LED light source and LED light source array

Abstract

The utility model discloses a kind of LED light source and LED light source array, LED light source includes light source main body, light source main body includes light emitting unit, dam and lens;Light emitting unit includes at least one light emitting chip, the dam is surrounded in the outer periphery of the light emitting unit;The lens includes opposite light-receiving end surface and light-exit curved surface;The lens is set on the light-exit surface of the light emitting chip with light-receiving end surface towards the light emitting unit, and make the light emitting chip be in the light-receiving end surface of the lens;The surface of dam is flush with the light-receiving end surface of lens, or the surface of dam is higher than the light-receiving end surface of lens, so that dam is surrounded in the four around of lens.The utility model is set on the light emitting chip by setting prefabricated lens, so that its light-emitting angle can be adjusted by using different shape lens, simple structure, low in cost, wide application range.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor light-emitting technology, and in particular to an LED light source and an LED light source array. Background Technology

[0002] With the improvement of luminous efficiency and the reduction of manufacturing cost of semiconductor light-emitting chips, semiconductor light-emitting chips have been widely used in directional projection high-power lighting fields, while different requirements have been put forward for the light emission angle.

[0003] One common type of existing LED light source is... Figure 1 As shown, the system includes a substrate 11, a light-emitting chip 12 disposed on the substrate 11, and a phosphor layer 13 covering the light-emitting surface and sides of the light-emitting chip 12. To change the light-emitting angle of the LED, a lens 14 is typically molded onto the substrate using a molding machine. The shape of the lens 14 can be changed by adjusting the mold, thereby changing the light-emitting angle of the LED. Besides using expensive molding equipment, changing the light-emitting angle of the LED requires modifying and remaking the mold, resulting in poor flexibility, time-consuming processes, and high costs.

[0004] It is obvious that the structure and manufacturing methods of existing common LED light sources have fundamental defects. Utility Model Content

[0005] The technical problem to be solved by this utility model is to provide an improved LED light source and LED light source array.

[0006] The technical solution adopted by this utility model to solve its technical problem is: to provide an LED light source, including a light source body, the light source body including a light-emitting unit, a dam and a lens; the light-emitting unit includes at least one light-emitting chip, and the dam surrounds the outer periphery of the light-emitting unit;

[0007] The lens includes a light-receiving end face and a light-emitting curved surface facing away from each other; the lens is disposed on the light-emitting surface of the light-emitting chip with the light-receiving end face facing the light-emitting unit, and the light-emitting chip is located within the light-receiving end face of the lens.

[0008] The surface of the dam is flush with the light-receiving end face of the lens, or the surface of the dam is higher than the light-receiving end face of the lens, so that the dam also surrounds the lens.

[0009] Preferably, a transparent adhesive is provided between the light-receiving end face of the lens and the light-emitting chip.

[0010] Preferably, the light source body further includes a fluorescent layer, and the light-emitting surface of at least one of the light-emitting chips in the light-emitting unit is covered by the fluorescent layer, while the light-emitting surfaces of the other light-emitting chips not covered by the fluorescent layer are covered by at least one transparent layer;

[0011] The lens is disposed on the fluorescent layer and the transparent layer with its light-receiving end face facing the light-emitting unit, and the fluorescent layer and the transparent layer are located within the light-receiving end face of the lens.

[0012] Preferably, a transparent adhesive or an adhesive doped with phosphor is provided between the light-receiving end face of the lens and the fluorescent layer and the transparent layer; and / or,

[0013] A transparent adhesive or an adhesive doped with phosphor is provided between the fluorescent layer and the transparent layer and the light-emitting surface of the light-emitting chip.

[0014] Preferably, the light-emitting chip is a flip chip, and the non-light-emitting surface of the flip chip is provided with conductive pads and thermally conductive pads.

[0015] Preferably, the light-receiving end face of the lens is a concave curved surface; and / or, the light-receiving end face of the lens is provided with an outwardly extending skirt.

[0016] Preferably, the LED light source further includes a substrate having opposing first and second surfaces, and the light source body is disposed on the first surface of the substrate;

[0017] The substrate is provided with a conductive circuit, and the light-emitting chip is electrically connected to the conductive circuit and thermally connected to the substrate.

[0018] This utility model also provides an LED light source array, including a substrate and a plurality of LED light sources; the substrate has a first surface and a second surface opposite to each other, and the plurality of LED light sources are arranged at intervals on the first surface of the substrate.

[0019] Preferably, the substrate is provided with a conductive circuit, and the light-emitting chip in the LED light source is conductively connected to the conductive circuit.

[0020] Preferably, the light-emitting chip is thermally connected to the substrate via a thermally conductive pad.

[0021] The beneficial effects of this invention are as follows: By setting a pre-fabricated lens on the light-emitting chip, the light emission angle of the LED light source can be changed. Since it avoids the use of expensive molding equipment and the frequent manufacture of new molds, production efficiency can be significantly improved and manufacturing costs reduced. Attached Figure Description

[0022] The present invention will be further described below with reference to the accompanying drawings and embodiments. In the accompanying drawings:

[0023] Figure 1 This is a schematic diagram of the structure of a common semiconductor light source;

[0024] Figure 2 This is a schematic diagram of the structure of the LED light source according to the first embodiment of the present invention;

[0025] Figure 3 This is a schematic diagram of the structure of the LED light source according to the second embodiment of the present invention;

[0026] Figure 4 This is a schematic diagram of the structure of the LED light source according to the third embodiment of the present invention;

[0027] Figure 5 This is a schematic diagram of the structure of an LED light source array according to an embodiment of the present invention. Detailed Implementation

[0028] To provide a clearer understanding of the technical features, objectives, and effects of this utility model, the specific embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0029] like Figure 2 and Figure 3 As shown, some embodiments of the LED light source of this utility model include a light source body, which further includes a light-emitting unit, a dam 20, a phosphor layer 30, and a lens 40. The light-emitting unit includes at least one light-emitting chip 10; the dam 20 surrounds the outer periphery of the light-emitting unit, and the phosphor layer 30 covers the light-emitting surface of each light-emitting chip 10. The lens 40 is disposed on the phosphor layer 30, such that both the phosphor layer 30 and the light-emitting surface of the light-emitting chip 10 fall within the forward projection range of the lens 40.

[0030] Specifically, in Figure 2 and Figure 3 In the illustrated embodiment, the light-emitting unit includes a light-emitting chip 10. The light-emitting chip 10 has two opposing surfaces and a side surface surrounding the two surfaces. One surface of the light-emitting chip 10 is a light-emitting surface, the side surface surrounding the two surfaces is a light-emitting side surface, and the other surface of the light-emitting chip 10 is a non-light-emitting surface. When the light-emitting side surface is enclosed by a non-transparent enclosure 20, it and the non-light-emitting surface can be collectively referred to as the non-light-emitting surface.

[0031] The dam 20 is set around the outer periphery of the light-emitting chip 10, specifically around the four sides of the light-emitting chip 10. The non-light-emitting surface of the light-emitting chip 10 can be used as a mounting surface to realize the mounting of the light-emitting chip 10 on a substrate or other structure.

[0032] The light-emitting surface and / or non-light-emitting surface of the light-emitting chip 10 are provided with conductive pads to enable conductive connection between the light-emitting chip 10 and external conductive structures such as conductive circuits. Optionally, the non-light-emitting surface of the light-emitting chip 10 may also be provided with thermally conductive pads to enable thermally conductive connection between the light-emitting chip 10 and structures such as substrates, thereby improving heat dissipation.

[0033] The light-emitting chip 10 can be selected as a flip chip, a vertical chip, or a standard chip.

[0034] exist Figure 2 In the illustrated embodiment, the light-emitting chip 10 is a flip chip, and its conductive pads are disposed on the non-light-emitting surface of the light-emitting chip 10. When the light-emitting chip 10 is mounted on a substrate, the conductive pads can make contact with conductive structures such as conductive circuits on the substrate for electrical connection. Thermally conductive pads can also be disposed on the non-light-emitting surface of the light-emitting chip 10, and when the light-emitting chip 10 is mounted on a substrate, the thermally conductive pads can make contact with thermally conductive structures such as thermally conductive platforms on the substrate for thermal connection.

[0035] exist Figure 3 In the illustrated embodiment, the light-emitting chip 10 is a vertical chip. When the light-emitting chip 10 is mounted on the substrate 50, the conductive pads on the light-emitting surface of the light-emitting chip 10 are electrically connected to conductive structures such as conductive circuits on the substrate 50 through conductive leads 100. The conductive pads on the non-light-emitting surface of the light-emitting chip 10 can make contact with and be electrically connected to conductive structures such as conductive circuits on the substrate 50.

[0036] The fluorescent layer 30 can be fixed to the light-emitting surface of the light-emitting chip 10 using a transparent adhesive or an adhesive doped with phosphor. The phosphor doped in the adhesive is not limited to one type; one or more phosphors can be selected based on the desired light emission effect.

[0037] Around the light-emitting unit, the dam 20 is positioned above the light-emitting surface of the light-emitting chip 10 and further above the height of the phosphor layer 30, so that the dam 20 surrounds the sides of the light-emitting chip 10 and the phosphor layer 30.

[0038] Lens 40 covers the fluorescent layer 30, and can be fixed to the surface of the fluorescent layer 30 by a transparent adhesive or an adhesive doped with phosphor. The phosphor doped in the adhesive is not limited to one type; one or more phosphors can be selected according to the desired light emission effect.

[0039] Lens 40 may specifically include a light-receiving end face and a light-emitting curved surface facing away from each other. Lens 40 is disposed on phosphor layer 30 with its light-receiving end face facing the light-emitting unit, so that the light-emitting surfaces of phosphor layer 30 and light-emitting chip 10 are both within the light-receiving end face of lens 40. Light emitted from light-emitting chip 10 passes through phosphor layer 30, enters lens 40 from the light-receiving end face, passes through lens 40, and exits from the light-emitting curved surface of lens 40. The light-emitting curved surface of lens 40 is typically a convex arc surface. By setting different curvatures and radii, the exit angle of light transmitted through lens 40 can be changed, i.e., the light-emitting angle. Therefore, during LED light source assembly, selecting a lens 40 with a corresponding curvature and radius according to the required light-emitting angle and fixing it to light-emitting chip 10 or phosphor layer 30 can avoid using expensive molding equipment and frequently manufacturing new molds.

[0040] The light-receiving end face of lens 40 can be a flat surface or a concave curved surface. By selecting the concave curved surface, it can be matched with the light-emitting curved surface to further adjust the light-emitting angle and light-receiving efficiency.

[0041] In conjunction with the arrangement of lens 40, the surface of the dam 20 can be flush with the light-receiving end face of lens 40. Alternatively, the surface of the dam 20 can be higher than the light-receiving end face of lens 40, so that the dam 20 also surrounds lens 40, thereby enhancing the stability of lens 40 on phosphor layer 30.

[0042] The light-receiving end face of lens 40 may also be provided with an outwardly extending skirt. The outward extension of the skirt allows it to extend into the dam 20, forming a structure embedded in the dam 20, thereby improving the connection stability between lens 40 and dam 20.

[0043] Furthermore, the aforementioned LED light source may also include a substrate 50. For example... Figure 3 As shown, substrate 50 has a first surface and a second surface opposite to each other. The light source body is disposed on the first surface of substrate 50, that is, the light-emitting chip 10 and the dam 20 are both disposed on the first surface of substrate 50, and the lens 40 is located on the side of the light source body away from substrate 50. Conductive circuits are provided on substrate 50, and the conductive pads of the light-emitting chip 10 are electrically connected to the conductive circuits through contact or through conductive leads.

[0044] In an embodiment where a thermally conductive pad is provided on the non-light-emitting surface of the light-emitting chip 10, the thermally conductive pad is attached to the first surface of the substrate 50 to achieve a thermally conductive connection between the two.

[0045] In other embodiments, the light source body does not include Figure 2 and Figure 3The fluorescent layer 30 and lens 40 shown are directly disposed on the light-emitting chip 10, specifically by being fixed to the light-emitting surface of the light-emitting chip 10 with a transparent adhesive. Alternatively, a transparent layer without phosphor is disposed on the light-emitting surface of the light-emitting chip 10, and the lens 40 is disposed above the transparent layer, so that both the transparent layer and the light-emitting surface of the light-emitting chip 10 are within the light-receiving end face of the lens 40.

[0046] like Figure 4 As shown, some embodiments of the LED light source of this utility model include a light source body, which includes a light-emitting unit, a dam 20, a light-transmitting layer 31, and a lens 40. The light-emitting unit includes at least one light-emitting chip 10; the dam 20 surrounds the outer periphery of the light-emitting unit, and the light-transmitting layer 31 covers the light-emitting surface of each light-emitting chip 10, or the light-transmitting layer 31 may cover multiple light-emitting chips 10. The lens 40 is disposed on the light-transmitting layer 31, so that both the light-transmitting layer 31 and the light-emitting surfaces of the light-emitting chips 10 fall within the forward projection range of the lens 40.

[0047] Unlike Figure 2 and Figure 3 The illustrated embodiment, in Figure 4 In the illustrated embodiment, the light-emitting unit includes two spaced-apart light-emitting chips 10. Each light-emitting chip 10 has two opposing surfaces and a side surface surrounding the two surfaces. One surface of the light-emitting chip 10 is a light-emitting surface, the side surface surrounding the two surfaces is a light-emitting side surface, and the other surface of the light-emitting chip 10 is a non-light-emitting surface. When the side surface is surrounded by a non-transparent barrier, it and the non-light-emitting surface can be collectively referred to as the non-light-emitting surface.

[0048] The light-emitting chip 10 can be a flip chip, a regular chip, or a vertical chip. The conductive connections for different types of chips can be referred to separately. Figure 2 and Figure 3 The embodiments shown are not described in detail here.

[0049] Each light-emitting chip 10 has a light-transmitting layer 31 on its light-emitting surface. Each light-emitting chip 10 has conductive pads on its light-emitting surface and / or non-light-emitting surface to enable conductive connections between the light-emitting chip 10 and external conductive structures such as conductive circuits. The non-light-emitting surface of the light-emitting chip 10 may also have thermally conductive pads to enable thermally conductive connections between the light-emitting chip 10 and structures such as a substrate, thereby improving heat dissipation.

[0050] The light-transmitting layer 31 includes a fluorescent layer and / or a transparent layer. In the light-emitting unit, at least one light-emitting chip 10 has a fluorescent layer covering its light-emitting surface, and the light-emitting surface of the light-emitting chip 10 not covered with a fluorescent layer may be provided with a transparent layer, so that all light-emitting surfaces of the light-emitting chips 10 have flat surfaces for placing the lens 40. The fluorescent layer and / or transparent layer can be fixed to the light-emitting surface of the light-emitting chip 10 using a transparent adhesive or an adhesive doped with phosphor. The phosphor doped in the adhesive is not limited to one type; one or more phosphors can be selected according to the desired light emission effect.

[0051] Understandably, in the light-emitting unit, the light-emitting surfaces of all light-emitting chips 10 are covered by a phosphor layer, or all are covered by a light-transmitting layer. The phosphor layers covering different light-emitting chips 10 can be different combinations of phosphors.

[0052] The dam 20 is set around the outer periphery of the light-emitting unit, specifically around the four sides of the light-emitting chip 10. The non-light-emitting surface of the light-emitting chip 10 can be used as a mounting surface to realize the mounting of the light-emitting chip 10 on the substrate 50 and other structures.

[0053] Around the light-emitting unit, the dam 20 is positioned above the light-emitting surface of the light-emitting chip 10 and further above the height of the light-transmitting layer 31, so that the dam 20 surrounds the sides of the light-emitting chip 10 and the light-transmitting layer 31.

[0054] Lens 40 covers the light-transmitting layer 31 and is positioned above the light-emitting unit. Lens 40 and the light-transmitting layer 31 on each light-emitting chip 10 can be fixedly connected by a transparent adhesive or an adhesive doped with phosphor. The phosphor doped in the adhesive is not limited to one type; one or more phosphors can be selected according to the desired light emission effect. The light emission effects of the light-transmitting layers 31 on different light-emitting chips 10 can be the same or different.

[0055] Lens 40 may specifically include a light-receiving end face and a light-emitting curved surface facing away from each other. Lens 40 is disposed on light-transmitting layer 31 with its light-receiving end face facing the light-emitting unit, such that both light-transmitting layer 31 and the light-emitting surface of light-emitting chip 10 are within the light-receiving end face of lens 40. Light emitted from each light-emitting chip 10 passes through light-transmitting layer 31, enters lens 40 from the light-receiving end face of lens 40, passes through lens 40, and exits from the light-emitting curved surface of lens 40.

[0056] The light-emitting surface of lens 40 is typically a convex arc surface. By setting different curvatures and radii, the emission angle of the light transmitted through lens 40 can be changed. Therefore, during LED light source assembly, a lens 40 with a corresponding curvature and radius is selected according to the required emission angle and fixed onto the phosphor layer 30.

[0057] The light-receiving end face of lens 40 can be a flat surface or a concave curved surface. By selecting the concave curved surface, it can be matched with the light-emitting curved surface to further adjust the light emission angle.

[0058] With the lens 40 in place, the surface of the dam 20 can be flush with the light-receiving end face of the lens 40. Alternatively, the surface of the dam 20 can be higher than the light-receiving end face of the lens 40, so that the dam 20 also surrounds the lens 40, thereby enhancing the stability of the lens 40 on the light-transmitting layer 31.

[0059] The light-receiving end face of lens 40 may also be provided with an outwardly extending skirt. The outward extension of the skirt allows it to extend into the dam 20, forming a structure embedded in the dam 20, thereby improving the connection stability between lens 40 and dam 20.

[0060] In other embodiments, the light source body does not include the light-transmitting layer 31, that is, it is not provided. Figure 4 Instead of using the light-transmitting layer 31, the lens 40 is directly mounted on the light-emitting chip 10. To avoid pressing on the conductive leads, the light-emitting chip 10 is preferably a flip chip, and the lens 40 is fixed to the light-emitting surface of the light-emitting chip 10 with a transparent adhesive.

[0061] Furthermore, Figure 4 The LED light source in the illustrated embodiment may further include a substrate 50. The substrate 50 has opposing first and second surfaces, and the light source body is disposed on the first surface of the substrate 50. Conductive circuits are provided on the substrate 50, and the conductive pads of the light-emitting chip 10 are electrically connected to the conductive circuits through contact or conductive leads.

[0062] In an embodiment where a thermally conductive pad is provided on the non-light-emitting surface of the light-emitting chip 10, the thermally conductive pad is attached to the first surface of the substrate 50 to achieve a thermally conductive connection between the two.

[0063] like Figure 5 As shown, an LED light source array according to an embodiment of the present invention includes a substrate 60 and a plurality of LED light sources 70. The substrate 60 has a first surface and a second surface facing each other, and the plurality of LED light sources 70 are arranged at intervals on the first surface of the substrate 60.

[0064] Each LED light source 70 includes a light-emitting unit, a dam 72, a phosphor layer 73, and a lens 74. The light-emitting unit includes at least one light-emitting chip 71; the dam 72 surrounds the outer periphery of the light-emitting chip 71, and the phosphor layer 73 covers the light-emitting surface of the light-emitting chip 71; the lens 74 is disposed on the phosphor layer 73, so that both the phosphor layer 73 and the light-emitting surface of the light-emitting chip 71 fall within the forward projection range of the lens 74.

[0065] Specifically, the light-emitting chip 71 has two opposing surfaces and a light-emitting side surface surrounding the two surfaces. One surface of the light-emitting chip 71 is a light-emitting surface, and the other surface is a non-light-emitting surface. When the light-emitting side surface is surrounded by a non-transparent dam, it and the non-light-emitting surface can be collectively referred to as the non-light-emitting surface. The dam 72 is disposed around the outer periphery of the light-emitting chip 71, specifically surrounding the four sides of the light-emitting chip 71.

[0066] The light-emitting surface and / or non-light-emitting surface of the light-emitting chip 71 are provided with conductive pads to enable conductive connection between the light-emitting chip 71 and external conductive structures such as conductive circuits on the substrate 60. Optionally, the non-light-emitting surface of the light-emitting chip 71 may also be provided with thermally conductive pads to enable thermally conductive connection between the light-emitting chip 71 and the substrate 60, thereby improving heat dissipation.

[0067] The light-emitting chip 71 can be a flip chip, a regular chip, or a vertical chip. The conductive connections for different types of chips can be referred to separately. Figure 2 and Figure 3 The embodiments shown are not described in detail here.

[0068] The fluorescent layer 73 can be fixed to the light-emitting surface of the light-emitting chip 71 using a transparent adhesive or an adhesive doped with phosphor. The phosphor doped in the adhesive is not limited to one type; one or more phosphors can be selected based on the desired light emission effect.

[0069] On the first surface of the substrate 60, a dam 72 is disposed above the light-emitting surface of the light-emitting chip 71 and further above the phosphor layer 73, so that the dam 72 surrounds the sides of the light-emitting chip 71 and the phosphor layer 73.

[0070] Lens 74 covers the fluorescent layer 73, and can be fixed to the surface of the fluorescent layer 73 by a transparent adhesive or an adhesive doped with phosphor. The phosphor doped in the adhesive is not limited to one type; one or more phosphors can be selected according to the desired light emission effect.

[0071] Lens 74 may specifically include a light-receiving end face and a light-emitting curved surface facing away from each other. Lens 74 is disposed on phosphor layer 73 with its light-receiving end face facing light-emitting chip 71, such that both phosphor layer 73 and the light-emitting surface of light-emitting chip 71 are within the light-receiving end face of lens 74. Light emitted from light-emitting chip 71 passes through phosphor layer 73, enters lens 74 from the light-receiving end face of lens 74, passes through lens 74, and exits from the light-emitting curved surface of lens 74.

[0072] The light-emitting surface of lens 74 is typically a convex arc surface. By setting different curvatures and radii, the emission angle of the light transmitted through lens 74 can be changed. Therefore, when assembling LED light sources, selecting a lens 74 with a corresponding curvature and radius according to the required emission angle and fixing it to the light-emitting chip 71 or phosphor layer 73 can avoid using expensive molding equipment and frequently manufacturing new molds.

[0073] The light-receiving end face of lens 74 can be either a flat surface or a concave curved surface. By selecting the concave curved surface, it can be matched with the light-emitting curved surface to further adjust the light-emitting angle and light-receiving efficiency.

[0074] In conjunction with the arrangement of lens 74, the surface of the dam 72 can be flush with the light-receiving end face of lens 74. Alternatively, the surface of the dam 72 can be higher than the light-receiving end face of lens 74, so that the dam 72 also surrounds lens 74, thereby enhancing the stability of lens 74 on phosphor layer 73.

[0075] The light-receiving end face of lens 74 may also be provided with an outwardly extending skirt. The outward extension of the skirt allows it to extend into the dam 72, forming a structure embedded in the dam 72, thereby improving the connection stability between lens 74 and dam 72.

[0076] In other embodiments, the LED light source 70 does not include the phosphor layer 73, and the lens 74 is directly disposed on the light-emitting surface of the light-emitting chip 71. Alternatively, the phosphor layer 73 may be replaced by a transparent layer without phosphor. Or, a portion of the light-emitting surface of the light-emitting chip 71 may be covered by the phosphor layer 73, and a portion of the light-emitting surface of the light-emitting chip 71 may be covered by a transparent layer, ensuring that the light-emitting surfaces of all the light-emitting chips 71 have the same height to form a flat surface for placing the lens 74.

[0077] In the fabrication process of one embodiment of the LED light source array, light-emitting chips 71 are first arranged at predetermined positions on the first surface of a substrate 60. Then, a phosphor layer 72 and a lens 74 are sequentially disposed on the light-emitting surface of the light-emitting chips 71. The phosphor layer 72 can be formed by coating the light-emitting surface of the light-emitting chips 71 with a phosphor paste and then curing it, or by bonding a pre-formed phosphor film to the light-emitting surface of the light-emitting chips 71 to form the phosphor layer 72. The lens 74 is a pre-formed structural component, bonded to the phosphor layer 72 with a transparent adhesive or an adhesive doped with phosphor. Finally, a dam 72 is formed on the first surface of the substrate 60. The dam 72 of each LED light source 70 can be provided individually, or the dam 72 of all LED light sources 70 can be integrally formed.

[0078] In the fabrication process of another embodiment of the LED light source array, a dam 72 can be first set on the substrate 60, then several grooves can be opened on the dam 72, the light-emitting chip 71 can be placed in the grooves, and then a phosphor layer 73 and a lens 74 can be sequentially set on the light-emitting chip 71.

[0079] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the description and drawings of this utility model, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. An LED light source, characterized in that, The light source includes a main body, which includes a light-emitting unit, a dam, and a lens; the light-emitting unit includes at least one light-emitting chip, and the dam surrounds the outer periphery of the light-emitting unit. The lens includes a light-receiving end face and a light-emitting curved surface facing away from each other; the lens is disposed on the light-emitting surface of the light-emitting chip with the light-receiving end face facing the light-emitting unit, and the light-emitting chip is located within the light-receiving end face of the lens. The surface of the dam is flush with the light-receiving end face of the lens, or the surface of the dam is higher than the light-receiving end face of the lens, so that the dam also surrounds the lens.

2. The LED light source according to claim 1, characterized in that, A transparent adhesive is provided between the light-receiving end face of the lens and the light-emitting chip.

3. The LED light source according to claim 1, characterized in that, The light source body also includes a fluorescent layer. The light-emitting surface of at least one of the light-emitting chips in the light-emitting unit is covered by the fluorescent layer, and the light-emitting surfaces of the other light-emitting chips that are not covered by the fluorescent layer are covered by at least one transparent layer. The lens is disposed on the fluorescent layer and the transparent layer with its light-receiving end face facing the light-emitting unit, and the fluorescent layer and the transparent layer are located within the light-receiving end face of the lens.

4. The LED light source according to claim 3, characterized in that, A transparent adhesive or an adhesive doped with phosphor is provided between the light-receiving end face of the lens and the fluorescent layer and the transparent layer; and / or, A transparent adhesive or an adhesive doped with phosphor is provided between the fluorescent layer and the transparent layer and the light-emitting surface of the light-emitting chip.

5. The LED light source according to any one of claims 1-4, characterized in that, The light-emitting chip is a flip chip, and the non-light-emitting surface of the flip chip is provided with conductive pads and thermally conductive pads.

6. The LED light source according to any one of claims 1-4, characterized in that, The light-receiving end face of the lens is a concave curved surface; and / or, the light-receiving end face of the lens is provided with an outwardly extending skirt.

7. The LED light source according to any one of claims 1-4, characterized in that, The LED light source also includes a substrate, the substrate having a first surface and a second surface opposite to each other, and the light source body is disposed on the first surface of the substrate; The substrate is provided with a conductive circuit, and the light-emitting chip is electrically connected to the conductive circuit and thermally connected to the substrate.

8. An LED light source array, characterized in that, The invention includes a substrate and several LED light sources as described in any one of claims 1-6; the substrate has opposing first and second surfaces, and several of the LED light sources are arranged at intervals on the first surface of the substrate.

9. The LED light source array according to claim 8, characterized in that, The substrate is provided with a conductive circuit, and the light-emitting chip in the LED light source is conductively connected to the conductive circuit.

10. The LED light source array according to claim 9, characterized in that, The light-emitting chip is thermally connected to the substrate via a thermally conductive pad.

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