A high-density LED array heat dissipation fin integrated structure

Abstract

The utility model discloses a high density LED array radiating fin integrated structure relates to electronic heat dissipation field, the radiating fin integrated structure is configured as the annular radiating part of adaptation inside and outside double -layer LED array, and the radiating fin integrated structure includes first radiating part and second radiating part, wherein: first radiating part and the aluminum base plate of outside layer LED array are attached and are connected, and first radiating part is equipped with two groups and its annular distribution, and the inside and outside of first radiating part are radially distributed with radial fin, and the radiating channel of equal angle interval is formed between each radial fin, second radiating part and the aluminum base plate of inside layer LED array are attached and are connected, and second radiating part includes heat spreading plate, main radiating unit and vice radiating unit, and this radiating fin integrated structure is through the collaborative setting of first radiating part and second radiating part, and the high -efficient radiating demand of inside and outside double -layer high density LED array is satisfied.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the field of electronic heat dissipation, concretely is a high density LED array heat dissipation fin integrated structure. BACKGROUND

[0002] With the rapid development of science and technology, high-density LED arrays have been widely used in many fields. In the field of lighting, high-density LED arrays gradually replace traditional lighting sources with their high brightness, long life, energy saving and environmental protection, etc. and become the mainstream choice of indoor and outdoor lighting, such as large sports stadium lighting, urban road lighting and decorative lighting in commercial places, etc. In the field of display, high-density LED arrays constitute the core components of high-definition display screens and are widely used in advertising media, stage performances, intelligent traffic indications and various information display scenarios, bringing people clearer and more beautiful visual experience.

[0003] When working normally, only about 20%-30% of the electric energy of high-density LED arrays is converted into light energy, and the rest is dissipated in the form of heat. If this heat cannot be dissipated in time and effectively, it will cause the working temperature of the LED array to rise sharply. Temperature has a crucial influence on the performance and life of LED. First, high temperature will significantly reduce the luminous efficiency of LED. With the increase of temperature, the quantum efficiency inside the LED chip will decrease, resulting in reduced light output and decreased brightness. This not only affects the lighting effect and display quality, but also increases energy consumption, which is contrary to the original intention of energy saving. Second, high temperature will accelerate the aging process of LED chip and shorten its service life. In high-temperature environment, the materials inside the LED chip will undergo physical and chemical changes, such as migration of electrode materials and degradation of encapsulation materials.

[0004] In order to solve the heat dissipation problem of high-density LED arrays, the finned heat dissipation scheme is currently more common. In the existing finned heat dissipation scheme, the layout and structure of the fins often cannot fully adapt to such high heat density. On the one hand, the spacing and arrangement of the fins may not form the optimal air flow channel, resulting in turbulence and vortex when air flows through the fins, increasing the resistance of air flow and reducing the heat exchange efficiency. In addition, in high-density LED arrays, the heat generated by LED chips at different positions may differ, and the traditional finned heat dissipation scheme is difficult to achieve uniform heat dissipation for the entire array. Due to the limited heat conduction path and heat conduction capacity of the fins, heat may accumulate locally during transmission, causing the temperature in some areas to be significantly higher than that in other areas. This uneven heat dissipation will accelerate the aging speed of LED chips and reduce the life of the chips. SUMMARY

[0005] The purpose of this invention is to provide an integrated structure of heat dissipation fins for high-density LED arrays, in order to solve the problem in the prior art that when heat dissipating double-layer high-density LED arrays, the heat dissipation effect of the heat dissipation fins on LED chips in different layers and positions is uneven due to the differences in the spatial environment and heat conduction path of the inner and outer layers of the array.

[0006] To achieve the above objectives, this utility model provides the following technical solution: an integrated heat dissipation fin structure for a high-density LED array, wherein the integrated heat dissipation fin structure is configured as a ring-shaped heat dissipation component adapted to inner and outer double-layer LED arrays, and the integrated heat dissipation fin structure includes a first heat dissipation component and a second heat dissipation component, wherein:

[0007] The first heat sink is bonded to the aluminum substrate of the outer LED array. The first heat sink has two sets arranged in a ring. Radial fins are radially distributed on the inner and outer sides of the first heat sink, and heat dissipation channels are formed between the radial fins at equal angles. Airflow guide gaps are provided on the front and rear sides of the two sets of first heat sinks. Positioning buckles that connect to the positioning posts on the outer LED array are provided on the radial fins of the two first heat sinks. The second heat sink is bonded to the aluminum substrate of the inner LED array. The second heat sink includes a heat spreader, a main heat dissipation unit and a secondary heat dissipation unit. The center of the heat spreader is locked to the aluminum substrate of the inner LED array by fasteners. Multiple U-shaped notches are arranged in a ring array on the outer side of the heat spreader.

[0008] Preferably, the main heat dissipation unit is located on the upper side of the center of the heat dissipation plate. The main heat dissipation unit includes a heat-conducting chassis, an outer frame, annular fins and a fan A. The bottom surface of the heat-conducting chassis protrudes downward and fits against the center of the heat dissipation plate. The heat-conducting chassis extends outward from the periphery near the U-shaped opening to form heat-conducting fins.

[0009] Preferably, the tilt angle of the heat-conducting fins is adapted to the U-shaped notch, allowing the fins to precisely extend into the notch and achieve a tight fit with the aluminum substrate of the inner LED array. This close contact significantly shortens the path of heat transfer from the aluminum substrate to the heat-conducting fins, reduces thermal resistance, and allows heat to be conducted more quickly and efficiently from the heat source (inner LED array) to the heat-conducting fins, thereby accelerating the heat transfer speed of the entire heat dissipation system. Furthermore, the tilt angle design of the heat-conducting fins, after extending into the U-shaped notch, creates channels and gaps with the surrounding structure. When heat dissipation components such as fan A are operating, these channels and gaps can guide airflow to form more effective convection.

[0010] Preferably, the upper end of the heat-conducting chassis is connected to the outer frame, a fan A is provided on the upper side of the outer frame, and annular fins distributed in concentric circles are provided on the inner side of the outer frame.

[0011] Preferably, the secondary heat dissipation units are arranged in a ring at intervals on the outer side of the heat spreader end face. Each secondary heat dissipation unit includes a fin base and a fan B, wherein the fin base is connected to the heat spreader end face by fasteners and is rectangular in shape. The secondary heat dissipation units can provide comprehensive heat dissipation to the edge area of ​​the heat spreader. Compared with a single central heat dissipation method, the ring-shaped distribution of secondary heat dissipation units can cover a larger area, effectively preventing heat accumulation at the edge of the heat spreader, ensuring uniform temperature across the entire heat spreader, and improving heat dissipation efficiency. Each secondary heat dissipation unit is equipped with a fan B, which generates forced airflow when activated. The ring-shaped interval distribution design allows the airflow to form an orderly convection circulation around the heat spreader, accelerating the airflow speed. When the air flows over the fin base, it can more quickly carry away the heat from the fins, further enhancing the heat dissipation effect.

[0012] Preferably, the vertical fins are arranged at intervals on the outer side of the fin base, and a circular notch is provided in the middle of the fin base. The fan B is installed in the circular notch, and the vertical fins extend inward toward the bottom of the circular notch to form an L-shaped airflow guide.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] This invention, through the coordinated arrangement of the first and second heat sinks, meets the high-efficiency heat dissipation requirements of the inner and outer double-layer high-density LED array, ensuring stable luminous efficiency of the LED array under long-term high-load operation and preventing accelerated light decay due to overheating. Specific technical effects include the following:

[0015] 1. The first heat sink is bonded to the aluminum substrate of the outer LED array. Its radial fins, which are distributed in a ring and radiate outwards, form heat dissipation channels at equal angles, effectively increasing the heat dissipation area and accelerating heat dissipation. The flow guide gaps set at the beginning and end of the two sets of first heat sinks optimize the airflow path and further improve the heat dissipation efficiency.

[0016] 2. The heat dissipation component includes a heat spreader that can quickly and evenly distribute the heat generated by the inner LED array. The heat-conducting chassis of the main heat dissipation unit is in close contact with the heat spreader. The heat-conducting fins extend into the U-shaped notch of the heat spreader and are locked in place, ensuring efficient heat conduction. The concentric annular fins distributed at equal intervals on the inner side of the outer frame increase the heat dissipation surface area. Fan A accelerates airflow and enhances the heat dissipation effect.

[0017] 3. The secondary heat dissipation units are distributed in a ring on the outer side of the heat spreader end face. The fin base is firmly connected to the heat spreader. The design of the vertical fins on the outer side, the circular notch in the middle, and the L-shaped air guide guides the air to form an orderly flow. Fan B further enhances the local heat dissipation capability. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings.

[0019] Figure 1 This is a schematic diagram of the structure of Embodiment 1 of the present utility model;

[0020] Figure 2 This is a schematic diagram of the structure of Embodiment 2 of the present invention;

[0021] Figure 3 This is a schematic diagram of the main heat dissipation unit in Embodiment 2 of this utility model;

[0022] Figure 4 This is a structural schematic diagram of Embodiment 3 of the present invention;

[0023] Figure 5 This is a schematic diagram of the secondary heat dissipation unit in Embodiment 3 of this utility model.

[0024] In the picture:

[0025] 1. First heat sink; 11. Radial fins; 12. Positioning buckle; 2. Second heat sink; 21. Heat spreader; 211. U-shaped notch; 22. Main heat dissipation unit; 221. Heat-conducting chassis; 222. Outer frame; 223. Annular fins; 224. Fan A; 225. Heat-conducting fins; 23. Secondary heat dissipation unit; 231. Fin base; 232. Fan B; 233. L-shaped airflow guide. Detailed Implementation

[0026] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings.

[0027] As attached Figure 1 As shown:

[0028] Example 1: This utility model provides an integrated heat dissipation fin structure for a high-density LED array. The integrated heat dissipation fin structure is configured as a ring-shaped heat dissipation component adapted to inner and outer double-layer LED arrays. The integrated heat dissipation fin structure includes a first heat dissipation component 1 and a second heat dissipation component 2. The first heat dissipation component 1 is bonded to the aluminum substrate of the outer layer LED array. The first heat dissipation component 1 has two sets arranged in a ring. Radial fins 11 are radially distributed on the inner and outer sides of the first heat dissipation component 1, and heat dissipation channels with equal angular intervals are formed between each radial fin 11. The second heat dissipation component 2 is bonded to the aluminum substrate of the inner layer LED array. The second heat dissipation component 2 includes a heat spreader 21.

[0029] 1. In one embodiment of this utility model, airflow guide gaps are provided on the front and rear sides of the two sets of first heat sinks 1. This design can effectively guide the air to flow along a preset path, enhance the convective heat transfer effect between the air and the heat sink, and improve the heat dissipation efficiency. Positioning buckles 12 are provided on the radial fins 11 of the two first heat sinks 1, which are connected to the positioning posts on the outer LED array. The precise connection between the positioning buckles 12 and the positioning posts not only achieves a stable assembly of the first heat sink 1 and the outer LED array, ensuring that the heat sink will not shake or shift during equipment operation, but also ensures good thermal conductivity contact between the heat sink and the LED array, which is beneficial for the rapid transfer of heat from the LED array to the heat sink for dissipation.

[0030] 2. In one embodiment of this utility model, the heat spreader 21 is secured to the aluminum substrate of the inner LED array by fasteners (bolts). The heat spreader 21 is made of high thermal conductivity copper and has a microchannel structure inside. Through the rapid phase change heat transfer of the cooling medium in the microchannels inside the heat spreader 21, the heat generated by the inner LED array can be quickly and evenly distributed to the entire surface of the heat spreader 21. The heat spreader 21 can work in conjunction with the first heat sink 1 to achieve efficient heat conduction and dissipation. The first heat sink 1 can promptly further diffuse the heat transferred from the heat spreader 21 to the surrounding environment, preventing the performance of the inner LED array from degrading due to local overheating.

[0031] Working principle:

[0032] In Embodiment 1, a first heat sink 1 and a second heat sink 2 (vapor chamber 21) are introduced to provide targeted heat dissipation for the inner and outer double-layer LED arrays, respectively. During heat dissipation, the heat emitted by the outer LED array is conducted through the first heat sink 1, which is in close contact with it. The first heat sink 1 is arranged in a ring shape, and its radial fins 11 on the inner and outer sides and the heat dissipation channels spaced at equal angles increase the heat dissipation area. At the same time, the flow guide gaps on the front and rear sides of the two sets of first heat sinks 1 guide the air to flow along a preset path, enhancing the convective heat transfer effect between the air and the heat sink, so that the heat generated by the outer LED array can be more efficiently dissipated into the surrounding environment. The heat emitted by the inner LED array is first absorbed by the vapor chamber 21, which is in close contact with it. The vapor chamber 21 is made of high thermal conductivity copper and has a microchannel structure inside. The internal cooling medium transfers heat through rapid phase change, which can quickly and evenly distribute the heat generated by the inner LED array to the entire surface of the vapor chamber 21.

[0033] As attached Figure 2 To be continued Figure 3 As shown:

[0034] Example 2: This example is basically the same as the previous example, except that the second heat sink 2 includes a heat dissipation plate 21 and a main heat dissipation unit 22. The center of the heat dissipation plate 21 is locked to the aluminum substrate of the inner LED array by fasteners (bolts). The outer side of the heat dissipation plate 21 has a plurality of U-shaped notches 211 distributed in a ring array.

[0035] 1. In one embodiment of this utility model, the main heat dissipation unit 22 is located on the upper side of the center of the heat spreader 21. The main heat dissipation unit 22 includes a heat-conducting chassis 221, an outer frame 222, annular fins 223, and a fan A224. The bottom surface of the heat-conducting chassis 221 protrudes downward and is in close contact with the center of the heat spreader 21. The heat-conducting chassis 221 extends outward around the periphery near the U-shaped notch 211 to form heat-conducting fins 225. The protruding bottom surface of the heat-conducting chassis 221 and its close contact with the center of the heat spreader 21 ensure good thermal conductivity between the heat-conducting chassis 221 and the heat spreader 21, enabling rapid absorption of heat from the heat spreader 21. The outward extension of the heat-conducting chassis 221 around the periphery near the U-shaped notch 211 to form heat-conducting fins 225 further increases the heat dissipation area of ​​the heat-conducting chassis 221, helping to disperse heat more widely and preparing for the subsequent heat dissipation process.

[0036] 2. In one embodiment of the present invention, the tilt angle of the heat-conducting wing 225 is adapted to the U-shaped notch 211, and the heat-conducting wing 225 extends into the U-shaped notch 211 and is locked to the aluminum substrate of the inner LED array by fasteners (bolts).

[0037] 3. In one embodiment of this utility model, the upper end of the heat-conducting chassis 221 is connected to the outer frame 222. A fan A224 is installed on the upper side of the outer frame 222, and concentrically distributed annular fins 223 are installed on the inner side of the outer frame 222. The outer frame 222 provides a stable structural support for the entire main heat dissipation unit 22, ensuring the relative position stability of each component during equipment operation. The annular fins 223 are positioned appropriately, increasing the contact area with air, and together with the airflow generated by the fan A224, can accelerate heat dissipation. The fan A224 forms forced convection through rotation, quickly carrying away the heat from the annular fins 223 and the heat-conducting fins 225, achieving a highly efficient heat dissipation effect.

[0038] Working principle:

[0039] In Embodiment 2, a unique heat dissipation structure is introduced that integrates a heat spreader 21 and a main heat dissipation unit 22, providing an efficient and reliable heat dissipation solution for the inner LED array. In Embodiment 2, the heat spreader 21 initially absorbs and disperses heat, while the main heat dissipation unit 22 further conducts and forces heat away. These two elements work together to form a complete heat dissipation chain, effectively preventing performance degradation of the inner LED array due to localized overheating and ensuring stable and efficient operation of the LED array over a long period.

[0040] As attached Figure 4 To be continued Figure 5 As shown:

[0041] Example 3: This example is basically the same as the previous example, except that the second heat sink 2 also includes a secondary heat sink unit 23.

[0042] 1. In one embodiment of this utility model, the auxiliary heat dissipation units 23 are arranged in a ring at intervals on the outer side of the end face of the heat spreader 21. Each auxiliary heat dissipation unit 23 includes a fin base 231 and a fan B232. The fin base 231 is connected to the end face of the heat spreader 21 by fasteners. The fin base 231 is rectangular in shape, with vertical fins arranged at intervals on the outer side of the fin base 231. The auxiliary heat dissipation units 23 are arranged in a ring at intervals on the outer side of the end face of the heat spreader 21. This layout makes full use of the space on the end face of the heat spreader 21 and expands the heat dissipation range. The fin base 231 of each auxiliary heat dissipation unit 23 is firmly connected to the end face of the heat spreader 21 by fasteners, ensuring good heat conduction performance, so that the heat in the edge area of ​​the heat spreader 21 can be smoothly transferred to the fin base 231.

[0043] 2. In one embodiment of this utility model, a circular notch is provided in the middle of the fin base 231, and the fan B232 is installed in the circular notch. The vertical fins extend inward toward the bottom of the circular notch to form an L-shaped airflow guide 233. After the fan B232 on the fin base 231 is started, it will drive the surrounding airflow and form a local convection environment. When the air flows through the vertical fins, it can quickly carry away the heat accumulated on the fins, further accelerating the dissipation of heat from the edge of the heat spreader 21.

[0044] Working principle:

[0045] In Embodiment 3, by introducing a secondary heat dissipation unit 23, a comprehensive, multi-layered three-dimensional heat dissipation system is constructed together with the original main heat dissipation unit 22 and the heat spreader 21, effectively improving the heat dissipation efficiency of the inner LED array. The main heat dissipation unit 22 primarily dissipates heat from the center and near the center of the heat spreader 21, while the secondary heat dissipation unit 23 focuses on heat dissipation from the outer edge of the heat spreader 21's end face. The two work together to form a complete heat dissipation network, ensuring that heat from all parts of the heat spreader 21 is dissipated in a timely and effective manner. This composite heat dissipation method effectively avoids the performance degradation problem caused by localized heat accumulation in the inner LED array, ensuring that the LED array can operate stably and efficiently for a long time, greatly improving the reliability and lifespan of the entire LED lighting equipment.

[0046] The foregoing description only illustrates certain exemplary embodiments of the present invention. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A high-density LED array heat dissipation fin integrated structure, wherein the heat dissipation fin integrated structure is configured as a ring-shaped heat dissipation component adapted to inner and outer double-layer LED arrays, the heat dissipation fin integrated structure includes a first heat dissipation component (1) and a second heat dissipation component (2), characterized in that: The first heat sink (1) is bonded to the aluminum substrate of the outer LED array. The first heat sink (1) has two sets arranged in a ring. Radial fins (11) are radially distributed on the inner and outer sides of the first heat sink (1). Heat dissipation channels with equal angular intervals are formed between each radial fin (11). Airflow guide gaps are provided on the front and rear sides of the two sets of the first heat sink (1). Positioning buckles (12) connected to the positioning posts on the outer LED array are provided on the radial fins (11) of the two first heat sinks (1). The second heat sink (2) is bonded to the aluminum substrate of the inner LED array. The second heat sink (2) includes a heat dissipation plate (21), a main heat dissipation unit (22), and a secondary heat dissipation unit (23). The center of the heat dissipation plate (21) is locked to the aluminum substrate of the inner LED array by fasteners. Multiple U-shaped notches (211) are arranged in a ring array on the outer side of the heat dissipation plate (21).

2. The integrated structure of high-density LED array heat dissipation fins according to claim 1, characterized in that: The main heat dissipation unit (22) is located on the upper side of the center of the heat dissipation plate (21). The main heat dissipation unit (22) includes a heat-conducting chassis (221), an outer frame (222), annular fins (223) and a fan A (224). The bottom surface of the heat-conducting chassis (221) protrudes downward and fits against the center of the heat dissipation plate (21). The heat-conducting chassis (221) extends outward from the periphery of the U-shaped notch (211) to form heat-conducting fins (225).

3. The integrated structure of high-density LED array heat dissipation fins according to claim 2, characterized in that: The tilt angle of the heat-conducting wing (225) is adapted to the U-shaped notch (211). The heat-conducting wing (225) extends into the U-shaped notch (211) and is locked to the aluminum substrate of the inner LED array by fasteners.

4. The integrated structure of high-density LED array heat dissipation fins according to claim 2, characterized in that: The upper end of the heat-conducting chassis (221) is connected to the outer frame (222), and a fan A (224) is provided on the upper side of the outer frame (222). Annular fins (223) are arranged in concentric circles at equal intervals on the inner side of the outer frame (222).

5. The integrated structure of high-density LED array heat dissipation fins according to claim 1, characterized in that: The secondary heat dissipation units (23) are distributed in a ring at intervals on the outer side of the heat exchange plate (21). Each secondary heat dissipation unit (23) includes a fin base (231) and a fan B (232). The fin base (231) is connected to the end face of the heat exchange plate (21) by fasteners. The fin base (231) is rectangular.

6. The integrated structure of high-density LED array heat dissipation fins according to claim 5, characterized in that: The fin base (231) has vertical fins arranged at intervals on the outer side. A circular notch is provided in the middle of the fin base (231). The fan B (232) is installed in the circular notch. The vertical fins extend inward toward the bottom of the circular notch and form an L-shaped guide section (233).

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