A novel heat conducting gasket

Abstract

The utility model relates to a novel heat conduction gasket, including upper heat conduction layer, elastic layer and lower heat conduction layer, the upper heat conduction layer and lower heat conduction layer are all heat conduction material, the elastic layer is filled with heat conduction gel. The novel heat conduction gasket because its upper piece and lower piece are all made of high heat conductivity material, and the elastic layer is filled with heat conduction gel, make the heat conduction gasket whole has good heat conduction performance. In addition, the elastic layer can have a certain degree of elastic expansion. So make the novel heat conduction gasket whole can have elastic deformation within a certain degree, relative to single layer gasket formula structure the novel heat conduction gasket's multilayer composite structure has better elastic deformation performance, can guarantee that heat conduction gasket is always with electronic components and the reliable contact of heat dissipation device, it is difficult to appear loose and gap between gasket and electronic components or heat dissipation device after long -time use because of material ageing hardening, improved the reliability of heat conduction gasket.

Description

Technical Field

[0001] This utility model relates to the field of thermal conductivity and heat dissipation technology, specifically to a novel thermally conductive pad. Background Technology

[0002] With the development of integrated circuit technology and the increasing density of microelectronic assembly, the heat generated by electronic devices is rapidly accumulating and increasing. As the temperature of electronic components rises, their performance and reliability directly decline. Therefore, the ability to dissipate heat in a timely manner becomes a crucial factor affecting their lifespan. To ensure that electronic components maintain normal operation under ambient temperatures, thermal pads are typically installed between heat dissipation components (such as finned heat sinks). These pads quickly transfer heat from the electronic components to the heat dissipation components, ensuring the normal operation of the electronic equipment.

[0003] Because thermal pads are clamped and fixed to electronic components via heat dissipation components, and the positions and heights of these components are also fixed, the spacing between them is also fixed. Thermal pads are typically made of thermally conductive silicone, which is prone to aging when operating in high-temperature environments for extended periods. After aging, the elasticity of the silicone decreases, causing the contact between the thermal pad and the electronic or heat dissipation components to loosen or gaps to appear. This affects the heat dissipation effect and requires improvement. Utility Model Content

[0004] Based on the above description, this utility model provides a novel thermally conductive pad with better elasticity, which can more reliably contact electronic components and heat dissipation components, and is less prone to loosening or gaps.

[0005] The technical solution of this utility model to solve the above-mentioned technical problems is as follows: A novel thermally conductive pad includes a multi-layer structure, consisting of an upper thermally conductive layer, an elastic layer, and a lower thermally conductive layer from top to bottom. Both the upper and lower thermally conductive layers are made of thermally conductive materials, and the upper, elastic, and lower thermally conductive layers are bonded and fixed together. The elastic layer includes an annular support frame, within which multiple sets of elastic elements are arranged in parallel. Both the support frame and the elastic elements are made of elastic material. The multiple sets of elastic elements are symmetrically distributed on both sides of the support frame. The cross-sectional shape of each elastic element is a horizontally laid-down "V" shape, and both ends of each elastic element are fixedly connected to the inner wall of the support frame. A distance exists between adjacent sets of elastic elements to form a receiving groove, which is filled with thermally conductive gel.

[0006] As a preferred option: with the center line of the thermal pad as the dividing line, the included angle of the center of the elastic element increases sequentially from the inside to the outside.

[0007] As a preferred embodiment, the multiple sets of elastic elements are symmetrically distributed on both sides of the support frame, and the spacing between adjacent sets of elastic elements gradually decreases and then gradually increases from the inside to the outside.

[0008] As a preferred embodiment, the thermal pad further includes an annular border that covers the edges of the upper thermally conductive layer, the elastic layer, and the lower thermally conductive layer.

[0009] As a preferred embodiment: the cross-sectional shape of the frame is "C" shaped, that is, the upper and lower edges of the inner side of the frame protrude inward; an annular recessed upper contact edge is provided at the edge of the upper heat-conducting layer, and an annular recessed lower contact edge is provided at the edge of the lower heat-conducting layer; the upper and lower contact edges are respectively used for the upper and lower edges of the inner side of the frame to be embedded.

[0010] As a preferred embodiment, the elastic element is a porous foam material or a mesh structure.

[0011] Compared with existing technologies, the technical solution of this application has the following beneficial technical effects: Because both the upper and lower sheets of this novel thermal pad are made of high thermal conductivity materials, and the elastic layer is filled with thermally conductive gel, the overall thermal pad has excellent thermal conductivity. Furthermore, the elastic layer can undergo a certain degree of elastic expansion and contraction. This allows the novel thermal pad to undergo elastic deformation to a certain extent. Compared to a single-layer pad structure, the multi-layer composite structure of this novel thermal pad has better elastic deformation performance, ensuring reliable contact between the thermal pad and electronic components and heat dissipation devices. It also reduces the likelihood of loosening and gaps between the pad and electronic components or heat dissipation devices due to material aging and hardening after prolonged use, thus improving the reliability of the thermal pad. Attached Figure Description

[0012] Figure 1 This is an exploded schematic diagram of the thermal pad described herein; Figure 2 This is an internal cross-sectional view of the thermal pad in this embodiment.

[0013] The attached diagram lists the components represented by each number as follows: 1. Upper thermally conductive layer; 101. Upper sheet; 102. Upper contact edge; 2. Elastic layer; 201. Support frame; 202. Elastic element; 203. Receiving groove; 3. Lower thermally conductive layer; 301. Lower sheet; 302. Lower contact edge; 4. Enclosing frame. Detailed Implementation

[0014] Reference Figure 1 A novel thermally conductive pad includes a multi-layer structure, consisting of an upper thermally conductive layer 1, an elastic layer 2, and a lower thermally conductive layer 3 from top to bottom.

[0015] The upper thermally conductive layer 1 and the lower thermally conductive layer 3 are both made of thermally conductive materials, and the upper thermally conductive layer 1, the elastic layer 2 and the lower thermally conductive layer 3 are bonded and fixed together.

[0016] Reference Figure 1 and Figure 2 The upper thermally conductive layer 1 includes an upper sheet 101, and the lower thermally conductive layer 3 includes a lower sheet 301; both the upper sheet 101 and the lower sheet 301 are made of a material with high thermal conductivity. In this embodiment, both the upper sheet 101 and the lower sheet 301 are made of thermally conductive silicone, but other materials may be used in other embodiments.

[0017] The elastic layer 2 includes an annular support frame 201, within which multiple sets of elastic elements 202 are arranged in parallel. Both the support frame 201 and the elastic elements 202 are made of elastic material. The multiple sets of elastic elements 202 are symmetrically distributed on both sides within the support frame 201. The cross-sectional shape of the elastic element 202 is a horizontally inverted "V" shape, and both ends of the elastic element 202 are fixedly connected to the inner wall of the support frame 201. A distance exists between adjacent sets of elastic elements 202 to form a receiving groove 203, which is filled with thermally conductive gel (not shown in the figure).

[0018] This novel thermal pad features an upper sheet 101 and a lower sheet 301 both made of high thermal conductivity materials, with the elastic layer 2 filled with a thermally conductive gel. This thermally conductive gel possesses advantages such as high thermal conductivity and high adhesion. Since the thermally conductive gel in the elastic layer 2 is in direct contact with the upper sheet 101 and the lower sheet 301, heat can be efficiently transferred between them through the gel, resulting in excellent overall thermal conductivity for the thermal pad.

[0019] Furthermore, since the support frame 201 is made of an elastic material, and the thermally conductive gel has a certain degree of elasticity and flexibility, the elastic layer 2 can undergo a certain degree of elastic expansion and contraction. Thus, when the upper thermally conductive layer 1 and the lower thermally conductive layer 3 are subjected to opposing forces, the elastic layer 2 is compressed and stores energy. When the external force is removed, the elastic layer 2 releases energy under the action of elastic force and gradually stretches back to its initial shape. This allows the novel thermally conductive pad to undergo elastic deformation to a certain extent. Compared to a single-layer pad structure, the multi-layer composite structure of this novel thermally conductive pad has better elastic deformation performance, ensuring reliable contact between the thermally conductive pad and electronic components and heat dissipation devices. It also reduces the likelihood of loosening and gaps between the pad and electronic components or heat dissipation devices due to material aging and hardening after prolonged use, thus improving the reliability of the thermally conductive pad.

[0020] like Figure 2As shown, in this embodiment, the center angle of the elastic element 202 increases sequentially from the inside to the outside, with the center line L of the thermal pad as the dividing line. For example, the center angle α1 < α2 < α3 in the figure. Since all groups of elastic elements 202 are made of the same material and have the same thickness, when the center angles are different, the reaction force generated by the elastic elements 202 with different center angles will be different when subjected to the same degree of compression deformation. This will make the contact pressure between different parts of the elastic layer 2 and the upper and lower contact pieces different. When the thermal pad as a whole undergoes different degrees of deformation, the elastic layer 2 can always provide effective elastic support for some parts of the thermal pad as a whole, ensuring reliable contact between the thermal pad as a whole and the electrical components and heat dissipation components.

[0021] like Figure 2 As shown, multiple sets of elastic elements 202 are symmetrically distributed on both sides of the support frame 201, and the spacing between adjacent sets of elastic elements 202 gradually decreases and then gradually increases from the inside to the outside. For example, spacing H1 < spacing H2 < spacing H3. This arrangement can provide better elastic support for the non-central and non-edge parts between the upper sheet 101 and the lower sheet 301.

[0022] Reference Figure 1 and Figure 2 In this embodiment, the thermal pad also includes an annular frame 4, which covers the edges of the upper thermally conductive layer 1, the elastic layer 2, and the lower thermally conductive layer 3. The frame 4 serves a reinforcing function, improving the overall structural strength of the thermal pad and preventing the edges of the support frame 201 from being squeezed outward when the thermal pad is compressed. The frame 4 also serves an insulating function, preventing particles that may fall off the upper thermally conductive layer 1, the contact layer, and / or the lower thermally conductive layer 3 due to compression, scratching, or aging from falling onto electrical components or circuit boards, thus preventing corrosion or short circuits.

[0023] like Figure 1 As shown, the cross-sectional shape of the frame 4 in this embodiment is "C" shaped, meaning that both the upper and lower edges of the inner side of the frame 4 protrude inwards. An annular recessed upper contact edge 102 is provided on the edge of the upper sheet 101, and an annular recessed lower contact edge 302 is provided on the edge of the lower sheet 301. The upper contact edge 102 and the lower contact edge 302 are respectively used for embedding the upper and lower edges of the inner side of the frame 4. This structure allows the frame 4 to more firmly and reliably cover the upper thermally conductive layer 1 and the lower thermally conductive layer 3, further improving the overall structural strength of the thermal pad.

[0024] In other embodiments, the elastic element 202 can be a porous foamed material, resulting in micropores inside the elastic element 202. These micropores can increase the adhesion between the thermally conductive gel and the elastic element 202, providing better containment for the thermally conductive gel. Similarly, in other embodiments, the elastic element 202 can also be a mesh structure.

[0025] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A novel thermally conductive pad, characterized in that: The device comprises a multi-layer structure, consisting of an upper thermally conductive layer, an elastic layer, and a lower thermally conductive layer from top to bottom. Both the upper and lower thermally conductive layers are made of thermally conductive materials, and they are bonded and fixed together. The elastic layer includes an annular support frame with multiple sets of elastic elements arranged parallel to each other within the frame. Both the support frame and the elastic elements are made of elastic material. The multiple sets of elastic elements are symmetrically distributed on both sides of the support frame. The cross-sectional shape of each elastic element is a horizontally laid-down "V" shape, and both ends of each elastic element are fixedly connected to the inner wall of the support frame. A distance exists between adjacent sets of elastic elements to form a receiving groove, which is filled with thermally conductive gel.

2. The novel thermally conductive pad according to claim 1, characterized in that: With the center line of the thermal pad as the dividing line, the included angle between the centers of the elastic elements increases sequentially from the inside to the outside.

3. The novel thermally conductive pad according to claim 1, characterized in that: The multiple sets of elastic elements are symmetrically distributed on both sides of the support frame, and the distance between adjacent sets of elastic elements gradually decreases and then gradually increases from the inside to the outside.

4. The novel thermally conductive pad according to claim 1, characterized in that: The thermal pad also includes an annular border that covers the edges of the upper thermally conductive layer, the elastic layer, and the lower thermally conductive layer.

5. The novel thermally conductive pad according to claim 4, characterized in that: The cross-sectional shape of the frame is "C", that is, the upper and lower edges of the inner side of the frame protrude inward; an annular recessed upper contact edge is provided at the edge of the upper heat-conducting layer, and an annular recessed lower contact edge is provided at the edge of the lower heat-conducting layer; the upper and lower contact edges are respectively used for the upper and lower edges of the inner side of the frame to be embedded.

6. The novel thermally conductive pad according to claim 1, characterized in that: The elastic element is made of porous foam material or has a mesh structure.

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