A low light-decay LED packaging structure
Patent Information
- Application Number
- CN202521892534.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-03
- Publication Date
- 2026-10-27
- Estimated Expiration
- 2035-09-03
AI Technical Summary
[0003]然而传统LED封装，在散热方面多采用普通金属或树脂基板，导热性能较差，不能够高效传递芯片工作时产生的热量，导致热量易在芯片附近堆积，使芯片结温升高，还会引发严重的光衰现象，另外在结构固定与光学稳定性方面，传统封装中光学透镜多通过胶体粘贴固定，胶体长期使用后易老化失效，造成透镜松动，外部灰尘、湿气易进入封装内部，影响LED器件的性能稳定性，为此，我们提出一种低光衰LED封装结构解决上述问题
[0010]与现有技术相比，本实用新型的有益效果包括：通过高导热基板的设置，能够快速承接芯片工作时产生的热量，并高效传导至底面的纳米级导热硅脂层，再由纳米级导热硅脂层将热量传递至外部散热结构，解决了传统封装中热量易在芯片附近堆积的问题，减少了高温引发的光衰现象，延长了LED器件的使用寿命，通过限位板与限位孔的配合，可以快速完成光学透镜的定位，确保其覆盖LED芯片层，避免因透镜偏移导致的出光偏差，随后借助锁紧螺钉、固定凸起、通孔与螺纹固定槽的配合，实现透镜的牢固固定，相比传统胶体粘贴方式，这种机械固定结构更耐老化，能长期保持透镜位置稳定，防止因透镜松动引入灰尘、湿气，减少外部因素引发的光衰。
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Figure CN224910054U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of LEDs, specifically a low light decay LED packaging structure. Background Technology
[0002] LED, or light-emitting diode, is a solid-state light-emitting device that works based on the principle of semiconductor PN junction. Its core components include semiconductor chip, electrodes, packaging substrate, and optical lens. When current passes through the semiconductor chip, electrons and holes recombine within the chip, releasing energy and converting it into visible light. It has significant advantages such as low energy consumption, fast response speed, high luminous efficiency, and being environmentally friendly and mercury-free. It is widely used in lighting, display, backlighting and other fields, and has become one of the core devices in the field of modern optoelectronic technology.
[0003] However, traditional LED packaging often uses ordinary metal or resin substrates for heat dissipation, which have poor thermal conductivity and cannot efficiently transfer the heat generated during chip operation. This causes heat to accumulate near the chip, raising the chip junction temperature and leading to severe light decay. In addition, regarding structural fixation and optical stability, optical lenses in traditional packaging are mostly fixed by adhesive bonding. After long-term use, the adhesive is prone to aging and failure, causing the lens to loosen. External dust and moisture can easily enter the package, affecting the performance stability of the LED device. To address these issues, we propose a low-light-decay LED packaging structure. Utility Model Content
[0004] The purpose of this invention is to provide a low light decay LED packaging structure to solve the problems mentioned in the background section and overcome its technical defects.
[0005] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is: a low light decay LED packaging structure, including a high thermal conductivity substrate, a chip bonding layer is provided on the upper surface of the high thermal conductivity substrate, an LED chip layer is mounted on the upper surface of the chip bonding layer, an optical lens is provided above the LED chip layer, two fixing protrusions are provided on the outer surface of the high thermal conductivity substrate, a locking screw is provided on one side of each of the two fixing protrusions, and two threaded fixing grooves are formed on the outer surface of the optical lens, and the outer surface of the locking screw is adapted to the inner wall of the threaded fixing groove.
[0006] Preferably, one side of each of the two fixing protrusions is provided with a through hole, and the inner diameter of the through hole is larger than the diameter of the locking screw, and a silicone washer is provided on the outside of the locking screw.
[0007] Preferably, the outer surface of the high thermal conductivity substrate has two limiting holes, and the bottom surface of the optical lens is fixedly connected to two limiting plates. The bottom ends of the two limiting plates extend into the interior of the two limiting holes, and the inner wall of the limiting hole contacts the outer surface of the limiting plate.
[0008] Preferably, the bottom surface of the high thermal conductivity substrate is provided with a nano-level thermally conductive silicone grease layer, the fixing protrusion and the high thermal conductivity substrate are integrally formed, the high thermal conductivity substrate is made of aluminum nitride ceramic material, and the thickness of the high thermal conductivity substrate is 0.8-1.5mm.
[0009] Preferably, the top of the optical lens is an arc-shaped protrusion, and a microstructure optical prism array is provided on the inner side of the arc-shaped protrusion.
[0010] Compared with existing technologies, the beneficial effects of this utility model include: by setting a high thermal conductivity substrate, the heat generated during chip operation can be quickly absorbed and efficiently conducted to the nano-level thermal conductive silicone grease layer on the bottom surface. The nano-level thermal conductive silicone grease layer then transfers the heat to the external heat dissipation structure, solving the problem of heat accumulation near the chip in traditional packaging, reducing light decay caused by high temperature, and extending the service life of LED devices. Through the cooperation of the limiting plate and the limiting hole, the optical lens can be quickly positioned to ensure that it covers the LED chip layer and avoid light output deviation caused by lens misalignment. Subsequently, the lens is firmly fixed by the cooperation of locking screws, fixing protrusions, through holes and threaded fixing grooves. Compared with the traditional adhesive bonding method, this mechanical fixing structure is more resistant to aging, can maintain the lens position stability for a long time, prevent dust and moisture from being introduced due to lens loosening, and reduce light decay caused by external factors. Attached Figure Description
[0011] The disclosure of this utility model is illustrated with reference to the accompanying drawings. It should be understood that the drawings are for illustrative purposes only and are not intended to limit the scope of protection of this utility model. In the drawings, the same reference numerals are used to refer to the same parts. Wherein: Figure 1 This is a three-dimensional structural diagram of the present invention viewed from the front; Figure 2 This is a frontal sectional view of the present invention; Figure 3 This is a top sectional view of the present invention; Figure 4 This is a side sectional view of the present invention; The following are the labels in the diagram: 1. High thermal conductivity substrate; 2. Chip die bonding layer; 3. Optical lens; 4. Limiting hole; 5. Limiting plate; 6. Fixing protrusion; 7. Threaded fixing groove; 8. Through hole; 9. Locking screw; 10. Silicone gasket; 11. LED chip layer; 12. Nanoscale thermally conductive silicone grease layer; 13. Arc-shaped protrusion. Detailed Implementation
[0012] It is readily understood that, based on the technical solution of this utility model, those skilled in the art can propose various interchangeable structural methods and implementations without altering the essential spirit of this utility model. Therefore, the following detailed embodiments and accompanying drawings are merely illustrative descriptions of the technical solution of this utility model and should not be considered as the entirety of this utility model or as limitations or restrictions on the technical solution of this utility model.
[0013] According to one embodiment of the present invention, in conjunction with the appended drawings Figure 1-4 As shown.
[0014] A low light decay LED packaging structure includes a high thermal conductivity substrate 1, a die-bonding layer 2 on the upper surface of the high thermal conductivity substrate 1, an LED chip layer 11 mounted on the upper surface of the die-bonding layer 2, an optical lens 3 above the LED chip layer 11, two fixing protrusions 6 on the outer surface of the high thermal conductivity substrate 1, and a locking screw 9 on one side of each fixing protrusion 6. Two threaded fixing grooves 7 are formed on the outer surface of the optical lens 3, and the outer surface of the locking screw 9 is adapted to the inner wall of the threaded fixing groove 7. Through the cooperation of the fixing protrusions 6, locking screws 9, threaded fixing grooves 7, through holes 8, silicone gaskets 10, limiting holes 4, limiting plates 5, etc., the optical lens 3 can be quickly positioned during installation, ensuring that the lens accurately covers the LED chip layer 11 and avoiding the light output effect due to lens misalignment. The fixing protrusions 6 can provide installation support for the locking screws 9.
[0015] In this embodiment, each of the two fixed protrusions 6 has a through hole 8 on one side, and the inner diameter of the through hole 8 is larger than the diameter of the locking screw 9. A silicone gasket 10 is provided on the outside of the locking screw 9. Two limiting holes 4 are provided on the outer surface of the high thermal conductivity substrate 1. Two limiting plates 5 are fixedly connected to the bottom surface of the optical lens 3. The bottom ends of the two limiting plates 5 extend into the interior of the two limiting holes 4, and the inner wall of the limiting hole 4 contacts the outer surface of the limiting plate 5. The design that the inner diameter of the through hole 8 is larger than the diameter of the locking screw 9 makes it easy for the locking screw 9 to pass through smoothly and cooperate with the threaded fixing groove 7 to achieve mechanical fixation of the optical lens 3. The silicone gasket 10 can enhance the sealing of the locking part, prevent external dust and moisture from entering the encapsulation, and at the same time play a buffering role to avoid damage to the components during locking, thus ensuring the stability and sealing of the optical lens 3 after installation.
[0016] In this embodiment, a nanoscale thermally conductive silicone grease layer 12 is provided on the bottom surface of the high thermal conductivity substrate 1. The fixing protrusion 6 and the high thermal conductivity substrate 1 are integrally formed. The high thermal conductivity substrate 1 is made of aluminum nitride ceramic material and the thickness of the high thermal conductivity substrate 1 is 0.8-1.5mm. The top of the optical lens 3 is an arc-shaped protrusion 13, and a microstructure optical prism array is provided on the inner side of the arc-shaped protrusion 13. The high thermal conductivity substrate 1 is made of aluminum nitride ceramic material, which utilizes its excellent thermal conductivity to ensure efficient heat conduction of the chip. The arc-shaped protrusion 13 design on the top of the optical lens 3 can expand the light emission range and reduce the light reflection loss at the top of the lens. The microstructure optical prism array on the inner side of the arc-shaped protrusion 13 can refract and homogenize the light emitted by the LED chip layer 11, solve the problem of uneven light output of traditional lenses, and improve the light utilization rate.
[0017] Working principle: First, the LED chip layer 11 is mounted on the high thermal conductivity substrate 1 through the chip die bonding layer 2. The high thermal conductivity substrate 1 conducts heat to the nano-scale thermal conductive silicone grease layer 12 on the bottom surface. The nano-scale thermal conductive silicone grease layer 12 transfers heat to the external heat dissipation structure, avoiding heat accumulation near the LED chip layer 11 and causing the junction temperature to rise, thus reducing light decay caused by high temperature. In addition, when installing the optical lens 3, the two limiting plates 5 on the bottom surface of the optical lens 3 are first inserted into the two limiting holes 4 on the outer surface of the high thermal conductivity substrate 1. The cooperation between the limiting holes 4 and the limiting plates 5 can quickly position the optical lens 3, ensuring that it covers the LED chip layer 11. Then, the locking screw 9 is passed through the through hole 8 on the side of the fixing protrusion 6 and screwed into the threaded fixing groove 7 on the surface of the optical lens 3 to install and fix it. At the same time, the arc-shaped protrusion 13 on the top of the optical lens 3 and the microstructure optical prism array on the inner side can refract and homogenize the light emitted by the LED chip layer 11, expand the light output range, improve the light utilization rate, and ensure that the LED device maintains good optical performance for a long time.
[0018] The technical scope of this utility model is not limited to the content described above. Those skilled in the art can make various modifications and variations to the above embodiments without departing from the technical concept of this utility model, and all such modifications and variations should fall within the protection scope of this utility model.
Claims
1. A low-light-decay LED packaging structure, characterized in that, The device includes a high thermal conductivity substrate (1), a chip bonding layer (2) is provided on the upper surface of the high thermal conductivity substrate (1), an LED chip layer (11) is mounted on the upper surface of the chip bonding layer (2), an optical lens (3) is provided above the LED chip layer (11), two fixing protrusions (6) are provided on the outer surface of the high thermal conductivity substrate (1), a locking screw (9) is provided on one side of each of the two fixing protrusions (6), two threaded fixing grooves (7) are opened on the outer surface of the optical lens (3), and the outer surface of the locking screw (9) is adapted to the inner wall of the threaded fixing groove (7).
2. The low light decay LED packaging structure according to claim 1, characterized in that, Both of the fixed protrusions (6) have through holes (8) on one side, and the inner diameter of the through holes (8) is larger than the diameter of the locking screw (9).
3. The low light decay LED packaging structure according to claim 2, characterized in that, The locking screw (9) is provided with a silicone washer (10) on the outside.
4. The low light decay LED packaging structure according to claim 3, characterized in that, Two limiting holes (4) are opened on the outer surface of the high thermal conductivity substrate (1), and two limiting plates (5) are fixedly connected to the bottom surface of the optical lens (3).
5. The low light decay LED packaging structure according to claim 4, characterized in that, The bottom ends of the two limiting plates (5) extend into the interior of the two limiting holes (4), and the inner wall of the limiting hole (4) contacts the outer surface of the limiting plate (5).
6. The low light decay LED packaging structure according to claim 5, characterized in that, The bottom surface of the high thermal conductivity substrate (1) is provided with a nano-scale thermally conductive silicone grease layer (12), and the fixing protrusion (6) and the high thermal conductivity substrate (1) are integrally formed.
7. The low light decay LED packaging structure according to claim 6, characterized in that, The high thermal conductivity substrate (1) is made of aluminum nitride ceramic material, and the thickness of the high thermal conductivity substrate (1) is 0.8-1.5mm.
8. The low light decay LED packaging structure according to claim 7, characterized in that, The top of the optical lens (3) is an arc-shaped protrusion (13), and the inner side of the arc-shaped protrusion (13) is provided with a microstructure optical prism array.