate 1. A heat-conducting fin assembly 2 is mounted on the upper surface of the heat dissipation base plate 1. The heat-conducting fin assembly 2 is composed of wavy fins that are interlaced, forming a spiral upward airflow channel between adjacent wavy fins. An inverted trapezoidal flare is provided at the bottom of the wavy fins. Contact protrusions 3 are mounted on the lower surface of the heat dissipation base plate 1. The contact protrusions 3 have a wavy design. Honeycomb microchannels 6 are evenly distributed in the lower part of the inner cavity of the heat dissipation base plate 1. The array consists of 6 honeycomb microchannels. The inner wall of the honeycomb microchannels 6 is coated with a graphene coating. The upper part of the inner cavity of the heat dissipation substrate 1 is uniformly provided with guide grooves 4. The guide grooves 4 are designed in a threaded shape. The air inlet and outlet of the guide grooves 4 extend outward through the inner wall of the heat dissipation substrate 1. The inner cavity of the guide grooves 4 is uniformly provided with turbulence protrusions. The turbulence protrusions are designed in a V-shape. The surface of the guide grooves 4 is covered with a nano-ceramic heat insulation layer. A through hole 5 is provided between the guide grooves 4 and the honeycomb microchannels 6. The through hole 5 is designed in an inclined manner.

[0031] The contact protrusion 3 adopts a wave-shaped design, which increases the contact area with the heating element, improves the heat transfer efficiency from the heating element to the heat dissipation substrate 1, and avoids heat accumulation on the surface of the heating element.

[0032] The inner wall of the honeycomb microchannel 6 is coated with graphene. The high thermal conductivity of graphene accelerates the diffusion rate of heat inside the heat dissipation substrate 1, solving the problem that the heat of traditional substrates relies solely on natural convection diffusion and slow heat equalization.

[0033] The heat-conducting fin group 2 is composed of staggered wavy fins. The spiral upward airflow channel formed by adjacent fins prolongs the residence time of air between the fins. At the same time, the wavy structure expands the heat dissipation area of ​​the fins, significantly improving the heat dissipation capacity of the fins. The inverted trapezoidal flare optimizes the airflow inlet environment, making it easier for airflow to enter the channel and further enhancing the heat dissipation effect.

[0034] The threaded design of the guide channel 4 extends the heat transfer path within the channel. Combined with the turbulent effect of the V-shaped turbulence protrusion on the airflow, it breaks the obstruction of the airflow boundary layer, significantly improves the heat exchange efficiency between the airflow and the guide channel 4, and achieves rapid heat removal.

[0035] The inclined through holes 5 establish a heat exchange channel between the honeycomb microchannels 6 and the flow channels 4, allowing the heat in the heat dissipation substrate 1 to be efficiently transferred in two paths, avoiding the problem of insufficient heat dissipation in a single path; at the same time, the nano-ceramic heat insulation layer effectively reduces the backflow of heat in the flow channels 4 to the heat dissipation substrate 1, reduces heat loss, and ensures the overall efficiency of the heat dissipation system.

[0036] like Figure 3As shown, the upper outer side of the heat dissipation substrate 1 is uniformly provided with connecting grooves 7. The connecting grooves 7 are designed as a ring. The air inlet and air outlet of the guide groove 4 are located at the center of the corresponding connecting grooves 7.

[0037] The heat dissipation substrate 1 provides a positioning reference for the air inlet and outlet of the guide channel 4 through the annular connecting groove 7 evenly opened on the upper outer side, so that the air inlet and outlet of the guide channel 4 can be stably located at the center of the corresponding connecting groove 7.

[0038] like Figure 2 As shown, the air inlet and outlet of the air guide channel 4 are equipped with filter elements 8, and the filter elements 8 are connected to the corresponding connecting channels 7.

[0039] The filter element 8 is installed at the air inlet and outlet of the guide channel 4 through the connection with the corresponding connecting groove 7, so as to achieve filtration coverage of the air outlet of the guide channel 4.

[0040] like Figure 6 As shown, the filter element 8 consists of a main frame 9, a dust filter screen 10, and a connecting plate 11. The main frame 9 has an overall circular design.

[0041] The main frame 9, as the core load-bearing component of the filter element 8, has a circular design and provides basic support for the installation of the dust filter 10 and the connecting plate 11.

[0042] The dust filter 10 is located at the center of the main frame 9. The dust filter 10 is connected to the air inlet and air outlet of the guide channel 4. The connecting plate 11 is designed as a ring.

[0043] The dust filter 10 is located at the center of the main frame 9 and connects with the air inlet and outlet of the guide groove 4 to form an airflow filtration channel; the connecting plate 11 is located on the back of the main frame 9 with a ring design and provides a structural interface for the connection between the filter element 8 and the connecting groove 7.

[0044] The connecting plate 11 is located on the back of the main frame 9. The outer surface of the connecting plate 11 is provided with external threads, and the inner wall of the connecting groove 7 is provided with internal threads. The connecting plate 11 and the connecting groove 7 are connected by threads.

[0045] During installation, by rotating the connecting plate 11, the external thread on the outer surface of the connecting plate 11 engages with the internal thread on the inner wall of the connecting groove 7, thereby connecting the connecting plate 11 and the connecting groove 7, and fixing the filter element 8 at the air outlet of the guide groove 4; during disassembly, by rotating the connecting plate 11 in the opposite direction, the external thread and the internal thread are separated, thereby separating the connecting plate 11 from the connecting groove 7, and then removing the filter element 8.

[0046] The usage process of a high thermal conductivity profile heat sink in this embodiment is as follows: the heat generated by the heating element is transferred to the contact protrusion 3, and the contact protrusion 3 drives the heat to be transferred to the heat dissipation substrate 1; the heat is transferred to the honeycomb microchannel 6 through the heat dissipation substrate 1, and the graphene coating on the inner wall of the honeycomb microchannel 6 drives the heat to diffuse rapidly inside the heat dissipation substrate 1.

[0047] The heat dissipation substrate 1 transfers some heat to the heat-conducting fin group 2. The wavy fins of the heat-conducting fin group 2 transfer the heat outward. At the same time, external airflow enters the spiral rising airflow channel between adjacent wavy fins. The airflow carries the heat on the fins outward. The inverted trapezoidal flare at the bottom of the wavy fins facilitates the airflow to enter the spiral rising airflow channel more smoothly. The heat dissipation substrate 1 transfers another part of the heat through the inclined through hole 5 to the guide groove 4. The guide groove 4 carries the heat along the spiral groove towards the air inlet and air outlet.

[0048] Meanwhile, the V-shaped turbulence protrusions in the inner cavity of the guide channel 4 cause the airflow to generate turbulence, destroy the airflow boundary layer, and enhance the heat exchange efficiency between the airflow and the guide channel 4. The nano-ceramic heat insulation layer on the surface of the guide channel 4 blocks the heat from flowing back to the heat dissipation substrate 1, reducing heat loss. The heat dissipation substrate 1, through the annular connecting groove 7 evenly opened on the upper outer side, drives the air inlet and outlet of the guide channel 4 to be stably positioned at the center of the corresponding connecting groove 7, thereby realizing the positioning of the air outlet of the guide channel 4.

[0049] The filter element 8 is installed at the air inlet and air outlet of the guide channel 4 through the connection with the corresponding connecting groove 7. The filter element 8 blocks external dust and impurities from entering the interior of the guide channel 4. The main frame 9 of the filter element 8 supports the dust filter 10 and the connecting plate 11. The dust filter 10 is connected to the air inlet and air outlet of the guide channel 4, thereby filtering the airflow passing through the guide channel 4.

[0050] When installing the filter element 8, rotate the connecting plate 11 to engage the external thread on the outer surface of the connecting plate 11 with the internal thread on the inner wall of the connecting groove 7, thereby connecting the connecting plate 11 and the connecting groove 7, and thus fixing the filter element 8 at the air outlet of the guide groove 4; when removing the filter element 8, rotate the connecting plate 11 in the opposite direction to separate the external thread on the outer surface of the connecting plate 11 from the internal thread on the inner wall of the connecting groove 7, thereby separating the connecting plate 11 from the connecting groove 7, and thus removing the filter element 8 from the air outlet of the guide groove 4.

[0051] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of the present invention, and all such modifications and substitutions should be considered within the scope of protection of the present invention.

Claims

1. A high thermal conductivity profile heat sink, comprising a heat dissipation substrate, characterized in that: The upper surface of the heat dissipation substrate is equipped with a heat-conducting fin assembly, which consists of wavy fins that are interlaced and form a spiral upward airflow channel between adjacent wavy fins. The bottom of the wavy fins has an inverted trapezoidal flare. The lower surface of the heat dissipation substrate is equipped with contact protrusions, which are wavy in design. The lower part of the inner cavity of the heat dissipation substrate is uniformly distributed with honeycomb microchannels, which form a honeycomb microchannel array. The inner wall of the honeycomb microchannels is coated with a graphene coating. The upper part of the inner cavity of the heat dissipation substrate is uniformly provided with a flow guide groove, which is threaded in design. The air inlet and outlet of the flow guide groove extend outward through the inner wall of the heat dissipation substrate. The inner cavity of the flow guide groove is uniformly equipped with turbulence protrusions, which are V-shaped in design. The surface of the flow guide groove is covered with a nano-ceramic heat insulation layer. A through hole is provided between the flow guide groove and the honeycomb microchannels, which is inclined in design.

2. The high thermal conductivity profile radiator according to claim 1, characterized in that: The upper outer side of the heat dissipation substrate is uniformly provided with connecting grooves. The connecting grooves are designed in a ring shape. The air inlet and air outlet of the air guide groove are located at the center of the corresponding connecting groove.

3. The high thermal conductivity profile radiator according to claim 2, characterized in that: The air inlet and outlet of the air guide channel are equipped with filters, and the filters are connected to the corresponding connecting channels.

4. The high thermal conductivity profile radiator according to claim 3, characterized in that: The filter element consists of a main frame, a dust filter screen, and a connecting plate. The main frame has an overall circular design.

5. The high thermal conductivity profile radiator according to claim 4, characterized in that: The dust filter is located at the center of the main frame and is connected to the air inlet and outlet of the guide channel. The connecting plate is designed as a ring.

6. The high thermal conductivity profile radiator according to claim 4, characterized in that: The connecting plate is located on the back of the main frame. The outer surface of the connecting plate has external threads, and the inner wall of the connecting groove has internal threads. The connecting plate and the connecting groove are connected by threads.

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