Submerged micro-positive pressure liquid cooling device
Patent Information
- Application Number
- CN202522525387.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-27
- Publication Date
- 2026-10-27
- Estimated Expiration
- 2035-11-27
AI Technical Summary
采用超纯水作为冷却介质的浸没式冷却设备中,防止外部杂质、污染物进入液冷机柜内部是重中之重,这是由于,杂质(尤其是离子性杂质)会迅速降低超纯水的电阻率,可使其从一个良好的“绝缘液”变成一个具有一定导电性的“电解液”,可能导致服务器内部短路
[0012]本实用新型的有益效果是:可采用超纯水作为浸没式冷却的冷却介质,泵送能力强、散热效率高,且具备防止外部杂质、污染物进入液冷液冷机柜的液冷部位的功能,可保持超纯水的纯净度,从而既能保障良好的散热效果,又能避免出现短路等问题,可保障服务器的安全;具有针对空气滤芯的拆除保护功能,可防止维护空气滤芯时微正压风机还在工作的情况出现;在维护过程中,能够自动切断上液冷腔与外界的通路,可保障超纯水不受污染。
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Figure CN224909972U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of server liquid cooling and immersion liquid cooling technology, and particularly relates to an immersion micro positive pressure liquid cooling device. Background Technology
[0002] Immersion liquid cooling involves directly immersing server electronic components in an insulating coolant, achieving efficient heat exchange. This has become a key technology for solving the heat dissipation problem in high-density data centers.
[0003] Currently, conventional immersion liquid cooling systems mostly use synthetic oils or fluorinated liquids as cooling media. While these media have their advantages, they also have some disadvantages, such as: thermal performance limitations: the specific heat capacity and thermal conductivity of synthetic oils and fluorinated liquids are generally lower than water, limiting their heat dissipation efficiency; high viscosity: higher viscosity leads to greater flow resistance, requiring more powerful pumps, resulting in higher energy consumption, and potentially creating flow dead zones in certain areas; difficult maintenance: during server maintenance or replacement, the oily coolant adhering to the surface is difficult to thoroughly clean, making maintenance cumbersome and potentially generating waste; safety risks: most synthetic oils have flash points, posing a potential flammability risk, while fluorinated liquids, due to their inherent properties, are prone to leakage and can pose certain health hazards. Therefore, using ultrapure water as a cooling media has become a new trend in the industry.
[0004] Ultrapure water, also known as UP water, refers to water with a resistivity of 18 MΩ·cm (25℃). It has a high specific heat capacity and low viscosity, requiring no additional cleaning during server maintenance or replacement, and is safe. In immersion cooling systems using ultrapure water as the cooling medium, preventing external impurities and contaminants from entering the liquid-cooled cabinet is paramount. This is because impurities (especially ionic impurities) can rapidly reduce the resistivity of ultrapure water, transforming it from a good "insulating liquid" into a "conductive" "electrolyte," potentially causing a short circuit inside the server. Utility Model Content
[0005] This utility model provides an immersion micro-positive pressure liquid cooling device that can use ultrapure water as the cooling medium for immersion cooling. It has strong pumping capacity and high heat dissipation efficiency, and has the function of preventing external impurities and contaminants from entering the liquid cooling part of the liquid cooling cabinet. It can maintain the purity of ultrapure water, thereby ensuring good heat dissipation effect and avoiding problems such as short circuits, thus ensuring the safety of the server.
[0006] To achieve the above objectives, the present invention adopts the following technical solution: An immersion micro-positive pressure liquid cooling device includes a main cabinet. The main cabinet has a middle bottom plate that divides the interior of the main cabinet into a lower equipment cavity with an opening at the lower end and an upper liquid cooling cavity with an opening at the upper end. The top of the main cabinet has a top cover plate that covers the upper opening of the upper liquid cooling cavity. The upper liquid cooling cavity has a mounting bracket for installing a liquid-cooled server and an internal socket for powering the liquid-cooled server. The lower equipment cavity is equipped with a circulating pump and at least one water inlet pipe, and also includes a return water pipe. The main unit cabinet side wall is provided with a side return water hole. The water outlet of the circulating pump, any water inlet pipe, the upper liquid cooling cavity and the side return water hole are connected in sequence. The side return water hole is connected to the water inlet of the circulating pump through the return water pipe. The main unit cabinet has an air inlet duct on its side wall, an air filter at the outer end of the air inlet duct, a micro positive pressure fan inside the air inlet duct, and the inner end of the air inlet duct is connected to the upper liquid cooling cavity. The air delivery direction of the micro positive pressure fan is from the outside through the air inlet duct to the upper liquid cooling cavity. The main unit cabinet has several pressure relief hole groups connected to the upper liquid cooling cavity on its side wall. The highest point of the side return water hole is lower than the liquid level in the upper liquid cooling chamber, the lowest point of the air inlet pipe is higher than the liquid level in the upper liquid cooling chamber, the lowest point of the internal socket is higher than the liquid level in the upper liquid cooling chamber, and the lowest point of the pressure relief hole group is higher than the liquid level in the upper liquid cooling chamber.
[0007] Preferably, there are two water inlet pipes, and the bottom plate has two bottom water inlet holes that correspond one-to-one with the water inlet pipes. The upper liquid cooling cavity is equipped with a flow equalization plate, which divides the interior of the upper liquid cooling cavity into a lower flow equalization cavity and an upper server cavity. The water inlet pipes are connected to the lower flow equalization cavity through the corresponding bottom water inlet holes. The flow equalization plate is equipped with multiple small through holes, and the mounting bracket and internal socket are located in the upper server cavity.
[0008] Preferably, there are two pressure relief hole groups, and each pressure relief hole group corresponds to a pair of side panels of the main unit cabinet. The pressure relief hole groups are set on the corresponding side panels. In the corresponding side panels and pressure relief hole groups, the pressure relief hole groups include multiple pressure relief holes, and each pressure relief hole is arranged sequentially in the horizontal direction.
[0009] Preferably, the air filter element includes a filter element body, two locking rods and two conductive rods. The micro positive pressure fan is provided with two locking holes corresponding to the locking rods and two conductive contact assemblies corresponding to the conductive rods. The conductive contact assembly includes two elastic conductive contacts for contacting the conductive rods. Both conductive contact assemblies are connected in series in the power supply circuit of the micro positive pressure fan. When one lever is engaged in the corresponding slot, the other lever is also engaged in the corresponding slot, and either conductive lever contacts the two elastic conductive contacts in the corresponding conductive contact assembly.
[0010] Preferably, the air inlet duct is provided with a protective tube located between the micro positive pressure fan and the inner end of the air inlet duct. The outer wall of the protective tube is sealed and fixed to the inner wall of the air inlet duct. The outer end of the protective tube faces the micro positive pressure fan. The inner end face of the protective tube is inclined. The distance between the inner end face of the protective tube and the inner end of the air inlet duct gradually decreases from top to bottom. The inner end of the protective tube is provided with an end cap for covering the opening of the inner end of the protective tube. The upper end of the end cap is hinged to the protective tube.
[0011] Preferably, the inner end of the air inlet duct faces the inner socket, and the outer shell of the inner socket is a horizontally arranged elongated strip. The upper end of the micro positive pressure fan, the upper end of the outer shell of the inner socket, the lower end of the micro positive pressure fan, and the lower end of the outer shell of the inner socket are arranged from top to bottom. The bottom of the outer shell of the inner socket is provided with a baffle plate extending downward toward the air inlet duct. In the length direction of the outer shell of the inner socket, one end of the outer shell of the inner socket, the air inlet duct, and the other end of the outer shell of the inner socket are arranged in sequence.
[0012] The beneficial effects of this utility model are: it can use ultrapure water as the cooling medium for immersion cooling, has strong pumping capacity and high heat dissipation efficiency, and has the function of preventing external impurities and contaminants from entering the liquid cooling part of the liquid cooling cabinet, thus maintaining the purity of ultrapure water. This ensures both good heat dissipation and avoids problems such as short circuits, thereby ensuring the safety of the server; it has a protection function for removing the air filter, which can prevent the micro positive pressure fan from still working when maintaining the air filter; during maintenance, it can automatically cut off the passage between the upper liquid cooling cavity and the outside world, ensuring that the ultrapure water is not contaminated. Attached Figure Description
[0013] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 This is a schematic diagram of the structure of this utility model after the top cover plate has been removed; Figure 3 yes Figure 2 Enlarged view of point A in the middle; Figure 4 yes Figure 2 A schematic diagram of the structure after removing the bottom plate; Figure 5 This is a partial structural schematic diagram of the present invention; Figure 6 This is a structural schematic diagram of the air filter element and the micro positive pressure fan of this utility model; Figure 7 This is a structural schematic diagram of the conductive contact assembly of this utility model; Figure 8 This is a schematic diagram of the structure of the protective tube of this utility model.
[0014] Reference numerals in the attached drawings: 1. Main unit cabinet; 1a. Side return water hole; 101. Middle bottom plate; 101a. Bottom water inlet; 101a. Top cover plate; 102. Mounting bracket; 103. Internal socket; 104. Flow equalization plate; 105. Small through hole; 105a. Pressure vent; 1.3. Lower equipment cavity; 1.1. Upper liquid cooling cavity; 1.2. Water inlet pipe; 2. Air inlet duct; 3. Air filter element; 4. Filter element body; 4.1. Clamping rod; 4.2. Conductive rod; 4.3. Micro positive pressure fan; 5. Conductive contact assembly; 5.1. Elastic conductive contact; 5.11. Protective tube; 6. End cap; 601. Detailed Implementation
[0015] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.
[0016] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 As shown, An immersion micro-positive pressure liquid cooling device includes a main unit cabinet 1. The main unit cabinet 1 is provided with a middle bottom plate 101 and a server rack. The middle bottom plate 101 divides the interior of the main unit cabinet 1 into a lower equipment cavity 1.1 with an opening at the lower end and an upper liquid cooling cavity 1.2 with an opening at the upper end. The top of the main unit cabinet 1 is provided with a top cover plate 102 that covers the upper opening of the upper liquid cooling cavity 1.2. The upper liquid cooling cavity 1.2 is provided with a mounting bracket 103 for installing a liquid-cooled server and an internal socket 104 for powering the liquid-cooled server. The lower equipment cavity 1.1 is equipped with a circulation pump and at least one water inlet pipe 2, and also includes a return water pipe. The side wall of the main unit cabinet 1 is provided with a side return water hole 1a. The water outlet of the circulation pump, any water inlet pipe 2, the upper liquid cooling cavity 1.2 and the side return water hole 1a are connected in sequence. The side return water hole 1a is connected to the water inlet of the circulation pump through the return water pipe. The main unit cabinet 1 has an air inlet duct 3 on its side wall, an air filter 4 at the outer end of the air inlet duct 3, a micro positive pressure fan 5 inside the air inlet duct 3, and the inner end of the air inlet duct 3 is connected to the upper liquid cooling cavity 1.2. The air supply direction of the micro positive pressure fan 5 is from the outside through the air inlet duct 3 to the upper liquid cooling cavity 1.2. The main unit cabinet 1 has a number of pressure relief holes connected to the upper liquid cooling cavity 1.2 on its side wall. The highest point of the side return water hole 1a is lower than the liquid level in the upper liquid cooling cavity 1.2, the lowest point of the air inlet pipe is higher than the liquid level in the upper liquid cooling cavity 1.2, the lowest point of the internal socket 104 is higher than the liquid level in the upper liquid cooling cavity 1.2, and the lowest point of the pressure relief hole group is higher than the liquid level in the upper liquid cooling cavity 1.2.
[0017] The liquid-cooled server is mounted in the upper liquid-cooling cavity 1.2 via mounting bracket 103. The upper liquid-cooling cavity 1.2 contains ultrapure water. During operation, the liquid-cooled server generates heat. A circulation pump operates, driving the ultrapure water to circulate along the route of the upper liquid-cooling cavity 1.2, side return water hole 1a, return water pipe, circulation pump, inlet water pipe 2, and back to the upper liquid-cooling cavity 1.2. During circulation, the ultrapure water flowing near the liquid-cooled server carries away a significant amount of heat. When the ultrapure water circulates to the outside of the upper liquid-cooling cavity 1.2, it can dissipate heat naturally, resulting in a relatively rapid cooling.
[0018] Meanwhile, during operation, the micro-positive pressure fan 5 continuously draws in outside air. After being purified by the air filter 4, the outside air reaches the liquid surface above the liquid level in the upper liquid cooling chamber 1.2. Some of this air is then discharged through the pressure relief vents, ensuring that the air pressure above the liquid surface in the upper liquid cooling chamber 1.2 is slightly higher than the outside air pressure (atmospheric pressure). This prevents external impurities and contaminants from entering the upper liquid cooling chamber 1.2, maintaining the purity of the ultrapure water. This ensures both good heat dissipation and avoids short circuits, thus guaranteeing the server's safety.
[0019] In practical applications, a barometer for measuring internal air pressure can be installed in the upper liquid-cooled cavity 1.2 and connected to an alarm device to achieve an early warning function. For example, an early warning (reminding maintenance) can be issued when the internal air pressure is below 1.2 atmospheres, and an alarm can be triggered when the internal air pressure is below 1.15 atmospheres (requiring immediate maintenance). The specific arrangement and settings can be determined according to actual needs.
[0020] There are two water inlet pipes 2. The bottom plate 101 is provided with two bottom water inlet holes 101a corresponding to the water inlet pipes 2. The upper liquid cooling cavity 1.2 is provided with a flow equalization plate 105, which divides the interior of the upper liquid cooling cavity 1.2 into a lower flow equalization cavity and an upper server cavity. The water inlet pipes 2 are connected to the lower flow equalization cavity through the corresponding bottom water inlet holes 101a. The flow equalization plate 105 is provided with multiple small through holes 105a. The mounting bracket 103 and the internal socket 104 are both located in the upper server cavity.
[0021] The flow equalization plate 105 allows the ultrapure water that just entered the upper liquid cooling cavity 1.2 to be distributed more evenly to the vicinity of each liquid-cooled server, which helps to ensure the overall heat dissipation balance and thus prevents local overheating.
[0022] There are two pressure relief hole groups. Each pressure relief hole group corresponds to a pair of side panels of the main unit cabinet 1. The pressure relief hole groups are set on the corresponding side panels. In the corresponding side panels and pressure relief hole groups: the pressure relief hole groups include multiple pressure relief holes 1.3, and each pressure relief hole 1.3 is arranged sequentially in the horizontal direction.
[0023] Multiple vent holes 1.3 ensure that some air above the liquid surface in the upper liquid cooling chamber 1.2 can be discharged smoothly, which is beneficial to the operation of the micro positive pressure fan 5 and can also prevent heat accumulation in the air above the liquid surface in the upper liquid cooling chamber 1.2.
[0024] The air filter element 4 includes a filter element body 4.1, two locking rods 4.2 and two conductive rods 4.3. The micro positive pressure fan 5 is provided with two locking holes corresponding to the locking rods 4.2 and two conductive contact assemblies 5.1 corresponding to the conductive rods 4.3. The conductive contact assembly 5.1 includes two elastic conductive contacts 5.11 and 5.11 for contacting the conductive rods 4.3. Both conductive contact assemblies 5.1 are connected in series in the power supply circuit of the micro positive pressure fan 5. When one lever 4.2 is engaged in its corresponding hole, the other lever 4.2 is also engaged in its corresponding hole, and any conductive rod 4.3 contacts the two elastic conductive contacts 5.11 in the corresponding conductive contact assembly 5.1. At this time, the power supply circuit of the micro positive pressure fan 5 is turned on.
[0025] When replacing or cleaning the air filter 4, if the operator forgets to turn off the micro-positive pressure fan 5 beforehand, external impurities and contaminants will enter the air intake duct 3 and the upper liquid cooling chamber 1.2 with the airflow, causing ultrapure water contamination, malfunction, and potentially damaging the liquid-cooled server. Therefore, when the air filter 4 is removed, the locking lever 4.2 begins to leave the locking hole, and the conductive rod 4.3 begins to leave the conductive contact assembly 5.1. Since both conductive contact assemblies 5.1 are connected in series in the power supply circuit of the micro-positive pressure fan 5, the power supply circuit of the micro-positive pressure fan 5 will be disconnected, thus ensuring that the micro-positive pressure fan 5 does not operate when the air filter 4 leaves the air duct. When the new or cleaned air filter 4 is reinstalled, once installation is complete, the locking lever 4.2 locks into the corresponding locking hole, and the conductive rod 4.3 contacts the two elastic conductive contacts 5.11 in the corresponding conductive contact assembly 5.1. At this time, the power supply circuit of the micro-positive pressure fan 5 is turned on, and the micro-positive pressure fan 5 continues to operate normally.
[0026] The air inlet duct 3 is provided with a protective tube located between the micro positive pressure fan 5 and the inner end of the air inlet duct 3. The outer wall of the protective tube is sealed and fixed to the inner wall of the air inlet duct 3. The outer end of the protective tube faces the micro positive pressure fan 5. The inner end face of the protective tube is inclined. The distance between the inner end face of the protective tube and the inner end of the air inlet duct 3 gradually decreases from top to bottom. The inner end of the protective tube is provided with an end cap 601 for covering the opening of the inner end of the protective tube. The upper end of the end cap 601 is hinged to the protective tube.
[0027] As mentioned earlier, when the air filter 4 is removed, the latch 4.2 begins to move away from the latch hole, and the conductive rod 4.3 begins to move away from the conductive contact assembly 5.1. Since "both conductive contact assemblies 5.1 are connected in series in the power supply circuit of the micro positive pressure fan 5," the power supply circuit of the micro positive pressure fan 5 will be disconnected, thus ensuring that the micro positive pressure fan 5 does not work when the air filter 4 leaves the air duct. However, if external airflow carrying impurities and contaminants blows into the air inlet duct 3 at this time, it will still lead to ultrapure water contamination. In view of this, when the micro positive pressure fan 5 is working, it naturally blows open the end cover 601. After the outside air is purified by the air filter 4, it can reach the liquid surface above the liquid level in the upper liquid cooling chamber 1.2 through the protective tube. When the micro positive pressure fan 5 stops, under the action of gravity, the protective tube rotates and falls along the hinge part, covering the inner end opening of the protective tube, thus protecting the ultrapure water inside. When it is necessary to reinstall a new or cleaned air filter 4, a vacuum cleaner can be used to clean the inside of the air duct 3. This will further ensure that the ultrapure water is not contaminated.
[0028] The inner end of the air inlet duct 3 faces the inner socket 104. The outer shell of the inner socket 104 is a horizontally arranged elongated strip. The upper end of the micro positive pressure fan 5, the upper end of the outer shell of the inner socket 104, the lower end of the micro positive pressure fan 5, and the lower end of the outer shell of the inner socket 104 are arranged from top to bottom. The bottom of the outer shell of the inner socket 104 is provided with a baffle plate extending downward toward the air inlet duct 3. In the length direction of the outer shell of the inner socket 104: one end of the outer shell of the inner socket 104, the air inlet duct 3, and the other end of the outer shell of the inner socket 104 are arranged in sequence.
[0029] If too much air blown into the liquid surface by the micro-positive pressure fan 5 is agitated and enters the ultrapure water, it will cause more bubbles and affect the heat dissipation effect. Therefore, the lower part of the air blown into the upper liquid cooling cavity 1.2 is blocked by the outer shell of the internal socket 104 and the baffle plate. Most of the air will enter the upper liquid cooling cavity 1.2 from the top of the outer shell of the internal socket 104, thereby reducing the impact of airflow on the liquid surface and reducing the possibility of air being agitated and entering the ultrapure water.
[0030] The embodiments of this utility model have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this utility model. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this utility model. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this utility model. Therefore, the content of this specification should not be construed as a limitation of this utility model.
Claims
1. An immersion-type micro-positive pressure liquid cooling device, characterized in that, The system includes a server rack, which has a bottom plate that divides the interior of the server rack into a lower equipment cavity with an opening at the bottom and an upper liquid cooling cavity with an opening at the top. The top of the server rack is provided with a top cover plate that covers the upper opening of the upper liquid cooling cavity. The upper liquid cooling cavity is provided with a mounting bracket for installing liquid-cooled servers and an internal socket for powering the liquid-cooled servers. The lower equipment cavity is equipped with a circulating pump and at least one water inlet pipe, and also includes a return water pipe. The main unit cabinet side wall is provided with a side return water hole. The water outlet of the circulating pump, any water inlet pipe, the upper liquid cooling cavity and the side return water hole are connected in sequence. The side return water hole is connected to the water inlet of the circulating pump through the return water pipe. The main unit cabinet has an air inlet duct on its side wall, an air filter at the outer end of the air inlet duct, a micro positive pressure fan inside the air inlet duct, and the inner end of the air inlet duct is connected to the upper liquid cooling cavity. The air delivery direction of the micro positive pressure fan is from the outside through the air inlet duct to the upper liquid cooling cavity. The main unit cabinet has several pressure relief hole groups connected to the upper liquid cooling cavity on its side wall. The highest point of the side return water hole is lower than the liquid level in the upper liquid cooling chamber, the lowest point of the air inlet pipe is higher than the liquid level in the upper liquid cooling chamber, the lowest point of the internal socket is higher than the liquid level in the upper liquid cooling chamber, and the lowest point of the pressure relief hole group is higher than the liquid level in the upper liquid cooling chamber.
2. The immersion-type micro-positive pressure liquid cooling device according to claim 1, characterized in that, There are two water inlet pipes. The bottom plate has two bottom water inlet holes that correspond one-to-one with the water inlet pipes. The upper liquid cooling cavity is equipped with a flow equalization plate, which divides the interior of the upper liquid cooling cavity into a lower flow equalization cavity and an upper server cavity. The water inlet pipes are connected to the lower flow equalization cavity through the corresponding bottom water inlet holes. The flow equalization plate is equipped with multiple small through holes. The mounting bracket and internal socket are located in the upper server cavity.
3. The immersion-type micro-positive pressure liquid cooling device according to claim 1, characterized in that, There are two pressure relief hole groups. Each pressure relief hole group corresponds to a pair of side panels of the main unit cabinet. The pressure relief hole groups are set on the corresponding side panels. In the corresponding side panels and pressure relief hole groups, the pressure relief hole groups include multiple pressure relief holes, and each pressure relief hole is arranged sequentially in the horizontal direction.
4. An immersion-type micro-positive pressure liquid cooling device according to claim 1, 2, or 3, characterized in that, The air filter element includes a filter element body, two locking rods and two conductive rods. The micro positive pressure fan is provided with two locking holes corresponding to the locking rods and two conductive contact assemblies corresponding to the conductive rods. The conductive contact assembly includes two elastic conductive contacts for contacting the conductive rods. Both conductive contact assemblies are connected in series in the power supply circuit of the micro positive pressure fan. When one lever is engaged in the corresponding slot, the other lever is also engaged in the corresponding slot, and either conductive lever contacts the two elastic conductive contacts in the corresponding conductive contact assembly.
5. The immersion-type micro-positive pressure liquid cooling device according to claim 4, characterized in that, The air inlet duct is equipped with a protective tube located between the micro positive pressure fan and the inner end of the air inlet duct. The outer wall of the protective tube is sealed and fixed to the inner wall of the air inlet duct. The outer end of the protective tube faces the micro positive pressure fan. The inner end face of the protective tube is inclined. The distance between the inner end face of the protective tube and the inner end of the air inlet duct gradually decreases from top to bottom. The inner end of the protective tube is equipped with an end cap for covering the opening of the inner end of the protective tube. The upper end of the end cap is hinged to the protective tube.
6. An immersion-type micro-positive pressure liquid cooling device according to claim 1, 2, or 3, characterized in that, The inner end of the air inlet duct faces the inner socket. The outer shell of the inner socket is a horizontally arranged elongated strip. The upper end of the micro positive pressure fan, the upper end of the outer shell of the inner socket, the lower end of the micro positive pressure fan, and the lower end of the outer shell of the inner socket are arranged from top to bottom. The bottom of the outer shell of the inner socket is provided with a baffle plate extending downward toward the air inlet duct. Along the length of the outer shell of the inner socket, one end of the outer shell of the inner socket, the air inlet duct, and the other end of the outer shell of the inner socket are arranged in sequence.