Shielding device and electronic device

Abstract

The application provides a shielding device and an electronic device. The shielding device comprises a cover structure and a support structure, the cover structure is used for shielding at least part of a circuit board; opposite two side edges of the cover structure are respectively connected with the support structure, and the two support structures are located on the same side of the cover structure along the thickness direction; the support structure comprises a clamping part and a first support part, the first support part connects the clamping part and the cover structure, and the clamping part is used for being connected with the circuit board.

Description

Technical Field

[0001] This application relates to the field of circuit board technology, and more particularly to a shielding device and electronic equipment. Background Technology

[0002] Circuit boards house electronic components that operate, generating electromagnetic waves that can interfere with other parts of the equipment or external devices—a phenomenon known as electromagnetic interference (EMI). Circuit boards typically have shielding covers to reflect and absorb EMI, reducing its impact. However, in current products, connecting the shielding covers to the circuit board is inconvenient and affects the circuit board layout. Utility Model Content

[0003] To address the aforementioned problems, embodiments of this application aim to provide a shielding device and an electronic device.

[0004] This application provides a shielding device, including: A shield structure for covering at least a portion of a circuit board; The support structure is provided, wherein two opposite side edges of the cover structure are respectively connected to the support structure, and the two support structures are located on the same side of the cover structure along the thickness direction; the support structure includes a snap-fit ​​part and a first support part, the first support part connecting the snap-fit ​​part and the cover structure, and the snap-fit ​​part being used to connect to the circuit board.

[0005] In some embodiments, the support structure further includes a second support portion, which is disposed intersecting with the first support portion, and the first support portion and the second support portion are located on the same side of the cover structure along the thickness direction.

[0006] In some embodiments, when the support structure undergoes elastic deformation, the relative distance between the two snap-fit ​​portions increases.

[0007] In some embodiments, the snap-fit ​​portion includes a first wall portion and a second wall portion and a third wall portion spaced apart, the second wall portion and the third wall portion being respectively connected to opposite ends of the first wall portion, the second wall portion being also connected to the first support portion, and the third wall portion including a curved surface structure arching toward the second wall portion.

[0008] In some embodiments, the surface of the cover structure facing away from the two support structures is recessed to form a first functional area, which is used to accommodate a heat dissipation structure to dissipate heat from the heat-generating components of the circuit board.

[0009] In some embodiments, a second functional area is formed on the side of the cover structure near the support structure. The second functional area is spaced apart from the first functional area and is used to avoid obstructing electronic components of the circuit board.

[0010] In some embodiments, the support structure is a conductive metal component, the snap-fit ​​portion has a slot facing the opening of the circuit board, the slot wall surface is used to contact the edge of the circuit board, and the cover structure can be electrically connected to the grounded shield fence of the edge of the circuit board through the support structure.

[0011] This application embodiment also provides an electronic device, including a circuit board and a shielding device, the shielding device comprising: A cover structure that covers at least a portion of the circuit board; The support structure is provided, wherein two opposite side edges of the cover structure are respectively connected to the support structure, and the two support structures are located on the same side of the cover structure along the thickness direction; the support structure includes a snap-fit ​​part and a first support part, the first support part connects the snap-fit ​​part and the cover structure, and the snap-fit ​​part is connected to the circuit board.

[0012] In some embodiments, the circuit board is located between the two support structures, and along the direction from one support structure to the other, the length of the cover structure is not less than the length of the circuit board; and / or, The projection of the cover structure onto a projection plane perpendicular to the thickness direction at least partially covers the electronic components mounted on the circuit board.

[0013] In some embodiments, the cover structure has a first functional area corresponding to the heat-generating components of the circuit board, the first functional area being provided with a heat dissipation structure, the heat dissipation structure dissipating heat from the heat-generating components through the cover structure. Attached Figure Description

[0014] Figure 1 This is a cross-sectional view of the shielding device and the circuit board assembled in another embodiment of this application; Figure 2 This is a cross-sectional view of the shielding device and the circuit board assembled in another embodiment of this application; Figure 3 This is a schematic diagram of the structure of the shielding device and the circuit board after assembly in one embodiment of this application; Figure 4 for Figure 3 Cross-sectional view of the structure at point A; Figure 5 for Figure 3 A partial cross-sectional view of the central structure in the first functional area; Figure 6 for Figure 3 Exploded view of the structure; Figure 7 This is a physical schematic diagram of a circuit board in one embodiment of this application. Detailed Implementation

[0015] The embodiments of this application will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this application, but should not be used to limit the scope of this application.

[0016] In the description of the embodiments of this application, it should be noted that the terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0017] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application based on the specific circumstances.

[0018] In the embodiments of this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature and the second feature are in direct contact, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0019] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example that is included in at least one embodiment or example of the embodiments of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0020] This application provides a shielding device 1. The shielding device 1 can be used inside electronic devices to shield the EMI of circuit boards. These electronic devices can be servers, industrial control computers, laptops, mobile phones, tablets, etc. Please refer to [link to relevant documentation]. Figure 1 and Figure 2 The shielding device 1 includes a cover structure 10 and a support structure 20.

[0021] The cover structure 10 is used to cover at least part of the circuit board 2. That is, when the shielding device 1 is installed in place, part or all of the circuit board 2 is covered by the cover structure 10. The circuit board 2 is a structural component used to support and connect electronic components 3 and realize the transmission of electrical signals between electronic components 3. It is usually characterized by a compact structure.

[0022] It is understandable that the enclosure structure 10 has conductive or magnetic materials, thereby reflecting and absorbing the EMI of the circuit board 2, so that the EMI gradually weakens in the space between the enclosure structure 10 and the circuit board 2, reducing its escape to the outside space.

[0023] It should be noted that the conductive material in the cover structure 10 may take on the following three forms, including but not limited to: First, the cover structure 10 is made of conductive material, which is in the form of a structural component; second, the cover structure 10 has a conductive material coating, which is in the form of a coating; third, the cover structure 10 has a conductive material electroplated layer, which is in the form of an electroplated layer. The conductive material is not limited here and can be copper, aluminum, etc., while the cover structure 10 can be a rigid structure or a flexible structure.

[0024] Please see Figure 1 and Figure 6 The cover structure 10 has two opposite side edges connected to support structures 20, and the two support structures 20 are located on the same side of the cover structure 10 along the thickness direction. The support structures 20 are used to provide mounting and support for the cover structure 10, so that the cover structure 10 can stably cover one side of the circuit board 2, forming a stable EMI shielding space.

[0025] The two opposing side edges mentioned above refer to the two edges of the cover structure 10 located at the near end and far end respectively along a specified direction. It is not limited to the two edges being parallel. The direction of the straight line where the two opposing support structures 20 are located determines the specified direction. The number of support structures 20 is not limited. There can be two, three or more. That is to say, it is not limited to the cover structure 10 having only two opposing side edges connected to the support structures 20. There can also be other side edges.

[0026] Please continue reading. Figure 1The support structure 20 includes a snap-fit ​​portion 23 and a first support portion 21. The first support portion 21 connects the snap-fit ​​portion 23 and the cover structure 10. The snap-fit ​​portion 23 is used to connect with the circuit board 2. Compared with the prior art solution of welding clamps onto the circuit board to fix the shielding cover, the shielding device 1 in this embodiment has a snap-fit ​​portion 23 that is directly connected to the circuit board 2, eliminating the need to weld clamps onto the circuit board 2 and reclaiming the area occupied by the clamps. This not only avoids the shielding device 1 affecting the layout of the circuit board 2, but also improves the space utilization of the circuit board 2.

[0027] For example, the snap-fit ​​part 23 snaps into the circuit board 2 using its own structure. For instance, the snap-fit ​​part 23 has a groove with a thickness equivalent to the edge of the circuit board 2. When the shielding device 1 is installed in place, the edge of the circuit board 2 extends into the groove, and the circuit board 2 snaps into the snap-fit ​​part 23, thereby fixing the cover structure 10. In this way, the way the shielding device 1 is connected to the circuit board 2 is relatively simple, eliminating the need for soldering fixtures and simplifying the production process.

[0028] For example, in different embodiments, the height of the first support 21 may be different to adjust the distance between the cover structure 10 and the circuit board 2 to meet different design requirements.

[0029] In some embodiments, please refer to Figure 6 The support structure 20 also includes a second support portion 22, which intersects with the first support portion 21, and the first support portion 21 and the second support portion 22 are located on the same side of the cover structure 10 along the thickness direction. That is, the first support portion 21 and the second support portion 22 are respectively connected to different side edges of the cover structure 10, for example... Figure 6 As shown, the first support part 21 and the second support part 22 are located on adjacent sides of the cover structure 10, respectively.

[0030] like Figure 3 and Figure 6 As shown, the second support 22 serves as a supplement to the edge side of the cover structure 10 and is located on the same side of the cover structure 10 as the first support 21. This makes the shielding space formed between the cover structure 10 and the circuit board 2 more enclosed, reducing the area of ​​open cutouts. Electromagnetic waves can undergo more reflections in this space until they are absorbed, reducing the escape to the outside of the space. The EMI shielding effect of the shielding device 1 is better.

[0031] It should be noted that a notch can be opened on the edge of the second support part 22 near the circuit board 2 to avoid the layout of electronic components 3 on the circuit board 2. Such an adjustment has little impact on the EMI shielding effect.

[0032] The connection between the snap-fit ​​part 23 and the circuit board 2 can be achieved in, but is not limited to, the following two ways.

[0033] In some embodiments, the slot of the snap-fit ​​part 23 is fitted with the edge of the circuit board 2, that is, the width of the slot is approximately equal to the edge thickness of the circuit board 2. In this way, when the shielding device 1 is installed in place, the snap-fit ​​part 23 forms a stable physical connection with the circuit board 2, and the cover structure 10 is fixed to the circuit board 2 through the snap-fit ​​part 23.

[0034] Secondly, in some embodiments, when the support structure 20 undergoes elastic deformation, the relative distance between the two latching portions 23 increases. It can be understood that when the support structure 20 returns to its elastic deformation state, the relative distance between the two latching portions 23 decreases. In this embodiment, the relative distance between the two latching portions 23 can be adjusted so that before the shielding device 1 is installed on the circuit board 2, there is a sufficiently large relative distance to avoid structural interference. After installation, the external force is removed, and the two latching portions 23 move closer to each other under the action of elastic force until the relative distance is equivalent to the distance between the opposite two edges of the circuit board 2. At this point, the shielding device 1 is in place.

[0035] In the first implementation, the snap-fit ​​part 23 can be stably connected to the circuit board 2 without the need for additional fasteners, resulting in a simple structure. In the second implementation, the operation steps for installing the shielding device 1 onto the circuit board 2 are simple and easy to learn. It should be noted that the first and second implementations can be combined.

[0036] In some embodiments, please refer to Figure 2 and Figure 4 The latching portion 23 includes a first wall portion 231 and a second wall portion 232 and a third wall portion 233 spaced apart. The second wall portion 232 and the third wall portion 233 are respectively connected to opposite ends of the first wall portion 231. The second wall portion 232 is also connected to the first support portion 21. Thus, the first wall portion 231, the second wall portion 232, and the third wall portion 233 can form a latching groove for the latching portion 23. When the shielding device 1 is installed in place, the edge of the circuit board 2 extends between the second wall portion 232 and the third wall portion 233.

[0037] In a specific embodiment of the first implementation described above, the third wall portion 233 and the first wall portion 231 are respectively attached to the opposite side surfaces of the circuit board 2 along the thickness direction. In a specific embodiment of the second implementation described above, the second wall portions 232 of the two snap-fit ​​portions 23 abut against the opposite side edges of the circuit board 2.

[0038] Please continue reading. Figure 2 and Figure 4In the shielding device 1 provided in this application embodiment, the third wall portion 233 includes a curved surface structure arching towards the second wall portion 232. In other words, the distance between the surface of the third wall portion 233 and the surface of the second wall portion 232 is variable, decreasing first and then increasing along the direction away from the first wall portion 231. Thus, on the one hand, a guide tolerance structure is formed at the slot opening, facilitating the edge of the circuit board 2 to extend into the slot during the installation of the shielding device 1, reducing the positioning alignment accuracy requirements; on the other hand, the surface of the third wall is convex, making it more prone to slight elastic deformation, so the distance between the third wall and the second wall can be slightly less than the thickness of the edge of the circuit board 2. In this way, when the edge of the circuit board 2 extends into the slot, the third wall and the second wall can stably contact the surface of the circuit board 2 and generate a clamping force.

[0039] In some embodiments, please refer to Figure 3 and Figure 6 The surface of the cover structure 10 facing away from the two support structures 20 is recessed to form a first functional area 10a. The first functional area 10a is used to accommodate the heat dissipation structure 4 to dissipate heat from the heat-generating components 31 of the circuit board 2. The heat-generating components 31 are one or more of the electronic components 3 mounted on the circuit board 2.

[0040] It is understandable that the electronic components 3 mounted on the circuit board 2 consume energy and radiate electromagnetic waves, while also generating heat. Therefore, heat may accumulate in the shielding space between the enclosure structure 10 and the circuit board 2. This heat-generating component 31 can be a central processing unit or an radio frequency chip, etc.

[0041] With the shielding device 1 installed, the first functional area 10a is formed by a portion of the cover structure 10 recessed towards the circuit board 2. Therefore, the first functional area 10a is relatively close to the heat-generating components 31 on the circuit board 2, facilitating the establishment of a thermally conductive connection with the heat-generating components 31. A thermally conductive connection refers to establishing a thermal path from the heat-generating components 31 to the cover structure 10 through thermally conductive adhesive or other physical contact. Furthermore, the first functional area 10a thermally connects to the heat dissipation structure 4 of the electronic device, transferring heat away. The recessed structure of the first functional area 10a facilitates accurate positioning of the heat-generating components 31 by the cooling kit, achieving efficient heat dissipation.

[0042] Electronic components 3 on circuit board 2 that have strong EMI often have high power consumption. In this embodiment, the shielding device 1 achieves good EMI shielding while taking into account the heat dissipation requirements of circuit board 2, greatly avoiding the impact of physical shielding on heat dissipation and improving the working stability of circuit board 2.

[0043] It should be noted that the aforementioned heat dissipation structure 4 refers to a partial structure of the heat dissipation system, including components such as a heat spreader, heat sink fins, or a cooling fan. The first functional area 10a transfers heat to the heat dissipation structure 4, and the heat dissipation system then exhausts the heat to the outside of the electronic device. Of course, the housing structure 10 itself also serves to increase the heat dissipation area and assist in heat dissipation.

[0044] In some embodiments, please refer to Figure 3 and Figure 6 A second functional area 10b is formed on the side of the cover structure 10 near the support structure 20. The second functional area 10b is spaced apart from the first functional area 10a. The second functional area 10b is used to avoid obstructing the electronic components 3 of the circuit board 2. The above-mentioned obstruction means that the second functional area 10b avoids structural interference with the electronic components 3 by means of openings or protruding in a direction away from the circuit board 2.

[0045] In other words, the cover structure 10 provided in this application embodiment can be a discontinuous surface (i.e., with openings) or a non-flat surface (i.e., with protruding structures). In different embodiments, the cover structure 10 can be adjusted according to the layout of the circuit board 2. Compared with the prior art, which adjusts the layout design to meet EMI shielding requirements, this application embodiment prioritizes meeting the layout design, reducing development costs.

[0046] In some embodiments, the support structure 20 is a conductive metal part, the snap-fit ​​part 23 has a slot facing the circuit board 2, the slot wall is used to contact the edge of the circuit board 2, and the cover structure 10 can be electrically connected to the grounding shield fence 201 at the edge of the circuit board 2 through the support structure 20.

[0047] The aforementioned groove wall surface refers to the inner surface of the slot, such as the surfaces of the first wall portion 231, the second wall portion 232, and the third wall portion 233 in some embodiments. The aforementioned grounding shield fence 201 refers to the grounding electrical structure at the edge of the circuit board 2 for suppressing EMI, and its implementation includes, but is not limited to, a grounding metal overlay or a metal via connecting the GND layer of the circuit board 2 (such as...). Figure 7 (The dotted image shown).

[0048] In this embodiment, on the one hand, the support structure 20 establishes an electrical connection between the cover structure 10 and the GND layer of the circuit board 2 through its own conductivity, that is, the cover structure 10 is grounded. Grounding can make the cover structure 10 and the GND layer at the same potential, avoiding the cover structure 10 from becoming a "secondary radiation source" due to charge accumulation. Grounding can also provide a low-impedance return path, reducing current radiation on the surface of the cover. On the other hand, both sides of the grounding shield fence 201 extend into the slot. The snap-fit ​​part 23, as a conductive metal part, can also play a role in suppressing EMI. The grounding shield fence 201 cooperates with the shielding device 1, thus further enhancing the EMI shielding effect of the shielding device 1.

[0049] For example, the minimum depth of the card slot is not less than the width of the grounding shield fence 201 at the edge of the circuit board 2. That is, the card slot wraps around the grounding shield fence 201 to better suppress EMI and stabilize the potential of the cover structure 10.

[0050] The shielding device 1 provided in this application embodiment can be an integral structure, that is, the cover structure 10 and the support structure 20 are integrally formed. The shielding device 1 has a simple structure, is easy to manufacture and easy to install on the circuit board 2.

[0051] In the shielding device 1 provided in this application embodiment, the cover structure 10 can be a stainless steel part. Stainless steel is an easy-to-obtain material with good structural strength, which can form a stable physical shield and suppress EMI.

[0052] In the shielding device 1 provided in this application embodiment, the conductive material of the cover structure 10 can be 430 stainless steel. The thickness of the 430 stainless steel material does not exceed 0.15mm (millimeters), and can be 0.15mm, 0.10mm, 0.05mm, etc. In this way, the cover structure 10 has a good shielding effect on EMI in most frequency bands, and the material cost is low and easy to manufacture.

[0053] Due to the skin effect, under EMI, the induced current in the enclosure structure 10 is mainly concentrated on the surface. Calculations using formulas (1) and (2) below show that, for an EMI frequency band of 100MHz to 1GHz, the required thickness of the 430 stainless steel material is at least 2.09 mm. (micrometers) ~0.66 .

[0054]

[0055] In the above formula, For frequency, Permeability, is the electrical conductivity.

[0056] As can be seen, in embodiments where the thickness of the 430 stainless steel material does not exceed 0.15 mm, the relatively large thickness of the 430 stainless steel material results in good shielding performance for most frequency bands of EMI by the enclosure structure 10, making it suitable for use in electronic devices such as servers and personal computers that communicate primarily using radio frequency signals. Verification has shown that in this embodiment, the EMI intensity outside the shielding space can be reduced by 3 dB.

[0057] This application also provides an electronic device, which may be an industrial control computer, a laptop computer, a mobile phone, a tablet, etc. Please refer to [link to relevant documentation]. Figure 1 , Figure 2 as well as Figure 6 The electronic device includes a circuit board 2 and a shielding device 1. The circuit board 2 is a structural component of the electronic device used to support and connect electronic components 3 and to realize the transmission of electrical signals between electronic components 3 in order to realize its function. It is often characterized by a compact structure.

[0058] Please see Figure 1 and Figure 2 The shielding device 1 includes a cover structure 10 that covers at least part of the circuit board 2. That is, when the shielding device 1 is installed in place, part or all of the circuit board 2 is covered by the cover structure 10.

[0059] It is understandable that the enclosure structure 10 has conductive or magnetic materials, thereby reflecting and absorbing the EMI of the circuit board 2, so that the EMI gradually weakens in the space between the enclosure structure 10 and the circuit board 2, reducing its escape to the outside space.

[0060] It should be noted that the conductive material in the cover structure 10 may take on the following three forms, including but not limited to: First, the cover structure 10 is made of conductive material, which is in the form of a structural component; second, the cover structure 10 has a conductive material coating, which is in the form of a coating; third, the cover structure 10 has a conductive material electroplated layer, which is in the form of an electroplated layer. The conductive material is not limited here and can be copper, aluminum, etc., while the cover structure 10 can be a rigid structure or a flexible structure.

[0061] Please see Figure 1 and Figure 6 The shielding device 1 also includes a support structure 20. The support structure 20 is connected to two opposite side edges of the cover structure 10, and the two support structures 20 are located on the same side of the cover structure 10 along the thickness direction. The support structure 20 is used to provide mounting and support for the cover structure 10, so that the cover structure 10 can stably cover one side of the circuit board 2, forming a stable EMI shielding space.

[0062] The two opposing side edges mentioned above refer to the two edges of the cover structure 10 located at the near end and far end respectively along a specified direction. It is not limited to the two edges being parallel. The direction of the straight line where the two opposing support structures 20 are located determines the specified direction. The number of support structures 20 is not limited. There can be two, three or more. That is to say, it is not limited to the cover structure 10 having only two opposing side edges connected to the support structures 20. There can also be other side edges.

[0063] Please continue reading. Figure 1 The support structure 20 includes a snap-fit ​​portion 23 and a first support portion 21. The first support portion 21 connects the snap-fit ​​portion 23 and the cover structure 10, and the snap-fit ​​portion 23 connects to the circuit board 2. Compared with the prior art solution of welding clamps onto the circuit board 2 to fix the shielding cover, the shielding device 1 in this embodiment has a snap-fit ​​portion 23 that is directly connected to the circuit board 2, eliminating the need to weld clamps onto the circuit board 2, and reclaiming the area occupied by the clamps. This not only avoids affecting the layout of the circuit board 2, but also improves the space utilization of the circuit board 2.

[0064] For example, the snap-fit ​​part 23 snaps into the circuit board 2 using its own structure. For instance, the snap-fit ​​part 23 has a groove with a thickness equivalent to the edge of the circuit board 2. When the shielding device 1 is installed in place, the edge of the circuit board 2 extends into the groove, and the circuit board 2 snaps into the snap-fit ​​part 23, thereby fixing the cover structure 10. In this way, the way the shielding device 1 is connected to the circuit board 2 is relatively simple, eliminating the need for soldering fixtures and simplifying the production process.

[0065] For example, in different embodiments, the height of the first support 21 may be different to adjust the distance between the cover structure 10 and the circuit board 2 to meet different design requirements.

[0066] In some embodiments, the circuit board 2 is located between two support structures 20, and the length of the cover structure 10 along the direction from one support structure 20 to the other is not less than the length of the circuit board 2. In this embodiment, the cover structure 10 can cover part or all of the circuit board 2, and the covered part is not affected by the length of the circuit board 2. In other words, the cover structure 10 can completely cover the circuit board 2, including the electronic components 3 mounted on the circuit board 2 and the areas not used by the electronic components 3, instead of being limited by the position of the clamp as in the prior art, and is not limited to only providing EMI shielding for a portion of the electronic components 3 on the circuit board 2.

[0067] In some embodiments, the projection of the shield structure 10 onto a projection plane perpendicular to the thickness direction at least partially covers the electronic components 3 mounted on the circuit board 2. That is, the electronic components 3 mounted on the circuit board 2 can be partially or completely shielded by the shield structure 10. In other words, the shield structure 10 can completely shield the circuit board 2, including the electronic components 3 mounted on the circuit board 2 and areas not used by the electronic components 3, rather than being limited by the position of the clamps as in prior art solutions, and is not limited to providing EMI shielding only for a portion of the electronic components 3 on the circuit board 2.

[0068] In some embodiments, the cover structure 10 has a first functional area 10a corresponding to the heat-generating component 31 of the circuit board 2. The first functional area is provided with a heat dissipation structure 4, which dissipates heat from the heat-generating component 31 through the cover structure 10.

[0069] It is understandable that the electronic components 3 mounted on the circuit board 2 consume energy and radiate electromagnetic waves, while also generating heat. Therefore, heat may accumulate in the shielding space between the enclosure structure 10 and the circuit board 2. This heat-generating component 31 can be a central processing unit or an radio frequency chip, etc.

[0070] With the shielding device 1 installed, the first functional area 10a is formed by a portion of the cover structure 10 recessed towards the circuit board 2. Therefore, the first functional area 10a is relatively close to the heat-generating components 31 on the circuit board 2, facilitating the establishment of a thermally conductive connection with the heat-generating components 31. A thermally conductive connection refers to establishing a thermal path from the heat-generating components 31 to the cover structure 10 through thermally conductive adhesive or other physical contact. Furthermore, the first functional area 10a thermally connects to the heat dissipation structure 4 of the electronic device, transferring heat away. The recessed structure of the first functional area 10a facilitates accurate positioning of the heat-generating components 31 by the cooling kit, achieving efficient heat dissipation.

[0071] Electronic components 3 on circuit board 2 that have strong EMI often have high power consumption. In this embodiment, the shielding device 1 achieves good EMI shielding while taking into account the heat dissipation requirements of circuit board 2, greatly avoiding the impact of physical shielding on heat dissipation and improving the working stability of circuit board 2.

[0072] It should be noted that the aforementioned heat dissipation structure 4 refers to a partial structure of the heat dissipation system, including components such as a heat spreader, heat sink fins, or a cooling fan. The first functional area 10a transfers heat to the heat dissipation structure 4, and the heat dissipation system then exhausts the heat to the outside of the electronic device. Of course, the housing structure 10 itself also serves to increase the heat dissipation area and assist in heat dissipation.

[0073] The electronic device provided in any embodiment of this application may include the shielding device 1 in any of the foregoing embodiments of this application. For other optional embodiments of the shielding device 1, please refer to the foregoing description, which will not be repeated here.

[0074] The various embodiments / implementations provided in this application can be combined with each other without creating contradictions.

[0075] The above description is merely a preferred embodiment of this application and is not intended to limit the application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A shielding device, characterized in that, include: A shield structure for covering at least a portion of a circuit board; The support structure is provided, wherein two opposite side edges of the cover structure are respectively connected to the support structure, and the two support structures are located on the same side of the cover structure along the thickness direction; the support structure includes a snap-fit ​​part and a first support part, the first support part connecting the snap-fit ​​part and the cover structure, and the snap-fit ​​part being used to connect to the circuit board.

2. The shielding device according to claim 1, characterized in that, The support structure further includes a second support portion, which is intersecting with the first support portion, and the first support portion and the second support portion are located on the same side of the cover structure along the thickness direction.

3. The shielding device according to claim 1, characterized in that, When the support structure undergoes elastic deformation, the relative distance between the two snap-fit ​​parts increases.

4. The shielding device according to claim 1, characterized in that, The snap-fit ​​portion includes a first wall portion and a second wall portion and a third wall portion spaced apart. The second wall portion and the third wall portion are respectively connected to opposite ends of the first wall portion. The second wall portion is also connected to the first support portion. The third wall portion includes a curved surface structure that arches toward the second wall portion.

5. The shielding device according to claim 1, characterized in that, The surface of the cover structure opposite to the two supporting structures is recessed to form a first functional area, which is used to accommodate a heat dissipation structure to dissipate heat from the heat-generating components of the circuit board.

6. The shielding device according to claim 5, characterized in that, The cover structure forms a second functional area on the side near the support structure. The second functional area is spaced apart from the first functional area and is used to avoid the electronic components of the circuit board.

7. The shielding device according to any one of claims 1-6, characterized in that, The support structure is a conductive metal part, the snap-fit ​​part has a slot facing the opening of the circuit board, the slot wall is used to contact the edge of the circuit board, and the cover structure can be electrically connected to the grounded shield fence of the edge of the circuit board through the support structure.

8. An electronic device, characterized in that, Includes a circuit board and a shielding device, the shielding device comprising: A cover structure that covers at least a portion of the circuit board; The support structure is provided, wherein two opposite side edges of the cover structure are respectively connected to the support structure, and the two support structures are located on the same side of the cover structure along the thickness direction; the support structure includes a snap-fit ​​part and a first support part, the first support part connects the snap-fit ​​part and the cover structure, and the snap-fit ​​part is connected to the circuit board.

9. The electronic device according to claim 8, characterized in that, The circuit board is located between the two supporting structures, and the length of the cover structure is not less than the length of the circuit board along the direction from one of the supporting structures to the other. And / or, The projection of the cover structure onto a projection plane perpendicular to the thickness direction at least partially covers the electronic components mounted on the circuit board.

10. The electronic device according to claim 8, characterized in that, The cover structure has a first functional area corresponding to the heat-generating components of the circuit board. The first functional area is provided with a heat dissipation structure, which dissipates heat from the heat-generating components through the cover structure.

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