Photovoltaic tile and photovoltaic tile system

Abstract

The utility model provides a kind of photovoltaic tile and photovoltaic tile system, it is related to photovoltaic technical field, and photovoltaic tile includes front plate;Battery layer, is located in the side of front plate;Stress buffer layer, is located in the side of battery layer away from front plate;Back plate, is located in the side of stress buffer layer away from battery layer;Adhesive film layer, including first adhesive film layer and / or second adhesive film layer, first adhesive film layer is located between front plate and battery layer, second adhesive film layer is located between battery layer and stress buffer layer;Wherein, the thermal expansion coefficient of stress buffer layer is greater than the thermal expansion coefficient of adhesive film layer, and less than the thermal expansion coefficient of back plate.The photovoltaic tile provided by the utility model effectively alleviates the internal stress caused by the difference in thermal expansion coefficient between back plate and adhesive film layer by using the stress buffer layer arranged between metal back plate and battery layer, reduces the risk of separation between the components of photovoltaic tile, solder strip welding, etc., improves the stability of the overall structure of photovoltaic tile, and prolongs the service life.

Description

Technical Field

[0001] This utility model relates to the field of photovoltaic technology, and more specifically, to a photovoltaic tile and a photovoltaic tile system. Background Technology

[0002] Currently, photovoltaic tiles typically use a base plate to support the entire photovoltaic tile. Under the alternating thermal expansion and contraction of day and night, the large difference between the thermal expansion coefficient of the base plate and the thermal expansion coefficient of the adhesive film layer creates internal stress. This internal stress can lead to risks such as interlayer separation and weld strip detachment in the components of the photovoltaic tile, affecting the overall structural stability of the photovoltaic tile.

[0003] Therefore, designing a photovoltaic tile that can reduce the internal stress caused by the difference in thermal expansion coefficients between the base plate and the adhesive film layer has become an urgent problem to be solved. Utility Model Content

[0004] The present invention aims to at least solve the problem in the related technology that the large difference between the thermal expansion coefficient of the base plate and the thermal expansion coefficient of the adhesive film layer in photovoltaic tiles causes internal stress, which can lead to problems such as interlayer separation and solder strip detachment in the components of photovoltaic tiles.

[0005] Therefore, the first aspect of this utility model provides a photovoltaic tile.

[0006] The second aspect of this utility model provides a photovoltaic tile system.

[0007] In view of the above, the first aspect of this utility model provides a photovoltaic tile, comprising: a front panel; a battery layer disposed on one side of the front panel; a stress buffer layer disposed on the side of the battery layer away from the front panel; a back panel disposed on the side of the stress buffer layer away from the battery layer; and an adhesive film layer, including a first adhesive film layer and / or a second adhesive film layer, wherein the first adhesive film layer is disposed between the front panel and the battery layer, and the second adhesive film layer is disposed between the battery layer and the stress buffer layer; wherein the coefficient of thermal expansion of the stress buffer layer is greater than the coefficient of thermal expansion of the adhesive film layer and less than the coefficient of thermal expansion of the back panel.

[0008] The photovoltaic tile provided by this utility model has a stress buffer layer between the metal backsheet and the battery layer. The coefficient of thermal expansion of the stress buffer layer is between that of the battery side adhesive film layer and the backsheet. This effectively alleviates the internal stress caused by the difference in the coefficient of thermal expansion between the backsheet and the adhesive film layer, reduces the risk of separation between the components of the photovoltaic tile and the desoldering of the solder strips, improves the stability of the overall structure of the photovoltaic tile, and extends its service life.

[0009] In the above technical solution, optionally, the stress buffer layer includes: a mesh support; and resin, which is filled in the mesh of the mesh support.

[0010] In this technical solution, the mesh support can provide stable mechanical support, and the filling resin has good adhesion, so that the stress buffer layer can not only deform appropriately with the thermal expansion and contraction of the back plate and the film layer, but also suppress excessive deformation through the mesh support, thereby further buffering the internal stress.

[0011] In the above technical solution, optionally, the adhesive film layer includes a second adhesive film layer, and the adhesive film layer further includes a third adhesive film layer, disposed between the stress buffer layer and the back plate; the resin crosslinks with the second adhesive film layer and the third adhesive film layer respectively to form an integral structure.

[0012] In this technical solution, the resin in the stress buffer layer is cross-linked with the adhesive film layers on both sides to form an integral structure, eliminating the gaps between the interlayer interfaces. This enhances the connection between the stress buffer layer and the adjacent adhesive film layers, allowing it to deform as a whole when exposed to thermal expansion and contraction, avoiding relative displacement between layers and reducing the risk of solder strip detachment.

[0013] In the above technical solution, optionally, the thermal conductivity of the stress buffer layer is less than that of the back plate.

[0014] In this technical solution, the stress buffer layer is made of a material with low thermal conductivity, which reduces the heat transfer rate inside the photovoltaic tile, avoids the impact of large temperature changes on the adhesive film layer, reduces the creep effect of the adhesive film layer, and further weakens the generation of internal stress, thereby improving the adaptability and service life of the photovoltaic tile in extreme temperature environments.

[0015] In the above technical solution, optionally, the glass transition temperature of the stress buffer layer is greater than or equal to 100°C and less than or equal to 115°C.

[0016] In this technical solution, by controlling the glass transition temperature of the stress buffer layer between 100℃ and 115℃, which is higher than the melting temperature of commonly used materials in the adhesive film layer (60℃ to 85℃), the stress buffer layer can still maintain a stable elastic structure in high-temperature environments during normal operation of the photovoltaic tile or after lamination and curing, and will not deform due to temperature rise, thus ensuring the structural stability of the stress buffer layer in extreme temperature environments.

[0017] In the above technical solution, optionally, the stress buffer layer includes at least one of a glass fiber reinforced layer, a basalt fiber reinforced layer, and a ceramic fiber layer.

[0018] In this technical solution, the coefficients of thermal expansion of the glass fiber reinforced layer, basalt fiber reinforced layer and ceramic fiber layer are all between those of the adhesive film layer and the backing plate. They also have low thermal conductivity and glass transition temperatures that meet the requirements of 100℃ to 115℃. Their internal fiber network structure can provide stable mechanical support. After resin filling, they can cross-link with the adhesive film layer to form an integral whole, thereby buffering internal stress and ensuring the stability of the structure.

[0019] In the above technical solution, optionally, the thickness of the stress buffer layer is greater than or equal to 0.3 mm and less than or equal to 0.5 mm.

[0020] In this technical solution, by limiting the thickness of the stress buffer layer, the need for lightweight photovoltaic tiles is taken into account while ensuring that the stress buffer layer can disperse internal stress and block heat transfer.

[0021] Optionally, in the above technical solution, the photovoltaic tile also includes a pre-encapsulation film disposed on the side of the front panel away from the battery layer; wherein the pre-encapsulation film includes a fluorine-containing film layer.

[0022] In this technical solution, the encapsulation film containing fluorine material can resist the harsh environmental effects of outdoor sunlight exposure, wind and rain erosion, etc., significantly improving the outdoor weather resistance and anti-aging ability of photovoltaic tiles, and reducing the damage of environmental factors to internal components.

[0023] In the above technical solution, optionally, the back plate is a curved metal structure, the thickness of the back plate is greater than or equal to 1 mm and less than or equal to 3 mm; and / or the radius of curvature of the back plate is greater than or equal to 50 mm and less than or equal to 150 mm; and / or the arch height of the back plate is greater than or equal to 15 mm and less than or equal to 50 mm.

[0024] In this technical solution, the metal backing plate has high strength and good structural stability. By limiting the thickness of the metal backing plate, the supporting strength of the backing plate can be guaranteed, while avoiding excessive weight. Furthermore, by limiting the radius of curvature and arch height of the curved metal backing plate, stress concentration can be avoided, and the stress buffer layer can work together to alleviate the internal stress caused by thermal expansion and contraction.

[0025] The second aspect of this application provides a photovoltaic tile system, including the photovoltaic tile provided in the first aspect of the technical solution.

[0026] Since the photovoltaic tile system in this technical solution includes the photovoltaic tiles provided by the first aspect of the technical solution, it also has all the beneficial effects of the photovoltaic tiles provided by the first aspect of the technical solution, which will not be repeated here.

[0027] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0028] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0029] Figure 1 A schematic diagram of the structure of a photovoltaic tile according to an embodiment of this application is shown;

[0030] Figure 2 A schematic diagram of the structure of a stress buffer layer according to an embodiment of this application is shown;

[0031] in, Figure 1 and Figure 2 The correspondence between the reference numerals and component names in the attached drawings is as follows:

[0032] 1. Front panel, 2. Battery layer, 3. Stress buffer layer, 32. Mesh support, 34. Resin, 4. Back panel, 5. Adhesive film layer, 52. First adhesive film layer, 54. Second adhesive film layer, 56. Third adhesive film layer, 58. Fourth adhesive film layer, 6. Encapsulation front film. Detailed Implementation

[0033] To better understand the above-mentioned objectives, features, and advantages of this application, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0034] Many specific details are set forth in the following description in order to provide a full understanding of this application. However, this application may also be implemented in other ways different from those described herein. Therefore, the scope of protection of this application is not limited to the specific embodiments disclosed below.

[0035] like Figure 1 As shown, the photovoltaic tile provided by this utility model includes: a front panel 1; a battery layer 2 disposed on one side of the front panel 1; a stress buffer layer 3 disposed on the side of the battery layer 2 away from the front panel 1; a back panel 4 disposed on the side of the stress buffer layer 3 away from the battery layer 2; and an adhesive film layer 5, including a first adhesive film layer 52 and / or a second adhesive film layer 54, wherein the first adhesive film layer 52 is disposed between the front panel 1 and the battery layer 2, and the second adhesive film layer 54 is disposed between the battery layer 2 and the stress buffer layer 3; wherein the coefficient of thermal expansion of the stress buffer layer 3 is greater than that of the adhesive film layer 5 and less than that of the back panel 4.

[0036] The photovoltaic tile provided by this utility model has a front panel 1 and a back panel 4 respectively set on both sides of the battery layer 2 to protect the front and back of the battery layer 2. The first adhesive film layer 52 and the second adhesive film layer 54 are used to achieve a stable connection between the front panel 1 and the battery layer 2, and between the battery layer 2 and the stress buffer layer 3, respectively. A third adhesive film layer 56 can also be set between the stress buffer layer 3 and the back panel 4 to achieve a connection. By setting the stress buffer layer 3 between the metal back panel 4 and the battery layer 2, the thermal expansion coefficient of the stress buffer layer 3 is between that of the battery-side adhesive film layer and the back panel 4, forming a gradient transition structure, which effectively disperses and offsets part of the force generated by thermal expansion and contraction, alleviates the internal stress caused by the difference in thermal expansion coefficients between the back panel 4 and the adhesive film layer 5, reduces the risk of separation between the photovoltaic tile components and the desoldering of the solder strips, improves the overall structural stability of the photovoltaic tile, and extends its service life.

[0037] In some embodiments, the stress buffer layer 3 may optionally include: a mesh support 32; and resin 34, which fills the mesh openings of the mesh support 32.

[0038] In these embodiments, such as Figure 2 As shown, the stress buffer layer 3 is composed of a mesh support 32 and resin 34. The mesh support 32 can be a continuous fiber mesh structure, and the resin 34 is uniformly filled into the gaps in the mesh of the mesh support 32, forming a dense composite structure that combines flexibility and rigidity. The mesh support 32 provides basic skeletal support, and the filling of resin 34 ensures the overall structural integrity of the stress buffer layer 3, and it can adaptively conform to the shape of the backing plate 4 before lamination and curing. In this design, the mesh support 32 can provide stable mechanical support, and the filled resin 34 has good adhesion, allowing the stress buffer layer 3 to undergo moderate deformation with the thermal expansion and contraction of the backing plate 4 and the adhesive film layer 5, while the mesh support 32 can suppress excessive deformation, thereby further buffering internal stress.

[0039] In some embodiments, the adhesive film layer 5 may optionally include a second adhesive film layer 54, and the adhesive film layer may further include a third adhesive film layer 56 disposed between the stress buffer layer 3 and the back plate 4; the resin 34 crosslinks with the second adhesive film layer 54 and the third adhesive film layer 56 respectively to form an integral structure.

[0040] In these embodiments, the second adhesive film layer 54 is disposed between the battery layer 2 and the stress buffer layer 3, and the third adhesive film layer 56 is disposed between the stress buffer layer 3 and the back sheet 4. During the lamination and curing process, the resin 34 in the stress buffer layer 3 can undergo a cross-linking reaction with the polymer materials of the second adhesive film layer 54 and the third adhesive film layer 56 to form an integral structure that is not easily separated. This allows the battery layer 2, the stress buffer layer 3, and the back sheet 4 to be seamlessly connected through the adhesive film layer 5, eliminating the gaps between the interlayer interfaces. This enhances the connection strength between the stress buffer layer 3 and the adjacent adhesive film layer 5, enabling it to deform as a whole when exposed to thermal expansion and contraction, avoiding relative displacement between the layers, and reducing the risks of interlayer separation and solder strip detachment of the components.

[0041] In some embodiments, the thermal conductivity of the stress buffer layer 3 may be less than that of the back plate 4.

[0042] In these embodiments, since the backsheet 4 has a relatively fast thermal conductivity, heat is easily and quickly transferred to the adhesive film layer 5 when exposed to outdoor sunlight or when the temperature changes abruptly, causing the temperature of the adhesive film layer 5 to change drastically and exacerbating the thermal expansion and contraction effect. The stress buffer layer 3 in this solution is made of a material with a low thermal conductivity, which is less than the thermal conductivity of the backsheet 4 and can be close to the thermal conductivity of the adhesive film layer. This reduces the heat transfer rate inside the photovoltaic tile, avoids the impact of large temperature changes on the adhesive film layer 5, reduces the creep effect of the adhesive film layer 5, and further weakens the generation of internal stress, thereby improving the adaptability and service life of the photovoltaic tile in extreme temperature environments.

[0043] In some embodiments, the glass transition temperature of the stress buffer layer 3 is optionally greater than or equal to 100°C and less than or equal to 115°C.

[0044] In these embodiments, the glass transition temperature is the critical temperature at which a material transitions from an elastic state to a plastic state. By controlling the glass transition temperature of the stress buffer layer 3 between 100°C and 115°C, which is higher than the melting temperature (60°C to 85°C) of commonly used materials in the adhesive film layer 5, the stress buffer layer 3 can still maintain a stable elastic structure in high-temperature environments during normal operation of the photovoltaic tile or after lamination and curing, and will not deform due to temperature rise, thus ensuring the structural stability of the stress buffer layer 3 in extreme temperature environments.

[0045] In some embodiments, the stress buffer layer 3 may optionally include at least one of a glass fiber reinforced layer, a basalt fiber reinforced layer, and a ceramic fiber layer.

[0046] In these embodiments, the coefficients of thermal expansion of the glass fiber reinforced layer, the basalt fiber reinforced layer, and the ceramic fiber layer are all between those of the film layer 5 and the backing plate 4, and they have low thermal conductivity and glass transition temperatures that meet the requirements of 100°C to 115°C. Their internal fiber network structure can provide stable mechanical support. After the resin 34 is filled, it can crosslink with the film layer 5 to form an integral structure to buffer internal stress and ensure the stability of the structure.

[0047] In some embodiments, the thickness of the stress buffer layer 3 is optionally greater than or equal to 0.3 mm and less than or equal to 0.5 mm.

[0048] In these embodiments, by limiting the thickness of the stress buffer layer 3, the need for lightweight photovoltaic tiles is taken into account while ensuring that the stress buffer layer 3 can disperse internal stress and block heat transfer.

[0049] In some embodiments, the photovoltaic tile may optionally include a pre-encapsulation film 6 disposed on the side of the front panel 1 away from the battery layer 2; wherein the pre-encapsulation film 6 includes a fluorine-containing film layer.

[0050] In these embodiments, a fluorinated encapsulation front film 6 is provided on one side of the original battery layer 2 of the front panel 1. This film can be selected from PVDF (Polyvinylidene Fluoride), PVF (Polyvinyl Fluoride), or ETFE (Ethylene Tetrafluoroethylene Copolymer). The fluorinated encapsulation front film 6 can resist the harsh environmental effects of outdoor sunlight exposure and wind and rain erosion, significantly improving the outdoor weather resistance and anti-aging ability of the photovoltaic tile, and reducing the damage of environmental factors to the internal components of the photovoltaic tile.

[0051] In some embodiments, the back plate 4 is optionally a curved metal structure, the thickness of the back plate 4 is greater than or equal to 1 mm and less than or equal to 3 mm; and / or the radius of curvature of the back plate 4 is greater than or equal to 50 mm and less than or equal to 150 mm; and / or the arch height of the back plate 4 is greater than or equal to 15 mm and less than or equal to 50 mm.

[0052] In these embodiments, the metal back plate 4 has high strength and good structural stability. By limiting the thickness of the metal back plate 4, the supporting strength of the back plate 4 can be guaranteed, while avoiding excessive weight. By limiting the radius of curvature and arch height of the curved metal back plate 4, stress concentration can be avoided, and it can work with the stress buffer layer 3 to alleviate the internal stress caused by thermal expansion and contraction.

[0053] Optionally, a fourth adhesive film layer 58 is used to connect the front encapsulation film 6 and the front panel 1. The thickness of the front encapsulation film 6 is greater than or equal to 25 micrometers and less than or equal to 50 micrometers. The thickness of the fourth adhesive film layer 58 is greater than or equal to 0.45 millimeters and less than or equal to 0.8 millimeters. The thickness of the front panel 1 is greater than or equal to 0.3 millimeters and less than or equal to 0.5 millimeters. The thickness of the first adhesive film layer 52 is greater than or equal to 0.45 millimeters and less than or equal to 0.8 millimeters. The thickness of the second adhesive film layer 54 is greater than or equal to 0.45 millimeters and less than or equal to 0.8 millimeters. The thickness of the stress buffer layer 3 is greater than or equal to 0.3 millimeters and less than or equal to 0.5 millimeters. The thickness of the third adhesive film layer 56 is greater than or equal to 0.45 millimeters and less than or equal to 0.8 millimeters. The thickness of the back panel 4 is greater than or equal to 1 millimeter and less than or equal to 3 millimeters. By limiting the thickness of each component in the photovoltaic tile, the lightweight requirement of the photovoltaic tile is ensured.

[0054] The second aspect of this application provides a photovoltaic tile system, including the photovoltaic tile provided in the first aspect embodiment.

[0055] Since the photovoltaic tile system in this embodiment includes the photovoltaic tile provided in the first aspect embodiment, it also has all the beneficial effects of the photovoltaic tile provided in the first aspect embodiment, which will not be repeated here.

[0056] The photovoltaic tile in this application will be further described below with reference to a specific embodiment.

[0057] With the widespread application of photovoltaic modules, the development of residential photovoltaic solar modules is becoming an important sub-sector in the field of photovoltaic technology. Currently, the market demands both good photoelectric performance and attractive appearance from photovoltaic modules, making curved photovoltaic tiles a focus and highly sought after by the market. Therefore, developing a stable and reliable curved solar module is extremely important.

[0058] Curved photovoltaic modules in related technologies are all made of curved glass lamination. However, the tempering degree of the glass decreases during the bending process, resulting in poor resistance to hail impact. Furthermore, the thermal expansion coefficients of the photovoltaic glass and the aluminum alloy frame differ significantly. This mismatch in thermal expansion coefficients can lead to fatigue failure of the sealant layer at the interface between the aluminum alloy frame and the glass under diurnal temperature variations and seasonal temperature fluctuations, increasing the risk of glass breakage. Curved solar modules using curved metal backsheets, under outdoor exposure and the alternating diurnal temperature variations, experience inconsistent thermal expansion and contraction between the sealant layer and the metal backsheet layer, easily leading to solder joint detachment, solar cell failure, and reduced lifespan.

[0059] To address the above issues, this solution proposes a lightweight curved metal solar module, the specific design of which is as follows:

[0060] The front side uses a flexible fluorine film material (pre-encapsulation film 6), and the back side (backplate 4) uses a metal material. A flexible heat insulation material is laid between the metal backplate layer and the adhesive film layer (second adhesive film layer 54 and third adhesive film layer 56) that contacts the battery cell, reducing the heat transfer effect between the metal layer and the adhesive film and reducing the coefficient of thermal expansion between the two contact materials.

[0061] like Figure 1 As shown, a curved metal solar module structure (photovoltaic tile) is as follows:

[0062] Encapsulation membrane 6: Encapsulation membrane 6 is a fluorinated membrane material, which can be selected from PVDF (Polyvinylidene Fluoride), PVF (Polyvinyl Fluoride), or ETFE (Ethylene Tetrafluoroethylene Copolymer) membrane materials, with a thickness of 25μm~50μm.

[0063] The first encapsulation film layer (fourth film layer 58) can be selected from one of high-cutoff EVA (Ethylene-Vinyl Acetate Copolymer), POE (Polyolefin Elastomer), or EPE (Expanded Polyethylene) film, with a thickness of 0.45mm to 0.8mm.

[0064] Encapsulation front panel (front panel 1): The encapsulation front panel can be made of transparent glass fiber prepreg, transparent CPC (Cellulose Propionate Copolymer), or PET (Polyethylene Terephthalate), with a thickness of 0.3mm to 0.5mm.

[0065] The second encapsulation film layer (first encapsulation film layer 52) can be one of the following: high transparency encapsulation film, high cutoff EVA, POE, EPE or PVB (Polyvinyl Butyral) film, with a thickness of 0.45mm to 0.8mm.

[0066] Crystalline silicon cell string layer (cell layer 2): can be one of the following: XBC (X Back Contact, back contact structure crystalline silicon solar cell), MWT (Metal Wrap Through, metal-perforated wound cell), or a cell without metal grid lines in the shingled structure, with both positive and negative metal electrodes led out from the back side. The light-receiving side of the cell string is protected by a light-transmitting front panel, and the back-lighting side is protected by a back panel. The first encapsulating film and the second encapsulating film achieve the bonding of the front panel, the cell string and the back panel.

[0067] The third encapsulation film layer (second encapsulation film layer 54) can be a high-transparency encapsulation film, specifically one of high-cutoff EVA, POE, EPE or PVB film, with a thickness of 0.45mm~0.8mm.

[0068] Thermal insulation and shaping layer (stress buffer layer 3): The thermal insulation and shaping layer material can be selected from glass fiber reinforced material (GFPR), basalt fiber reinforced material, and ceramic fiber material. Before the resin 34 is cured, it can conform to the curved shape of the curved metal back plate. The fiber mesh structure (mesh support 32) plays a supporting role. After the resin 34 is heated and laminated and cured, it is completely shaped and maintains the curved shape. The thickness is 0.3mm~0.5mm.

[0069] The fourth encapsulation film layer (third encapsulation film layer 56) can be selected from one of the following: high transparency encapsulation film, high cutoff EVA, POE, and EPE film, with a thickness of 0.45mm to 0.8mm.

[0070] Metal backing layer (backing plate 4): Optional aluminum alloy backing plate or stainless steel backing plate, with a three-curved wave shape, a thickness of 1mm~3mm, a radius of curvature of 50mm~150mm, and an arch height of 15mm~50mm.

[0071] Table 1. Linear thermal expansion coefficients and thermal conductivity of various materials for lightweight curved metal solar modules.

[0072] Table 1 clearly shows that the coefficient of thermal expansion of the glass fiber reinforced material is between that of the adhesive film (adhesive film layer 5) and the metal backing plate (aluminum alloy or stainless steel). The thermal conductivity of the glass fiber reinforced material is much smaller than that of the metal backing plate (aluminum alloy or stainless steel) and is close to that of the adhesive film.

[0073] The beneficial effects of this application are:

[0074] 1. A lightweight curved metal tile encapsulation structure is provided, wherein glass fiber reinforced material is used as a heat insulation layer (stress buffer layer 3), the coefficient of thermal expansion of which is between that of the adhesive film and the metal backing plate, and the thermal conductivity of which is close to that of the adhesive film layer and much lower than that of the metal backing plate. This reduces the rate of heat transfer, buffers the creep effect of the adhesive film (adhesive film layer 5) during the alternating hot and cold shock process, and enhances the service life and stability of the lightweight curved tile.

[0075] 2. The glass fiber reinforced material adopts a mesh structure. During the lamination and curing process, the adhesive film layer (second adhesive film layer 54 and third adhesive film layer 56) and the epoxy (acrylic / polyurethane) resin 34 in the glass fiber prepreg are cross-linked together and interlocked to form a mesh structure, becoming an integral whole. The glass fiber cloth (mesh support 32) provides support and skeleton function, fixing and supporting its curved shape, reducing the thermal expansion and contraction effect during outdoor exposure, making it less prone to creep, preventing the weld strip from detaching, and improving the stability of the lightweight curved metal tile.

[0076] 3. The Tg (Glass Transition Temperature) value of the resin in the glass fiber reinforced material is in the range of 100℃~115℃, which is much higher than the melting temperature of EVA and POE films of 60℃~85℃. After the lamination is fully cured, it improves the resistance of the entire lightweight curved metal component to thermal cycling shock.

[0077] The terms "installation," "connection," "linking," and "fixing" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; "linking" can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of these terms in this utility model based on the specific circumstances.

[0078] In the description of this specification, the terms "one embodiment," "some embodiments," "specific embodiment," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0079] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A photovoltaic tile, characterized in that, include: front panel; A battery layer is disposed on one side of the front panel; A stress buffer layer is provided on the side of the battery layer away from the front panel; A backplate is disposed on the side of the stress buffer layer away from the battery layer; The adhesive film layer includes a first adhesive film layer and / or a second adhesive film layer, wherein the first adhesive film layer is disposed between the front panel and the battery layer, and the second adhesive film layer is disposed between the battery layer and the stress buffer layer; The coefficient of thermal expansion of the stress buffer layer is greater than that of the adhesive film layer and less than that of the back plate.

2. The photovoltaic tile according to claim 1, characterized in that, The stress buffer layer includes: Mesh support structure; Resin is filled into the mesh of the mesh support.

3. The photovoltaic tile according to claim 2, characterized in that, The adhesive film layer includes the second adhesive film layer, and the adhesive film layer further includes: The third adhesive film layer is disposed between the stress buffer layer and the back plate; The resin is cross-linked with the second adhesive film layer and the third adhesive film layer to form an integral structure.

4. The photovoltaic tile according to claim 1, characterized in that, The thermal conductivity of the stress buffer layer is less than that of the back plate.

5. The photovoltaic tile according to claim 1, characterized in that, The glass transition temperature of the stress buffer layer is greater than or equal to 100°C and less than or equal to 115°C.

6. The photovoltaic tile according to claim 1, characterized in that, The stress buffer layer includes at least one of a glass fiber reinforced layer, a basalt fiber reinforced layer, and a ceramic fiber layer.

7. The photovoltaic tile according to any one of claims 1 to 6, characterized in that, The thickness of the stress buffer layer is greater than or equal to 0.3 mm and less than or equal to 0.5 mm.

8. The photovoltaic tile according to any one of claims 1 to 6, characterized in that, Also includes: A pre-encapsulation film is disposed on the side of the front panel away from the battery layer; The pre-encapsulation film includes a fluorine-containing film layer.

9. The photovoltaic tile according to any one of claims 1 to 6, characterized in that, The back plate has a curved metal structure. The thickness of the back plate is greater than or equal to 1 mm and less than or equal to 3 mm; and / or The radius of curvature of the back plate is greater than or equal to 50 mm and less than or equal to 150 mm; and / or The arch height of the back panel is greater than or equal to 15 mm and less than or equal to 50 mm.

10. A photovoltaic tile system, characterized in that, Including photovoltaic tiles as described in any one of claims 1 to 9.

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