Bulk patcher

Abstract

The application provides a bulk patching machine, which belongs to the technical field of electronic manufacturing equipment. The bulk patching machine comprises a rack, a clamp device, a feeding device and a die bonding device which are arranged on the rack. The feeding device comprises a circular vibration assembly, a first straight vibration assembly, a rotary table assembly and a second straight vibration assembly which are sequentially arranged on the rack. The circular vibration assembly has a discharge port. The first straight vibration assembly has a first feeding end and a first discharge end. The second straight vibration assembly has a second feeding end and a second discharge end. The first feeding end is connected to the discharge port. The rotary table assembly is arranged between the first discharge end and the second feeding end. The second discharge end faces the clamp device. The bulk patching machine has the advantages of small material taking action amplitude and high material taking efficiency, and the overall efficiency of bulk patching is improved.

Description

Technical Field

[0001] This application belongs to the field of electronic manufacturing equipment technology, and more specifically, relates to a bulk material placement machine. Background Technology

[0002] Bulk component placement machines are used to precisely mount bulk electronic components onto designated locations on circuit boards or other substrates. Currently, most existing bulk component placement machines use a vibrating table mechanism to feed bulk components and use a swing arm to pick up the electronic components from the vibrating table and place them onto the circuit board. This results in problems such as large picking motion amplitude and low picking efficiency. Utility Model Content

[0003] The purpose of this application is to provide a bulk material placement machine to solve the technical problems of large material handling range and low material handling efficiency in existing bulk material placement machines.

[0004] To achieve the above objectives, this application provides a bulk material placement machine, including a frame and a clamping device, a feeding device, and a die bonding device disposed on the frame; the feeding device includes a circular oscillator assembly, a first vertical oscillator assembly, a turntable assembly, and a second vertical oscillator assembly disposed sequentially on the frame; the second vertical oscillator assembly faces the clamping device; The clamping device is used to fix the first workpiece; the circular vibration assembly is configured to accommodate a plurality of second workpieces and sequentially transfer the plurality of second workpieces to the first vertical vibration assembly; the turntable assembly is configured to receive the second workpieces output from the first vertical vibration assembly; the second vertical vibration assembly is configured to receive the second workpieces output from the turntable assembly; the die bonding device is configured to receive the second workpieces output from the second vertical vibration assembly and attach the second workpieces to the target position of the first workpiece.

[0005] In some embodiments, the die bonding device includes a support shaft, a die bonding swing arm connected to the support shaft, and a die bonding nozzle disposed on the die bonding swing arm; the second linear vibration assembly has a second feed end and a second discharge end, and the support shaft is rotatably connected to the frame such that the die bonding nozzle has a first position facing the second discharge end and a second position facing the clamping device. The die-bonding nozzle is configured to pick up the second workpiece at the second discharge end when in the first position, and to place the second workpiece at the target position when in the second position.

[0006] In some embodiments, the height of the die-bonding nozzle is higher than that of the second discharge end, and there is a preset height difference between them.

[0007] In some embodiments, there are multiple die-bonding arms, which are arranged circumferentially around the support shaft, and each die-bonding arm is provided with a die-bonding nozzle.

[0008] In some embodiments, the number of the feeding devices is two sets, the two sets of feeding devices are symmetrically arranged on the frame, and the clamping device is located between the two sets of feeding devices.

[0009] In some embodiments, the frame includes a first frame and two second frames, the two second frames being respectively disposed on opposite sides of the first frame, and each of the feeding devices being disposed on each of the second frames.

[0010] In some embodiments, the number of die bonding devices is two sets, and the two sets of die bonding devices are symmetrically arranged on the frame. Each die bonding device corresponds to each feeding device and is configured to bond the second workpiece in the corresponding feeding device to the target position.

[0011] In some embodiments, the turntable assembly includes a spindle connected to the frame, a turntable disposed on the spindle, a plurality of gripping nozzles disposed on the turntable, and at least one processing component disposed on the frame; The first linear vibration assembly has a first discharge end, and the second linear vibration assembly has a second feed end; wherein, a plurality of gripping nozzles are arranged at intervals around the circumference of the turntable, and the turntable assembly is configured such that each gripping nozzle sequentially passes through the first discharge end and the second feed end when the turntable rotates; the processing component is disposed between the first discharge end and the second feed end, and is configured to perform at least one of the following processing on the second workpiece: alignment, testing, screening, reversing, or detection.

[0012] In some embodiments, the number of processing components is multiple, and the multiple processing components include a first guiding component, a testing component, a screening component, a reversing component, a second guiding component, and an optical fiber sensing component arranged sequentially in the circumferential direction of the turntable from the first discharge end to the second feed end; Wherein, the first guiding component is configured to perform a first guiding of the second workpiece; the testing component is configured to test the polarity of the second workpiece; the screening component is used to eliminate faulty second workpieces; the reversing component is configured to rotate the second workpiece to a preset posture; the second guiding component is configured to perform a second guiding of the second workpiece; and the fiber optic sensing component is configured to perform power-on detection of the second workpiece.

[0013] In some embodiments, the clamping device includes a first base disposed on the frame, a second base slidably connected to the first base along a first direction, a third base slidably connected to the second base along a second direction, and a clamping assembly disposed on the third base, wherein the first direction is perpendicular to the second direction, and the clamping assembly is configured to fix the first workpiece.

[0014] The beneficial effects of the loose material placement machine provided in this application are as follows: Compared with the prior art, the feeding device adopts a combination transmission method of circular vibration component, first direct vibration component, turntable component and second direct vibration component, which shortens the material picking path, reduces the material picking action amplitude of the die bonding device, and thus improves the material picking efficiency. It not only optimizes the workflow of the equipment, but also reduces the errors that may be caused by long-distance material picking, and improves the overall placement accuracy.

[0015] Furthermore, in the bulk component placement machine provided in this application, the cooperation between the feeding device and the die bonding device can sequentially place a single second workpiece onto the first workpiece. Compared with the prior art method of placing multiple workpieces simultaneously, it is less likely to cause obvious color difference problems, improves the consistency of product appearance, achieves efficient and accurate mixed-patch operation, and ensures uniform material placement. At the same time, for workpieces with different spacing / models, it can be compatible with various pad spacing requirements without manually adjusting the nozzle spacing, greatly improving the ease of operation. Moreover, it can quickly correct individual position and angle deviations, effectively reducing the risk of high defect rates caused by row misalignment, and improving placement accuracy and product yield.

[0016] In addition, the feeding device can be independently separated from the frame, which can significantly shorten the changeover time of the feeding device, support the equipment to work without stopping, and improve production efficiency; at the same time, it can also reduce the number of equipment to be purchased, effectively save equipment procurement costs, and improve the economic benefits of enterprises. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the bulk material patching machine in the embodiments of this application; Figure 2 This is an exploded view of the bulk material placement machine in the embodiments of this application; Figure 3 for Figure 1 A partial view along direction A in the middle; Figure 4This is a schematic diagram of the clamping device in the embodiments of this application; Figure 5 This is a schematic diagram of the feeding device in the embodiments of this application; Figure 6 for Figure 3 Enlarged view of section B; Figure 7 This is a schematic diagram of the die bonding device in an embodiment of this application; Figure 8 for Figure 3 A partial sectional view along the CC direction; Figure 9 This is a schematic diagram of the die bonding device in another embodiment of this application.

[0019] The following are the labeling elements in the figure: 100 - Frame; 110 - First frame; 120 - Second frame; 200-Clamping device; 210-First base; 211-First track; 220-Second base; 221-Second track; 230-Third base; 240-Clamping assembly; 241-Support plate; 242-Conveyor belt; 10-Circuit board; 300 - Feeding device; 310 - Circular vibration assembly; 311 - Discharge port; 320 - First vertical vibration assembly; 321 - First feed end; 322 - First discharge end; 330 - Turntable assembly; 331 - Main shaft; 332 - Turntable; 3321 - Vacuum diverter; 3322 - Positioning seat; 3323 - Rotary joint; 333 - Gripping nozzle; 3331 - Air pipe; 334 - First guiding component; 335 - Testing component; 336 - Screening component; 337 - Reversing component; 338 - Second guiding component; 339 - Fiber optic sensing component; 340 - Second vertical vibration assembly; 341 - Second feed end; 342 - Second discharge end; 400 - Die bonding device; 410 - Drive motor; 411 - Support shaft; 420 - Swing arm; 430 - Die bonding nozzle. Detailed Implementation

[0020] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0021] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0022] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0023] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0024] This application provides a bulk component placement machine for fixing a first workpiece and sequentially attaching multiple workpieces onto the first workpiece. The first workpiece may be a circuit board or other substrate, and the multiple workpieces are bulk electronic components.

[0025] Reference Figure 1 The bulk component bonding machine provided in this application includes a frame 100 and a clamping device 200, a feeding device 300, and a die bonding device 400 disposed on the frame 100. The clamping device 200 is configured to fix a first workpiece at a predetermined position. The feeding device 300 is configured to sequentially transfer multiple bulk second workpieces to the die bonding device 400. The die bonding device 400 is configured to bond each of the second workpieces conveyed by the feeding device 300 to a target position on the first workpiece. The number of feeding devices 300 and die bonding devices 400 can both be one or more.

[0026] Reference Figure 2 and Figure 3 In some embodiments, the number of feeding devices 300 can be two sets, which can be symmetrically arranged on the frame 100, with the clamping device 200 positioned between the two sets of feeding devices 300. During operation, the two sets of feeding devices 300 can work simultaneously, respectively conveying the bulk second workpiece to the corresponding die-bonding device 400. The die-bonding device 400 then attaches the second workpiece to the target position of the first workpiece fixed on the clamping device 200. This arrangement improves bonding efficiency and meets the needs of large-scale production. Furthermore, if one set of feeding devices 300 malfunctions, the other set can continue to operate, ensuring production continuity and avoiding production stoppages due to equipment failure, thereby improving overall production efficiency.

[0027] Furthermore, the frame 100 may include a first frame 110 and two second frames 120, which are respectively disposed on opposite sides of the first frame 110. The clamping device 200 and the die bonding device 400 are both disposed on the first frame 110, and each feeding device 300 is disposed on each of the second frames 120. Both the first frame 110 and the second frame 120 may be frame-type or box-type frame structures. For example, both the first frame 110 and the second frame 120 may be constructed from multiple columns and beams to form a stable support structure. The bottom of the first frame 110 and the second frame 120 may also be equipped with support feet and support wheels. The support feet are used to stably support the frame 100 on the ground, preventing the frame 100 from shaking or shifting during operation, while the support wheels facilitate the overall movement and adjustment of the frame 100, improving the flexibility and convenience of the equipment.

[0028] The second frame 120 can be independently installed from the first frame 110, or it can be detachably connected to the first frame 110, allowing the feeding device 300 connected to the second frame 120 to be disassembled for independent maintenance or replacement, reducing maintenance costs and time. This also facilitates equipment transportation and installation, improving maintainability and scalability. In some embodiments, the second frame 120 and the first frame 110 are independently installed, meaning there is no connection between them; they are simply used together by placing them in the same work area. In other embodiments, the second frame 120 is connected to the first frame 110 via detachable connections such as bolts or snap-fit ​​connections. When maintenance or replacement of the second frame 120 and its feeding device 300 is required, only the corresponding connecting parts need to be disassembled to remove the second frame 120 along with the feeding device 300 as a whole, without affecting the normal use of the first frame 110 and other components. In addition, it can significantly shorten the changeover time of the feeding device, support the equipment to work without stopping, and improve production efficiency; at the same time, it can also reduce the number of equipment to be purchased, effectively save equipment procurement costs, and improve the economic benefits of enterprises.

[0029] Reference Figure 3 In some embodiments, the number of die bonding devices 400 is also two sets, symmetrically arranged on the frame 100. Each die bonding device 400 corresponds to a feeding device 300 and is configured to bond the second workpiece from the corresponding feeding device 300 to the target position. During operation, the two sets of die bonding devices 400 can operate simultaneously, receiving the second workpiece from the corresponding feeding device 300 and precisely bonding it to the target position of the first workpiece fixed on the fixture device 200, which can improve bonding efficiency and shorten the production cycle. At the same time, when one set of die bonding devices 400 fails, the other set can continue to work, ensuring the continuity and stability of the production line.

[0030] Reference Figure 4 The clamping device 200 may include a first base 210 disposed on the frame 100, a second base 220 slidably connected to the first base 210 along a first direction, a third base 230 slidably connected to the second base 220 along a second direction, and a clamping assembly 240 disposed on the third base 230. The first direction is perpendicular to the second direction, and the clamping assembly 240 is configured to fix the first workpiece. During equipment operation, the first workpiece is fixed in the clamping assembly 240, and the position of the first workpiece on the frame 100 can be adjusted by the relative movement of the second base 220 and the third base 230, so as to cooperate with the movement of the die bonding device 400 so that the second workpiece can be accurately attached to the target position of the first workpiece.

[0031] The first base 210 can be any shape, such as a rectangular base, providing stable sliding support for the second base 220 and the third base 230. The first direction and the second direction are perpendicular to each other. When the first base 210 is rectangular, the first direction can be the length of the first base 210, and the second direction can be the width of the first base 210. That is, the second base 220 can slide along the length of the first base 210, and the third base 230 can slide along the width of the second base 220. Specifically, the first base 210 may have a first track 211 extending along its length. The bottom of the second base 220 has a first slider adapted to the first track 211. Through the cooperation of the first slider and the first track 211, the second base 220 slides along the first direction on the first base 210. Similarly, a second track 221 can be provided on the second base 220. The second track 221 extends along the width direction of the first base 210. A second slider adapted to the second track 221 is provided at the bottom of the third base 230. Through the cooperation of the second slider and the second track 221, the third base 230 can slide on the second base 220 along the second direction.

[0032] The clamping assembly 240 is disposed on the third base 230 and can be adjusted in position along with the third base 230 in the first and second directions. In some embodiments, the clamping assembly 240 may include a support plate 241 and conveyor belts 242 disposed on both sides of the support plate 241. The support plate 241 is fixed on the third base 230, and the two conveyor belts 242 are symmetrically disposed on both sides of the support plate 241, with a placement space for placing the first workpiece formed between the two conveyor belts 242. Taking the circuit board 10 as the first workpiece as an example, during equipment operation, the circuit board 10 can be placed in the placement space between the two conveyor belts 242. Through the operation and positioning action of the conveyor belts 242, the circuit board 10 is stably fixed in a predetermined position so that the subsequent die bonding device 400 can perform precise placement. At the same time, the setting of the conveyor belts 242 also facilitates the rapid loading and unloading of the first workpiece and can cooperate with other workpiece transfer equipment to realize the automatic loading and unloading of the circuit board 10, thereby improving the overall production efficiency.

[0033] Reference Figure 3 and Figure 5 The feeding device 300 includes a circular vibration assembly 310, a first vertical vibration assembly 320, a turntable assembly 330, and a second vertical vibration assembly 340, which are sequentially arranged on the frame 100. The circular vibration assembly 310 has a discharge port 311, the first vertical vibration assembly 320 has a first feed end 321 and a first discharge end 322, and the second vertical vibration assembly 340 has a second feed end 341 and a second discharge end 342. The first feed end 321 is connected to the discharge port 311, and the turntable assembly 330 is arranged between the first discharge end 322 and the second feed end 341. The second discharge end 342 faces the clamping device 200.

[0034] The circular vibrating assembly 310 is configured to accommodate multiple second workpieces and sequentially transfer them to the discharge port 311. Specifically, the circular vibrating assembly 310 may include a circular vibrating disk and a vibrator disposed at the bottom of the vibrating disk. The inner wall of the vibrating disk is provided with a spiral upward track. Multiple second workpieces are placed inside the vibrating disk, and under the action of the vibrator, the second workpieces rise sequentially along the spiral track and move to the discharge port 311. The first vertical vibrating assembly 320 is configured to receive the second workpieces output from the discharge port 311 and transfer them from the first feed end 321 to the first discharge end 322. Specifically, the first vertical vibrating assembly 320 may include a vertical vibration track and a vertical vibrator disposed at the bottom of the vertical vibration track. The vertical vibration track is linear, and its first feed end 321 is connected to the discharge port 311 of the circular vibrating assembly 310. When the second workpiece falls from the discharge port 311 into the vertical vibration track, the vertical vibrator generates linear vibration, causing the second workpiece to move along the vertical vibration track towards the first discharge end 322. The turntable assembly 330 is configured to receive the second workpiece output from the first discharge end 322, and after performing at least one of the following processes on the second workpiece: alignment, testing, screening, reversing, or inspection, it is transferred to the second feed end 341 to ensure that the second workpiece has the correct posture and qualified quality before entering the second linear vibration assembly 340. The structure of the second linear vibration assembly 340 may be the same as that of the first linear vibration assembly 320, and it is configured to receive the second workpiece output from the turntable assembly 330, and transfer the second workpiece from the second feed end 341 to the second discharge end 342 to deliver the second workpiece to the die bonding device 400.

[0035] With the cooperation of the circular oscillator assembly 310, the first vertical oscillator assembly 320 and the second vertical oscillator assembly 340, the second workpiece can move towards the die bonding device 400 in an orderly and stable manner. Furthermore, the second vertical oscillator assembly 340 is oriented towards the die bonding device 400 and the angle device to shorten the transmission distance of the second workpiece to the die bonding device 400, reduce the movement amplitude of the die bonding device 400, and further improve the chip bonding efficiency.

[0036] Reference Figure 5 In some embodiments, the turntable assembly 330 may include a spindle 331 connected to the frame 100, a turntable 332 disposed on the spindle 331, a plurality of gripping nozzles 333 disposed on the turntable 332, and at least one processing component disposed on the frame 100. The plurality of gripping nozzles 333 are arranged at intervals around the circumference of the turntable 332, and the turntable assembly 330 is configured such that each gripping nozzle 333 sequentially passes through a first discharge end 322 and a second feed end 341 when the turntable 332 rotates. The processing component is disposed between the first discharge end 322 and the second feed end 341 and is configured to perform at least one of the following processing on the second workpiece: guiding, testing, screening, reversing, or inspection.

[0037] Specifically, the spindle 331 can be connected to the frame 100 via bearings or other components. The turntable assembly 330 may also include a driver connected to the spindle 331, which can be a motor or similar device, to drive the spindle 331 to rotate, thereby causing the turntable 332 and its multiple gripping nozzles 333 to perform circular motion. The turntable 332 can be a circular disc structure, and its edge can be provided with multiple positioning seats 3322. Each gripping nozzle 333 is connected to a positioning seat 3322, so that the gripping nozzles 333 are arranged in an array around the turntable 332. The turntable 332 may be provided with a vacuum distribution plate 3321 and a rotary joint 3323. Each gripping nozzle 333 is provided with an air pipe 3331, which is connected to the rotary joint 3323. The vacuum distribution plate 3321 is used to evenly distribute the air pressure of the vacuum source to each air pipe 3331, ensuring that each gripping nozzle 333 can obtain stable and sufficient suction force during operation, thereby reliably gripping and releasing the second workpiece. The rotary joint 3323 is used to keep the air pipes 3331 connected and unobstructed during the rotation of the turntable 332, preventing the air pipes 3331 from getting tangled or broken, and ensuring the continuous and stable operation of the turntable assembly 330.

[0038] During the operation of the turntable assembly 330, when the driver drives the spindle 331 to rotate, the turntable 332 performs a circular motion accordingly. Each gripping nozzle 333, driven by the turntable 332, sequentially passes through the first discharge end 322 and the second feed end 341. When the gripping nozzle 333 rotates to the first discharge end 322, under the stable suction provided by the vacuum diverter 3321, it grips the second workpiece from the first discharge end 322 through the air pipe 3331. As the turntable 332 continues to rotate, the gripping nozzle 333 holding the second workpiece moves to the area where the processing unit is located. The processing unit performs at least one of the following processes on the second workpiece: alignment, testing, screening, reversal, or inspection, to confirm the posture and quality status of the second workpiece. When the gripping nozzle 333 rotates to the second feed end 341 after passing the processing unit, it releases the second workpiece, allowing it to accurately fall into the second feed end 341, and then enters the second linear vibration assembly 340 for further transmission.

[0039] The process includes: guiding the second workpiece to adjust its posture to meet the positional requirements of subsequent chip placement; testing the second workpiece to assess its electrical performance or physical characteristics to ensure it meets production requirements; screening the second workpiece to remove defective products and avoid impacting subsequent production; reversing the second workpiece to adjust it to the appropriate orientation according to production needs; and inspecting the second workpiece, including visual inspection and dimensional checks, to ensure its quality. Through these processes, it is ensured that all second workpieces entering the second linear vibration assembly 340 have the correct posture and acceptable quality, thereby improving the placement accuracy and product quality of the entire chip placement machine. The number of processing components can be one or more, and different numbers can be configured according to the type of the second workpiece to perform different processing tasks on it before it enters the second linear vibration assembly 340. In one example, there is one processing component that can perform one of the following: guiding, testing, screening, reversing, or inspecting the second workpiece. In another example, there are multiple processing components, such as two, three or more, which perform various operations on the second workpiece, including alignment, testing, screening, reversal or inspection.

[0040] Reference Figure 5 and Figure 6 In some embodiments, the number of processing components can be multiple, including a first guiding component 334, a testing component 335, a screening component 336, a reversing component 337, a second guiding component 338, and an optical fiber sensing component 339 arranged sequentially in the circumferential direction of the turntable 332 from the first discharge end 322 to the second feed end 341.

[0041] The first guiding component 334 is configured to perform initial guiding of the second workpiece. Specifically, the first guiding component 334 may include a guiding base disposed on the frame 100, a guiding platform mounted on the guiding base, and a positioning structure located on the guiding platform. The guiding base provides stable support for the entire guiding component, ensuring that no shaking or displacement occurs during the guiding process. The guiding platform is used to support the second workpiece, and its surface may be provided with grooves or protrusions adapted to the shape of the second workpiece for initial positioning. The positioning structure may include multiple positioning pins or positioning blocks distributed around the edge or center area of ​​the guiding platform. When the second workpiece is placed on the guiding platform, the positioning pins or positioning blocks can be inserted into corresponding holes on the second workpiece or abut against its edge, thereby achieving precise guiding of the second workpiece and ensuring that its posture meets the positional requirements of subsequent patch placement.

[0042] Test component 335 is configured to test the polarity of the second workpiece to determine whether the second workpiece can conduct electricity. Specifically, test component 335 may include a test base mounted on the frame 100, test probes mounted on the test base, and a test circuit electrically connected to the test probes. The test base provides a stable mounting foundation for test component 335, ensuring stable and reliable contact between the probes and the second workpiece during testing. The number and position of the test probes can be designed according to the electrode distribution of the second workpiece. When the second workpiece is placed in the test position, the test probes contact the electrodes of the second workpiece. The test circuit determines whether the polarity of the second workpiece is correct and whether it can conduct electricity normally by detecting changes in current or voltage. If the test result does not meet the requirements, the test circuit can issue an alarm signal.

[0043] The screening component 336 is configured to eliminate a faulty second workpiece. Specifically, the screening component 336 can be an air blowing component, including an air blowing device mounted on the frame 100 and an air source connected to the air blowing device. The air outlet of the air blowing device is aligned with the transport path of the second workpiece. When the testing component 335 detects a fault in the second workpiece (such as incorrect polarity, inability to conduct electricity, etc.), it sends a control signal to the screening component 336 to trigger the air blowing device to operate. High-pressure gas provided by the air source is ejected at high speed through the air outlet of the air blowing device, blowing the faulty second workpiece away from the transport path and causing it to fall into a preset waste collection area.

[0044] The reversing component 337 is configured to rotate the second workpiece to a preset posture. Specifically, the reversing component 337 may include a reversing base mounted on the frame 100, a rotating platform mounted on the reversing base, and a reversing drive mechanism for driving the rotating platform to rotate. The reversing base provides stable support for the reversing component 337, ensuring the stability of the rotating platform during rotation. The rotating platform is used to carry the second workpiece, and its surface may be provided with a positioning structure adapted to the second workpiece for accurate placement. When the second workpiece is conveyed to the position of the reversing component 337, the reversing drive mechanism starts working, driving the rotating platform to rotate in a preset direction and angle, thereby rotating the second workpiece to a preset posture that meets the requirements of subsequent patch placement.

[0045] The second guiding component 338 is configured to perform a second guiding of the second workpiece, and its structure can be the same as that of the first guiding component 334. By performing a second guiding of the second workpiece, the posture of the second workpiece can be further fine-tuned to ensure that its positional accuracy reaches the highest standard, providing a reliable guarantee for subsequent precise patch placement.

[0046] The fiber optic sensing component 339 is configured to perform power-on detection on the second workpiece to ultimately determine whether the second workpiece can operate normally. Specifically, the fiber optic sensing component 339 may include a fiber optic sensing base mounted on the rack 100, a fiber optic transmitter and a fiber optic receiver mounted on the fiber optic sensing base, and a detection circuit electrically connected to the fiber optic transmitter and receiver. The fiber optic sensing base provides a stable mounting position for the fiber optic sensing component 339, ensuring accurate relative positions of the fiber optic transmitter and receiver during the detection process. The fiber optic transmitter emits a light signal of a specific wavelength, which illuminates the second workpiece passing through it. If the second workpiece can operate normally, its surface or internal structure will produce a specific reflection or transmission effect on the light signal. The fiber optic receiver receives the light signal after it has passed through the second workpiece and converts it into an electrical signal, which is then transmitted to the detection circuit. The detection circuit analyzes and processes the received electrical signal, comparing it with preset electrical signal parameters under normal operating conditions to determine whether the second workpiece can operate normally.

[0047] Specifically, during the operation of the turntable assembly 330, the gripping nozzle 333 carries the second workpiece sequentially through the first guiding component 334, the testing component 335, the screening component 336, the reversing component 337, the second guiding component 338, and the fiber optic sensing component 339. When the gripping nozzle 333 moves the second workpiece to the first guiding component 334, the guiding platform of the first guiding component 334 supports the second workpiece, and the positioning pin or positioning block is inserted into the corresponding hole of the second workpiece or abuts against its edge, completing the first guidance, so that the posture of the second workpiece meets the initial position requirements for subsequent patch placement. Next, the gripping nozzle 333 carries the guided second workpiece to the position of the testing component 335, and the test probe contacts the electrode of the second workpiece. The test circuit determines whether its polarity is correct and whether it can conduct normally by detecting changes in current or voltage. If the result does not meet the requirements, an alarm signal is issued. Subsequently, the gripping nozzle 333 carries the second workpiece to the screening component 336. If the testing component 335 previously detected a fault in the second workpiece, the air blowing device of the screening component 336, upon receiving a control signal, ejects high-pressure gas from its air source at high speed through the outlet, blowing the faulty second workpiece away from the transport path to the preset waste collection area. Afterward, the gripping nozzle 333 carries the qualified second workpiece to the reversing component 337. The reversing drive mechanism rotates the rotating platform in a preset direction and angle, rotating the second workpiece to a preset posture that meets the requirements for subsequent placement. Then, the gripping nozzle 333 carries the second workpiece to the second guiding component 338 for a second guidance, further fine-tuning the posture of the second workpiece to ensure its positional accuracy reaches the highest standard. Finally, the gripping nozzle 333 carries the second workpiece to the fiber optic sensing component 339. The fiber optic transmitter emits a specific wavelength light signal that illuminates the second workpiece. If the second workpiece is powered on and functioning normally, its surface or internal structure will produce a specific reflection or transmission effect on the light signal. The fiber optic receiver receives the light signal and converts it into an electrical signal, which is then transmitted to the detection circuit. After analysis and processing, the detection circuit determines whether the second workpiece can function normally. After all processing is complete, the gripping nozzle 333 releases the second workpiece to the second feed end 341, ensuring it falls accurately into the second feed end 341 and then enters the second direct vibration assembly 340 for further transmission. This ensures that the second workpiece attached to the first workpiece has the correct orientation, acceptable quality, and is in a normal working state.

[0048] Reference Figure 7The die bonding apparatus 400 may include a support shaft 411, a die bonding swing arm 420 connected to the support shaft 411, and a die bonding nozzle 430 disposed on the die bonding swing arm 420. The support shaft 411 is rotatably connected to the frame 100 such that the die bonding nozzle 430 has a first position facing the second discharge end 342 and a second position facing the clamping device 200. The die bonding nozzle 430 is configured to pick up a second workpiece at the second discharge end 342 in the first position and to place the second workpiece at a target position in the second position.

[0049] Specifically, the die bonding device 400 may include a drive motor 410, which is fixed to the frame 100. The output shaft of the drive motor 410 serves as a support shaft 411, so that when the drive motor 410 operates, it drives the support shaft 411 to rotate, thereby causing the die bonding arm 420 and the die bonding nozzle 430 disposed on the die bonding arm 420 to perform circumferential motion. The die bonding arm 420 is a rod-shaped structure extending radially along the support shaft 411. The die bonding arm 420 may have a hollow structure to reduce the overall weight and improve the flexibility of movement. The die bonding nozzle 430 is installed at the end of the die bonding arm 420, and its shape and size are customized according to the characteristics of the second workpiece to ensure reliable pick-up and placement of the second workpiece.

[0050] During the operation of the die bonding device 400, the drive motor 410 starts, and its output shaft drives the support shaft 411 to rotate. The rotation of the support shaft 411 causes the die bonding arm 420 to perform a circular motion. When the die bonding arm 420 moves to the first position, the die bonding nozzle 430 reaches above the second discharge end 342. At this time, the die bonding nozzle 430 picks up the second workpiece at the second discharge end 342 under vacuum. As the die bonding arm 420 continues to rotate, the die bonding nozzle 430 carries the second workpiece to the second position. When the die bonding arm 420 rotates to the second position, the die bonding nozzle 430 accurately places the second workpiece at the target position, which is usually the patch position on the fixture device 200 corresponding to the first workpiece. Through this motion process, the die bonding device 400 can efficiently and accurately transfer the processed second workpiece from the second discharge end 342 of the second linear vibration assembly 340 to the target position on the fixture device 200, preparing for subsequent chip placement operations, ensuring that the entire bulk chip placement machine can successfully complete the chip placement task, and improving production efficiency and chip placement quality.

[0051] Reference Figure 8The height of the die-bonding nozzle 430 can be higher than the second discharge end 342, with a preset height difference between them. This allows the nozzle 430 to directly pick up the second workpiece with appropriate force and angle when it moves above the second discharge end 342, eliminating the need for a downward pressing action. This design avoids potential damage to the second workpiece caused by downward pressure and also improves pick-up efficiency. The preset height difference can be precisely adjusted according to the size, shape, and material characteristics of the second workpiece, ensuring that the second workpiece is stably attached to the die-bonding nozzle 430 during the pick-up process. When the die-bonding nozzle 430 moves to the second position to place the second workpiece, this preset height difference also ensures that the nozzle 430 places the second workpiece at the target position with an appropriate distance and speed, allowing the second workpiece to accurately and stably adhere to the first workpiece, further improving the precision and quality of the placement. In one example, the preset height difference can be 1.1 to 1.5 times the thickness of the second workpiece, so that the die bonding nozzle 430 will not interfere with the second workpiece when it swings to the position of the second discharge end 342, and can accurately pick up the second workpiece from the second discharge end 342 under the negative pressure of the die bonding nozzle 430.

[0052] Reference Figure 9 In other embodiments, there may be multiple die-bonding arms 420, arranged circumferentially around the support shaft 411, each equipped with a die-bonding nozzle 430. When the drive motor 410 operates, the multiple die-bonding arms 420 synchronously rotate in a circular motion. The die-bonding nozzle 430 on each die-bonding arm 420 sequentially passes through a first position (above the second discharge end 342) and a second position (at the target position). When a die-bonding arm 420 rotates to the first position, its die-bonding nozzle 430, under vacuum, picks up the second workpiece at the second discharge end 342. Subsequently, as the die-bonding arm 420 rotates, it carries the second workpiece to the second position and accurately places it at the target position. Simultaneously, the other die-bonding arms 420 perform the same picking and placing actions, but at different stages of motion. This design with multiple die-bonding arms 420 can greatly improve the working efficiency of the die-bonding device 400, realize the continuous pick-up and placement of multiple second workpieces, shorten the cycle of the entire chip bonding process, and further improve the production efficiency of the bulk chip bonding machine.

[0053] The combination of the feeding device 300 and the die bonding device 400 can sequentially mount a single second workpiece onto the first workpiece. Compared with the existing technology of mounting multiple workpieces at the same time, it is less likely to cause obvious color difference problems, improves the consistency of product appearance, achieves efficient and accurate mixed-batch operation, and ensures uniform material mounting. At the same time, it can accommodate various pad spacing requirements without manually adjusting the nozzle spacing for workpieces with different spacing / models, greatly improving the convenience of operation. Moreover, it can quickly correct individual position and angle deviations, effectively reducing the risk of high defect rate caused by row misalignment, and improving mounting accuracy and product yield.

[0054] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A bulk material patching machine, characterized in that, The device includes a frame and a clamping device, a feeding device, and a die bonding device mounted on the frame. The feeding device includes a circular oscillator assembly, a first vertical oscillator assembly, a turntable assembly, and a second vertical oscillator assembly, which are sequentially mounted on the frame. The second vertical oscillator assembly faces the clamping device. The clamping device is used to fix the first workpiece; the circular vibration assembly is configured to accommodate a plurality of second workpieces and sequentially transfer the plurality of second workpieces to the first vertical vibration assembly; the turntable assembly is configured to receive the second workpieces output from the first vertical vibration assembly; the second vertical vibration assembly is configured to receive the second workpieces output from the turntable assembly; the die bonding device is configured to receive the second workpieces output from the second vertical vibration assembly and attach the second workpieces to the target position of the first workpiece.

2. The bulk material placement machine according to claim 1, characterized in that, The die bonding device includes a support shaft, a die bonding swing arm connected to the support shaft, and a die bonding nozzle disposed on the die bonding swing arm; the second linear vibration assembly has a second feed end and a second discharge end, and the support shaft is rotatably connected to the frame so that the die bonding nozzle has a first position facing the second discharge end and a second position facing the clamping device. The die-bonding nozzle is configured to pick up the second workpiece at the second discharge end when in the first position, and to place the second workpiece at the target position when in the second position.

3. The bulk material patching machine according to claim 2, characterized in that, The height of the die-bonding nozzle is higher than that of the second discharge end, and there is a preset height difference between them.

4. The bulk material placement machine according to claim 3, characterized in that, The number of die-bonding arms is multiple, and the multiple die-bonding arms are arranged around the circumference of the support axis. Each die-bonding arm is provided with a die-bonding nozzle.

5. The bulk material placement machine according to any one of claims 1-4, characterized in that, The number of feeding devices is two sets, and the two sets of feeding devices are symmetrically arranged on the frame, with the clamping device located between the two sets of feeding devices.

6. The bulk material placement machine according to claim 5, characterized in that, The frame includes a first frame and two second frames, which are respectively disposed on opposite sides of the first frame, and each of the feeding devices is disposed on each of the second frames.

7. The bulk material placement machine according to claim 5, characterized in that, The number of die bonding devices is two sets, and the two sets of die bonding devices are symmetrically arranged on the frame. Each die bonding device corresponds to each feeding device and is configured to bond the second workpiece in the corresponding feeding device to the target position.

8. The bulk material placement machine according to any one of claims 1-4, characterized in that, The turntable assembly includes a spindle connected to the frame, a turntable disposed on the spindle, a plurality of gripping nozzles disposed on the turntable, and at least one processing component disposed on the frame; The first linear vibration assembly has a first discharge end, and the second linear vibration assembly has a second feed end; wherein, a plurality of gripping nozzles are arranged at intervals around the circumference of the turntable, and the turntable assembly is configured such that each gripping nozzle sequentially passes through the first discharge end and the second feed end when the turntable rotates; the processing component is disposed between the first discharge end and the second feed end, and is configured to perform at least one of the following processing on the second workpiece: alignment, testing, screening, reversing, or detection.

9. The bulk material placement machine according to claim 8, characterized in that, The number of processing components is multiple, and the multiple processing components include a first guiding component, a testing component, a screening component, a reversing component, a second guiding component, and an optical fiber sensing component arranged sequentially in the circumferential direction of the turntable from the first discharge end to the second feed end; Wherein, the first guiding component is configured to perform a first guiding of the second workpiece; the testing component is configured to test the polarity of the second workpiece; the screening component is used to eliminate faulty second workpieces; the reversing component is configured to rotate the second workpiece to a preset posture; the second guiding component is configured to perform a second guiding of the second workpiece; and the fiber optic sensing component is configured to perform power-on detection of the second workpiece.

10. The bulk material placement machine according to any one of claims 1-4, characterized in that, The clamping device includes a first base disposed on the frame, a second base slidably connected to the first base along a first direction, a third base slidably connected to the second base along a second direction, and a clamping assembly disposed on the third base. The first direction is perpendicular to the second direction, and the clamping assembly is configured to fix the first workpiece.

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