Highly heat conductive LED light source

Abstract

The utility model discloses a high heat conduction LED light source, including substrate, substrate has the ceramic interlayer made of ceramic material, and the upper surface of ceramic interlayer is equipped with circuit etching copper layer and lower surface is equipped with the heat dissipation copper layer, and the outer surface of circuit etching copper layer is equipped with LED chip, and ceramic interlayer forms the thinning portion just below the chip, and the thickness of this thinning portion is less than the rest area of ceramic interlayer, and the heat generated by chip can quickly transfer to the heat dissipation copper layer through the thinning portion of ceramic interlayer, so the copper base ceramic composite substrate has high heat dissipation capacity, and the rest area of ceramic interlayer still retains enough thickness, and the excellent electric insulating property of substrate is ensured.

Description

Technical Field

[0001] This utility model relates to the field of LED lighting, and in particular to a high thermal conductivity LED light source. Background Technology

[0002] Only about 30%-40% of the electrical energy in high-power LED light sources is converted into light energy, with the remaining electrical energy being converted into waste heat and accumulated inside the chip. This waste heat is efficiently dissipated through an insulating metal substrate to maintain the device's performance and lifespan. Copper-based ceramic composite substrates are widely used as insulating metal substrates, as they possess both excellent electrical insulation and thermal conductivity. These substrates have a ceramic interlayer made of ceramic material, with a circuit-etched copper layer on top and a heat-dissipating copper layer below, forming a three-layer composite structure of "copper-ceramic-copper". Traditional ceramic interlayers have uniform thickness, but under continuous high power density operation, due to the limited thermal conductivity of the ceramic material itself, the overall thermal resistance is high, making it difficult to meet heat dissipation requirements. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a high thermal conductivity LED light source, which has a copper-based ceramic composite substrate with strong heat dissipation capability.

[0004] A high thermal conductivity LED light source includes a substrate. The substrate has a ceramic interlayer made of ceramic material. The upper surface of the ceramic interlayer has a circuit-etched copper layer and the lower surface has a heat-dissipating copper layer. An LED chip is disposed on the outer surface of the circuit-etched copper layer. A thinning portion is formed in the ceramic interlayer directly below the chip. The thickness of the thinning portion is smaller than that of the rest of the ceramic interlayer.

[0005] Furthermore, the thickness of the thinned portion of the ceramic interlayer and the remaining regions has a continuous, gradual transition.

[0006] Furthermore, a recessed structure is formed on the lower surface of the heat-dissipating copper layer with a local upward orientation.

[0007] Furthermore, the recessed structure mimics the branching structure of plant leaf veins or tree roots.

[0008] Furthermore, the recessed structures are symmetrically distributed around the chip location.

[0009] Furthermore, the recessed structure includes multiple primary channels that connect from directly below the chip to the edge of the substrate; multiple secondary channels branch off from the primary channels and connect to the edge of the substrate; and multiple tertiary channels branch off from the secondary channels.

[0010] Furthermore, the cross-sectional areas of the primary channel, the secondary channel, and the tertiary channel decrease sequentially.

[0011] Furthermore, the cross-sectional shape of each level of channel is rectangular, trapezoidal, or semi-circular.

[0012] Furthermore, the chip is specifically located at the center of the outer surface of the copper layer etched in the circuit.

[0013] In this invention, the high thermal conductivity LED light source has a ceramic interlayer where the thinned portion is thinner than the rest of the layer. This allows the heat generated by the chip to be quickly transferred to the heat-dissipating copper layer via the thinned portion of the ceramic interlayer, resulting in a copper-based ceramic composite substrate with strong heat dissipation capabilities. The remaining areas of the ceramic interlayer retain sufficient thickness to ensure that the substrate has excellent electrical insulation properties. Attached Figure Description

[0014] Figure 1 This is a longitudinal cross-sectional view of a high thermal conductivity LED light source.

[0015] Figure 2 This is a schematic diagram of the lower surface of the heat dissipation copper layer.

[0016] Figure 3 yes Figure 2 Cross-sectional view of AA. Detailed Implementation

[0017] The present invention will be further described in detail below with reference to specific embodiments.

[0018] like Figure 1 The high thermal conductivity LED light source shown has a substrate 2 with a ceramic interlayer 21 made of ceramic material. The upper surface of the ceramic interlayer 21 has a circuit-etched copper layer 22, and the lower surface has a heat-dissipating copper layer 24. A copper-tungsten hybrid transition layer 23 is sandwiched between the ceramic interlayer 21 and the circuit-etched copper layer 22, and also between the ceramic interlayer 21 and the heat-dissipating copper layer 24. The copper-tungsten hybrid transition layer 23 is a prior art technology. Its coefficient of thermal expansion is higher near the circuit-etched copper layer 22 and the heat-dissipating copper layer 24, similar to that of metallic copper, while its coefficient of thermal expansion is lower near the ceramic interlayer 21, similar to that of the ceramic material. The coefficient of thermal expansion transitions smoothly from high to low, resulting in lower thermal stress in the interface region and making it less prone to delamination of the copper-based ceramic composite substrate.

[0019] An LED chip 1 is positioned at the center of the outer surface of the copper layer 22 etched in the substrate 2. A thinned portion 211 is formed directly below the chip 1 in the ceramic interlayer 21. The thickness of the thinned portion 211 is less than that of the remaining area 212 of the ceramic interlayer 21, and the thickness between the thinned portion 211 and the remaining area 212 is a continuous and gradual transition. The heat generated by the LED chip 1 during operation can be quickly transferred to the center of the heat-dissipating copper layer 24 through the thinned portion 211 of the ceramic interlayer 21, thus the copper-based ceramic composite substrate 2 has strong heat dissipation capabilities. The remaining area 212 of the ceramic interlayer 21 still retains sufficient thickness to ensure that the substrate 2 has excellent electrical insulation properties.

[0020] See the lower surface of the heat dissipation copper layer 24 Figure 2 A recessed structure 240 is formed in the upper part of the substrate 245 to increase the surface area and improve the longitudinal heat dissipation efficiency between the substrate 2 and the external cooling medium. This recessed structure 240 mimics the branching structure of plant veins or tree roots, and is symmetrically distributed around the center of the substrate 2. The recessed structure 240 includes multiple primary channels 241, which connect from the center of the substrate 2 to the edge of the substrate 2; multiple secondary channels 242 branch from the primary channels 241, connecting to the edge of the substrate 2; and multiple tertiary channels 243 branch from the secondary channels 242. The cross-sectional area of ​​the primary channels 241, secondary channels 242, and tertiary channels 243 decreases sequentially. The cross-sectional shape of each channel is rectangular, trapezoidal, or semi-circular. See [link to documentation]. Figure 3 The surface 245 of the heat-dissipating copper layer 24 has a recessed structure 240, which can effectively increase the surface area of ​​the heat-dissipating copper layer 24 and enhance the heat dissipation effect. Since the recessed structure 240 imitates the branching structure of plant leaf veins or tree roots, it forms a multi-level heat dissipation network radiating outward from the center. On the one hand, it effectively increases the heat dissipation area. On the other hand, no matter which side edge of the substrate 2 the air flows in from, it will be naturally guided to the center through the various levels of channels and then flow from the center to the opposite edge. This recessed structure 240 can ensure that the airflow passes through the central high-heat area, thereby efficiently removing the central heat and improving the overall heat dissipation performance.

[0021] In this embodiment, the recessed structure 240 includes a primary channel 241, a secondary channel 242, and a tertiary channel 243. In a non-preferred embodiment, the secondary channel 242 and the tertiary channel 243 can be omitted, leaving only the primary channel 241.

Claims

1. A high thermal conductivity LED light source, comprising a substrate, the substrate having a ceramic interlayer made of ceramic material, a circuit-etched copper layer on the upper surface of the ceramic interlayer and a heat-dissipating copper layer on the lower surface, and an LED chip on the outer surface of the circuit-etched copper layer, characterized in that: A thinning section is formed in the ceramic interlayer directly beneath the chip, and the thickness of this thinning section is smaller than that of the rest of the ceramic interlayer.

2. The LED light source according to claim 1, characterized in that: The thickness of the thinned portion of the ceramic interlayer and the remaining areas has a continuous and gradual transition.

3. The LED light source according to claim 1, characterized in that: The lower surface of the heat-dissipating copper layer has a localized upward-facing recessed structure.

4. The LED light source according to claim 3, characterized in that: The recessed structure mimics the veins of a plant leaf or the branching structure of a tree root system.

5. The LED light source according to claim 4, characterized in that: The recessed structures are symmetrically distributed around the chip location.

6. The LED light source according to claim 4, characterized in that: The recessed structure includes multiple main channels, which connect from the position directly below the chip to the edge of the substrate. Multiple secondary channels branch off from the main channel and connect to the edge of the substrate; Multiple third-level channels branch off from the second-level channel.

7. The LED light source according to claim 6, characterized in that: The cross-sectional areas of the primary channel, the secondary channel, and the tertiary channel decrease sequentially.

8. The LED light source according to claim 6, characterized in that: The cross-sectional shape of each level of channel is rectangular, trapezoidal, or semi-circular.

9. The LED light source according to any one of claims 1 to 8, characterized in that: The chip is specifically located at the center of the outer surface of the copper layer etched in the circuit.

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