A to-can for high-rate signal transmission

Abstract

The utility model relates to a TO pipe seat for high -speed signal transmission, include: substrate, a plurality of first pin hole, a plurality of first pin hole is spaced apart and arranged on the substrate side by side, each first pin hole is filled with first insulating medium, and first insulating medium is inserted with first pin, a plurality of ground pin, a plurality of ground pin are fixedly connected with the substrate, and a plurality of ground pin are distributed on both sides of a plurality of first pin hole symmetrically, a plurality of second pin hole, a plurality of second pin hole are spaced apart and arranged on the substrate along the circumference of the substrate, each second pin hole is filled with second insulating medium, and second insulating medium is inserted with second pin, wherein, a plurality of first pin hole and a plurality of second pin hole constitute the chip patch area between. Compared with the prior art, the chip patch area of the utility model is larger, guarantees that the chip can be more stable and fixed on the TO base surface, can be applied to larger chip, is more favorable to shorten the wire distance.

Description

Technical Field

[0001] This utility model relates to a TO tube socket, specifically a TO tube socket for high-speed signal transmission. Background Technology

[0002] TO sockets are used to form TO packages, which consist of a TO socket and a TO cap. The TO socket serves as the base for the packaged component and provides it with power, while the cap enables smooth optical signal transmission by focusing the signal. These two components form a hermetically sealed package that protects the sensitive semiconductor component.

[0003] Patent CN103943574A discloses a TO housing and a method for manufacturing the same. The TO housing includes a base for accommodating a device for transmitting data, including a receiving or emitting diode. The device is connected to a connection line via a bonding wire. The connection line is guided through the base in a through-hole and insulated relative to the base by a filler and held within the base. The device is characterized in that, to shorten the bonding wire, at least one connection line is cross-sectionally enlarged relative to the through-hole on the device side, asymmetrically arranged in the through-hole, and / or bent, and / or the device including the receiving or emitting diode extends into the region of the through-hole. Furthermore, to at least partially compensate for the resulting increase in capacitance, at least one connection line protrudes from the through-hole on the connection connector side. However, the above patent has at least one of the following defects: (1) The chip mounting area is limited, making it difficult to stably fix larger chips and also not conducive to further shortening the bonding wire distance; (2) The through-hole is a U-shaped hole, which is not only difficult to process and has poor consistency during mass production, but also affects the impedance performance due to the hole diameter related design, making it difficult to stably guarantee a 50-ohm impedance; (3) The connecting lines are eccentrically arranged in the U-shaped through-hole, making it impossible to control the concentricity of the through-hole and the through lead, resulting in poor positional consistency and further affecting impedance stability. Utility Model Content

[0004] The purpose of this invention is to overcome at least one of the defects of the prior art and provide a TO tube socket for high-speed signal transmission.

[0005] The objective of this utility model can be achieved through the following technical solutions: A TO connector for high-speed signal transmission includes: substrate; Multiple first pin holes are arranged side by side and spaced apart on the substrate. Each first pin hole is filled with a first insulating medium and a first pin is inserted into the first insulating medium. Multiple grounding pins are fixedly connected to the substrate, and the multiple grounding pins are symmetrically distributed on both sides of multiple first pin holes; Multiple second pin holes are spaced apart on the substrate along the circumference of the substrate. Each second pin hole is filled with a second insulating medium, and a second pin is inserted into the second insulating medium.

[0006] The chip mounting area is formed between multiple first pin holes and multiple second pin holes.

[0007] Furthermore, there are at least two first pin holes arranged at equal intervals.

[0008] Furthermore, the first insulating medium is a glass insulator.

[0009] Furthermore, the first pin hole is a round hole.

[0010] Furthermore, the first pin hole and the first pin located therein are on the same axis.

[0011] Furthermore, the grounding pin is connected to the substrate by brazing.

[0012] Furthermore, there are at least three second pin holes arranged circumferentially at equal intervals.

[0013] Furthermore, the second insulating medium is a glass insulator.

[0014] Furthermore, the second pin hole is a circular hole.

[0015] Furthermore, the second pin hole and the second pin located therein are on the same axis.

[0016] Compared with the prior art, the present invention has the following advantages: (1) The chip mounting area of ​​this utility model is larger, which ensures that the chip can be more stably fixed on the TO base surface, can be applied to larger chips, and is more conducive to shortening the bonding wire distance; (2) The size of the first pin hole will affect the impedance performance. In this utility model, the first pin hole is two round holes, which are easier to process and form, and the batch consistency is better, and the impedance is better guaranteed. (3) The position of the first pin hole and the lead wire passing through it will affect the impedance. In this invention, the first pin hole is at least two independent circular holes, which can control the concentricity of the circular holes and the lead wire passing through them, ensuring positional consistency and better guaranteeing the impedance; (4) The first pin hole is an independent circular hole, which can reduce the outer diameter of the transmission hole while ensuring a 50-ohm impedance. High-frequency signals are limited by the cutoff frequency when they are transmitted in the structure. When the outer diameter is reduced, the cutoff frequency of the system increases, thereby allowing higher frequency electromagnetic waves to pass through without significant attenuation or mode distortion. Attached Figure Description

[0017] Figure 1 This is a front view of the TO tube socket used for high-speed signal transmission in the embodiment; Figure 2 for Figure 1 AA view; Figure 3 for Figure 1 BB view; The numbers in the diagram indicate: 1-substrate; 2-first insulating medium; 3-second insulating medium; 4-second pin; 5-first pin; 6-ground pin; 7-first pin hole; 8-second pin hole; 9-chip mounting area. Detailed Implementation

[0018] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. These embodiments are implemented based on the technical solution of the present invention, providing detailed implementation methods and specific operating procedures. However, the scope of protection of the present invention is not limited to the following embodiments.

[0019] Example

[0020] This embodiment provides a TO tube socket for high-speed signal transmission; see the specific structure below. Figure 1-3 It includes: a substrate 1, multiple first pin holes 7, multiple grounding pins 6, and multiple second pin holes 8; Multiple first pin holes 7 are arranged side by side at intervals on the substrate 1, each first pin hole 7 is filled with a first insulating medium 2, and a first pin 5 is inserted into the first insulating medium 2. Multiple grounding pins 6 are fixedly connected to the substrate 1, and the multiple grounding pins 6 are symmetrically distributed on both sides of multiple first pin holes 7; Multiple second pin holes 8 are spaced apart along the circumference of the substrate 1 on the substrate, and each second pin hole 8 is filled with a second insulating medium 3, and a second pin 4 is inserted into the second insulating medium 3.

[0021] In this embodiment, the chip mounting area 9 is formed between multiple first pin holes 7 and multiple second pin holes 8. Compared with patent CN103943574A, the chip mounting area 9 in this embodiment has a larger area, which ensures that the chip can be more stably fixed on the TO base surface, can be applied to larger chips, and is more conducive to shortening the bonding wire distance.

[0022] Preferably, there are at least two first pin holes 7 arranged at equal intervals. In this embodiment, there are two first pin holes 7. In this embodiment, the first pin holes 7 are connecting holes. In this embodiment, the first insulating medium 2 is a glass insulator.

[0023] In this embodiment, the first pin hole 7 is a circular hole. The diameter of the first pin hole 7 affects impedance performance. While patent CN 103943574A uses a U-shaped hole for the through-hole, this embodiment uses two circular holes (i.e., the first pin hole 7), which makes it easier to process and shape, improves batch consistency, and better guarantees impedance.

[0024] In this embodiment, the first pin hole 7 and the first pin 5 located within it are on the same axis. Since the position of the first pin hole 7 and the first pin 5 passing through it affects the impedance, and in patent CN 103943574A the through lead 3 is eccentric in component 8, making it difficult to ensure positional consistency, this embodiment uses two separate circular holes (i.e., the first pin hole 7) to control the concentricity of the circular holes and the through lead, ensuring positional consistency and better guaranteeing impedance.

[0025] Meanwhile, using two separate circular holes allows for a reduction in the outer diameter of the transmission aperture while maintaining a 50-ohm impedance. High-frequency signals are limited by the cutoff frequency when transmitting within the structure; as the outer diameter decreases, the cutoff frequency increases, allowing higher-frequency electromagnetic waves to pass through without significant attenuation or mode distortion.

[0026] In this embodiment, the grounding pin 6 is connected to the substrate 1 by brazing.

[0027] In this embodiment, there are at least three second pin holes 8 arranged circumferentially with equal spacing.

[0028] In this embodiment, the second insulating medium 3 is a glass insulator.

[0029] In this embodiment, the second pin hole 8 is a circular hole.

[0030] In this embodiment, the second pin hole 8 and the second pin 4 located therein are on the same axis.

[0031] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of this utility model without departing from its technical solution shall still fall within the protection scope of this utility model.

Claims

1. A TO tube socket for high-speed signal transmission, characterized in that, include: substrate(1); Multiple first pin holes (7) are arranged side by side on the substrate (1), and each first pin hole (7) is filled with a first insulating medium (2), and a first pin (5) is inserted in the first insulating medium (2). Multiple grounding pins (6) are fixedly connected to the substrate (1), and the multiple grounding pins (6) are symmetrically distributed on both sides of the multiple first pin holes (7); Multiple second pin holes (8) are spaced apart on the substrate (1) in the circumferential direction. Each second pin hole (8) is filled with a second insulating medium (3), and a second pin (4) is inserted into the second insulating medium (3). Among them, the chip mounting area (9) is formed between the multiple first pin holes (7) and the multiple second pin holes (8).

2. A TO tube socket for high-speed signal transmission according to claim 1, characterized in that, The first pin hole (7) has at least two holes and is arranged at equal intervals.

3. A TO tube socket for high-speed signal transmission according to claim 1, characterized in that, The first insulating medium (2) is a glass insulator.

4. A TO tube socket for high-speed signal transmission according to claim 1, characterized in that, The first pin hole (7) is a round hole.

5. A TO tube socket for high-speed signal transmission according to claim 1, characterized in that, The first pin hole (7) and the first pin (5) inside it are on the same axis.

6. A TO tube socket for high-speed signal transmission according to claim 1, characterized in that, The grounding pin (6) is connected to the substrate (1) by brazing.

7. A TO tube socket for high-speed signal transmission according to claim 1, characterized in that, The second pin hole (8) has at least three holes arranged circumferentially with equal spacing.

8. A TO tube socket for high-speed signal transmission according to claim 1, characterized in that, The second insulating medium (3) is a glass insulator.

9. A TO tube socket for high-speed signal transmission according to claim 1, characterized in that, The second pin hole (8) is a round hole.

10. A TO tube socket for high-speed signal transmission according to claim 1, characterized in that, The second pin hole (8) and the second pin (4) inside it are on the same axis.

Images